Power module and inverter
By designing a seamless contact between the driver board and the power board and rationally arranging the circuit board mounting points, the problems of insufficient compactness and connection strength in traditional power modules are solved, achieving a compact layout and reliable connection of the power module and improving heat dissipation efficiency.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- CHAFA FRIEDRICH SCHAFFEN CO LTD
- Filing Date
- 2025-09-03
- Publication Date
- 2026-08-04
AI Technical Summary
In traditional power module design, there is a gap between the driver board and the power board, which makes it difficult to achieve compactness of the power module and inverter. In addition, the layout of the circuit component mounting points is unreasonable, resulting in problems such as interference and insufficient connection strength.
The design adopts a gapless contact between the driver board and the power board, and achieves a compact layout through plate-shaped electrical connectors. Circuit board mounting points and power module mounting points are set in the central and edge areas. The structure is optimized by using heat dissipation insulation plates and cooling fins, and liquid inlet and outlet pipes are integrated to improve heat dissipation efficiency.
This design achieves a compact layout of the drive board and power board, reduces the axial dimension of the power module, improves the stable connection between the circuit board and the inverter circuit components, enhances the connection reliability between the power module and the inverter housing, simplifies the assembly process, and improves heat dissipation efficiency.
Smart Images
Figure CN224596378U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of inverter technology, and more specifically, to power modules and inverters. Background Technology
[0002] The power module is the core component of an inverter, used to convert direct current (DC) to alternating current (AC). A power module typically consists of a power board and a driver board. The power board houses the power switching devices, while the driver board drives and controls these devices.
[0003] In traditional power module designs, the driver board is mounted on the power board with a certain gap between them. This design is not conducive to the compactness of the power module and inverter. In addition, the mounting points of the driver board and power board with the inverter's circuit components, as well as the mounting points of the power module as a whole with the inverter's housing, lack a reasonable layout in traditional power module designs, resulting in problems such as interference and insufficient connection strength.
[0004] It should be noted that the information disclosed in the background section above is only used to enhance the understanding of the background of this application, and therefore may include information that does not constitute prior art known to those skilled in the art. Utility Model Content
[0005] This application provides a power module and an inverter that achieves a compact layout between the driver board and the power board, and a reasonable layout of the circuit board mounting points and the power module mounting points.
[0006] According to one aspect of this application, a power module for an inverter is provided, comprising a power board and a drive board disposed on a housing, wherein the drive board and the power board are in close contact without gaps; the power module includes a central region where the drive board and the power board are disposed, the housing includes an edge region surrounding the central region, the central region and the edge region are provided with circuit board mounting points, and the edge region is further provided with power module mounting points.
[0007] In some embodiments, the drive board and the power board are bonded together by a plate-shaped electrical connector.
[0008] In some embodiments, the electrical connector includes a connector for electrically connecting electronic components of the drive board and the power board, and an insulating support portion supporting the non-electronic component areas of the drive board and the power board, wherein the connector and the insulating support portion are integrated into a plate-shaped structure.
[0009] In some embodiments, the power board and the housing are connected by a heat dissipation insulating plate.
[0010] In some embodiments, the heat dissipation insulating plate, the power plate, the electrical connector, and the drive plate are stacked in sequence and screwed to the shell plate.
[0011] In some embodiments, a cooling space is reserved between the heat dissipation insulation plate and the shell plate, and cooling fins are provided in the cooling space; the power module further includes an inlet pipe and an outlet pipe separately disposed in the edge region and communicating with the cooling space.
[0012] In some embodiments, the electronic components of the driver board are exposed on the surface of the driver board; the electronic components of the power board are embedded in the power board, and the power board forms a chip embedded circuit board.
[0013] In some embodiments, circuit board mounting points distributed in the central region are disposed on the electrical connector and extend from the drive board.
[0014] In some embodiments, the edge region includes an idle edge region where no other components of the power module are disposed and a functional edge region where other components of the power module are disposed; each idle edge region is provided with multiple circuit board mounting points; the functional edge region includes multiple DC busbars, AC busbars, liquid inlet pipes and liquid outlet pipes of the power module respectively disposed thereon, and each functional edge region is provided with at least one circuit board mounting point.
