An integrated inductor

By integrating the windings, heat sink, and pins into a single structure, the problem of rapid heat conduction in integrated inductors is solved, achieving rapid heat dissipation and improved stability. This reduces the risk of magnet cracking and enhances the performance and reliability of the equipment.

CN224595332UActive Publication Date: 2026-08-04HUIZHOU POCO NEW INDUCTOR TECHNOLOGY CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
HUIZHOU POCO NEW INDUCTOR TECHNOLOGY CO LTD
Filing Date
2025-07-30
Publication Date
2026-08-04

AI Technical Summary

Technical Problem

When existing integrated inductors are in operation, the heat generated by the windings cannot be quickly conducted to the heat sink, causing a large amount of heat to accumulate inside the magnet, leading to cracking and affecting performance and equipment reliability.

Method used

The design integrates the winding, heat sink, and pins into a single structure. The heat sink is attached to the outer wall of the magnet to optimize the heat conduction path. Heat from the winding is directly transferred to the heat sink, preventing heat from accumulating inside the magnet. Rapid heat dissipation is achieved through copper or silver sheet materials.

Benefits of technology

This improves the heat dissipation efficiency and stability of integrated inductors, reduces the risk of magnet cracking, enhances the performance and reliability of electronic devices, and reduces processing costs.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model belongs to the technical field of electronic components, disclose an integrated inductor, including magnet and integrated part, integrated part includes winding, fin and pin, winding is placed in the magnet, the fin is pasted with the outer wall of magnet, winding and fin are integrally connected, and the pin is connected with the both ends of winding respectively and is exposed in magnet. Through the winding, fin and pin of integrated inductor are designed into integrated structure, when integrated inductor works, the heat generated by winding can be directly transferred to fin, the conduction path of heat is optimized, makes the heat in integrated inductor evenly distribute, avoids the heat to gather in the interior of magnet, reduces the risk of magnet cracking, and the fin is pasted with the magnet, and the fin carries out heat dissipation to winding and magnet simultaneously, makes the heat in integrated inductor evenly distribute and can quickly spread to external environment, and the use performance is guaranteed, and then the use performance of electronic equipment is guaranteed.
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Description

Technical Field

[0001] This utility model relates to the field of electronic component technology, and in particular to an integrated inductor. Background Technology

[0002] Compared to traditional assembled inductors, integrated inductors are widely used in consumer, industrial, and automotive electronic devices due to their low impedance, low parasitic capacitance, small size, and ability to maintain good heating current and saturation current even under high frequency and high voltage environments.

[0003] Integrated inductors generate a significant amount of heat during operation. Current methods dissipate heat by attaching heat sinks to the magnet surface. However, the heat generated by the windings cannot be quickly conducted to the heat sinks. Therefore, existing integrated inductors still accumulate a large amount of heat during operation. With prolonged use, cracks may appear inside the magnet, affecting the performance of the integrated inductor and consequently impacting the reliability of the equipment.

[0004] Therefore, there is an urgent need for an integrated inductor to solve the above-mentioned technical problems. Utility Model Content

[0005] The purpose of this invention is to provide an integrated inductor that can solve the problem that the heat generated by the windings in existing integrated inductors cannot be quickly conducted to the heat sink, causing the magnet to crack after long-term operation, affecting its performance and thus the reliability of electronic devices.

[0006] To achieve this objective, the present invention adopts the following technical solution:

[0007] An integrated inductor, comprising:

[0008] A magnet and an integrated component, the integrated component including a winding, a heat sink and pins, the winding being placed inside the magnet, the heat sink being attached to the outer wall of the magnet, the winding being integrally connected to the heat sink, and the pins being respectively connected to both ends of the winding and exposed outside the magnet.

[0009] As a preferred technical solution for integrated inductors, the winding has a plate-like structure and its length is consistent with the length of the magnet. The winding is placed inside the magnet along the length direction of the magnet. The integrated component includes two heat sinks, which are respectively connected to the two ends of the winding along the length or width direction. Both heat sinks are in contact with the outer surface of the magnet.

