An integrated broadband dielectric patch antenna

Abstract

This invention belongs to the field of antenna technology, and particularly relates to an integrated broadband dielectric patch antenna, comprising a dielectric substrate, a first metal patch unit, several second metal patch units, and a third metal patch unit. The third metal patch unit has several clearance areas. A non-metallic clearance ring is formed between each second metal patch unit and the third metal patch unit. A first metallized feed post is located at the center of each second metal patch unit. Several metallized through-holes are provided on the dielectric substrate, connecting the first and second metal patch units. Several metallized mounting posts are provided on the dielectric substrate, located near the edge of the third metallized patch unit. Through the above structural design, the dielectric substrate is integrated, and the metallized through-holes maximize the RF signal bandwidth of the first metal patch unit, thereby achieving a broadband effect.

Description

Technical Field

[0001] This invention belongs to the field of antenna technology, and in particular relates to an integrated broadband dielectric patch antenna. Background Technology

[0002] With the continuous evolution of Global Navigation Satellite Systems (GNSS), the number of systems and the frequency bands they use are increasing. Taking China's BeiDou Navigation Satellite System as an example, its high-precision positioning function and short message communication service (including reception and transmission) both require independent operating frequency bands. Therefore, modern navigation terminal antennas need to have the multi-functional integration capability to support high-precision positioning and short message transmission and reception simultaneously in multiple frequency bands.

[0003] Traditionally, the use of stacked structures is the mainstream technical solution for achieving multi-band GNSS coverage. This solution usually expands the operating frequency band by increasing the number of dielectric layers and radiating patches. That is, each new frequency band often requires an additional layer of structure, which directly leads to a continuous increase in the overall physical size of the antenna (such as thickness and area) and the number of stacked layers, resulting in a significant increase in manufacturing costs. Existing stacked antenna technology is facing severe challenges in further meeting the requirements of multi-frequency, miniaturization and low cost.

[0004] For example, Chinese patent document CN112290205A discloses a miniaturized combined antenna, the GNSS antenna portion of which includes: a first dielectric layer; a first radiating patch disposed on the upper surface of the dielectric layer with a feed point for forming one of a first or second radiating elements; a feed pin connected to the feed point; a second dielectric layer disposed on the lower surface of the first dielectric layer; and a second radiating patch located between the two dielectric layers, the second patch having a coupling hole, the feed pin extending into the hole, and a gap existing between the pin and the hole wall, so that the second patch forms another radiating element through coupling excitation, is disposed on the lower surface of the second dielectric layer for reference, and provides grounding for the two radiating patches.

[0005] However, existing technologies that introduce radio frequency signals into the antenna structure and excite the desired resonant mode to achieve effective radiation typically require soldering discrete components such as feed pins onto a dielectric substrate. This process not only increases the complexity of the antenna structure but also places higher demands on the precision and consistency of manufacturing, ultimately leading to reduced production efficiency and increased difficulty in cost control. Therefore, it is urgent to explore new antenna architectures and feeding technologies to solve the aforementioned technical bottlenecks. Summary of the Invention

[0006] The purpose of this invention is to provide an integrated broadband dielectric patch antenna, which aims to solve the technical problems of complex antenna structure and high cost in the prior art.

[0007] To achieve the above objectives, an integrated broadband dielectric patch antenna is provided in this embodiment of the invention, comprising a dielectric substrate, a first metal patch unit, a plurality of second metal patch units, and a third metal patch unit. The first metal patch unit is fixed to the upper surface of the dielectric substrate, and each of the second and third metal patch units is fixed to the lower surface of the dielectric substrate. The third metal patch unit has a plurality of clearance regions, and each of the second metal patch units is located in one of the clearance regions. A non-metallic clearance ring is formed between each of the second and third metal patch units. A first metal patch is disposed at the center of each of the second metal patch units. The first metallized feed post has an equal center distance from each of the first metallized feed posts to the first metal patch unit. The dielectric substrate has a plurality of metallized through holes, each of which passes through both ends of the first metal patch unit and each of the second metal patch units, and the metallized through holes on each of the second metal patch units are connected to the first metallized feed post. The dielectric substrate also has a plurality of metallized mounting posts, each of which is located near the edge of the third metallized patch unit and is soldered to the pads on the circuit PCB.

[0008] Preferably, the first metal patch unit and the third metal patch unit are both arranged in a centrally symmetrical manner with the center of the first metal patch unit as the center.