[0015] In some embodiments, the circuit board mounting points located in the functional edge region of the DC bus can be used as separate circuit board mounting points or reused as power module mounting points.
[0016] In some embodiments, the circuit board mounting point is configured as an embedded threaded sleeve.
[0017] In some embodiments, the power module mounting points are distributed at least at each corner of the edge region.
[0018] In some embodiments, the edge region includes an idle edge region where no other components of the power module are disposed and a functional edge region where other components of the power module are disposed; the corners and edges of the idle edge region are provided with mounting points for the power module, and the corners of the functional edge region are provided with mounting points for the power module.
[0019] In some embodiments, the power module mounting point is configured as a through hole.
[0020] In some embodiments, the edge region is further provided with a plurality of positioning holes; wherein the plurality of positioning holes includes a pair distributed diagonally in the edge region.
[0021] In some embodiments, the power module further includes an AC busbar and a DC busbar separately disposed in the edge region; wherein the AC busbar integrates a current sensor magnetic ring, and / or the DC busbar integrates an EMC magnetic ring and a Y capacitor.
[0022] In some embodiments, the mounting brackets for the DC busbar and the AC busbar are respectively screwed to the shell plate.
[0023] According to another aspect of this application, an inverter is provided, the inverter being configured with a power module as described in any of the above embodiments.
[0024] The beneficial effects of this application compared to the prior art include at least the following:
[0025] The driver board and power board have a gapless contact, which enables a compact layout of the driver board and power board, reduces the axial dimension of the power module, and facilitates the assembly of the power module in the inverter.
[0026] Circuit board mounting points are located in the central area of the power module and the edge area of the casing, providing a stable and reliable connection between the power module's circuit board and the inverter's circuit components. Power module mounting points are also located in the edge area of the casing, providing a stable and reliable connection between the power module as a whole and the inverter's housing. By placing only circuit board mounting points in the central area and spaced-out circuit board and power module mounting points in the edge areas, a reasonable zoning layout of the circuit board and power module mounting points is achieved, ensuring a reliable connection for both the power module's circuit board and the power module as a whole, while avoiding interference and excessive occupation of the central area.
[0027] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and do not limit this application. Attached Figure Description
[0028] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application. It is obvious that the drawings described below are merely some embodiments of this application, and those skilled in the art can obtain other drawings based on these drawings without any inventive effort.
[0029] Figure 1 and Figure 2 This document shows a schematic diagram of the power module structure in an embodiment of this application.
[0030] Figure 3 This document shows a schematic diagram of the structure of the electrical connector in an embodiment of this application;
[0031] Figure 4This document shows a schematic diagram of the shell plate structure in an embodiment of this application;
[0032] Figure 5 A schematic diagram of the structure of the heat dissipation insulation plate in an embodiment of this application is shown. Detailed Implementation
[0033] Exemplary embodiments will now be described more fully with reference to the accompanying drawings. However, these exemplary embodiments can be implemented in many forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided to make this application more comprehensive and complete, and to fully convey the concept of the exemplary embodiments to those skilled in the art.
[0034] The accompanying drawings are merely illustrative of this application and are not necessarily drawn to scale. The same reference numerals in the drawings denote the same or similar structures, and therefore, repeated descriptions of them will be omitted.
[0035] The terms "upper," "lower," etc., indicating orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this application. The term "multiple" means two or more, unless otherwise explicitly specified. In addition, in the description of this application, unless otherwise explicitly specified and limited, the term "connection" should be interpreted broadly, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, or it can be a connection within two elements.
[0036] It should be noted that, unless otherwise specified, the embodiments of this application and the features in different embodiments can be combined with each other.
[0037] Figure 1 and Figure 2 The diagram illustrates the structure of the power module in the embodiments of this application, combined with Figure 1 and Figure 2 As shown, the power module for an inverter provided in this application embodiment includes a power board 200 and a drive board 300 disposed on a housing 100, with no gap between the drive board 300 and the power board 200; wherein, the power module includes a central region where the drive board 300 and the power board 200 are disposed, the housing 100 includes an edge region (110, 120) surrounding the central region, the central region and the edge region (110, 120) are provided with circuit board mounting points (400a, 400b, 400b'), and the edge region (110, 120) is also provided with power module mounting points (500a, 500b).
