Vehicle-mounted chip liquid cooling heat dissipation plate with spoiler column

Abstract

The utility model relates to liquid cooling plate technical field especially brings the vehicle -mounted chip liquid cooling heat sink of spoiler column, including for the main body mechanism of device main body, the main body mechanism includes chip main body, be provided with the heat dissipation mechanism for the effective heat dissipation of chip main body on the main body mechanism, the heat dissipation mechanism includes the heat dissipation box body, installs the apron on the heat dissipation box body. The utility model discloses through setting heat dissipation mechanism makes device can effectively heat dissipation to high frequency chip, through indium piece as heat conduction material makes chip heat can effectively conduct, and the cooling liquid is circulated by liquid inlet pipe, makes the cooling liquid directional flow through the special-shaped flow guide plate, increases the disturbance of fluid in the flow channel when passing through a plurality of spoiler column body, improves flow velocity and heat exchange area to enhance the heat dissipation effect, guarantees the uniformity of heat dissipation, and simultaneously because only contains a small -size liquid cooling plate, effectively reduces the risk of leakage.

Description

Technical Field

[0001] This utility model relates to the field of liquid cooling plate technology, specifically to a vehicle-mounted chip liquid cooling heat dissipation plate with a baffle column. Background Technology

[0002] The main functions of chips in automotive controllers include controlling basic vehicle functions, ensuring vehicle safety, enabling intelligent control, and improving vehicle performance. As the power of chips in automotive domain controllers continues to increase, traditional heat dissipation methods are no longer sufficient to meet the demands for efficient heat dissipation. Traditional liquid-cooled heat sinks rely on increasing the contact area for heat dissipation, as coolant flows through flat or straight finned channels. However, this is insufficient for high-frequency chips and is detrimental to stable system operation. Utility Model Content

[0003] To address the shortcomings of existing technologies, this utility model provides an automotive chip liquid cooling heat sink with a baffle column, which has the advantages of good heat dissipation and convenient system stable operation. It solves the problem that traditional liquid cooling heat sinks rely on increasing the contact area to dissipate heat, which is insufficient for high-frequency chips because the coolant flows in a flat or straight finned channel.

[0004] To solve the above-mentioned technical problems, this utility model provides the following technical solution: A vehicle-mounted chip liquid cooling heat sink with baffle columns includes a main body structure serving as the main body of the device. The main body structure includes a chip body and a heat dissipation mechanism for effectively dissipating heat from the chip body. The heat dissipation mechanism includes a heat dissipation box with a cover plate installed on it. An inlet pipe and an outlet pipe are respectively connected to one side of the heat dissipation box. A shaped guide plate is fixedly connected to the heat dissipation box. Multiple baffle columns are installed inside the heat dissipation box on one side of the shaped guide plate, and the multiple baffle columns are provided with fixing components for easy assembly and disassembly.

[0005] Preferably, the fixing component includes a circular groove formed on the top of a plurality of turbulence columns, a plurality of fixing rods are installed on the bottom of the cover plate, and small suction cups are connected to the bottom of the plurality of turbulence columns.

[0006] Preferably, the heat sink body has multiple mounting slots, and the cover plate has multiple mounting holes.

[0007] Preferably, the heat sink body and the cover plate are fixed together by multiple stainless steel screws, and a sealing strip is installed at the bottom edge of the cover plate.

[0008] Preferably, the diameter of the plurality of fixing rods is the same as the diameter of the plurality of circular grooves, and the interior of the heat dissipation box is divided into two interconnected regions by an irregularly shaped guide plate, with the liquid inlet pipe and liquid outlet pipe respectively connected to different regions.

[0009] Preferably, an indium sheet is mounted on the chip body, the indium sheet is mounted on the bottom of the heat sink housing, and the bottom of the heat sink housing is equipped with a plurality of supports and brackets for fixing to the module.

[0010] By employing the above technical solution, this utility model provides an automotive chip liquid cooling heat dissipation plate with a baffle column, which has at least the following beneficial effects: 1. This utility model enables the device to effectively dissipate heat from high-frequency chips by setting up a heat dissipation mechanism. Indium sheets are used as thermal conductive materials to effectively conduct heat from the chip. Coolant flows through the inlet pipe and is directed to flow through a special-shaped guide plate. When passing through multiple turbulence columns, the turbulence of the fluid in the flow channel is increased, the flow rate and heat exchange area are increased, thereby enhancing the heat dissipation effect and ensuring the uniformity of heat dissipation. At the same time, since it only contains a small liquid cooling plate, the risk of leakage is effectively reduced.