[0009] Preferably, the medium plate is provided with a central through hole, the two ends of the central through hole are respectively disposed through the first metal patch unit and the third metal patch unit, and the central through hole is arranged to coincide with the center of the first metal patch unit.

[0010] Preferably, the third metal patch unit is provided with a plurality of second metallized feed posts, and the distance between each second metallized feed post and the center of the first metal patch unit is equal.

[0011] Preferably, the line connecting the first metallized feed post and the second metallized feed post to the center of the first metal patch unit is arranged to coincide.

[0012] Preferably, the lines connecting the first metallized feed post and the second metallized feed post to the center of the first metal patch unit are staggered at an angle.

[0013] Preferably, an annular protrusion is provided along the bottom edge of the medium plate, the annular protrusion is provided around the third metal patch unit, and each of the metallized mounting posts is spaced apart on the bottom plane of the annular protrusion.

[0014] Preferably, an antenna ground is provided on the bottom plane of the annular protrusion, and each of the metallized mounting posts is disposed on the antenna ground.

[0015] Preferably, the dielectric substrate is provided with a plurality of metallized grounding holes, each of the metallized grounding holes being arranged at intervals around the first metal patch unit, and each of the metallized grounding holes being provided with an extension branch.

[0016] The integrated broadband dielectric patch antenna provided by the embodiments of the present invention has at least one of the following technical effects: An integrated broadband dielectric patch antenna of this application comprises a dielectric substrate and a first metal patch unit, a second metal patch unit, and a third metal patch unit fixed on the dielectric substrate. The third metal patch unit has several clearance areas. Multiple second metal patch units are provided, each located within a clearance area. A non-metallized clearance ring is formed between the second and third metal patch units. Multiple metallized through-holes are provided on the dielectric substrate, arranged in multiple groups. Each group of multiple metallized through-holes is disposed on one of the second metal patch units. A first metallized through-hole is disposed on each second metal patch unit. The substrate includes metallized feed posts and multiple metallized mounting posts on the lower surface of the dielectric substrate. Each metallized mounting post surrounds the edge of the third metal patch unit and is located close to the edge of the dielectric substrate. The metallized mounting posts are soldered to the circuit PCB. This structural design achieves integrated dielectric substrate setup, replacing conventional soldered feed pins with feed posts integrated on the dielectric substrate. The metallized mounting posts are soldered to the pads on the circuit PCB, replacing the screws or adhesive backing of traditional antennas. Furthermore, the metallized vias maximize the RF signal bandwidth of the first metal patch unit, thereby achieving a wideband effect. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a front view of an integrated broadband dielectric patch antenna (style 1) provided in an embodiment of the present invention.

[0019] Figure 2This is a rear view of an integrated broadband dielectric patch antenna (style 1) provided in an embodiment of the present invention.

[0020] Figure 3 The image shows a front view of an integrated broadband dielectric patch antenna (style 2) provided in an embodiment of the present invention.

[0021] Figure 4 This is a rear view of an integrated broadband dielectric patch antenna (style 2) provided in an embodiment of the present invention.

[0022] Figure 5 The image shows a front view of an integrated broadband dielectric patch antenna (style 3) provided in an embodiment of the present invention.

[0023] Figure 6 This is a rear view of an integrated broadband dielectric patch antenna (style 3) provided in an embodiment of the present invention.

[0024] Figure 7 The image shows a front view of an integrated broadband dielectric patch antenna (style four) provided in an embodiment of the present invention.

[0025] Figure 8 This is a rear view of an integrated broadband dielectric patch antenna (style four) provided in an embodiment of the present invention.

[0026] Figure 9 The image shows a front view of an integrated broadband dielectric patch antenna (style 5) provided in an embodiment of the present invention.

[0027] Figure 10 This is a rear view of an integrated broadband dielectric patch antenna (style 5) provided in an embodiment of the present invention.

[0028] Figure 11 A flowchart illustrating the manufacturing process of an integrated broadband dielectric patch antenna, provided for an embodiment of the present invention.