[0010] As a preferred technical solution for integrated inductors, the heat sink includes a vertically connected vertical plate and a horizontal plate. The vertical plate is vertically connected to the winding and is attached to the side wall of the magnet, while the horizontal plate is attached to the bottom surface of the magnet.

[0011] As a preferred technical solution for integrated inductors, the bottom surface of the magnet is provided with two receiving grooves spaced apart along its length, and the horizontal plates of the two heat sinks are respectively placed in the two receiving grooves.

[0012] As a preferred technical solution for integrated inductors, the magnet has positioning grooves on two sides along its length, the positioning grooves are connected to the receiving grooves, and the two vertical plates are respectively placed in the two positioning grooves.

[0013] As a preferred technical solution for integrated inductors, the thickness of the heat sink is 0.1mm to 0.5mm.

[0014] As a preferred technical solution for integrated inductors, the heat sink is made of copper or silver.

[0015] As a preferred technical solution for integrated inductors, the outer peripheral surface of the magnet is coated with an insulating material.

[0016] As a preferred technical solution for integrated inductors, the magnet and the integrated component are integrally formed by die casting.

[0017] As a preferred technical solution for integrated inductors, at least one of the integrated components is provided in one of the magnet bodies.

[0018] The beneficial effects of this utility model are as follows:

[0019] The integrated inductor provided by this invention integrates the winding, heat sink, and pins into a single structure, with the heat sink attached to the outer wall of the magnet. During operation, the heat generated by the winding is directly transferred to the heat sink, optimizing the heat conduction path and preventing heat accumulation inside the magnet, thus reducing the risk of internal cracking. Simultaneously, the heat sink, attached to the magnet, dissipates heat from both the winding and the magnet, ensuring uniform heat distribution and rapid dissipation to the external environment. This guarantees the performance of the integrated inductor and, consequently, the performance of the electronic device. Furthermore, the rapid heat transfer from the winding to the heat sink prevents excessive heat buildup in the winding itself, reducing copper losses during operation and improving efficiency and stability, further enhancing the user experience. Integrating the winding, heat sink, and pins into a single structure eliminates the need for separate heat sink assembly during inductor manufacturing, saving processing steps and reducing manufacturing costs. Attached Figure Description

[0020] Figure 1 This is a cross-sectional schematic diagram of the integrated inductor provided by this utility model;

[0021] Figure 2 This is a schematic diagram of the structure of the integrated component provided by this utility model;

[0022] Figure 3 This is a schematic diagram of the structure of the magnet provided by this utility model.

[0023] In the picture:

[0024] 1. Magnet; 11. Receiving slot; 12. Positioning slot; 2. Integrated component; 21. Winding; 22. Heat sink; 221. Vertical plate; 222. Horizontal plate; 23. Pin. Detailed Implementation

[0025] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only the parts relevant to the present invention, not the entire structure.

[0026] In the description of this utility model, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0027] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0028] In the description of this embodiment, the terms "upper," "lower," "right," etc., refer to the orientation or positional relationship shown in the accompanying drawings. They are used only for ease of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first" and "second" are only used for distinction in description and have no special meaning.

[0029] like Figures 1 to 3 As shown in the diagram, this embodiment provides an integrated inductor, including a magnet 1 and an integrated component 2. The integrated component 2 includes a winding 21, a heat sink 22, and pins 23. The winding 21 is placed inside the magnet 1 to ensure the working performance of the integrated inductor. The heat sink 22 is attached to the outer wall of the magnet 1, and the winding 21 and the heat sink 22 are an integral structure. The pins 23 are respectively connected to both ends of the winding 21 and are exposed outside the magnet 1, so that the integrated inductor can be assembled onto a circuit board.

