Terminal soldering anti-tin creep structure

Abstract

The utility model discloses a terminal welding anti -soldering structure, terminal includes the fixed positioning of the fixed part for with plastic shell, the welding part for with circuit board surface welding and the elastic support arm of pressure can elastic deformation, the fixed part and elastic support arm respectively from the welding part both sides extend upwards, and the elastic support arm upper end forms the through contact for contact through, be equipped with the flux containing groove on the fixed part side wall, the flux containing groove height is lower than the through contact of elastic support arm upper end, and the redundant soldering tin and flux of welding part and circuit board surface welding produce can all be contained in the flux containing groove after the along fixed part side wall climb, the utility model discloses can prevent the flux of melting along the elastic support arm and climb to the surface of through contact, has guaranteed the stability of terminal signal transmission, and has guaranteed the high -frequency transmission performance of connector, has also improved terminal and circuit board welding strength.

Description

Technical Field

[0001] This utility model relates to a connector terminal, and more particularly to a terminal soldering anti-solder creep structure. Background Technology

[0002] The chip module 10 and circuit board 20 are generally electrically connected through a flat connector 30 to achieve functional expansion. The conductive terminals of the flat connector are of a press-fit structure. The terminals include a retaining part, a soldering part, an elastic support arm, and an elastic contact arm. The soldering part of the terminal is located on the outer side of the lower end of the plastic shell. The lower side of the soldering part forms a horizontal soldering surface. The soldering surface of the soldering part is soldered onto the circuit board to achieve electrical connection between the terminal and the circuit board. On both sides of the soldering part are the retaining part and the elastic support arm extending upward, respectively. The retaining part of the terminal is used to fix and position the terminal within the plastic shell. The elastic contact arm is located at the upper end of the retaining part. An upper contact point protruding from the outer side of the upper end of the plastic shell is formed on the elastic contact arm. The elastic contact arm also has a lower contact point located within the plastic shell. When the upper contact point on the elastic contact arm is pressed down by the chip module, the lower contact point on the elastic contact arm tightly contacts the conductive contact part at the upper end of the elastic support arm. At this time, the terminal forms a closed loop, and a dual-channel signal transmission structure is formed between the chip module and the circuit board to improve the high-frequency performance of the flat connector.

[0003] During the SMT soldering process between the terminal and the circuit board, the solder paste is heated in a reflow oven to melt the tin metal. After the reflow oven cools down, the tin metal solidifies, thus soldering the terminal to the PAD surface of the circuit board. During the solder paste melting process, the main components of the solder paste are tin beads, flux (rosin), activators, etc. The active substances in the solder paste have good fluidity and may carry the dissolved flux to the conductive contact part at the upper end of the elastic support arm of the terminal. After the flux solidifies, it adheres to the surface of the conductive contact part, resulting in poor contact between the conductive contact part at the upper end of the elastic support arm of the terminal and the lower contact point of the elastic contact arm, which seriously affects the high-frequency performance of the connector during signal transmission. Utility Model Content

[0004] To overcome the above deficiencies, this utility model provides a terminal soldering anti-climbing structure. This terminal soldering anti-climbing structure can prevent flux from flowing to the conductive contact surface at the upper end of the elastic support arm of the terminal when the soldering part of the terminal is soldered to the circuit board, thereby fully ensuring the signal transmission stability and high-frequency transmission performance of the flat panel connector.

[0005] The technical solution adopted by this utility model to solve its technical problem is: a terminal welding anti-solder creep structure, wherein the terminal includes a holding part for fixing and positioning with a plastic shell, a welding part for welding with the surface of a circuit board, and an elastic support arm that can be elastically deformed under pressure. The holding part and the elastic support arm extend upward from both sides of the welding part, and a conductive contact part for making contact is formed at the upper end of the elastic support arm. A flux receiving groove is provided on the side wall of the holding part. The height of the flux receiving groove is lower than the conductive contact part at the upper end of the elastic support arm. When the welding part is welded to the surface of the circuit board, the excess solder and flux generated can be completely contained in the flux receiving groove after creeping up the side wall of the holding part.