[0038] The drive board 300 and the power board 200 have a gapless contact, which enables a compact layout of the drive board 300 and the power board 200, reduces the axial dimension of the power module, and facilitates the assembly of the power module in the inverter.
[0039] Circuit board mounting points (400a, 400b, 400b') are provided in the central area of the power module and the edge areas (110, 120) of the housing 100 to provide a stable and reliable connection between the circuit boards (drive board 300 and power board 200) of the power module and the circuit components (e.g., control board, DC filter components, etc.) of the inverter; the edge areas (110, 120) of the housing 100 are also provided with power module mounting points (500a, 500b) to provide a stable and reliable connection between the power module as a whole and the housing of the inverter. By setting only circuit board mounting point 400a in the central area, and setting circuit board mounting points (400b, 400b') and power module mounting points (500a, 500b) at intervals in the edge areas (110, 120), a reasonable partitioned layout of circuit board mounting points (400a, 400b, 400b') and power module mounting points (500a, 500b) is achieved while ensuring reliable connection of the power module circuit board and the power module as a whole, avoiding interference and excessive occupation of the central area.
[0040] In some embodiments, the drive board 300 and the power board 200 are bonded together by a plate-shaped electrical connector 600, achieving gapless contact between the drive board 300 and the power board 200. The plate-shaped electrical connector 600 can provide uniform and reliable support while achieving electrical connection and simplifying the assembly process.
[0041] Figure 3 The structure of the electrical connector is illustrated, combined with Figures 1 to 3 As shown, in some embodiments, the electrical connector 600 includes a connector 610 that electrically connects the electronic components of the drive board 300 and the power board 200, and an insulating support 620 that supports the non-electronic component areas of the drive board 300 and the power board 200. The connector 610 and the insulating support 620 are integrated into a plate-shaped structure. The connector 610 is responsible for transmitting signals and power, while the insulating support 620 provides mechanical support and ensures reasonable electrical clearances and creepage distances. The integration of the connector 610 and the insulating support 620 into a plate-shaped structure can improve the structural rigidity of the power module, reduce the number of parts, and simplify the assembly process.
[0042] The insulating support 620 may be made of engineering plastics, such as PPS (polyphenylene sulfide) or PBT (polybutylene terephthalate), but is not limited thereto.
[0043] Continue to combine Figure 1 and Figure 2As shown, in some embodiments, the power board 200 and the shell plate 100 are connected by a heat dissipation insulation plate 660, which enables the heat generated by the power board 200 and the drive board 300 to be conducted to the shell plate 100, while also serving as insulation and support.
[0044] In some embodiments, the heat dissipation insulation plate 660, power plate 200, electrical connector 600 and drive plate 300 are stacked in sequence and screwed to the shell plate 100 for fixation, which helps to balance the contact pressure between the layers and optimize structural stability and heat conduction efficiency.
[0045] Figure 4 The structure of the shell plates is illustrated. Figure 5 The structure of the heat dissipation insulation plate is illustrated, combined with Figure 1 , Figure 2 , Figure 4 and Figure 5 As shown, in some embodiments, a cooling space 160 is reserved between the heat dissipation insulation plate 660 and the shell plate 100. The cooling space 160 can be realized by grooves provided in the heat dissipation insulation plate 660 and / or the shell plate 100. Cooling fins 666 are provided in the cooling space 160. The power module also includes an inlet pipe 710 and an outlet pipe 720, which are separately provided in the functional edge region 120 and communicate with the cooling space 160. The cooling space 160 forms a coolant flow channel, allowing the coolant to directly cool the heat dissipation insulation plate 660. The cooling fins 666 can increase the heat dissipation area and improve the heat dissipation efficiency. The inlet pipe 710 and the outlet pipe 720 serve as interfaces for connecting to an external cooling system and are integrated in the functional edge region 120 to realize the modular design of the power module.
