High-voltage control box integrated electric connection structure and high-voltage control box

Abstract

The utility model relates to a kind of high-voltage control box integrated type electric connection structure and high-voltage control box, involve power battery pack control technical field, the electric connection structure includes shell body, the shell body is made of insulating material;Main copper bar, the main copper bar is embedded in the shell body, the main copper bar includes series copper bar and independent copper bar;And collection copper sheet, the collection copper sheet is electrically connected with the main copper bar, and with the shell body injection molding integrated, the collection copper sheet is worn in the shell body and in the shell body same side extension joint. The utility model can simplify assembly process, improve connection reliability, reduce contact resistance and reduce manufacturing cost.

Description

Technical Field

[0001] This utility model relates to the field of power battery pack control technology, and in particular to an integrated electrical connection structure for a high-voltage control box and a high-voltage control box. Background Technology

[0002] In existing power battery systems, the main copper busbar is responsible for transmitting high current, while the battery management system (BMS) needs to collect voltage data from each circuit node to monitor the battery status. Traditional voltage acquisition methods typically employ additional wiring harnesses or retrofitted small copper strips to transmit the voltage signal from the main copper busbar to the battery management system for processing via external connections. This approach has been widely used in the design of power battery packs.

[0003] However, existing voltage acquisition solutions face several technical challenges. Due to the use of external wiring harnesses or retrofitted small copper plates, the overall structure is complex (low internal space utilization, messy wiring), involves numerous assembly steps, and is prone to reliability issues during long-term use. Furthermore, multiple contact points exist between the main copper busbar and the acquisition terminal, easily generating contact resistance and affecting the accuracy of voltage sampling. Simultaneously, the wiring method of the external harness also leads to assembly inconvenience, increasing manufacturing costs and maintenance difficulty. Utility Model Content

[0004] In view of the shortcomings of the prior art described above, the purpose of this utility model is to provide an integrated electrical connection structure for a high-voltage control box and a high-voltage control box, which can simplify the assembly process, improve connection reliability, reduce contact resistance and reduce assembly costs.

[0005] To achieve the above objectives, the present invention adopts the following technical solution.

[0006] In a first aspect, the present invention provides an integrated electrical connection structure for a high-voltage control box, comprising:

[0007] The outer casing is made of insulating material;

[0008] The main copper busbar, embedded in the outer casing, comprises series copper busbars and independent copper busbars; and

[0009] A copper plate is collected, which is electrically connected to the main copper busbar and integrally molded with the outer casing. The copper plate passes through the outer casing and extends out of the connector on the same side of the outer casing.

[0010] Furthermore, in the above electrical connection structure, the series copper busbar is long and the independent copper busbar is short and the series copper busbar and the independent copper busbar are fixed together in the outer casing.

[0011] Furthermore, in the above electrical connection structure, the copper sampling plate includes a main circuit sampling plate and a branch circuit sampling plate. The main circuit sampling plate is connected to the series copper busbar, and the branch circuit sampling plate is connected to the independent copper busbar.

[0012] Furthermore, in the above electrical connection structure, the main circuit acquisition chip is located between the branch circuit acquisition chips.

[0013] Furthermore, in the above-mentioned electrical connection structure, the outer casing simultaneously fixes the main copper busbar and the collecting copper sheet through an injection molding process.

[0014] Furthermore, in the above electrical connection structure, the main copper busbar includes one series copper busbar and two independent copper busbars. The series copper busbar is used to connect two relays in series, and the two independent copper busbars are respectively connected to the corresponding two relays.

[0015] Furthermore, in the above electrical connection structure, when the number of relays inside the housing is odd, the extra relays are connected by a separate independent copper busbar.

[0016] Secondly, this utility model provides a high-voltage control box, comprising:

[0017] The high-voltage control box integrated electrical connection structure as described in any one of the first aspects above;

[0018] A relay group, wherein the relay group is disposed within the housing and electrically connected to the main copper busbar; and

[0019] The BMS board has an interface, and the connector of the copper acquisition plate is directly electrically connected to the interface of the BMS board.