[0029] The following are the labeling elements in the figure: 10—Dielectric plate; 11—Central through hole; 12—Metallic mounting post 13—Metallized through-hole; 14—Annular protrusion; 20—First metal patch unit 30—Second metal patch unit; 31—First metallized feed post; 32—Non-metallized anti-drain ring. 40—Third metal patch unit; 41—Second metallized power supply post. Detailed Implementation

[0030] The embodiments of the present invention are described in detail below, and examples of these embodiments are provided in the appendix. Figures 1-11As shown, the same or similar reference numerals throughout denote the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain embodiments of the invention, and should not be construed as limiting the invention.

[0031] In the description of the embodiments of the present invention, it should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the present invention.

[0032] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of embodiments of the present invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0033] In the embodiments of the present invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of the present invention according to the specific circumstances.

[0034] In one embodiment of the present invention, such as Figures 1-2As shown, an integrated broadband dielectric patch antenna is provided, including a dielectric substrate 10, a first metal patch unit 20, a plurality of second metal patch units 30, and a third metal patch unit 40. The first metal patch unit 20 is fixed to the upper surface of the dielectric substrate 10, and each of the second metal patch units 30 and the third metal patch unit 40 is fixed to the lower surface of the dielectric substrate 10. The third metal patch unit 40 is provided with a plurality of clearance areas, and each of the second metal patch units 30 is located in a clearance area. A non-metallic clearance ring 3 is formed between each of the second metal patch units 30 and the third metal patch unit 40. 2. The non-metallized anti-cavity ring 32 is filled with dielectric material to block the direct electrical connection between the second metal patch unit 30 and the third metal patch unit 40. Each second metal patch unit 30 has a first metallized power supply post 31 at its center. The dielectric plate 10 has several metallized through holes 13, with both ends of each metallized through hole 13 penetrating the first metal patch unit 20 and each second metal patch unit 30 respectively. Each metallized through hole 13 connects the first metal patch unit 20 and the second metal patch unit 30. The two ends of each metallized through hole 13 are connected to the first metal patch unit 20 and the second metal patch unit 40. Unit 30 is electrically connected, and each metallized via 13 on each second metal patch unit 30 is arranged around the first metallized feed post 31. The radio frequency signal of the first metal patch unit 20 is conducted to the second metal patch unit 30 on the lower surface through these metallized vias 13, and output to the circuit PCB from the first feed post 31 located at the center of the second metal patch unit 30. Each metallized via 13 has a different distance relative to the center of the first metal patch unit 20, that is, a different offset. Different offsets produce different resonant frequencies. Each group of metallized vias 13 is equivalent to a group of feeds. The wideband radio frequency signal generated by the collector is concentrated and output from the first metallized feed post. In addition, by setting a non-metallized air-avoiding ring, the radio frequency signal on the third metal patch unit 40 is coupled to the first feed post 31, so that the output signal is further superimposed with the radio frequency signal of the third metal patch unit, further expanding the bandwidth and improving the gain. Several metallized mounting posts 12 are provided on the dielectric board 10. Each metallized mounting post 12 is set close to the edge of the third metal patch unit 40 and is fixed to the circuit PCB by soldering, replacing the traditional antenna fixing method of screws or adhesive.

[0035] An integrated broadband dielectric patch antenna of this application is composed of a dielectric substrate 10 and a first metal patch unit 20, a second metal patch unit 30, and a third metal patch unit 40 fixed on the dielectric substrate 10. The first metal patch unit 20 has several clearance areas. Multiple second metal patch units 30 are provided, each located within a clearance area. A non-metallized clearance ring 32 is formed between the second metal patch units 30 and the third metal patch units 40. Multiple metallized through-holes 13 are provided on the dielectric substrate 10, and these through-holes 13 are arranged in multiple groups. Each group of multiple metallized through-holes 13 is disposed on one of the second metal patch units 30. A first metallized feed post 31 is provided on the patch unit 30, and multiple metallized mounting posts 12 are also provided on the lower surface of the dielectric substrate 10. Each metallized mounting post 12 is provided along the edge of the third metal patch unit 40 and is close to the edge of the dielectric substrate 10. Through the above structural configuration, the dielectric substrate 10 is integrated. The feed post integrated on the dielectric replaces the conventional soldered feed pin, and the metallized mounting posts 12 integrated on the dielectric substrate 10 replace the screw or adhesive fixing method of the traditional antenna. Furthermore, the metallized through-hole 13 and the non-metallized anti-air ring 32 maximize the RF signal bandwidth of the first metal patch unit 20, thereby achieving a wideband effect.