[0046] The inlet pipe 710 and the outlet pipe 720 can be welded to the shell plate 100, but are not limited thereto.
[0047] Continue to combine Figures 1 to 4 As shown, in some embodiments, the electronic components 330 of the driver board 300 are exposed on the surface of the driver board 300; the electronic components of the power board 200 are embedded in the power board 200, and the power board 200 forms a chip-embedded circuit board. This facilitates the design of the power board 200 being stacked below the driver board 300, and facilitates the electrical connection between the driver board 300 and the circuit components of the inverter.
[0048] In some embodiments, circuit board mounting points 400a distributed in the central area are disposed on the electrical connector 600 and extend from the drive board 300 to realize electrical connection between the drive board 300 and the power board 200 and the circuit elements of the inverter. It should be noted that the circuit board mounting points 400a distributed in the central area will occupy a certain space of the drive board 300, and one or more can be set as needed in actual operation; for example, there may be two circuit board mounting points 400a distributed in the central area, but this is not a limitation.
[0049] In some embodiments, the edge regions (110, 120) include an idle edge region 110 where other components of the power module are not located and a functional edge region 120 where other components of the power module are located. The idle edge region 110 has multiple circuit board mounting points to provide sufficient mounting space for the circuit boards and enhance connection stability; for example, the idle edge region 110 may have five circuit board mounting points 400b, but is not limited thereto. The functional edge regions 120 include four, respectively housing the DC bus 810, AC bus 820, inlet pipe 710, and outlet pipe 720 of the power module. Each functional edge region 120 has at least one circuit board mounting point to ensure effective connection between each edge region of the housing 100 and the circuit elements of the inverter; for example, each functional edge region 120 may have one or two circuit board mounting points (400b, 400b'), but is not limited thereto.
[0050] In some embodiments, a functional edge region 120 of the DC bus 810 is provided for connecting the DC filter component of the inverter; a circuit board mounting point 400b' located in the functional edge region 120 of the DC bus 810 is provided, which can be used as a circuit board mounting point alone or reused as a power module mounting point. By reusing the mounting point, it can simultaneously perform two functions: connecting the functional edge region 120 of the DC bus 810 to the DC filter component, and connecting the entire power module to the inverter housing, thereby achieving integrated design and improving structural stability. In actual operation, the position of the circuit board mounting point 400b' can be appropriately moved to achieve the functional reuse of simultaneously connecting the DC filter component and the housing of the inverter.
[0051] In some embodiments, the circuit board mounting points (400a, 400b, 400b') are configured as embedded threaded sleeves, which can provide high-strength threads for a secure connection.
[0052] In some embodiments, power module mounting points (500a, 500b) are at least distributed at each corner of the edge regions (110, 120) to enable connection between each corner of the edge regions (110, 120) and the inverter housing.
[0053] In some embodiments, power module mounting points 500a are provided at the corners and edges of the vacant edge region 110 to make full use of the position of the vacant edge region 110; power module mounting points 500b are provided at the corners of the functional edge region 120 to ensure that the functional edge region 120 achieves a stable connection with the inverter housing through the corners.
[0054] In some embodiments, the power module mounting points (500a, 500b) are configured as through holes, allowing the power module to be connected to the inverter housing using fasteners such as bolts or pins.
[0055] In some embodiments, the edge regions (110, 120) are further provided with a plurality of positioning holes 900, which may include a pair distributed diagonally in the edge regions (110, 120). The diagonally distributed positioning holes 900 are used for precise positioning and error prevention during installation, improving production assembly efficiency and accuracy.
[0056] In some embodiments, the power module further includes an AC bus 820 and a DC bus 810 separately disposed in the functional edge region 120. The AC bus 820 may integrate a current sensor magnetic ring, enabling high-precision current sampling and improving reliability; the DC bus 810 may integrate an EMC (electromagnetic compatibility) magnetic ring and a Y capacitor to optimize EMC performance and improve stability.
