Capacitor housing and capacitor

Abstract

This application discloses a capacitor casing and a capacitor, relating to the field of capacitor technology. The capacitor casing includes a main frame made of insulating material and a heat dissipation component made of thermally conductive material; the outer surface of the main frame is the outer surface of the frame; the main frame includes a housing cavity for accommodating capacitor cores, a sandwich cavity located between the housing cavity and the outer surface of the frame, and a connecting channel connecting the sandwich cavity and the outer surface of the frame; wherein, the heat dissipation component includes a first heat dissipation part, a second heat dissipation part, and a heat dissipation connecting part connecting the first and second heat dissipation parts, the first heat dissipation part being disposed in the sandwich cavity, the heat dissipation connecting part being disposed in the connecting channel, and the second heat dissipation part being disposed on the outer surface of the frame. This application can improve the capacitor's resistance to damp heat.

Description

Technical Field

[0001] This application relates to the field of capacitor technology, and more specifically to capacitor housings and capacitors. Background Technology

[0002] Capacitors are indispensable components in power conversion modules and are commonly used in DC filtering, AC filtering, absorption, and resonant circuits. With the development of new energy and power, the high-temperature environment in outdoor applications has placed more stringent requirements on the heat resistance of capacitors.

[0003] Existing capacitors generally consist of a main frame made of insulating material, a capacitor core assembly, and a heat dissipation component. The main frame has a housing cavity, in which the capacitor core assembly is housed. The heat dissipation component is attached to the outside of the main frame.

[0004] Existing capacitors have the following problems: the heat dissipation of the composite structure of the main frame and heat dissipation components is limited, resulting in poor heat dissipation performance of the capacitor.

[0005] Clearly, how to provide a capacitor with higher heat resistance remains a technical problem that needs to be solved by those skilled in the art. Utility Model Content

[0006] In view of this, in order to solve the above-mentioned technical problems, this application provides a capacitor housing and a capacitor.

[0007] To solve the above-mentioned technical problems, one technical solution adopted in this application is to provide a capacitor housing, which includes a main frame of the housing made of insulating material and a heat dissipation component made of thermally conductive material; the outer surface of the outer periphery of the main frame of the housing is the outer surface of the frame; the main frame of the housing includes a housing cavity for accommodating the capacitor core assembly, a sandwich cavity located between the housing cavity and the outer surface of the frame, and a connecting channel connecting the sandwich cavity and the outer surface of the frame.

[0008] The heat dissipation component includes a first heat dissipation part, a second heat dissipation part, and a heat dissipation connecting part that connects the first heat dissipation part and the second heat dissipation part. The first heat dissipation part is disposed in the interlayer cavity, the heat dissipation connecting part is disposed in the connecting channel, and the second heat dissipation part is disposed on the outer surface of the frame.

[0009] Optionally, the thermally conductive material of the first heat dissipation part is densely packed to form a dense structure with pores smaller than the diameter of water molecules and smaller than the pores of the main frame of the outer shell.

[0010] Optionally, the main frame of the outer shell is integrally formed, and the cavity wall of the interlayer cavity is fixedly connected to the first heat dissipation part.

[0011] Optionally, the main frame of the outer shell is integrally formed, and the second heat dissipation part is fixed to the main frame of the outer shell for integral connection.

[0012] Optionally, the second heat dissipation unit covers the connection channel.

[0013] Optionally, when viewed from the side where the second heat dissipation part is located towards the outer surface of the frame, the second heat dissipation part and the first heat dissipation part are at least partially overlapped or staggered.

[0014] Optionally, the main frame of the outer shell has an outer wall covering the interlayer cavity on the side of the interlayer cavity away from the receiving cavity; the second heat dissipation part is at least disposed on the outer surface of the frame outside the outer wall; the outer wall has a first region and a second region; the first region covers the first heat dissipation part, and the second region is provided with a connection channel;

[0015] The second region is distributed on the outer wall in either the first distribution pattern or the second distribution pattern; the first distribution pattern is that multiple second regions are dispersed on the outer wall; the second distribution pattern is that a single second region is distributed on the outer wall.