[0020] Furthermore, in the aforementioned high-voltage control box, the BMS board is a PCB board, the interface of the BMS board is a metal slot, and the connector of the copper acquisition plate is directly inserted into the metal slot.

[0021] Furthermore, in the aforementioned high-voltage control box, the connector of the copper sampling plate transmits the voltage signal of the main copper busbar to the BMS board for sampling and monitoring through the metal slot.

[0022] In summary, compared with the prior art, the present invention has at least one of the following beneficial technical effects:

[0023] This utility model's integrated electrical connection structure for the high-voltage control box simplifies assembly processes, reduces the use of external wiring harnesses, and improves the overall structural compactness by molding the acquisition copper sheet and main copper busbar into a single unit. This integrated molding solution eliminates multiple contact points between the main copper busbar and the acquisition terminal, reducing contact resistance and improving the accuracy and reliability of voltage sampling. Furthermore, the design of the acquisition copper sheet extending its connector on the same side of the housing facilitates connection to the BMS board, simplifies wiring, reduces manufacturing costs and maintenance difficulty, and provides better stability and reliability during long-term use. Attached Figure Description

[0024] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0025] Figure 1 This is a schematic diagram of the first embodiment of the integrated electrical connection structure of the high-voltage control box of this utility model.

[0026] Figure 2 This is a side view of the first embodiment of the integrated electrical connection structure of a high-voltage control box according to the present invention.

[0027] Figure 3 This is a schematic diagram of the second embodiment of the integrated electrical connection structure of the high-voltage control box of this utility model.

[0028] Figure 4 This is a side view of the second embodiment of the integrated electrical connection structure of the high-voltage control box of this utility model.

[0029] Figure 5 This is a side view of an embodiment of a high-voltage control box according to the present invention.

[0030] Figure descriptions: 1. Outer casing; 2. Main copper busbar; 21. Series copper busbar; 22. Independent copper busbar; 3. Acquisition copper plate; 31. Main circuit acquisition plate; 32. Branch circuit acquisition plate; 4. BMS board; 5. Relay group. Detailed Implementation

[0031] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application. Furthermore, it should be understood that the specific embodiments described herein are only for illustration and explanation of this application and are not intended to limit this application.

[0032] It should be noted that the order of description of the following embodiments is not intended to limit the preferred order of the embodiments of this application. Furthermore, the descriptions of each embodiment in the following embodiments have their own emphasis; for parts not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.

[0033] Reference Figure 1 This utility model embodiment provides an integrated electrical connection structure for a high-voltage control box, including an outer shell 1, a main copper busbar 2, and a copper acquisition plate 3.

[0034] The housing 1 is made of insulating material and forms the basic structure of the high-voltage control box. The housing 1 includes multiple compartments and mounting features, and is designed to accommodate relays. In some embodiments, the housing 1 is manufactured using an injection molding process.

[0035] The main copper busbar 2 is embedded in the housing 1 and is used to provide electrical connection. The main copper busbar 2 includes a series copper busbar 21 and an independent copper busbar 22, which are both embedded in the housing 1. In some embodiments, the series copper busbar 21 is used to connect relays in series, and the independent copper busbar 22 is individually connected to the corresponding relays.

[0036] The collecting copper sheet 3 is electrically connected to the main copper busbar 2 and integrally injection molded with the outer casing 1, extending from the main copper busbar 2. The collecting copper sheet 3 passes through the outer casing 1 and extends out of the connector on the same side of the outer casing 1. In some embodiments, the collecting copper sheet 3 is designed to protrude from the outer casing 1 and connect to external components. In other embodiments, the collecting copper sheet may also be embedded within the outer casing 1 and electrically connected via a plug-in head of an external component.