[0036] In another embodiment of the invention, such as Figures 1-2 As shown, the first metal patch unit 20 and the third metal patch unit 40 are both centrally symmetrically arranged with the center of the first metal patch unit 20 as the center. This centrally symmetrical layout ensures the symmetry of the antenna radiation pattern, reduces the pattern distortion caused by high-order mode excitation, and improves the cross-polarization performance, thus making it suitable for application scenarios such as multiple-input multiple-output (MIMO) systems.

[0037] In another embodiment of the invention, such as Figures 1-10 As shown, a central through hole 11 is provided on the dielectric substrate 10. The two ends of the central through hole 11 pass through the first metal patch unit 20 and the third metal patch unit 40, respectively. The central through hole 11 coincides with the center of the first metal patch unit 20. The central through hole 11 can be a metallized or non-metallized structure to accommodate additional structural components, feeding components or heat dissipation channels. Its coaxial alignment design helps to maintain the geometric symmetry of the antenna, reduce the impact of manufacturing tolerances on performance, and may serve as a tuning element to extend the low-frequency response.

[0038] In another embodiment of the invention, such as Figure 4 , Figure 6 , Figure 8 and Figure 10 As shown, the third metal patch unit 40 is provided with a plurality of second metallized feed pillars 41. Each second metallized feed pillar 41 is equidistant from the center of the first metal patch unit 20. This equidistant distribution makes the second metallized feed pillars 41 form a circular array, which can be used for differential feeding or phase control to excite the ring resonant mode of the third metal patch unit 40, thereby increasing the operating bandwidth and supporting circular polarization radiation.

[0039] In another embodiment of the invention, such as Figures 1-6 As shown, the line connecting the first metallized feed post 31 and the second metallized feed post 41 to the central axis of the first metal patch unit 20 is arranged to coincide, that is, the first metallized feed post 31 and the second metallized feed post 41 are aligned along the same radial line. This configuration strengthens the electromagnetic coupling between the feed networks, which is beneficial to realize compact dual-band operation, and simplifies feed phase matching and reduces signal delay differences.

[0040] In another embodiment of the invention, such as Figure 8 and Figure 10 As shown, the connection between the first metallized feed post 31 and the second metallized feed post 41 and the central axis of the first metal patch unit 20 is set at an angle, that is, there is an angular offset between the feed posts (such as 30° or 45°). This angled design can introduce a phase difference to control the antenna polarization characteristics (such as to achieve dual polarization or elliptical polarization) and reduce inter-feed interference to improve isolation. In another embodiment of the invention, such as Figure 4 , Figure 8 and Figure 10 As shown, an annular protrusion 14 is provided along the bottom edge of the dielectric substrate 10. The annular protrusion 14 surrounds the third metal patch unit 40. Each metallized mounting post 12 is spaced apart on the bottom plane of the annular protrusion 14. The annular protrusion 14 serves as an overhead structure, raising the third metal patch unit 40 so that a cavity is formed between the third metal patch unit 40 and the circuit PCB. The third metal patch unit 40 and the air or vacuum in the cavity generate another resonant frequency. This resonant signal is output to the PCB by the second metallized feed post 41 provided on the third metal patch unit 40. On the circuit PCB, it is combined with the radio frequency signal output by the first metallized feed post, further expanding the bandwidth of the antenna.

[0041] In another embodiment of the invention, such as Figure 4 , Figure 8 and Figure 10As shown, an antenna ground is provided on the bottom plane of the annular protrusion 14, and each metallized mounting post 12 is provided on the antenna ground. The antenna ground is a continuous metal layer, which serves as a reference ground plane and is electrically connected to the metallized mounting post 12 to form a low-impedance grounding path, thereby reducing common-mode noise and electromagnetic interference (EMI) and improving the radiation efficiency of the antenna in the high-frequency band.

[0042] In another embodiment of the invention, such as Figure 2 , Figure 4 , Figure 6 , Figure 8 and Figure 10 As shown, the dielectric substrate 10 is provided with several grounding holes (not shown in the figure), each grounding hole is arranged at intervals around the first metal patch unit 20, and each grounding hole is provided with an extension branch (not shown in the figure) to connect the upper and lower metal layers to form a uniform ground; the extension branch is a microstrip patch structure that extends radially from the grounding hole. The grounding holes and grounding branches mainly reduce the frequency of the antenna to compensate for the insufficient dielectric constant of the dielectric material, and can first expand the bandwidth of the antenna and reduce the axial ratio of the antenna.

