A flat panel earphone magnet unit with impact protection

Abstract

The utility model discloses a flat panel earphone magnet unit with anti -impact protection relates to the electroacoustic device technical field, this unit includes the magnetic frame, the long strip shape magnet group and the diaphragm assembly in the magnetic gap of parallel in the magnetic frame, the magnet group outside surface covers the compound shock attenuation layer, and this layer is from inside to outside in proper order is the adhesive layer, the fiber reinforced layer and the base material buffer layer, and total thickness 0.3 0.8mm, the compound layer is equal width and covers the area and the strip square hole, and the covering area both ends exceed the magnet 1.0 3.0mm and form the suspension buffer wing, and the square hole length-width ratio 8:1 30:1, through the base material surface optional half ball convex and 50% 100% coverage area design, realize three layers synergic energy absorption, cantilever lever force relief and hollow weight reduction triple protection mechanism, make the magnet impact fracture strength improve 200% or more, guarantee diaphragm acoustics performance no attenuation simultaneously.

Description

Technical Field

[0001] This utility model relates to the field of planar magnetic headphone technology, specifically to a planar magnetic headphone magnet unit with shock-resistant protection, and is particularly suitable for magnet units of high-sensitivity planar magnetic headphone. Background Technology

[0002] Planar magnetic headphone magnet units typically use parallel rows of elongated magnets to form the magnetic gap. These magnets are prone to breakage due to stress concentration during transport or impact drops. Existing technologies often add a metal protective cover to the outside of the magnet frame, but this increases the size and causes magnetic leakage; some solutions use a monolithic potting layer, but this reduces the diaphragm's degrees of freedom. How to balance shock resistance and acoustic performance is a pressing problem in this field. Utility Model Content

[0003] To address the aforementioned issues, this invention provides a planar magnetic headphone unit with shock-resistant protection. Through an innovative structural design of a composite damping layer, it significantly enhances shock resistance while ensuring acoustic performance.

[0004] A planar magnetic headphone magnet unit with shock resistance protection includes a magnetic frame, a group of elongated magnets arranged parallel to the magnetic frame, and a gap region located between the magnet groups; a diaphragm assembly is disposed in the gap region.

[0005] The outer surface of the magnet assembly away from the diaphragm assembly is covered with a composite damping layer, which comprises, from the inside out, the following components:

[0006] Adhesive layer: Directly attached to the outer surface of the magnet assembly, it is an acrylic pressure-sensitive adhesive layer with a thickness of 0.05-0.15mm and a peel strength ≥8N / cm;

[0007] Fiber reinforcement layer: Composite on the outside of the adhesive layer, made of aramid fibers or glass fibers woven at 45°-60° into an 80-120 mesh structure, with a single filament diameter of 15-35μm;

[0008] Substrate buffer layer: Covering the outside of the fiber reinforcement layer, made of closed-cell silicone foam, with a thickness of 0.2-0.6mm and a density of 100-180kg / m³. 3 ;

[0009] The total thickness of the composite damping layer is 0.3-0.8 mm, and the Shore hardness is 25-35 HA.

[0010] The composite damping layer includes a covered area and strip-shaped square holes located on the covered area;

[0011] The coverage area has the same width as the outer side of the magnet assembly, and extends 1.0-3.0 mm beyond the length of the magnet assembly at both ends in the length direction, forming a suspended buffer wing;

[0012] The parallel arrangement of the hollow square holes is aligned with the length of the magnet assembly. The width of a single square hole is W1 = 0.5-1.5mm, and the length-to-width ratio is 8:1-30:1.

[0013] The surface of the substrate buffer layer is provided with an array of hemispherical protrusions, the protrusions having a diameter of 0.02-0.05 mm and a height of 0.01-0.03 mm.

[0014] The fiber reinforcement layer is embedded inside the substrate buffer layer, and the edge of the fiber mesh extends 1.0-2.0 mm beyond the outer contour of the magnet assembly.

[0015] The composite damping layer covers 50%-80% of the surface area of ​​the magnet assembly and is configured as a semi-attached layer.

[0016] The composite damping layer covers 100% of the surface area of ​​the magnet assembly and is configured as a full-coverage layer.

[0017] The beneficial effects of this utility model are as follows:

[0018] Three-layer synergistic protection: the adhesive layer eliminates interfacial stress, the fiber layer inhibits crack propagation, and the foam layer absorbs impact energy.