[0037] In some implementations, the housing 1 simultaneously secures the main copper busbar 2 and the acquisition copper plate 3 via injection molding. The integrated design of the housing 1, the main copper busbar 2, and the acquisition copper plate 3 creates a compact and organized electrical connection structure.

[0038] Reference Figure 1 and Figure 2In some embodiments, the series copper busbar 21 is long and narrow, while the independent copper busbar 22 is short and narrow. The series copper busbar 21 and the independent copper busbar 22 are arranged in parallel to each other and are fixed together in the outer casing 1.

[0039] Reference Figure 1 In the first embodiment, the four relays inside the housing 1 are arranged vertically. Correspondingly, refer to... Figure 2 The series copper busbar 21 has a long strip structure and extends along the length of the outer casing 1. The independent copper busbar 22 has a short strip structure, and its length is less than that of the series copper busbar 21. The series copper busbar 21 and the independent copper busbar 22 are arranged parallel to each other within the outer casing 1. The series copper busbar 21 and the independent copper busbar 22 are fixed together in the outer casing 1 by injection molding. During the injection molding process, the insulating material of the outer casing 1 covers the series copper busbar 21 and the independent copper busbar 22, forming a stable fixed structure.

[0040] Reference Figure 3 In the second embodiment, two of the four relays inside the housing 1 are arranged vertically, and the other two are arranged horizontally. (Refer to...) Figure 4 In this embodiment, the arrangement of the series copper busbar 21 and the independent copper busbar 22 adapts to different relay placement methods. The series copper busbar 21 maintains a long strip structure, while the independent copper busbar 22 maintains a short strip structure. The arrangement relationship of the series copper busbar 21 and the independent copper busbar 22 within the housing 1 is adjusted according to the relay placement position, such as... Figure 4 As shown, the independent copper busbars 22 connecting the two horizontally placed relays in the middle are arranged vertically, and the independent copper busbars 22 connecting the vertically placed relays on both sides are arranged parallel to the series copper busbars 21. The series copper busbars 21 and the independent copper busbars 22 are fixed by the injection molding process of the housing 1.

[0041] In some embodiments, the housing 1 is manufactured from insulating material using an injection molding process, and the series copper busbar 21 and the independent copper busbar 22 are embedded inside the housing 1 during the injection molding process. The injection molding process ensures that the series copper busbar 21 and the independent copper busbar 22 are stably positioned within the housing 1, preventing displacement or loosening of the series copper busbar 21 and the independent copper busbar 22 during use.

[0042] Reference Figure 2 and Figure 4 In some embodiments, the copper acquisition piece 3 includes a main circuit acquisition piece 31 and a branch circuit acquisition piece 32. The main circuit acquisition piece 31 is connected to the series copper busbar 21, and the branch circuit acquisition piece 32 is connected to the independent copper busbar 22.

[0043] Reference Figure 2In the first embodiment, the main circuit acquisition chip 31 is located in the middle of the housing 1, and is electrically connected to the series copper busbar 21. The branch circuit acquisition chips 32 are located on the left and right sides of the housing 1, and are electrically connected to their respective independent copper busbars 22. Both the main circuit acquisition chip 31 and the branch circuit acquisition chip 32 pass through the housing 1 and extend their connectors from the same side of the housing 1.

[0044] Reference Figure 4 In the second embodiment, the main circuit acquisition chip 31 is also connected to the series copper busbar 21, and the branch circuit acquisition chip 32 is also connected to the independent copper busbar 22. In this embodiment, the arrangement of the main circuit acquisition chip 31 and the branch circuit acquisition chip 32 adapts to different placement methods of the relays inside the housing 1. The branch circuit acquisition chips 32 are arranged at regular intervals along the top edge of the housing 1, and the main circuit acquisition chip 31 is located between the branch circuit acquisition chips 32.

