An electronically commutated motor

Abstract

The utility model provides a kind of electronic commutating motor, including motor and driver, the output shaft of motor is located at the front end of motor, and driver includes main control board and shell;Main control board is located at the one end of motor away from output shaft, and shell cover is located at main control board;Main control board is divided into first area and second area;The side of main control board away from motor bears electrical element;Electrical element includes first electrical element and second electrical element, first electrical element is located in first area, and second electrical element is located in second area;The power of first electrical element is higher than the power of second electrical element. By arranging the electrical element with larger heat output in first area and arranging the electrical element with smaller heat output in first area, the concentrated heat dissipation of key heating elements is realized.

Description

Technical Field

[0001] This utility model relates to the field of motor technology, specifically to an electronically commutated motor. Background Technology

[0002] With the rapid development of technology, the integration and intelligence of motor drivers are constantly improving, and the number of electrical components inside them has increased significantly. During the operation of the motor, the electrical components in the driver will generate a lot of heat. If the heat cannot be dissipated in time, the high temperature will affect the switching characteristics of semiconductor devices, leading to reduced driving efficiency and even causing control signal distortion. Furthermore, long-term high-temperature operation will accelerate the aging of electrical components, shorten the life of the motor driver, and increase the failure rate.

[0003] However, the key heat-generating components in the electrical components of current motor drives are not centrally located, making it impossible to centrally dissipate heat, resulting in low heat dissipation efficiency and affecting the performance and reliability of the motor. Utility Model Content

[0004] This invention addresses the existing problem that the key heat-generating components in the electrical components of a motor driver are not centrally located, making centralized heat dissipation impossible.

[0005] To solve the above problems, this utility model provides an electronically commutated motor, including a motor and a driver. The output shaft of the motor is located at the front end of the motor, and the driver includes a main control board and a housing. The main control board is located at the end of the motor away from the output shaft, and the housing covers the main control board; the main control board is divided into a first area and a second area; The main control board carries electrical components on the side away from the motor; the electrical components include a first electrical component and a second electrical component, the first electrical component is located in a first area, and the second electrical component is located in a second area; the power of the first electrical component is higher than the power of the second electrical component.

[0006] The technical effects achieved by adopting this technical solution are as follows: By concentrating high-power electrical components in the first area and low-power electrical components in the second area, that is, by concentrating high-heat-generating electrical components in the first area and low-heat-generating electrical components in the second area, the key heat-generating components can be centrally cooled. This zoned centralized cooling can optimize the operating temperature gradient of electrical components within the optimal range.

[0007] Optionally, the housing is provided with heat dissipation fins and has an opening. The first area is the cavity inside the housing corresponding to the heat dissipation fins, and the second area is the cavity inside the housing corresponding to the opening.

[0008] The technical effects achieved by adopting this technical solution are as follows: by dividing the main control board into a first area with corresponding heat dissipation fins and a second area with corresponding openings, the first area forms a closed and efficient heat dissipation cavity, and the heat dissipation of the core heat-generating components is centrally managed through the heat dissipation fin structure; at the same time, the second area forms a maintenance channel through the opening design, which allows for quick inspection or replacement of vulnerable parts without disassembling the entire shell.

[0009] Optionally, the first electrical component includes at least one of an insulated gate bipolar transistor module, a transformer, a thin-film capacitor, and a metal-oxide-semiconductor field-effect transistor.

[0010] The technical effect achieved by adopting this technical solution is as follows: By concentrating key heat-generating components such as insulated gate bipolar transistor modules, transformers, metal-oxide-semiconductor field-effect transistors, and thin-film capacitors in a first area with heat dissipation fins, this zoned centralized heat dissipation can optimize the operating temperature gradient of each electrical component within the optimal range.

[0011] Optionally, the second electrical component includes at least one of a transformer, terminal block, relay, common mode inductor, display interface, and DC-DC converter.