[0006] As a further improvement of this utility model, the flux receiving groove is a T-shaped structure with the upper end width being greater than the lower end width.

[0007] As a further improvement of this utility model, the welding part is a flat plate structure that is flat against the circuit board, and the holding part and the elastic support arm are bent structures that bend upward from both sides of the welding part.

[0008] As a further improvement of this utility model, the welding part is provided with an opening that runs vertically through it. During welding, solder paste can flow upward along the opening and be contained within the opening.

[0009] As a further improvement of this utility model, the lower end of the flux receiving groove on the side wall of the holding part is connected to the opening through a connecting channel to form a siphon structure.

[0010] As a further improvement of this utility model, the holding part and the elastic support arm are bent upward from both sides of the welding part to form an outer arc bending surface. The outer arc bending surface and the circuit board form a solder-accommodating gap, and the solder paste during welding can be accommodated in the solder-accommodating gap.

[0011] As a further improvement of this utility model, the holding part of the terminal extends vertically, the elastic support arm extends obliquely along a direction that makes an angle with the vertical direction, and the elastic support arm gradually moves away from the holding part from bottom to top. The upper end of the holding part is bent to form an elastic contact arm. The free end of the elastic contact arm is bent at least once to form an upper contact point and a lower contact point. The upper contact point is subjected to downward pressure, which can force the lower contact point to move downward and closely contact the upper surface of the conductive contact part at the upper end of the elastic support arm. The conductive contact part at the upper end of the elastic support arm is a bent edge with an angle with the vertical direction greater than the angle between the elastic support arm and the vertical direction.

[0012] The beneficial technical effects of this utility model are as follows: By forming a flux receiving groove on the side wall of the holding part of the terminal, when the solder paste is in a molten state, since the height of the flux receiving groove is lower than the height of the conductive contact part at the upper end of the elastic support arm, excess molten solder paste climbs up along the holding part and enters the flux receiving groove for containment. This prevents the molten solder paste from climbing up along the elastic support arm to the surface of the conductive contact part. This ensures that when the upper contact point of the elastic contact arm of the chip module presses down on the terminal, the lower contact point of the elastic contact arm is stably in contact with the surface of the conductive contact part at the upper end of the elastic support arm, thereby ensuring the stability of signal transmission and the high-frequency transmission performance of the connector. At the same time, it also increases the welding area between the terminal and the circuit board, improves the welding strength between the terminal and the circuit board, and effectively prevents the solder joint from breaking under the action of pull-out force. Attached Figure Description

[0013] Figure 1 A 3D view showing the electrical connection between chip modules and circuit boards via a flat panel connector;

[0014] Figure 2 An exploded 3D view showing the electrical connection between the chip module and the circuit board via a flat panel connector;

[0015] Figure 3 An exploded front view showing the electrical connection between the chip module and the circuit board via a flat panel connector;

[0016] Figure 4 A 3D view of an existing flat panel connector;

[0017] Figure 5 An exploded 3D view of an existing flat panel connector;

[0018] Figure 6 Main view of the chip module's position when it begins to contact the flat panel connector;

[0019] Figure 7 This is a front view of the terminal state when the chip module begins to contact the upper contact point of the terminal;

[0020] Figure 8 Main view of the position status of the chip module when it is pressed against the flat panel connector;

[0021] Figure 9 A front view of the terminal state when the upper contact point of the chip module is pressed into the terminal;

[0022] Figure 10 This is a first perspective view of the first type of terminal of this utility model;

[0023] Figure 11 This is a second perspective view of the first type of terminal of this utility model;

[0024] Figure 12This is a third perspective view of the first type of terminal of this utility model;

[0025] Figure 13 This is a perspective view of the first type of terminal and circuit board welding state of this utility model;

[0026] Figure 14 This is a schematic diagram showing the state of excess solder paste creeping onto the circuit board during the soldering of the first type of terminal of this utility model;

[0027] Figure 15 This is a first perspective view of the second type of terminal of this utility model;

[0028] Figure 16 This is a second perspective view of the second type of terminal of this utility model;

[0029] Figure 17 This is a third perspective view of the second type of terminal of this utility model;