[0045] In some embodiments, the main circuit acquisition piece 31 and the branch circuit acquisition piece 32 are integrally formed with the corresponding series copper busbar 21 and independent copper busbar 22 through an injection molding process. The main circuit acquisition piece 31 extends from the series copper busbar 21, and the branch circuit acquisition piece 32 extends from the independent copper busbar 22. The main circuit acquisition piece 31 and the branch circuit acquisition piece 32 are fixed simultaneously with the series copper busbar 21 and the independent copper busbar 22 during the injection molding process of the housing 1.

[0046] Reference Figure 2 and Figure 4 In some embodiments, the main circuit acquisition chip 31 is located between the branch circuit acquisition chips 32. This arrangement has different specific implementations in different embodiments.

[0047] Reference Figure 2 In the first embodiment, the main circuit acquisition chip 31 is located in the central region of the housing 1, and the branch circuit acquisition chips 32 are located to the left and right of the main circuit acquisition chip 31, respectively. The main circuit acquisition chip 31 is electrically connected to the series copper busbar 21, and the branch circuit acquisition chips 32 are electrically connected to their respective independent copper busbars 22. Both the main circuit acquisition chip 31 and the branch circuit acquisition chips 32 extend from the same side of the housing 1, forming a uniform connector arrangement. In this arrangement, the main circuit acquisition chip 31 serves as the central acquisition point, and the branch circuit acquisition chips 32 serve as branch acquisition points on both sides, forming a symmetrical voltage acquisition structure.

[0048] Reference Figure 4In the second embodiment, the main circuit acquisition chip 31 is also located between the branch circuit acquisition chips 32, but the arrangement adapts to different relay placement configurations. The branch circuit acquisition chips 32 are distributed at regular intervals along the top edge of the housing 1, and the main circuit acquisition chip 31 is interspersed in the intervals between the branch circuit acquisition chips 32. In this embodiment, the main circuit acquisition chip 31 and the branch circuit acquisition chips 32 form an alternating connector layout. This arrangement allows the main circuit acquisition chip 31 to provide voltage acquisition functionality for the main circuit between the branch circuit acquisition chips 32, while maintaining the compactness of the overall structure.

[0049] In some implementations, the arrangement of the main circuit acquisition chip 31 among the branch circuit acquisition chips 32 provides a hierarchical structure for voltage acquisition. The main circuit acquisition chip 31 is responsible for acquiring the voltage signal of the main circuit, while the branch circuit acquisition chips 32 are responsible for acquiring the voltage signals of each branch circuit. This arrangement allows the BMS board 4 to simultaneously acquire voltage information from both the main circuit and branch circuits through a unified interface, achieving comprehensive voltage monitoring functionality.

[0050] In some embodiments, the outer casing 1 simultaneously fixes the main copper busbar 2 and the collecting copper sheet 3 through an injection molding process. During the injection molding process, the insulating material is heated to a molten state, and the molten insulating material is molded in the injection mold around the pre-placed main copper busbar 2 and collecting copper sheet 3. During injection molding, the main copper busbar 2 and collecting copper sheet 3 are placed as inserts at designated positions in the injection mold, and the molten insulating material fills the mold cavity and covers the surfaces of the main copper busbar 2 and collecting copper sheet 3, exposing the required electrical connection locations.

[0051] In some embodiments, the injection molding process achieves mechanical fixation of the main copper busbar 2 and the collecting copper sheet 3 through the cooling and solidification of the insulating material. During cooling, the insulating material shrinks and tightly conforms to the surface contours of the main copper busbar 2 and the collecting copper sheet 3, forming a stable encapsulation structure. A mechanical lock is formed between the insulating material of the outer casing 1 and the main copper busbar 2 and the collecting copper sheet 3, preventing displacement of the main copper busbar 2 and the collecting copper sheet 3 within the outer casing 1.