[0012] The technical effects achieved by adopting this technical solution are as follows: By concentrating low-heat electrical components such as terminals, relays, common-mode inductors, display interfaces, and DC-DC converters in a second area with openings, the openings provide convenient access for components that require frequent operation and maintenance, allowing wiring adjustments or component replacements to be completed without disassembling the entire housing.

[0013] Optionally, a heat dissipation substrate is provided at the end of the electrical component away from the main control board, which conducts the heat generated by the electrical component to the housing.

[0014] The technical effects achieved by adopting this technical solution are as follows: By setting a heat dissipation substrate between the electrical components and the housing, an efficient heat conduction path is constructed. The heat dissipation substrate is closely attached to the electrical components, and heat is quickly absorbed by the heat dissipation substrate and evenly conducted to the housing. At the same time, the heat dissipation substrate also has a structural support function, which improves the heat dissipation efficiency and enhances the mechanical stability of the main control board. It is particularly suitable for high power density application scenarios that require long-term reliable operation.

[0015] Optionally, the housing may also include a cover that snaps into the opening.

[0016] The technical effects achieved by adopting this technical solution are as follows: by setting a snap-on cover at the opening of the housing, the internal electrical components can be effectively protected and dust can be prevented from entering the drive.

[0017] Optionally, the housing includes an end cover and a side panel, with heat dissipation fins and openings disposed on the end cover, and the heat dissipation fins extending from the end cover to the side panel.

[0018] The technical effect achieved by adopting this technical solution is that the heat dissipation fins are extended from the end cover to the side plate, making the heat dissipation fins more widely distributed and further improving the heat dissipation effect.

[0019] Optionally, the heat dissipation substrate is made of heat dissipation material; and / or the thickness of the heat dissipation substrate is 20~200μm.

[0020] The technical effects achieved by adopting this technical solution are as follows: the heat dissipation substrate made of a heat dissipation material with high thermal conductivity enables the heat generated by electrical components to be quickly transferred to the heat dissipation fins; the ultra-thin design of the heat dissipation substrate reduces the thickness of the thermal resistance layer, further shortening the thermal response speed.

[0021] Optionally, the motor includes a front motor cover, a side motor panel, and a rear motor cover. The front motor cover has a first threaded hole, the side motor panel has a second threaded hole, and the rear motor cover has a third threaded hole. The front motor cover, the side motor panel, and the rear motor cover are fixedly connected by a first screw that passes through the first threaded hole, the second threaded hole, and the third threaded hole in sequence.

[0022] The technical effects achieved by adopting this technical solution are as follows: the first screw passes through the threaded holes of the front cover, side panel and rear cover of the motor in sequence, realizing a tight connection between the three, improving the rigidity and stability of the overall structure, and reducing the risk of vibration or loosening of assembly.

[0023] Optionally, the motor rear end cover is provided with a fourth threaded hole, and the housing is provided with a fifth threaded hole. The motor rear end cover and the housing are fixedly connected by inserting a second screw through the fourth threaded hole and the fifth threaded hole.

[0024] The technical effects achieved by adopting this technical solution are as follows: the rear end cover of the motor is directly fastened to the housing by the second screw, forming a stable mechanical connection, which further effectively improves the vibration resistance and load bearing capacity of the electronic commutation motor during operation, and reduces the loosening or displacement of components caused by vibration. Attached Figure Description

[0025] Figure 1 An exploded view of the structure of the electronically commutated motor provided in the embodiments of this application; Figure 2 This is a schematic diagram of the electronic commutator motor structure provided in an embodiment of this application; Figure 3 This is a schematic diagram of the structure of the shell provided in an embodiment of this application; Figure 4 This is a schematic diagram of the main control board provided in an embodiment of this application; Figure 5This is a structural schematic diagram of the main control board provided in an embodiment of this application from another perspective; Figure 6 An exploded view of the motor portion provided in an embodiment of this application.