[0016] Optionally, the heat dissipation components are distributed along the outer periphery of the accommodating cavity to form a groove-shaped distribution area distributed along the outer periphery of the accommodating cavity.

[0017] Optionally, the insulating material of the main frame of the housing is one or more of PBT, PPS, PET and PC; the heat dissipation component is made of one or more of thermally conductive metal, thermally conductive ceramic, carbon-based material and metal-based composite material.

[0018] To solve the above-mentioned technical problems, another technical solution adopted in this application is to provide a capacitor, which includes a capacitor shell and a capacitor core assembly, wherein the capacitor shell is the aforementioned capacitor shell, and the capacitor core assembly is disposed in the accommodating cavity.

[0019] Beneficial effects: Unlike existing technologies, in this application, by conducting heat to the second heat dissipation part through the heat dissipation connection part of the first heat dissipation part disposed in the interlayer cavity, the heat conduction efficiency between the main frame of the outer shell and the second heat dissipation part can be improved, thereby improving the heat dissipation performance of the capacitor. In other words, the capacitor of this application has higher heat resistance than existing capacitors. That is, this application can improve the heat resistance of the capacitor. Attached Figure Description

[0020] Figure 1 This is a schematic cross-sectional view of the capacitor of this application. Figure 1 The first, third, and fifth sections of the wall were cut apart;

[0021] Figure 2 yes Figure 1 Enlarged schematic diagram of region A in the middle;

[0022] Figure 3 This is a cross-sectional schematic diagram of the capacitor of this application. Figure 3 Back section of the second, fourth, and fifth wall sections;

[0023] Figure 4 yes Figure 1 The diagram shows the labeling of the cross-section line BB of the capacitor shown.

[0024] Figure 5 yes Figure 4 Enlarged schematic diagram of region C in the middle;

[0025] Figure 6 It is along Figure 4 A schematic cross-sectional view of the first example obtained by cutting along the cutting line BB shown;

[0026] Figure 7 It is along Figure 4 A schematic cross-sectional view of the second example obtained by cutting along the cutting line BB shown;

[0027] Figure 8 It is along Figure 4 A schematic diagram of the cross-section obtained by cutting along section line BB in the third example;

[0028] Figure 9 yes Figure 1 A schematic diagram showing the labeled area of ​​the capacitor's slot;

[0029] Figure 10 yes Figure 9 An isolated schematic diagram of the groove-shaped area marked in the diagram.

[0030] Explanation of reference numerals in the attached figures:

[0031] Capacitor 10; Capacitor casing 11; Main frame of casing 100; First wall 110; Second wall 120; Third wall 130; Fourth wall 140; Fifth wall 150; Receiving cavity 101; Outer wall 1011; Connecting channel 1012; Interlayer cavity 102; Mounting port 103; Frame outer surface 104; Capacitor core assembly 200; Lead wire 201; Encapsulant 300; Heat dissipation component 400; First heat dissipation part 410; Heat dissipation connection part 420; Second heat dissipation part 430; First region Q1; Second region Q2; Channel-shaped distribution area Q3. Detailed Implementation

[0032] To enable those skilled in the art to better understand the technical solutions of this application, the application will be further described in detail below with reference to the accompanying drawings and specific embodiments. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0033] Please see Figures 1-3The capacitor 10 of this application includes a capacitor casing 11 and a capacitor core assembly 200. The capacitor casing 11 includes a main casing frame 100 made of insulating material and a heat dissipation component 400 made of thermally conductive material.

[0034] The outer surface of the outer frame 100 is defined as the outer surface 104 of the frame. The outer frame 100 includes a housing cavity 101 for housing the capacitor core assembly 200, a sandwich cavity 102 located between the housing cavity 101 and the outer surface 104 of the frame, and a connecting channel 1012 connecting the sandwich cavity 102 and the outer surface 104 of the frame.

[0035] The heat dissipation component 400 includes a first heat dissipation part 410, a second heat dissipation part 430, and a heat dissipation connecting part 420 connecting the first heat dissipation part 410 and the second heat dissipation part 430. The first heat dissipation part 410 is disposed in the interlayer cavity 102, the heat dissipation connecting part 420 is disposed in the connecting channel 1012, and the second heat dissipation part 430 is disposed on the outer surface 104 of the frame.