[0052] In some embodiments, the injection molding process achieves precise positioning of the main copper busbar 2 and the collecting copper sheet 3 within the housing 1. The design of the injection mold ensures that the main copper busbar 2 and the collecting copper sheet 3 maintain a predetermined spatial relationship during injection molding. The series copper busbar 21 and the independent copper busbar 22 are positioned in the injection mold according to design requirements, and the main circuit collecting sheet 31 and the branch circuit collecting sheet 32 ​​are positioned in the injection mold according to a predetermined extension direction.

[0053] In some embodiments, the injection molding process simultaneously manufactures the outer casing 1 and fixes the main copper busbar 2 and the collecting copper sheet 3 in a single molding operation. Injection molding eliminates the additional fixing steps in subsequent assembly processes, reducing the complexity of the manufacturing process. After injection molding, the outer casing 1, main copper busbar 2, and collecting copper sheet 3 form an integrated structure, which exhibits good structural stability and reliable electrical connections.

[0054] In some implementations, the injection molding process ensures that the connector portion of the acquisition copper strip 3 accurately extends beyond the designated surface of the housing 1. The design of the injection mold controls the position and angle at which the acquisition copper strip 3 passes through the housing 1, ensuring that the connector of the acquisition copper strip 3 extends from the same side of the housing 1 and maintains an appropriate extension length. The injection molding process achieves consistent positioning of the connector of the acquisition copper strip 3 through precise mold control, providing a standardized interface configuration for subsequent connection with the BMS board 4.

[0055] In some embodiments, the main copper busbar 2 includes a series copper busbar 21 and two independent copper busbars 22. The series copper busbar 21 and the two independent copper busbars 22 form a specific electrical connection configuration in the housing 1, and the series copper busbar 21 and the independent copper busbars 22 respectively perform different electrical connection functions.

[0056] Specifically, the series copper busbar 21 is used to connect two relays in series. The series copper busbar 21 has a long, strip-shaped structure, with its two ends connected to the corresponding terminals of the two relays. The series copper busbar 21 establishes an electrical connection path between the two relays, allowing current to flow between them. The long, strip-shaped structure of the series copper busbar 21 accommodates the spatial distance between the two relays, and its conductive cross-sectional area meets the current-carrying requirements of a series circuit.

[0057] Two independent copper busbars 22 are each individually connected to two corresponding relays. Each independent copper busbar 22 forms an independent electrical connection with one relay. The short strip structure of the independent copper busbar 22 is adapted to the connection requirements of a single relay, and the conductive cross-sectional area of ​​the independent copper busbar 22 meets the current carrying requirements of an independent circuit.

[0058] In some embodiments, the series copper busbar 21 and the two independent copper busbars 22 are made of the same conductive material, which has good conductivity and mechanical strength. The series copper busbar 21 and the independent copper busbars 22 have the same surface treatment process, which improves their oxidation resistance and contact stability.

[0059] Reference Figure 1 and Figure 3 In some implementations, two relays form a relay group 5, and four relays are provided inside the housing 1, forming two relay groups 5 in pairs.

[0060] Reference Figure 1 In the first embodiment, the four relays inside the housing 1 are arranged vertically. The four relays are arranged along the length of the housing 1, maintaining the same vertical orientation. The four relays are paired to form two relay groups 5, each containing two adjacent relays. In this embodiment, the two relay groups 5 form a symmetrical arrangement within the housing 1, and are located in different areas of the housing 1.

[0061] The two relays in each relay group 5 are electrically connected via a series copper busbar 21. The series copper busbar 21 connects the corresponding terminals of the two relays within the relay group 5 and carries the series current within the relay group 5. The two relays in each relay group 5 are also connected to an external circuit via independent copper busbars 22, which provide an independent electrical connection path for each relay.

[0062] Reference Figure 3 In the second embodiment, the four relays inside the housing 1 are arranged in a mixed configuration. Two of the four relays are placed vertically, and the other two are placed horizontally. The vertically placed relays and the horizontally placed relays form different spatial configurations within the housing 1. The four relays are still paired up to form two relay groups 5, each relay group 5 containing one vertically placed relay and one horizontally placed relay.