[0026] Explanation of reference numerals in the attached figures: 1. Motor; 11. Output shaft; 12. Motor front end cover; 121. First threaded hole; 13. Motor side panel; 131. Second threaded hole; 14. Motor rear end cover; 141. Third threaded hole; 142. Fourth threaded hole; 15. First screw; 2. Driver; 21. Main control board; 211. First area; 212. Second area; 22. Housing; 221. Heat sink fins; 2211. First heat sink fin; 2212. Second heat sink fin; 2213. Third heat sink fin; 2214. Fourth heat sink fin; 222. Opening; 223. Cover plate; 224. End cap; 225. Side panel; 226. Fifth threaded hole; 227. Second screw; 23. Electrical component; 231. Insulated gate bipolar transistor module; 232. Transformer; 233. Thin film capacitor; 234. Metal-oxide-semiconductor field-effect transistor; 235. Terminal block; 236. Relay; 237. Common mode inductor; 238. Display interface; 239. DC-DC converter; 24. Heat sink; 241. First heat sink; 242. Second heat sink; 243. Third heat sink; 244. Fourth heat sink. Detailed Implementation

[0027] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, the specific embodiments of this utility model will be described in detail below.

[0028] This application provides an electronically commutated motor, see... Figures 1 to 5 As shown, Figure 1 This is an exploded view illustrating the structure of the electronically commutated motor provided in the embodiments of this application. Figure 2 This is a schematic diagram of the electronic commutator motor structure provided in an embodiment of this application. Figure 3 This is a schematic diagram of the shell structure provided in an embodiment of this application. Figure 4 This is a schematic diagram of the main control board provided in an embodiment of this application. Figure 5This is a structural schematic diagram of the main control board provided in an embodiment of this application from another perspective. The electronically commutated motor includes a motor 1 and a driver 2. The output shaft 11 of the motor 1 is located at the front end of the motor 1. The driver 2 includes a main control board 21 and a housing 22. The main control board 21 is located at the end of the motor 1 away from the output shaft 11. The housing 22 covers the main control board 21. The main control board 21 is divided into a first region 211 and a second region 212. An electrical component 23 is carried on the side of the main control board 21 away from the motor 1. The electrical component 23 includes a first electrical component and a second electrical component. The first electrical component is located in the first region 211, and the second electrical component is located in the second region 212. The power of the first electrical component is higher than that of the second electrical component. By concentrating high-power electrical components in the first region 211 and low-power electrical components in the second region 212, that is, by concentrating high-heat-generating electrical components in the first region 211 and low-heat-generating electrical components in the first region 212, concentrated heat dissipation of key heat-generating components can be achieved. This zoned concentrated heat dissipation can optimize the operating temperature gradient of electrical components within the optimal range.

[0029] Furthermore, the housing 22 is provided with heat dissipation fins 221 and has an opening 222. The main control board 21 is divided into a first region 211 and a second region 212. The first region 211 is the cavity inside the housing 22 corresponding to the heat dissipation fins 221, and the second region 212 is the cavity inside the housing 22 corresponding to the opening 222. By dividing the main control board 21 into the first region 211 corresponding to the heat dissipation fins 221 and the second region 212 corresponding to the opening 222, the first region 211 forms a closed, high-efficiency heat dissipation cavity, and the heat dissipation of the core heat-generating components is centrally managed through the structure of the heat dissipation fins 221. At the same time, the second region 212 is designed to form a maintenance channel through the opening 222, allowing for quick inspection or replacement of vulnerable parts without disassembling the entire housing 22.

[0030] Furthermore, the first electrical components include an insulated-gate bipolar transistor (IGBT) module 231, a transformer 232, a metal-oxide-semiconductor (MOSFET) field-effect transistor (MOF-FET) 234, and a thin-film capacitor 233. The IGBT module 231, transformer 232, MOF-FET 234, and thin-film capacitor 233 are located in the first region 211. By concentrating key heat-generating components such as the IGBT module 231, transformer 232, MOF-FET 234, and thin-film capacitor 233 within the first region 211 equipped with heat dissipation fins 221, this zoned centralized heat dissipation optimizes the operating temperature gradient of each component within its optimal range.