[0036] In the above manner, the first heat dissipation part 410 disposed in the interlayer cavity 102 conducts heat to the second heat dissipation part 430 through the heat dissipation connection part 420, which can improve the heat conduction efficiency between the main frame 100 of the outer shell and the second heat dissipation part 430, thereby improving the heat dissipation performance of the capacitor 10. That is, the capacitor 10 of this application has higher heat resistance performance than existing capacitors. In other words, this application can improve the heat resistance performance of the capacitor 10.

[0037] Optionally, such as Figures 1-3 As shown, the insulating material of the main frame 100 of the outer shell is, but is not limited to, one or more of polybutylene terephthalate (PBT), polyphenylene sulfide (PPS), polyethylene terephthalate (PET), and polycarbonate (PC).

[0038] Optionally, such as Figures 1-3 As shown, the heat dissipation component 400 is made of one or more of the following materials: thermally conductive metal, thermally conductive ceramic, carbon-based material, and metal-based composite material. The thermally conductive metal includes, but is not limited to, one or more of the following: aluminum (Al), copper (Cu), aluminum alloy, nickel (Ni), nickel alloy, and metal composite material.

[0039] Optionally, such as Figures 1-3As shown, the thermally conductive material of the first heat dissipation part 410 is densely packed to form a dense structure with pores smaller than the diameter of water molecules and smaller than the pores of the outer shell main frame 100, so as to block moisture from invading into the accommodating cavity 101, thereby improving the ability of the capacitor 10 to block moisture intrusion.

[0040] For example, but not as a limitation, the heat dissipation component 400 may be made of a heat-conducting metal, which may be densely packed to form a compact structure with pores smaller than the diameter of a water molecule and smaller than the pores of the main frame 100 of the outer shell.

[0041] For example, but not as a limitation, the heat dissipation component 400 may be made of a metal composite material, which is densely packed to form a compact structure with pores smaller than the diameter of a water molecule and smaller than the pores of the main frame 100 of the outer shell.

[0042] Optionally, such as Figures 1-3 As shown, in one example, viewed from the side where the second heat sink 430 is located towards the outer surface 104 of the frame, the second heat sink 430 at least partially overlaps with the first heat sink 410.

[0043] Alternatively, in another example (not shown), when viewed from the side where the second heat sink is located towards the outer surface of the frame, the second heat sink is offset from the first heat sink.

[0044] Optionally, such as Figures 1-3 As shown, in one example, capacitor 10 includes potting compound 300, which is filled between capacitor core assembly 200 and housing main frame 100 to fix capacitor core assembly 200.

[0045] Alternatively, in another example (not shown), the capacitor core assembly is detachably disposed within the receiving cavity. By way of example, and not limitation, the capacitor core assembly can be snap-fitted or plugged into the receiving cavity.

[0046] Optionally, the capacitor core assembly 200 may be provided with lead wires 201 extending out of the main frame 100 of the housing, but is not limited thereto.

[0047] Furthermore, by spaced apart by the accommodating cavity 101 and the interlayer cavity 102, the connection between the first heat dissipation part 410 and the capacitor core assembly 200 can be avoided or reduced, thereby avoiding or reducing the impact on the performance of the capacitor core assembly 200.

[0048] Optionally, combined Figures 1-3 See Figures 4-8 The first heat dissipation part 410 is located in the interlayer cavity 102 of the main frame 100 and is covered by the outer wall 1011. Therefore, the first heat dissipation part 410 is schematically shown in the form of a dashed frame. Figures 6-8As shown in the diagram, the main frame 100 of the outer casing has an outer wall 1011 covering the interlayer cavity 102 on the side of the interlayer cavity 102 opposite to the receiving cavity 101. A second heat dissipation portion 430 is provided at least on the outer surface 104 of the frame outside the outer wall 1011. The outer wall 1011 has a first region Q1 and a second region Q2. The first region Q1 covers the first heat dissipation portion 410, and the second region Q2 is provided with a connecting channel 1012. A heat dissipation connection portion 420 is provided in the connecting channel 1012.