[0063] In relay group 5, one relay is positioned horizontally and the other vertically. The horizontally positioned relay and the vertically positioned relay form a vertical spatial arrangement within relay group 5. The long axis of the horizontally positioned relay is perpendicular to the long axis of the vertically positioned relay, and the horizontally positioned relay and the vertically positioned relay are electrically connected through a series copper busbar 21.

[0064] In some embodiments, the different arrangements of the relays within the relay group 5 adapt to the spatial layout requirements of the housing 1. The horizontal and vertical relay arrangements fully utilize the available space within the housing 1, achieving a compact configuration of the relay group 5. The shapes and arrangements of the series copper busbars 21 and the independent copper busbars 22 are adjusted accordingly to accommodate different relay placement orientations.

[0065] In some implementations, the arrangement of the two relay groups 5 within the housing 1 is configured according to specific application requirements. The relays in the two relay groups 5 may be arranged in the same way, or they may use different relay arrangements. The internal structure of the housing 1 is designed to accommodate the different arrangement requirements of the relay groups 5, providing each relay group 5 with corresponding installation space and fixing structure.

[0066] In some implementations, the configuration of the relay group 5 affects the arrangement of the main copper busbar 2 and the acquisition copper plate 3. The placement of the relays within the relay group 5 determines the connection path between the series copper busbar 21 and the independent copper busbar 22, and the spatial arrangement of the relay group 5 affects the extension positions of the main circuit acquisition plate 31 and the branch circuit acquisition plate 32. The housing 1, through injection molding, simultaneously accommodates the installation requirements of the relay group 5 and the fixing requirements of the main copper busbar 2 and the acquisition copper plate 3.

[0067] In some implementations, when the number of relays within the housing 1 is odd, the excess relays are connected using a separate, independent copper busbar 22. In this configuration, the housing 1 may contain an odd number of relays, such as three or five. When the number of relays is odd, after pairing the relays into relay groups 5, one relay remains. This remaining single relay is electrically connected via a dedicated, independent copper busbar 22, which does not share connections with other relays. The separate independent copper busbar 22 provides an independent electrical connection path for the remaining relay, and its size and shape are designed according to the connection requirements of the individual relay.

[0068] During the injection molding process, the individual independent copper busbar 22 is simultaneously embedded into the housing 1 along with other series-connected copper busbars 21 and the independent copper busbar 22, forming a stable fixed structure. The corresponding branch circuit acquisition chip 32 extends from the individual independent copper busbar 22, passes through the housing 1, and extends a connector on the same side of the housing 1 to provide the voltage acquisition function of the individual relay for the BMS board 4.

[0069] This utility model embodiment also discloses a high-voltage control box.

[0070] Reference Figure 1 , Figure 3 as well as Figure 5 A high-voltage control box includes an integrated electrical connection structure for the high-voltage control box, a relay group 5, and a BMS board 4.

[0071] The high-voltage control box includes an integrated electrical connection structure as described in any of the above embodiments. The integrated electrical connection structure includes a housing 1, a main copper busbar 2, and a copper sampling plate 3. The housing 1 is made of insulating material, the main copper busbar 2 is embedded in the housing 1, and the copper sampling plate 3 is integrally injection molded with the main copper busbar 2 and passes through the housing 1. The integrated electrical connection structure provides basic electrical connection functions and structural support for the high-voltage control box.

[0072] The relay group 5 is housed within the housing 1 and electrically connected to the main copper busbar 2. The relay group 5 includes multiple relays, all electrically connected via the main copper busbar 2. In some embodiments, the relays within the relay group 5 are connected in series via a series copper busbar 21, while the relays within the relay group 5 are independently connected via a separate copper busbar 22. The electrical connection between the relay group 5 and the main copper busbar 2 provides circuit control functionality for the high-voltage control box.