[0031] Furthermore, the second electrical components include terminal blocks 235, relays 236, common-mode inductors 237, display interfaces 238, and DC-DC converters 239; wherein terminal blocks 235, relays 236, common-mode inductors 237, display interfaces 238, and DC-DC converters 239 are located in the second region 212. By concentrating the auxiliary electrical components 23 such as terminal blocks 235, relays 236, common-mode inductors 237, display interfaces 238, and DC-DC converters 239 within the second region 212 with openings 222, the openings 222 provide convenient physical access for components requiring frequent operation and maintenance, allowing wiring adjustments or component replacements to be completed without disassembling the entire housing 22. The first region 211 and the second region 212 are demarcated by the end face of the insulated-gate bipolar transistor module 231 near the common-mode inductor 237.

[0032] In other embodiments, a heat dissipation substrate 24 is provided at the end of the electrical component 23 facing away from the main control board 21. The heat dissipation substrate 24 conducts the heat generated by the electrical component 23 to the housing 22. By setting the heat dissipation substrate 24 between the electrical component 23 and the housing 22, an efficient heat conduction path is constructed. The heat dissipation substrate 24 is in close contact with the electrical component 23, and the heat dissipation substrate 24 quickly absorbs heat and conducts it evenly to the housing 22. At the same time, the heat dissipation substrate 24 also has a structural support function, which improves the heat dissipation efficiency and enhances the mechanical stability of the main control board 21. It is particularly suitable for high power density applications that require long-term reliable operation.

[0033] To further illustrate, the heat sink 221 includes a first heat sink 2211, a second heat sink 2212, a third heat sink 2213, and a fourth heat sink 2214. The first heat sink 2211 is located in the insulated gate bipolar transistor module 231, the second heat sink 2212 is located in the transformer 232, the third heat sink 2213 is located in the film capacitor 233, and the fourth heat sink 2214 is located in the metal-oxide-semiconductor field-effect transistor 234. In the direction away from the main control board 21, the height of the insulated gate bipolar transistor module 231 is less than the height of the transformer 232, the height of the transformer 232 is less than the height of the film capacitor 233, and the height of the metal-oxide-semiconductor field-effect transistor 234 is less than the height of the main control board 21. The height of the conductor field-effect transistor 234 is equal to the height of the insulated gate bipolar transistor module 231. That is to say, the position of the insulated gate bipolar transistor module 231 corresponds to the first heat sink fin 2211, the position of the transformer 232 corresponds to the second heat sink fin 2212, the position of the thin film capacitor 233 corresponds to the third heat sink fin 2213, and the metal-oxide-semiconductor field-effect transistor 234 corresponds to the fourth heat sink fin 2214. According to the different heights of the first electrical components, heat sink fins 221 of different sizes are set so that the heat sink fins 221 on the housing 22 have a stepped heat dissipation structure, so that the heat dissipation capacity is precisely matched with the heat generation of the first electrical components, avoiding local overheating or heat dissipation redundancy.