[0019] Suspended buffer wing design: By leveraging the principle, the impact force is converted into elastic deformation, reducing the stress at the root of the magnet by more than 40%;

[0020] Strip-shaped square hole structure: Reduce weight while ensuring structural integrity and avoid affecting the acoustic performance of the diaphragm;

[0021] Optional coverage modes: a half-coverage layout balances weight reduction and protection, while a full-coverage layout is suitable for extreme impact environments. Attached Figure Description

[0022] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0023] Appendix Figure 1 This is a three-dimensional structural diagram of the present invention;

[0024] Appendix Figure 2 This is a schematic diagram of the structure of the present invention that conforms to the buffer structure;

[0025] Appendix Figure 3 This is a schematic diagram of the semi-attached layout of this utility model.

[0026] Appendix Figure 4 This is a schematic diagram of the fully-attached layout of this utility model.

[0027] Appendix Figure 5 These are actual images of the semi-attached layout (left) and the fully attached layout (right) of this utility model.

[0028] in:

[0029] Magnetic frame: 1. Magnet assembly: 2. Composite damping layer: 5. Fiber reinforcement layer: 51. Substrate buffer layer: 52. Adhesive layer: 53. Surface protrusion of substrate buffer layer: 55. Diaphragm assembly: 7. Detailed Implementation

[0030] Example 1:

[0031] See Figure 1 This utility model provides a planar magnetic headphone magnet unit with impact protection, including a magnetic frame 1, a long strip magnet group 2 arranged parallel to the magnetic frame 1, and a gap area located between the magnet groups 2; a diaphragm assembly 7 is arranged in the gap area;

[0032] The outer surface of the magnet assembly 2 away from the diaphragm assembly 7 is covered with a composite damping layer 5, which comprises, from the inside out, the following components:

[0033] Adhesive layer 53: Directly adhered to the outer surface of magnet assembly 2, it is an acrylic pressure-sensitive adhesive layer with a thickness of 0.05-0.15mm and a peel strength ≥8N / cm;

[0034] Fiber reinforcement layer 51: Composite to the outside of adhesive layer 53, made of aramid fibers or glass fibers woven at 45°-60° into an 80-120 mesh structure, with a single filament diameter of 15-35μm;

[0035] Substrate buffer layer 52: Covering the outside of fiber reinforcement layer 51, made of closed-cell silicone foam, with a thickness of 0.2-0.6mm and a density of 100-180kg / m³. 3 ;

[0036] The total thickness of the composite damping layer 5 is 0.3-0.8 mm, and its Shore hardness is 25-35 HA.

[0037] The composite damping layer 5 includes a covering area and strip-shaped square holes located on the covering area;

[0038] The coverage area has the same width as the outer side of the magnet assembly 2, and extends 1.0-3.0 mm beyond the length of the magnet assembly 2 at both ends in the length direction, forming a suspended buffer wing;

[0039] The parallel arrangement of the hollow square holes is aligned with the length of the magnet assembly 2. The width of a single square hole is W1 = 0.5-1.5mm, and the length-to-width ratio is 8:1-30:1.

[0040] The surface of the substrate buffer layer 52 is provided with an array of hemispherical protrusions 55, with a diameter of 0.02-0.05 mm and a height of 0.01-0.03 mm.

[0041] The fiber reinforcement layer 51 is embedded inside the substrate buffer layer 52, and the edge of the fiber mesh extends 1.0-2.0 mm beyond the outer contour of the magnet assembly 2.

[0042] The composite damping layer 5 covers 50%-80% of the surface area of ​​the magnet assembly 2 and is configured as a semi-attached layer.

[0043] The composite damping layer 5 covers 100% of the surface area of ​​the magnet assembly 2, and is configured as a fully bonded layer.

[0044] See attached document Figure 3 and Figure 5 On the left side, six sets of long strip neodymium iron boron magnets 2 are installed in parallel on the magnetic frame 1. The dimensions of a single magnet are 3mm wide × 25mm long × 1.2mm high, and the spacing between adjacent magnets is 0.8mm to form a magnetic gap.

[0045] A composite damping layer 5 is covered on the outer surface of the magnet assembly 2 away from the diaphragm assembly 7, and its structure is as follows:

[0046] Adhesive layer 53: 0.1mm thick acrylic pressure-sensitive adhesive with a peel strength of 10N / cm, completely adhering to the magnet surface;

[0047] Fiber reinforcement layer 51: Aramid fibers are woven at 55° to form a 100-mesh mesh with a single filament diameter of 25μm, which is embedded inside the substrate buffer layer;

[0048] Substrate buffer layer 52: 0.4mm thick closed-cell silicone foam, density 150kg / m³ 3 Shore hardness 30HA, no protrusions on the surface;

[0049] The composite damping layer has a total thickness of 0.5mm and a 70% coverage area with a semi-adhesive layout.