[0073] In some embodiments, the relay group 5 is arranged in a specific manner within the housing 1. The relays of the relay group 5 maintain a stable mounting position within the housing 1, and the relays of the relay group 5 form a reliable electrical connection with the main copper busbar 2. The housing 1 provides mounting space and a fixing structure for the relay group 5, and the insulating material of the housing 1 ensures electrical isolation between the relay group 5 and the external environment.

[0074] BMS board 4 uses a PCB board, and its interface is a metal slot. The connector of the acquisition copper plate 3 is directly inserted into the metal slot. BMS board 4 receives voltage signals from acquisition copper plate 3 through the interface, and processes and analyzes the received voltage signals. A direct electrical connection path is formed between the connector of acquisition copper plate 3 and the interface of BMS board 4, eliminating additional connection links.

[0075] The connectors of the copper acquisition plate 3 extend from the same side of the housing 1, forming a unified connection interface with the interface of the BMS board 4. The connectors of the copper acquisition plate 3 are arranged regularly on the outside of the housing 1, and the interface of the BMS board 4 matches this arrangement. The direct electrical connection between the connectors of the copper acquisition plate 3 and the interface of the BMS board 4 ensures reliable transmission of voltage signals.

[0076] Furthermore, the connector of the acquisition copper plate 3 transmits the voltage signal of the main copper busbar 2 to the BMS board 4 for sampling and monitoring through a metal slot. A direct electrical connection path is formed between the connector of the acquisition copper plate 3 and the metal slot, which transmits the voltage signal on the main copper busbar 2 to the voltage sampling circuit of the BMS board 4.

[0077] Specifically, the main copper busbar 2 carries high-voltage current and generates a corresponding voltage signal during the carrying process. The acquisition copper sheet 3 is injection molded integrally with the main copper busbar 2, and the acquisition copper sheet 3 directly obtains the voltage signal from the main copper busbar 2. The connector part of the acquisition copper sheet 3 extends out of the outer shell 1 and forms a plug-in connection with the metal slot of the BMS board 4, establishing a voltage signal transmission path from the main copper busbar 2 to the BMS board 4.

[0078] The metal slot receives the voltage signal from the copper plate 3 connector and transmits it to the internal circuitry of the BMS board 4. The voltage sampling circuit of the BMS board 4 acquires the real-time voltage information of the main copper busbar 2 through the metal slot and performs analog-to-digital conversion on the received voltage signal. The processor of the BMS board 4 receives and analyzes the digitized voltage signal, monitoring the operating status of the main copper busbar 2 based on changes in the voltage signal.

[0079] In some embodiments, the exposed direction of the copper acquisition plate 3 extends to any one of the six sides of the housing 1 for easy insertion with the BMS board 4. The six sides of the housing 1 include the top, bottom, front, back, left, and right sides, and the copper acquisition plate 3 extends from any one of these sides. The exposed direction of the copper acquisition plate 3 is selected according to the installation position and connection requirements of the BMS board 4, ensuring convenient connection with the BMS board 4.

[0080] In some embodiments, the copper sampling plate 3 extends from the top surface of the housing 1, and the BMS board 4 is mounted in the top region of the housing 1. The connector of the copper sampling plate 3 extends upward and forms a vertical connection with the interface of the BMS board 4. In other embodiments, the copper sampling plate 3 extends from the side of the housing 1, and the BMS board 4 is mounted in the side region of the housing 1. The connector of the copper sampling plate 3 extends laterally and forms a horizontal connection with the interface of the BMS board 4.

[0081] In some implementations, the orientation of the copper acquisition plate 3 is chosen considering the overall layout and installation environment of the high-voltage control box. The orientation of the copper acquisition plate 3 adapts to the installation method of the high-voltage control box in the application environment, ensuring convenient connection between the BMS board 4 and the high-voltage control box. The structural design of the housing 1 supports the extension of the copper acquisition plate 3 from different directions, and the housing 1 provides corresponding passageways for the copper acquisition plate 3.