[0049] Optionally, such as Figure 6 As shown, the distribution of the second region Q2 on the outer wall 1011 is the first distribution pattern. In the first distribution pattern, multiple second regions Q2 are dispersedly distributed on the outer wall 1011. In this way, the heat dissipation connection portion 420 in the multiple first regions Q1 can improve the thermal conductivity of the first heat dissipation portion 410 to the second heat dissipation portion 430.

[0050] Optionally, such as Figures 6-8 As shown, when viewed from the side where the second heat dissipation part 430 is located towards the outer wall 1011, the connecting channel 1012 is formed as a fully enclosed structure surrounding the second region Q2.

[0051] Optionally, such as Figures 1-3 As shown, the second heat dissipation part 430 covers the connection channel 1012. This prevents moisture from entering the main frame 10 of the housing through the gap between the heat dissipation connection part 420 and the side wall of the connection channel 1012, thereby improving the capacitor's ability to resist moisture intrusion.

[0052] Optionally, such as Figure 7 and Figure 8 As shown, the distribution of the second region Q2 on the outer wall 1011 is the second distribution method. The second distribution method is that a single second region Q2 is distributed on the outer wall 1011. In this way, by distributing the second region Q2 on the outer wall 1011 individually, the number of connecting channels 1012 can be reduced, thereby reducing the risk of moisture intruding into the main frame 100 of the outer shell through the connecting channels 1012.

[0053] Optionally, combined Figures 1-3 See Figures 4-8 It should be noted that the shape of the connecting channel 1012 includes, but is not limited to, a circle, a polygon, a bent line, or a planar spiral.

[0054] Optionally, such as Figures 1-3 As shown, the main frame 100 of the outer casing is integrally formed. This improves the sealing performance of the main frame 100 of the outer casing, thereby enhancing its ability to resist moisture intrusion into the receiving cavity 101.

[0055] For example, and not as a limitation, the main frame 100 of the outer shell can be integrally formed in either the first or the second manner.

[0056] In one embodiment, the main frame 100 of the outer shell can be integrally injection molded to form a sandwich cavity 102 that encloses the first heat dissipation part 410.

[0057] In a second approach, the main frame of the outer shell can be additively manufactured (3D Printing) to form a sandwich cavity 102 that encloses the first heat dissipation part 410.

[0058] Optionally, such as Figures 1-3 As shown, the cavity wall of the interlayer cavity 102 is integrally connected to the first heat dissipation part 410. This has at least two beneficial effects. First, it improves the sealing between the cavity wall of the interlayer cavity 102 and the first heat dissipation part 410, thereby improving the capacitor's resistance to moisture intrusion. Second, it improves the heat conduction efficiency between the cavity wall of the interlayer cavity 102 and the first heat dissipation part 410, thereby improving the capacitor's heat dissipation performance.

[0059] Optionally, such as Figures 1-3 As shown, the second heat dissipation part 430 is integrally connected to the main frame 100 of the outer casing. This has at least two beneficial effects. First, it improves the sealing between the outer casing wall 1011 and the second heat dissipation part 430, thereby improving the capacitor's resistance to moisture intrusion. Second, it improves the heat conduction efficiency between the outer casing wall 1011 and the second heat dissipation part 430, thereby improving the capacitor's heat dissipation performance.

[0060] Combination Figures 1-3 See Figures 9-10 As shown, the heat dissipation components 400 are distributed along the outer periphery of the accommodating cavity 101 to form a groove-shaped distribution area Q3 distributed along the outer periphery of the accommodating cavity 101. In this way, the heat dissipation efficiency of the capacitor can be improved by utilizing the heat dissipation components 400 distributed within the groove-shaped distribution area Q3.

[0061] Optionally, combined Figures 1-3 See Figures 9-10 As shown, the heat dissipation component 400 is distributed in the groove-shaped distribution area Q3 in either the third or fourth distribution pattern.

[0062] The third distribution method involves multiple heat dissipation components 400 distributed within the slot-shaped distribution area Q3. In one example, the heat dissipation components 400 within the slot-shaped distribution area Q3 can be dispersed. In another example, at least two heat dissipation components 400 within the slot-shaped distribution area Q3 satisfy the condition that the first heat dissipation portion 410 or the second heat dissipation portion 430 of the two heat dissipation components 400 are integrally formed. The fourth distribution method involves a single heat dissipation component 400 distributed individually within the slot-shaped distribution area Q3.