[0050] Example 2:

[0051] See attached document Figure 4 and Figure 5 On the right side, the magnet assembly 2 has the same dimensions as in Example 1, and the composite damping layer 5 adopts a full-coverage layout (100% coverage):

[0052] Adhesive layer 53: 0.15mm thick acrylic pressure-sensitive adhesive (peel strength 12N / cm);

[0053] Fiber reinforcement layer 51: Glass fibers are woven at 50° in a 90-mesh net (monofilament diameter 30μm);

[0054] Substrate buffer layer 52: 0.5mm thick closed-cell silicone foam (density 160kg / m³) 3 The surface is decorated with an array of 55 hemispherical protrusions (0.03 mm in diameter, 0.02 mm in height, and a density of 200 protrusions / mm²). 2 );

[0055] The total thickness of the composite damping layer is 0.7mm.

[0056] Thus far, the description of the above embodiments has been provided for illustrative and descriptive purposes. This is not intended to be exhaustive or limiting of the present disclosure. Individual elements or features of particular embodiments are generally not limited to those particular embodiments, but may be interchanged and used in selected embodiments where applicable, even if not specifically shown or described. In many respects, the same elements or features may also be varied. Such variations are not considered a departure from this disclosure, and all such modifications are intended to be included within the scope of this disclosure.

[0057] Example embodiments are provided so that this disclosure will become thorough and will fully convey the scope to those skilled in the art. Numerous details, such as examples of specific parts, apparatus, and methods, are set forth to provide a thorough understanding of embodiments of this disclosure. It will be apparent to those skilled in the art that the specific details are not required, and the example embodiments may be implemented in many different forms, neither of which should be construed as limiting the scope of this disclosure. In some example embodiments, well-known processes, well-known apparatus structures, and well-known techniques are not described in detail.

[0058] Technical terms are used herein for the purpose of describing specific exemplary embodiments only and are not intended to be limiting. Unless the context clearly indicates otherwise, the singular forms “a” and “the” as used herein may also refer to the plural forms. The terms “comprising” and “having” are inclusive and therefore specify the presence of the stated features, integrals, steps, operations, elements, and / or components, but do not exclude the presence or additional having of one or more other features, integrals, steps, operations, elements, components, and / or combinations thereof. Unless expressly indicated in order of execution, the method steps, processes, and operations described herein are not to be construed as necessarily requiring performance in the specific order discussed and shown. It should also be understood that additional or optional steps may be employed.

Claims

1. A planar magnetic headphone magnet unit with shock resistance protection, comprising a magnet frame (1), elongated magnet groups (2) arranged parallel to the magnet frame (1), and a gap region located between the magnet groups (2); a diaphragm assembly (7) is disposed in the gap region; characterized in that: The outer surface of the magnet assembly (2) away from the diaphragm assembly (7) is covered with a composite damping layer (5), which comprises, from the inside out, the following components: Adhesive layer (53): directly attached to the outer side of the magnet assembly (2), is an acrylic pressure-sensitive adhesive layer with a thickness of 0.05-0.15mm and a peel strength ≥8N / cm; Fiber reinforcement layer (51): Composite on the outside of the adhesive layer (53), made of aramid fiber or glass fiber woven at 45°-60° into an 80-120 mesh structure, with a single filament diameter of 15-35μm; Substrate cushion layer (52): covering the outside of the fiber reinforced layer (51), made of closed-cell silica gel foam, thickness 0.2-0.6mm, density 100-180kg / m 3 ; The total thickness of the composite damping layer (5) is 0.3-0.8 mm, and the Shore hardness is 25-35 HA; The composite damping layer (5) includes a covered area and strip-shaped square holes located on the covered area; The coverage area has the same width as the outer side of the magnet assembly (2), and extends beyond the length of the magnet assembly (2) by 1.0-3.0 mm at both ends in the length direction, forming a suspended buffer wing; The length direction of the parallel-arranged hollow square holes is consistent with the length direction of the magnet group (2). The width of a single square hole is W1 = 0.5-1.5mm, and the length-to-width ratio is 8:1-30:

1.

2. The planar magnetic headphone unit according to claim 1, characterized in that: The surface of the substrate buffer layer (52) is provided with an array of hemispherical protrusions (55), with a diameter of 0.02-0.05 mm and a height of 0.01-0.03 mm.

3. The planar magnetic headphone unit according to claim 1, characterized in that: The fiber reinforcement layer (51) is embedded inside the substrate buffer layer (52), and the edge of the fiber mesh extends 1.0-2.0 mm beyond the outer contour of the magnet assembly (2).

4. The planar magnetic headphone unit according to claim 1, characterized in that: The composite damping layer (5) covers 50%-80% of the surface of the magnet assembly (2) and is set in a semi-attached layout.

5. The planar magnetic headphone unit according to claim 1, characterized in that: The composite damping layer (5) covers 100% of the surface of the magnet assembly (2) and is set to a fully attached layout.

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