[0011] 2. This utility model allows for easy customization of the number and arrangement of the turbulence columns by setting a fixing component. The placement of the turbulence columns is easily fixed by a small suction cup. The position of the turbulence columns is further fixed by installing fixing rods at different positions opposite to the circular groove on different cover plates. By changing the corresponding cover plates, it can be adapted to different types of high-power chips, realizing modular customization and improving compatibility. Attached Figure Description

[0012] The accompanying drawings, which are included to provide a further understanding of the present invention, form part of this application: Figure 1 This is a three-dimensional structural diagram of the present invention; Figure 2 This is a schematic diagram of the main structure of the present utility model; Figure 3 This is a schematic diagram of the heat dissipation mechanism of this utility model; Figure 4 This is an exploded view of the fixing component of this utility model.

[0013] Figure label: 1. Main body structure; 101. Chip body; 102. Indium wafer; 103. Support block; 104. Support; 2. Heat dissipation mechanism; 201. Heat dissipation box; 202. Cover plate; 203. Liquid inlet pipe; 204. Liquid outlet pipe; 205. Irregularly shaped guide plate; 206. Baffle column; 207. Fixing component; 2071. Circular groove; 2072. Fixing rod; 2073. Small suction cup. Detailed Implementation

[0014] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0015] As the power of chips in vehicle domain controllers continues to increase, traditional heat dissipation methods can no longer meet the demand for efficient heat dissipation. Traditional liquid cooling heat sinks rely on the flow of coolant in flat or straight finned channels to dissipate heat, which is insufficient for high-frequency chips and is not conducive to stable system operation. The following describes some embodiments of the present invention with a liquid cooling heat sink with a turbulence column for vehicle chips.

[0016] Example 1: To meet the high power heat dissipation requirements of the system chip, combined with Figures 1-4 As shown, a vehicle-mounted chip liquid cooling heat sink with a baffle column is proposed. The main body 1 is set as the main body of the device, and a heat dissipation mechanism 2 is set on the main body 1. The heat dissipation mechanism 2 is used to effectively dissipate heat from the chip body 101.

[0017] To improve the heat dissipation effect of the device on the chip, a heat dissipation mechanism 2 is proposed. This mechanism includes a heat dissipation box 201 with a cover plate 202. An inlet pipe 203 and an outlet pipe 204 are connected to one side of the heat dissipation box 201. A shaped guide plate 205 is fixedly connected to the heat dissipation box 201. Multiple baffle columns 206 are installed inside the heat dissipation box 201 on one side of the guide plate 205. The interior of the heat dissipation box 201 is divided into two interconnected regions by the guide plate 205. The inlet pipe 203 and the outlet pipe 204 are connected to different regions respectively. The multiple baffle columns 206 are equipped with... A fixing component 207 is provided for easy assembly and disassembly of the turbulence column 206. The indium sheet 102 is used as a heat-conducting material to effectively conduct the heat from the chip to the heat sink 201. The coolant flows through the inlet pipe 203 and is directed by the shaped guide plate 205. When passing through multiple turbulence columns 206, the turbulence of the fluid in the flow channel is increased, the flow rate and heat exchange area are increased, thereby enhancing the heat dissipation effect and ensuring the uniformity of heat dissipation. The cover plate 202 ensures the sealing effect of the cooling process. At the same time, since it only contains a small liquid cooling plate, the risk of leakage is effectively reduced.

[0018] Example 2: Based on Embodiment 1, the technical solution proposed in Embodiment 1 is used to solve the problem that in the prior art, the liquid cooling heat dissipation plate relies on increasing the contact area for heat dissipation through the flow of coolant in a flat or straight finned channel, which is insufficient for high-frequency chips. However, the arrangement of the baffle columns can create different heat dissipation effects. In order to make the device suitable for different types of high-power chips, the baffle column 206 should be easy to install and remove.