[0030] By integrating the winding 21, heat sink 22, and pins 23 into a single structure, and with the heat sink 22 attached to the outer wall of the magnet 1, the heat generated by the winding 21 during operation can be directly transferred to the heat sink 22. This optimizes the heat conduction path, prevents heat accumulation inside the magnet 1, and reduces the risk of internal cracking. Simultaneously, the heat sink 22, attached to the magnet 1, dissipates heat from both the winding 21 and the magnet 1, ensuring uniform heat distribution and rapid dissipation of heat from the integrated inductor to the external environment. This guarantees the performance of the integrated inductor and, consequently, the performance of the electronic device. Furthermore, the rapid heat transfer from the winding 21 to the heat sink 22 prevents excessive heat buildup in the winding 21 itself during operation, reducing copper losses and improving efficiency and operational stability, thus enhancing the user experience of the electronic device. Meanwhile, the winding 21, heat sink 22 and pin 23 are designed as an integrated structure, avoiding the need to assemble the heat sink 22 separately when processing integrated inductors, saving processing steps of integrated inductors and reducing processing costs of integrated inductors.

[0031] For example, the winding 21 has a plate-like structure and its length is the same as that of the magnet 1. The winding 21 is placed inside the magnet 1 along its length. This ensures that the winding 21 is completely placed inside the magnet 1, while avoiding material waste caused by an excessively long magnet 1. This guarantees the performance of the integrated inductor and improves the rationality of the integrated inductor design. The integrated component 2 includes two heat sinks 22, which further improves the heat dissipation capacity of the integrated inductor and enables it to maintain a stable temperature during operation. The two heat sinks 22 are connected to the two ends of the winding 21 along its length or width, making the structure of the integrated component 2 more rational and easier to process, thus reducing the processing difficulty. Both heat sinks 22 are attached to the outer surface of the magnet 1, and both heat sinks 22 simultaneously dissipate heat from the magnet 1 and the winding 21, further improving the heat dissipation capacity of the integrated inductor and further improving its performance and service life.

[0032] Furthermore, the heat sink 22 includes a vertically connected vertical plate 221 and a horizontal plate 222, meaning the longitudinal cross-sectional shape of the heat sink 22 is "L". The vertical plate 221 is vertically connected to the winding 21 and is attached to the sidewall of the magnet 1, while the horizontal plate 222 is attached to the bottom surface of the magnet 1. This allows the heat sink 22 to simultaneously attach to multiple sidewalls of the magnet 1, improving the heat dissipation effect of the heat sink 22 on the magnet 1, further reducing the risk of the magnet 1 cracking due to overheating, and extending the service life of the integrated inductor while improving its performance.

[0033] Furthermore, such as Figure 1 and Figure 3 As shown, two spaced-apart receiving slots 11 are provided on the bottom surface of the magnet 1 along its length. The horizontal plates 222 of the two heat sinks 22 are respectively placed in the two receiving slots 11, making the layout of the integrated component 2 and the magnet 1 more reasonable. At the same time, placing the horizontal plates 222 in the receiving slots 11 allows the integrated inductor to occupy less space, making it more compact and versatile. Furthermore, positioning slots 12 are provided on two sides along the length of the magnet 1, and the positioning slots 12 are connected to the receiving slots 11. Two vertical plates 221 are respectively placed in the two positioning slots 12. The vertical plates 221 are placed in the positioning slots 12, and the horizontal plates 222 are placed in the receiving slots 11. This can prevent the heat sinks 22 from protruding out of the magnet 1. The addition of heat sinks 22 will not increase the space occupied by the integrated inductor. The setting of the positioning slots 12 and the receiving slots 11 ensures the miniaturization of the integrated inductor and makes the design of the integrated inductor more reasonable.

[0034] In this embodiment, the thickness of the heat sink 22 is 0.1mm to 0.5mm, which enables simultaneous heat dissipation of the winding 21 and the magnet 1, while also keeping the integrated inductor miniaturized.

[0035] In this embodiment, the heat sink 22 is made of copper or silver. Both copper and silver have good thermal conductivity, enabling rapid heat dissipation from the integrated inductor and further improving its lifespan. Specifically, the material of the heat sink 22 can be selected based on the manufacturing cost and usage requirements of the integrated inductor; no restrictions are placed on the specific material selection for the heat sink 22.