[0063] Optionally, the main frame 100 of the housing is provided with a mounting port 103, which communicates with the receiving cavity 101 to allow the capacitor core assembly 200 to pass through and be received in the receiving cavity 101. The cavity wall of the receiving cavity 101 includes a first wall portion 110, a second wall portion 120, a third wall portion 130, a fourth wall portion 140, and a fifth wall portion 150.

[0064] The first wall portion 110, the second arm portion, the third wall portion 130, and the fourth wall portion 140 surround the outer periphery of the mounting opening 103. The fifth wall portion 150 connects to the first wall portion 110, the second wall portion 120, the third wall portion 130, and the fourth wall portion 140 respectively and is arranged opposite to the mounting opening 103.

[0065] The heat dissipation components 400 are distributed in the first wall portion 110, the second wall portion 120, the third wall portion 130, the fourth wall portion 140 and the fifth wall portion 150 respectively.

[0066] The above are merely embodiments of this application and do not limit the scope of this patent application. Any equivalent structural or procedural changes made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the scope of patent protection of this application.

Claims

1. A capacitor casing, characterized in that, The capacitor housing includes a main frame made of insulating material and a heat dissipation component made of thermally conductive material; the outer surface of the main frame is the outer surface of the frame; the main frame includes a housing cavity for accommodating the capacitor core assembly, a sandwich cavity located between the housing cavity and the outer surface of the frame, and a connecting channel connecting the sandwich cavity and the outer surface of the frame. The heat dissipation component includes a first heat dissipation part, a second heat dissipation part, and a heat dissipation connecting part connecting the first heat dissipation part and the second heat dissipation part. The first heat dissipation part is disposed in the interlayer cavity, the heat dissipation connecting part is disposed in the connecting channel, and the second heat dissipation part is disposed on the outer surface of the frame.

2. The capacitor casing according to claim 1, characterized in that, The thermally conductive material of the first heat dissipation part is densely packed to form a dense structure with pores smaller than the diameter of a water molecule and smaller than the pores of the main frame of the outer shell.

3. The capacitor casing according to claim 2, characterized in that, The outer shell main frame is integrally formed, and the cavity wall of the interlayer cavity is fixedly connected to the first heat dissipation part.

4. The capacitor casing according to claim 2, characterized in that, The main frame of the outer shell is integrally formed, and the second heat dissipation part is fixedly connected to the main frame of the outer shell.

5. The capacitor casing according to claim 4, characterized in that, The second heat dissipation unit covers the connection channel.

6. The capacitor casing according to claim 1, characterized in that, Looking down at the outer surface of the frame from the side where the second heat dissipation part is located, the second heat dissipation part is at least partially overlapped with the first heat dissipation part or the second heat dissipation part is staggered from the first heat dissipation part.

7. The capacitor casing according to claim 1, characterized in that, The outer shell main frame has an outer wall covering the interlayer cavity on the side of the interlayer cavity away from the receiving cavity; the second heat dissipation part is at least disposed on the outer surface of the frame outside the outer wall; the outer wall has a first region and a second region; the first region covers the first heat dissipation part, and the second region is provided with the connection channel; The second region is distributed on the outer wall in either a first distribution pattern or a second distribution pattern; the first distribution pattern is that multiple second regions are dispersed on the outer wall; the second distribution pattern is that a single second region is distributed on the outer wall.

8. The capacitor casing according to claim 1, characterized in that, The heat dissipation components are distributed along the outer periphery of the accommodating cavity to form a groove-shaped distribution area distributed along the outer periphery of the accommodating cavity.

9. The capacitor casing according to claim 1, characterized in that, The insulating material of the main frame of the outer shell is one or more of PBT, PPS, PET and PC; the thermally conductive material of the heat dissipation component is one or more of thermally conductive metal, thermally conductive ceramic, carbon-based material and metal-based composite material.

10. A capacitor, characterized in that, The capacitor includes a capacitor housing and a capacitor core assembly, wherein the capacitor housing is the capacitor housing according to any one of claims 1-9, and the capacitor core assembly is disposed in the accommodating cavity.

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