[0043] like Figure 11 As shown, another embodiment of the present invention provides a manufacturing process for an integrated broadband dielectric patch antenna, comprising the following steps: S1: Injection-molded medium plate material 10; S2: Surface pretreatment: including sandblasting, using 80~300 mesh diamond abrasive, pressure 3~8kg, to roughen the surface.

[0044] After completing step S2, ultrasonic cleaning is used to remove dirt, sand particles, and oil stains brought in during sandblasting. Then, degreasing is performed by using weak acid and alkali to clean the surface of the parts and remove grease, dust, and other substances from the material. These substances will directly affect the effect of subsequent processes and the appearance quality of the workpiece.

[0045] S3: Chemical roughening: A mixture of chromic acid and sulfuric acid is used at a temperature of 60±5°C for 5~8 minutes to form a micro-rough surface on the material, increasing the contact area between the subsequent plating layer and the workpiece, making the workpiece surface hydrophilic, which is conducive to the smooth progress of subsequent processes, and increasing the adhesion between the plating layer and the material.

[0046] Then, the reducing properties of the solution are used to remove harmful substances remaining on the surface of the workpiece. These residual substances will have an adverse effect on subsequent production. If these substances are carried into subsequent processes, plating defects will occur.

[0047] S4: Catalysis and electroless nickel deposition: A palladium chloride-containing catalyst solution is used, which is evenly distributed in the dovetail-shaped pores of the roughened surface to provide catalytic centers for the subsequent electroless nickel deposition reaction. Then, the divalent tin around the palladium ions is dissolved through a degumming process, exposing it. Because the palladium chloride adsorbed on the workpiece surface in the catalyst solution does not have catalytic activity, its surface is covered by divalent tin. Subsequently, electroless nickel deposition is performed, and a conductive nickel-phosphorus alloy layer is covered on the workpiece surface, forming a 0.2μm thick conductive layer, which makes the originally non-conductive material conductive.

[0048] Metallize the surface of the material, hang it up and bake it in a 70°C oven for 1 hour. After it is completely dry, proceed to the next step.

[0049] S5: Laser segmentation uses CO2 or ultraviolet lasers to precisely cut according to the circuit diagram with an accuracy of ±0.05mm. The accuracy of the laser affects the accuracy of the circuit and its performance. The dimensions of the laser area are precisely calibrated, often using specialized measuring tools, microscopic measurements, and two-dimensional measurements.

[0050] During the aforementioned hanging and laser treatment processes, the workpiece inevitably comes into contact with oil and dirt. Once this dirt is carried into the subsequent processes, it will have a significant impact on the adhesion and appearance quality of the coating. Therefore, a second degreasing treatment is required. Only after degreasing and re-hanging can the subsequent processing be carried out.

[0051] S6: Alternating treatment of copper plating and micro-etching: The circuit area is thickened by copper plating, which is very close to pure copper and has good conductivity. Micro-etching removes the chemical nickel in the non-circuit area. This process is repeated at least three times. S7: Thick copper plating: A copper layer is electroplated in the circuit area to the target thickness, giving the workpiece good conductivity and low resistance.

[0052] S8: Tin plating and passivation: Copper is a highly active metal with good electrical properties, but it is easily oxidized. Since the workpiece needs to be soldered in subsequent production, a layer of tin needs to be plated on the surface to protect the copper layer and enhance solderability. In some high temperature, high humidity, salt spray and acid / alkalinity environments, it is also quite easy to be oxidized, so the workpiece surface needs to be passivated. Generally, a special passivation solution is used.

[0053] After passivation, the workpiece is washed with water and then placed in an oven at 70°C for 2 hours. After the workpiece is completely dry and cooled, it is hung up.

[0054] S9: Testing: After plating test, frequency test and continuity test.

[0055] Coating tests include adhesion testing (i.e., cross-cut adhesion test), high and low temperature testing, salt spray testing, and conductivity testing (the main test is resistance).

[0056] Silkscreen printing: Planar antennas require a ring of solder resist ink to be silkscreened around the solder joints to prevent solder from overflowing onto the pads during soldering. Photosensitive ink is generally used, and the ink is dried under ultraviolet light after silkscreening.