[0030] Figure 18 This is a perspective view of the second type of terminal and circuit board welding state of this utility model;

[0031] Figure 19 This is a schematic diagram showing the state of excess solder paste creeping onto the circuit board during the soldering of the second type of terminal of this utility model. Detailed Implementation

[0032] Example: A terminal soldering anti-crawling structure, the terminal 1 includes a holding part 11 for fixing and positioning with a plastic shell 2, a soldering part 12 for soldering with the surface of a circuit board 20, and an elastic support arm 13 that can elastically deform under pressure. The holding part 11 and the elastic support arm 13 extend upward from both sides of the soldering part 12. The upper end of the elastic support arm 13 forms a conductive contact part 131 for making contact. The side wall of the holding part 11 is provided with a flux 4 receiving groove 111. The height of the flux 4 receiving groove 111 is lower than the conductive contact part 131 at the upper end of the elastic support arm 13. When the soldering part 12 is soldered to the surface of the circuit board 20, the excess solder 3 and flux 4 generated can be completely contained in the flux 4 receiving groove 111 after climbing up the side wall of the holding part 11.

[0033] A flux 4 receiving groove 111 is formed on the side wall of the holding part 11 of the terminal 1 of the flat connector. During soldering, the molten flux 4 flows into the flux 4 receiving groove 111 through the surface of the terminal 1. After solidification, the flux 4 is solidified inside the flux 4 receiving groove 111. This greatly reduces the amount of flux 4 flowing into the surface of the elastic support arm 13 during soldering. Since the height of the flux 4 receiving groove 111 is lower than the conductive contact part 131 at the upper end of the elastic support arm 13, no flux 4 will reach the surface of the conductive contact part 131 at the upper end of the elastic support arm 13. This ensures that the terminal 1 forms a stable closed-loop conductive structure when it is pressed down by the chip module, ensuring stable signal transmission of the terminal 1 in the connector and ensuring dual-channel high-frequency transmission.

[0034] The flux 4 receiving tank 111 has a T-shaped structure with the upper end wider than the lower end. This structure allows the flux 4 to climb upwards smoothly into the flux 4 receiving tank 111, and the flux 4 inside the flux 4 receiving tank 111 is less likely to flow downwards. It can also fully contain the flux 4 and prevent the flux 4 from flowing towards the elastic support arm 13.

[0035] The welding part 12 is a flat plate structure that is flat against the circuit board 20. The holding part 11 and the elastic support arm 13 are bent structures that bend upwards from both sides of the welding part 12. The flat plate structure of the welding part 12 can maintain close contact with the PAD surface on the circuit board 20, ensuring a stable conductive connection between the terminal 1 and the circuit board 20 after welding, ensuring stable signal transmission, and ensuring welding strength. The terminal 1 adopts an integral bent structure, which has a strong overall structure and good elasticity.

[0036] The soldering part 12 is provided with a through hole 121 extending vertically. During soldering, solder paste can flow upward along the through hole 121 and be contained within it. After the solder paste melts and solidifies, the through hole 121 of the soldering part 12 of the terminal 1 can accommodate metallic tin, increasing the soldering area, and can also accommodate part of the flux 4, reducing the amount of flux 4 climbing upward and lowering the height of flux 4 climbing upward.

[0037] The lower end of the flux 4 receiving groove 111 on the side wall of the holding part 11 is connected to the opening 121 through a connecting channel to form a siphon structure 122. The opening 121 of the welding part 12 is connected to the flux 4 receiving groove 111 on the holding part 11 through the connecting channel, thereby forming a siphon channel extending from the welding part 12 of the terminal 1 to the holding part 11, which can siphon the flux 4. When the solder paste melts, it can guide the flux 4 to the holding part 11 of the terminal 1. At the same time, when the tin solidifies, the groove can contain the tin, which can also increase the welding area and increase the welding force.

[0038] The retaining part 11 and the elastic support arm 13 are bent upward from both sides of the welding part 12 to form outer arc bending surfaces. A solder-accommodating gap is formed between the outer arc bending surface and the circuit board 20, allowing the solder paste to be accommodated during welding. This creates a gap between the two sides of the welding part 12 of the terminal 1 and the PAD surface of the circuit board 20 to accommodate the solder 3, ensuring a firm weld.