[0019] To improve device compatibility, combined with Figure 2 and Figure 3 as well as Figure 4 As shown, a fixing component 207 is proposed. A circular groove 2071 is formed on the top of multiple turbulence-disrupting pillars 206. Multiple fixing rods 2072 are installed on the bottom of the cover plate 202, with the diameter of the fixing rods 2072 being the same as the diameter of the circular grooves 2071. Small suction cups 2073 are connected to the bottom of the multiple turbulence-disrupting pillars 206. Multiple mounting slots are formed on the heat sink 201, and multiple mounting holes are formed on the cover plate 202. The heat sink 201 and the cover plate 202 are fixed together by multiple stainless steel screws. A sealing strip is installed at the bottom edge of the cover plate 202. The small suction cups 2073 easily fix the placement of the turbulence-disrupting pillars 206 on the heat sink 201. By installing and arranging multiple fixing rods 2072 at different positions opposite to the circular grooves 2071 on different cover plates 202, the position of the turbulence-disrupting pillars 206 is further fixed. By replacing the corresponding cover plate 202, it can be adapted to different types of high-power chips, achieving modular customization and improving compatibility.

[0020] To further ensure the heat dissipation effect of the chip, a main body structure 1 is proposed, comprising a chip body 101, on which an indium sheet 102 is mounted. The indium sheet 102 is installed at the bottom of a heat sink 201. Multiple supports 103 and 104 for fixing the device to the module are installed at the bottom of the heat sink 201. The supports 103 and 104 facilitate easy installation and fixation of the entire device to the system. The indium sheet 102 effectively conducts heat from the chip body 101. It is flexible and malleable, adaptable to irregular surfaces or heat dissipation scenarios requiring bending, and fits tightly against the chip body 101 and the heat sink 201, reducing contact thermal resistance and improving heat dissipation efficiency. It should be noted that the terms “comprising,” “including,” or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0021] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A vehicle-mounted chip liquid cooling heat dissipation plate with a spoiler column, comprising a main body mechanism (1) for serving as a device main body, the main body mechanism (1) comprising a chip main body (101), characterized in that: The main body (1) is provided with a heat dissipation mechanism (2) for effectively dissipating heat from the chip body (101). The heat dissipation mechanism (2) includes a heat dissipation box (201), a cover plate (202) is installed on the heat dissipation box (201), an inlet pipe (203) and an outlet pipe (204) are respectively connected to one side of the heat dissipation box (201), a special-shaped guide plate (205) is fixedly connected to the heat dissipation box (201), and a plurality of turbulence columns (206) are installed inside the heat dissipation box (201) on one side of the special-shaped guide plate (205), and a fixing component (207) for easy disassembly and assembly is provided on the plurality of turbulence columns (206).

2. The vehicle-mounted chip liquid cooling heat sink with baffles as described in claim 1, characterized in that: The fixing component (207) includes a circular groove (2071) opened on the top of a plurality of turbulence columns (206), a plurality of fixing rods (2072) are installed on the bottom of the cover plate (202), and a small suction cup (2073) is connected to the bottom of the plurality of turbulence columns (206).

3. The vehicle-mounted chip liquid cooling heat sink with baffle pillars according to claim 2, characterized in that: The heat dissipation box (201) has multiple mounting slots, and the cover plate (202) has multiple mounting holes.

4. The vehicle-mounted chip liquid cooling heat sink with baffle pillars according to claim 3, characterized in that: The heat dissipation box (201) and the cover plate (202) are fixed together by a number of stainless steel screws, and a sealing strip is installed at the bottom edge of the cover plate (202).

5. The vehicle-mounted chip liquid cooling heat sink with baffle pillars according to claim 2, characterized in that: The diameter of the multiple fixing rods (2072) is the same as the diameter of the multiple circular grooves (2071). The interior of the heat dissipation box (201) is divided into two connected areas by the irregular guide plate (205). The liquid inlet pipe (203) and the liquid outlet pipe (204) are respectively connected to different areas.

6. The vehicle-mounted chip liquid cooling heat sink with baffle pillars according to claim 1, characterized in that: An indium sheet (102) is mounted on the chip body (101). The indium sheet (102) is mounted on the bottom of the heat sink (201). The bottom of the heat sink (201) is equipped with a plurality of supports (103) and supports (104) for fixing to the module.

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