[0036] In this embodiment, the outer peripheral surface of the magnet 1 is coated with an insulating material, which improves the electrical insulation performance of the integrated inductor and prevents the integrated inductor from breaking down when leakage occurs on the circuit board. At the same time, the insulating coating can also prevent moisture and salt spray from the external environment from penetrating into the interior of the magnet 1, significantly improving the service life of the integrated inductor.

[0037] In this embodiment, the magnet 1 and the integrated component 2 are integrally formed by die casting. First, an insulated enameled copper wire is wound into a winding 21 using a dedicated winding machine according to the required number of turns. The heat sink 22 is then welded to the winding 21 to form an integral structure. The pins 23 are then welded to the winding 21 to form the integrated component 2. Alloy powder and iron powder are mixed in a 4:6 ratio to form a metallic magnetic powder. The integrated component 2 is placed in the cavity of a mold, and the metallic magnetic powder is filled into the cavity until it evenly coats the winding 21. Die casting is then performed under concentrated hydraulic pressure at 200MPa-800MPa to refine the metallic magnetic powder, forming the magnet 1. The processing method of the magnet 1 is a conventional process for processing integrated inductors and will not be described in detail here.

[0038] In this embodiment, at least one integrated component 2 is provided inside a magnet 1. Since the specifications of integrated inductors vary depending on the circuit design, for integrated inductors that do not conform to standard specifications, two or more integrated components 2 of different specifications can be placed inside the magnet 1 to process them into integrated inductors that meet the usage requirements and satisfy the needs of the circuit design.

[0039] Obviously, the above embodiments of this utility model are merely examples for clearly illustrating the present utility model, and are not intended to limit the implementation of the present utility model. Those skilled in the art can make various obvious changes, readjustments, and substitutions without departing from the protection scope of this utility model. It is neither necessary nor possible to exhaustively describe all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this utility model should be included within the protection scope of the claims of this utility model.

Claims

1. An integrated inductor, characterized by, include: The magnet (1) and the integrated component (2) include a winding (21), a heat sink (22) and pins (23). The winding (21) is placed inside the magnet (1). The heat sink (22) is attached to the outer wall of the magnet (1). The winding (21) is integrally connected to the heat sink (22). The pins (23) are respectively connected to both ends of the winding (21) and are exposed outside the magnet (1).

2. The integrated inductor of claim 1, wherein, The winding (21) is a plate-shaped structure and its length is the same as that of the magnet (1). The winding (21) is placed inside the magnet (1) along the length direction of the magnet (1). The integrated component (2) includes two heat sinks (22). The two heat sinks (22) are respectively connected to the two ends of the winding (21) along the length direction or the width direction. Both heat sinks (22) are in contact with the outer surface of the magnet (1).

3. The integrated inductor according to claim 2, characterized in that, The heat sink (22) includes a vertical plate (221) and a horizontal plate (222) connected vertically. The vertical plate (221) is vertically connected to the winding (21) and is attached to the side wall of the magnet (1). The horizontal plate (222) is attached to the bottom surface of the magnet (1).

4. The integrated inductor according to claim 3, characterized in that, The bottom surface of the magnet (1) is provided with two receiving grooves (11) spaced apart along its length, and the horizontal plates (222) of the two heat sinks (22) are respectively placed in the two receiving grooves (11).

5. The integrated inductor according to claim 4, characterized in that, The magnet (1) has positioning grooves (12) on its two sides along its length. The positioning grooves (12) are connected to the receiving groove (11). The two vertical plates (221) are placed in the two positioning grooves (12) respectively.

6. The integrated inductor according to any one of claims 1-5, characterized in that, The thickness of the heat sink (22) is 0.1mm to 0.5mm.

7. The integrated inductor according to any one of claims 1-5, characterized in that, The heat sink (22) is made of copper or silver.

8. The integrated inductor according to any one of claims 1-5, characterized in that, The outer peripheral surface of the magnet (1) is coated with an insulating material.

9. The integrated inductor according to any one of claims 1-5, characterized in that, The magnet (1) and the integrated component (2) are integrally formed by die casting.

10. The integrated inductor according to any one of claims 1-5, characterized in that, At least one of the integrated components (2) is provided within one of the magnets (1).