[0039] The holding portion 11 of the terminal 1 extends vertically, and the elastic support arm 13 extends obliquely along a direction that forms an angle with the vertical direction. The elastic support arm 13 gradually moves away from the holding portion 11 from bottom to top. The upper end of the holding portion 11 is bent to form an elastic contact arm 14. The free end of the elastic contact arm 14 is bent at least once to form an upper contact point 141 and a lower contact point 142. The upper contact point 141 is subjected to downward pressure, which can force the lower contact point 142 to move downward and closely contact the upper surface of the conductive contact portion 131 at the upper end of the elastic support arm 13. The conductive contact portion 131 at the upper end of the elastic support arm 13 is a bent edge with an angle with the vertical direction greater than the angle between the elastic support arm 13 and the vertical direction.

[0040] The retaining part 11 of terminal 1 adopts a vertically upward extending bent edge, which can ensure that terminal 1 is fixed in the plastic shell 2. The elastic support arm 13 adopts a non-tilted upward extending structure, which can ensure that the conductive contact part 131 at its upper end can be smoothly elastically deformed when pressure is applied. Moreover, the slope of the conductive contact part 131 is gentler than that of the elastic support arm 13, which ensures stable contact with the lower contact point 142 of the elastic contact arm 14. At the same time, since the elastic support arm 13 has a larger slope, it is less conducive to the flux 4 climbing up.

Claims

1. A terminal soldering anti-tin creep structure, wherein the terminal (1) includes a retaining part (11) for fixing and positioning with a plastic shell (2), a soldering part (12) for soldering with the surface of a circuit board (20), and an elastic support arm (13) that can elastically deform under pressure, wherein the retaining part and the elastic support arm extend upward from both sides of the soldering part, and the upper end of the elastic support arm forms a conductive contact part (131) for making contact, characterized in that: The side wall of the holding part is provided with a flux receiving groove (111). The height of the flux receiving groove is lower than the conductive contact part at the upper end of the elastic support arm. When the welding part is welded to the surface of the circuit board, the excess solder (3) and flux (4) generated can be fully contained in the flux receiving groove after climbing up the side wall of the holding part.

2. The terminal solder creep tin prevention structure of claim 1, wherein: The flux reservoir is a T-shaped structure with a width at the top greater than that at the bottom.

3. The terminal solder creep tin prevention structure of claim 1, wherein: The welding part is a flat plate structure that is flat against the circuit board, and the holding part and the elastic support arm are bent structures that bend upward from both sides of the welding part.

4. The solder creep stop terminal structure of claim 1 or 3, wherein: The welding part is provided with an opening (121) that runs vertically through it. During welding, solder paste can flow upward along the opening and be contained within the opening.

5. The terminal solder creep tin prevention structure of claim 4, wherein: The lower end of the flux receiving tank on the side wall of the retaining part is connected to the opening through a connecting channel to form a siphon structure (122).

6. The terminal solder creep tin prevention structure of claim 3, wherein: The retaining part and the elastic support arm are bent upward from both sides of the welding part to form an outer arc bending surface. The outer arc bending surface and the circuit board form a solder-accommodating gap, and the solder paste during welding can be accommodated in the solder-accommodating gap.

7. The terminal solder creep tin prevention structure of claim 3, wherein: The holding portion of the terminal extends vertically, and the elastic support arm extends obliquely along a direction that forms an angle with the vertical direction. The elastic support arm gradually moves away from the holding portion from bottom to top. The upper end of the holding portion is bent to form an elastic contact arm (14). The free end of the elastic contact arm is bent at least once to form an upper contact point (141) and a lower contact point (142). The upper contact point is subjected to downward pressure, which can force the lower contact point to move downward and closely contact the upper surface of the conductive contact portion at the upper end of the elastic support arm. The conductive contact portion at the upper end of the elastic support arm is a bent edge with an angle greater than the angle between the elastic support arm and the vertical direction.

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