[0057] In some embodiments, the mounting bracket 811 of the DC busbar 810 and the mounting bracket 822 of the AC busbar 820 are screwed to the shell plate 100, but this is not a limitation and the connection can also be achieved by welding, snap-fitting or other methods.
[0058] This application also provides an inverter configured with the power module described in any of the above embodiments. The inverter also has the same or similar technical effects as the power module described above. The inverter of this application can be applied to fields such as electric drive systems and wind power generation systems.
[0059] The above description, in conjunction with specific preferred embodiments, provides a further detailed explanation of this application and should not be construed as limiting the specific implementation of this application to these descriptions. For those skilled in the art, various simple deductions or substitutions can be made without departing from the concept of this application, and all such modifications or substitutions should be considered within the scope of protection of this application.
Claims
1. A power module for an inverter, comprising a power board and a drive board mounted on a housing, characterized in that: There is no gap between the drive board and the power board; The power module includes a central region where the driver board and the power board are disposed, and the shell includes an edge region surrounding the central region. The central region and the edge region are provided with circuit board mounting points, and the edge region is also provided with power module mounting points.
2. The power module of claim 1, wherein, The drive board and the power board are attached together by a plate-shaped electrical connector.
3. The power module of claim 2, wherein, The electrical connector includes a connector for electrically connecting the electronic components of the drive board and the power board, and an insulating support portion supporting the non-electronic component areas of the drive board and the power board. The connector and the insulating support portion are integrated into a plate-shaped structure.
4. The power module of claim 2, wherein, The power board and the shell are connected by a heat dissipation insulating plate.
5. The power module of claim 4, wherein, The heat dissipation insulation plate, the power plate, the electrical connector, and the drive plate are stacked in sequence and screwed to the shell plate.
6. The power module of claim 5, wherein, A cooling space is reserved between the heat dissipation insulation plate and the shell plate, and cooling fins are provided in the cooling space; The power module also includes an inlet pipe and an outlet pipe that are separately disposed in the edge region and communicate with the cooling space.
7. The power module of any one of claims 1, 2, 5, wherein, The electronic components of the drive board are exposed on the surface of the drive board; The electronic components of the power board are embedded in the power board, and the power board forms a chip embedded circuit board.
8. The power module of claim 2 or 5, wherein, Circuit board mounting points distributed in the central area are located on the electrical connector and extend from the drive board.
9. The power module of claim 1, wherein, The edge region includes an empty edge region where other components of the power module are not installed, and a functional edge region where other components of the power module are installed; Each of the aforementioned free edge regions is provided with multiple circuit board mounting points; The functional edge region includes multiple DC busbars, AC busbars, liquid inlet pipes and liquid outlet pipes of the power module respectively, and each functional edge region is provided with at least one circuit board mounting point.
10. The power module of claim 9, wherein, The circuit board mounting points set in the functional edge area of the DC bus can be used as separate circuit board mounting points or reused as power module mounting points.
11. The power module of any one of claims 1, 8 to 10, wherein, The circuit board mounting point is configured as an embedded threaded sleeve.
12. The power module of claim 1, wherein, The power module mounting points are distributed at least at each corner of the edge region.
13. The power module as described in claim 12, characterized in that, The edge region includes an empty edge region where other components of the power module are not installed, and a functional edge region where other components of the power module are installed; The power module mounting points are set at the corners and edges of the free edge region, and the power module mounting points are set at the corners of the functional edge region.
14. The power module of any one of claims 1, 12, 13, wherein, The power module mounting point is configured as a through hole.
15. The power module of claim 1, wherein, The edge region is also provided with multiple positioning holes; The plurality of positioning holes include a pair distributed diagonally across the edge region.
16. The power module of claim 1, wherein, It also includes AC busbars and DC busbars separately disposed in the edge region; The AC busbar integrates a current sensor magnetic ring, and / or the DC busbar integrates an EMC magnetic ring and a Y capacitor.
17. The power module of claim 16, wherein, The mounting brackets for the DC busbar and the AC busbar are respectively screwed to the shell plate.
18. An inverter, characterized by, The inverter is configured with a power module as claimed in any of claims 1 to 17.