[0082] The integrated electrical connection structure of the high-voltage control box, relay group 5, and BMS board 4 form a complete high-voltage control system. The integrated electrical connection structure provides the electrical connection basis, relay group 5 provides circuit control functions, and BMS board 4 provides voltage monitoring and management functions. The high-voltage control box realizes the electrical connection between relay group 5 and BMS board 4 through the integrated electrical connection structure, and the high-voltage control box realizes voltage signal acquisition and transmission through copper acquisition plate 3.

[0083] The high-voltage control box integrates electrical connections, circuit control, and voltage monitoring. The outer casing 1 provides a unified mounting platform and protective structure for all components; the main copper busbar 2 and the acquisition copper plates 3 enable electrical connections and signal acquisition; the relay group 5 implements circuit switching control; and the BMS board 4 processes and manages voltage signals. This integrated design of the high-voltage control box improves the system's compactness and reliability.

[0084] The above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this utility model.

Claims

1. An integrated electrical connection structure for a high-voltage control box, characterized in that, include: The outer casing (1) is made of insulating material; A main copper busbar (2), which is embedded in the outer casing (1), includes a series copper busbar (21) and an independent copper busbar (22); and A copper plate (3) is collected. The copper plate (3) is electrically connected to the main copper busbar (2) and is integrally molded with the outer shell (1). The copper plate (3) is inserted through the outer shell (1) and extends out of the connector on the same side of the outer shell (1).

2. The integrated electrical connection structure of the high-voltage control box according to claim 1, characterized in that, The series copper busbar (21) is long and narrow, and the independent copper busbar (22) is short and narrow. The series copper busbar (21) and the independent copper busbar (22) are fixed together in the outer shell (1).

3. The integrated electrical connection structure of the high-voltage control box according to claim 1, characterized in that, The copper acquisition plate (3) includes a main circuit acquisition plate (31) and a branch circuit acquisition plate (32). The main circuit acquisition plate (31) is connected to the series copper busbar (21), and the branch circuit acquisition plate (32) is connected to the independent copper busbar (22).

4. The integrated electrical connection structure of the high-voltage control box according to claim 3, characterized in that, The main circuit acquisition chip (31) is located between the branch circuit acquisition chips (32).

5. The integrated electrical connection structure of the high-voltage control box according to claim 1, characterized in that, The outer casing (1) simultaneously fixes the main copper busbar (2) and the collecting copper sheet (3) through injection molding.

6. The integrated electrical connection structure of the high-voltage control box according to claim 1, characterized in that, The main copper busbar (2) includes a series copper busbar (21) and two independent copper busbars (22). The series copper busbar (21) is used to connect two relays in series, and the two independent copper busbars (22) are connected to the corresponding two relays separately.

7. The integrated electrical connection structure of the high-voltage control box according to claim 6, characterized in that, When the number of relays inside the housing (1) is odd, the extra relays are connected by a separate independent copper busbar (22).

8. A high-voltage control box, characterized in that, include: The high-voltage control box integrated electrical connection structure as described in any one of claims 1-7; A relay group (5) is disposed inside the housing (1) and electrically connected to the main copper busbar (2); and BMS board (4), the BMS board (4) is provided with an interface, and the connector of the acquisition copper sheet (3) is directly electrically connected to the interface of the BMS board (4).

9. The high-voltage control box according to claim 8, characterized in that, The BMS board (4) is a PCB board, and the interface of the BMS board (4) is a metal slot. The connector of the copper acquisition sheet (3) is directly inserted into the metal slot.

10. The high-voltage control box according to claim 9, characterized in that, The connector of the copper sampling plate (3) transmits the voltage signal of the main copper busbar (2) to the BMS board (4) for sampling and monitoring through the metal slot.

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