[0034] Furthermore, the heat dissipation substrate 24 includes a first heat dissipation substrate 241, a second heat dissipation substrate 242, a third heat dissipation substrate 243, and a fourth heat dissipation substrate 244. The first heat dissipation substrate 241 is disposed between the insulated gate bipolar transistor module 231 and the first heat dissipation fin 2211, and abuts against the first heat dissipation fin 2211. The second heat dissipation substrate 242 is disposed between the transformer 232 and the second heat dissipation fin 2212, and abuts against the second heat dissipation fin 2212. The third heat dissipation substrate 243 is disposed between the thin film capacitor 233 and the third heat dissipation fin 2213, and abuts against the third heat dissipation fin 2213. The fourth heat dissipation substrate 244 is disposed between the transformer 232 and the transformer 232, and abuts against the transformer 232. Between the metal-oxide-semiconductor field-effect transistor 234 and the fourth heat sink 2214, and in contact with the fourth heat sink 2214, the heat generated by the insulated gate bipolar transistor module 231 is conducted to the first heat sink 2211 through the first heat sink substrate 241, the heat generated by the transformer 232 is conducted to the second heat sink 2212 through the second heat sink substrate 242, the heat generated by the thin film capacitor 233 is conducted to the third heat sink 2213 through the third heat sink substrate 243, and the heat generated by the metal-oxide-semiconductor field-effect transistor 234 is conducted to the fourth heat sink 2214 through the fourth heat sink substrate 244.

[0035] In some other embodiments, see Figure 1As shown, the housing 22 also includes a cover plate 223, which is fastened to the opening 222. By providing a fastening cover plate 223 at the opening 222 of the housing 22, the internal electrical components 23 can be effectively protected and dust can be prevented from entering the driver 2.

[0036] Furthermore, the housing 22 also includes an end cover 224 and a side plate 225. The heat dissipation fins 221 and the opening 222 are disposed on the end cover 224, and the side plate 225 is connected to the periphery of the end cover 224. The heat dissipation fins 221 extend from the end cover 224 to the side plate 225, so that the heat dissipation fins 221 are more widely distributed, and the heat dissipation effect is further improved.

[0037] In some other embodiments, the heat dissipation substrate 24 is made of a heat dissipation material; and / or the thickness of the heat dissipation substrate 24 is 20~200μm. The heat dissipation substrate 24, made of a highly thermally conductive heat dissipation material, allows the heat generated by the electrical component 23 to be rapidly transferred to the heat dissipation fins 221; the ultra-thin design of the heat dissipation substrate 24 reduces the thickness of the thermal resistance layer, further shortening the thermal response speed. The heat dissipation substrate 24 can be tightly attached to the surface of the electrical component 23 by welding or coating processes. The heat dissipation material can be a metal-based material (such as aluminum, copper, and their alloys), a thermally conductive interface material (such as silicone grease, gaskets, phase change materials), a highly thermally conductive non-metallic material (such as graphene, aluminum nitride), a composite material (such as metal-diamond, thermally conductive plastics), or a liquid metal (such as gallium-based alloys), etc.

[0038] Among them, see Figure 1 and Figure 6 As shown, Figure 6 The exploded view of the motor portion provided in this embodiment shows that the motor 1 includes a front cover 12, a side panel 13, and a rear cover 14. The front cover 12 is located at the end of the motor near the output shaft 11. The rear cover 14 is located between the motor 1 and the driver 2. The side panel 13 is located between the front cover 12 and the rear cover 14. The front cover 12 has a first threaded hole 121, the side panel 13 has a second threaded hole 131, and the rear cover 14 has a third threaded hole 141. A first screw 15 is sequentially inserted into the first threaded hole 121, the second threaded hole 131, and the third threaded hole 141 to securely connect the front cover 12, the side panel 13, and the rear cover 14. The first screw 15 sequentially passing through the threaded holes of the front cover 12, the side panel 13, and the rear cover 14 achieves a tight connection between the three components, improving the rigidity and stability of the overall structure and reducing the risk of vibration or loosening during assembly.

[0039] The motor rear end cover 14 has a fourth threaded hole 142, and the housing 22 has a fifth threaded hole 226. A second screw 227 passes through the fourth threaded hole 142 and the fifth threaded hole 226 to securely connect the motor rear end cover 14 and the housing 22. The second screw 227 directly fastens the motor rear end cover 14 to the housing 22, forming a stable mechanical connection. This further effectively improves the vibration resistance and load-bearing capacity of the electronic commutator motor during operation, reducing component loosening or displacement caused by vibration. The first screw 15 and the second screw 227 ensure a firm and reliable connection for the electronic commutator motor.