[0057] Frequency Testing: Using a network analyzer and a specialized fixture, the resonant frequency of each product set is tested. This resonant frequency is the product's output center frequency. After the instrument is calibrated, the resonant curve of a standard component is first displayed on the instrument and memorized on the instrument's monitor. After the product is installed in the fixture, the displayed curve is compared with the previously memorized standard curve. Products with a deviation within ±3m are considered qualified products, while products exceeding the deviation are considered unqualified products.

[0058] Continuity test: Impedance test is performed on the upper and lower layers of the antenna. Our product design does not require continuity between the upper and lower layers. However, solder splatter during PIN soldering, if not cleaned thoroughly, can penetrate the adhesive backing, causing continuity between the upper and lower layers. Therefore, continuity testing of the upper and lower layers is necessary.

[0059] Set the multimeter to the continuity setting. Use the two test probes of the multimeter to test the antenna lines on the upper and lower layers of the antenna board. If the multimeter reading does not change, the product is qualified. If the multimeter reading changes, the product is unqualified and needs to be disassembled and the solder residue cleaned until the upper and lower layers are no longer conductive.

[0060] S10: Appearance Inspection and Packaging. The appearance of the product is inspected, mainly through visual inspection, following standard procedures. Products that pass the appearance inspection are then packaged. Generally, they are placed in blister packs and then boxed.

[0061] The integrated broadband dielectric patch antenna produced by the manufacturing process of this invention uses a feed post integrated on the dielectric instead of a conventional soldered feed pin, and maximizes the RF signal bandwidth of the first metal patch unit 20 through the metallized through-hole 13, thereby achieving a broadband effect.

[0062] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. An integrated broadband dielectric patch antenna, characterized in that: The device includes a dielectric substrate, a first metal patch unit, several second metal patch units, and a third metal patch unit. The first metal patch unit is fixed to the upper surface of the dielectric substrate, and each of the second and third metal patch units is fixed to the lower surface of the dielectric substrate. Each third metal patch unit has several clearance areas, and each second metal patch unit is located within one of these clearance areas. A non-metallized clearance ring is formed between each second and third metal patch unit. A first metallized feed post is located at the center of each second metal patch unit. The center distance from the power supply post to the first metal patch unit is equal. The dielectric substrate is provided with a plurality of metallized through holes. The two ends of each metallized through hole pass through the first metal patch unit and each of the second metal patch units, respectively. Each metallized through hole connects the first metal patch unit and the second metal patch unit. Each metallized through hole on each of the second metal patch units is arranged around the first metallized power supply post. The dielectric substrate is provided with a plurality of metallized mounting posts. Each metallized mounting post is arranged close to the edge of the third metal patch unit. Each metallized mounting post is soldered to the circuit PCB.

2. The integrated broadband dielectric patch antenna according to claim 1, characterized in that: Both the first metal patch unit and the third metal patch unit are arranged in a centrally symmetrical manner with the center of the first metal patch unit as the center.

3. The integrated broadband dielectric patch antenna according to claim 1, characterized in that: The medium plate is provided with a central through hole, and the two ends of the central through hole are respectively provided through the first metal patch unit and the third metal patch unit, and the central through hole is arranged to coincide with the center of the first metal patch unit.

4. An integrated broadband dielectric patch antenna according to claim 1, characterized in that: The third metal patch unit is provided with a plurality of second metallized feed posts, and each second metallized feed post is equidistant from the center of the first metal patch unit.

5. An integrated broadband dielectric patch antenna according to claim 4, characterized in that: The lines connecting the first metallized feed post and the second metallized feed post to the center of the first metal patch unit are aligned.

6. An integrated broadband dielectric patch antenna according to claim 4, characterized in that: The lines connecting the first metallized feed post and the second metallized feed post to the center of the first metal patch unit are staggered at an angle.

7. An integrated broadband dielectric patch antenna according to any one of claims 1 to 6, characterized in that: An annular protrusion is provided along the bottom edge of the medium plate, the annular protrusion surrounds the third metal patch unit, and each of the metallized mounting posts is spaced apart on the bottom plane of the annular protrusion.

8. An integrated broadband dielectric patch antenna according to claim 7, characterized in that: An antenna ground is provided on the bottom plane of the annular protrusion, and each of the metallized mounting posts is provided on the antenna ground.

9. An integrated broadband dielectric patch antenna according to claim 7, characterized in that: An antenna ground is provided on the bottom plane of the annular protrusion, and each of the metallized mounting posts is provided on the antenna ground.

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