[0040] Furthermore, the heat dissipation fins 221 can be straight, U-shaped, or inclined. Alternatively, to further increase the surface area of ​​the heat dissipation fins 221, a combination of straight, U-shaped, and inclined shapes can be designed according to actual needs, allowing the heat dissipation fins 221 to fully utilize the space of the housing 22 and improve heat dissipation performance. While the present invention has been disclosed above, it is not limited thereto. Any person skilled in the art can make various modifications and alterations without departing from the spirit and scope of the present invention; therefore, the scope of protection of the present invention should be determined by the scope defined in the claims.

Claims

1. An electronically commutated electric motor, characterized in that It includes a motor (1) and a driver (2), the output shaft (11) of the motor is located at the front end of the motor (1), and the driver (2) includes a main control board (21) and a housing (22). The main control board (21) is located at one end of the motor (1) away from the output shaft (11), and the housing (22) covers the main control board (21); the main control board (21) is divided into a first region (211) and a second region (212). The main control board (21) carries electrical components (23) on the side opposite to the motor (1); the electrical components (23) include a first electrical component and a second electrical component, the first electrical component is located in the first region (211) and the second electrical component is located in the second region (212); the power of the first electrical component is higher than the power of the second electrical component.

2. The electronically commutated electric motor of claim 1, characterized in that The housing (22) is provided with heat dissipation fins (221) and has an opening (222). The first region (211) is the cavity inside the housing (22) corresponding to the heat dissipation fins (221), and the second region (212) is the cavity inside the housing (22) corresponding to the opening (222).

3. The electronically commutated electric motor of claim 1, wherein, The first electrical component includes at least one of an insulated gate bipolar transistor module (231), a transformer (232), a thin film capacitor (233), and a metal-oxide-semiconductor field-effect transistor (234).

4. The electronically commutated electric motor of claim 1, wherein, The second electrical component includes at least one of a transformer (232), a terminal block (235), a relay (236), a common-mode inductor (237), a display interface (238), and a DC-DC converter (239).

5. The electronically commutated electric motor of claim 1, wherein, The electrical component (23) has a heat dissipation substrate (24) at one end away from the main control board (21), and the heat dissipation substrate (24) conducts the heat generated by the electrical component (23) to the housing (22).

6. The electronically commutated electric motor of claim 2, wherein, The housing (22) also includes a cover plate (223) that engages with the opening (222).

7. The electronically commutated electric motor of claim 2, wherein, The housing (22) includes an end cap (224) and a side panel (225). The heat dissipation fins (221) and the opening (222) are disposed on the end cap (224). The heat dissipation fins (221) extend from the end cap (224) to the side panel (225).

8. The electronically commutated electric motor of claim 5, wherein, The heat dissipation substrate (24) is made of a heat dissipation material; and / or The thickness of the heat dissipation substrate (24) is 20~200μm.

9. The electronically commutated electric motor of claim 1, wherein, The motor (1) includes a front end cover (12), a side panel (13), and a rear end cover (14). The front end cover (12) has a first threaded hole (121), the side panel (13) has a second threaded hole (131), and the rear end cover (14) has a third threaded hole (141). The front end cover (12), the side panel (13), and the rear end cover (14) are fixedly connected by a first screw (15) that passes through the first threaded hole (121), the second threaded hole (131), and the third threaded hole (141) in sequence.

10. The electronically commutated electric motor of claim 9, characterized in that The motor rear end cover (14) is provided with a fourth threaded hole (142), the shell (22) is provided with a fifth threaded hole (226), the motor rear end cover (14) and the shell (22) are fixedly connected by the second screw rod (227) penetrating into the fourth threaded hole (142) and the fifth threaded hole (226).

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