A circuit board assembly, temperature acquisition device, battery pack and vehicle
By introducing redundant structures and reinforcing lines into the circuit board assembly, the connection reliability problem caused by cell deformation is solved, and a stable connection of the circuit board assembly is achieved when the cell is displaced, avoiding wire breakage.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- BEIJING CHEHEJIA AUTOMOBILE TECH CO LTD
- Filing Date
- 2025-05-15
- Publication Date
- 2026-08-04
AI Technical Summary
Deformation of battery cells in the battery pack reduces the reliability of circuit board assembly connections, which may lead to open circuits in wires and failure of thermal components.
Design a circuit board assembly including a first region, a second region, and a redundant structure, connected by a micro-interconnect structure, with reinforcement lines and redundant structure provided. The redundant structure provides deformation margin, the micro-interconnect structure is easy to break to release displacement, and the reinforcement lines prevent cracks from extending to the conductors.
This improves the deformation adaptability of the circuit board assembly during cell displacement, avoids wire breakage, and ensures the reliability and stability of the connection.
Smart Images
Figure CN224596656U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of electronic devices, and more specifically, to a circuit board assembly, a temperature acquisition device, a battery pack, and a vehicle. Background Technology
[0002] To meet the requirement of temperature sampling of the cells in the battery pack, a circuit board assembly for temperature acquisition and transfer is needed in the battery pack. Typically, one end of this circuit board assembly is fixed to the cell and a thermistor is installed thereon. The other end of the circuit board assembly is connected to a temperature measuring device, which can feed back the electrical parameters fed back by the thermistor to the temperature measuring device, so that the temperature measuring device can obtain the temperature parameters of the cell based on these parameters.
[0003] During the operation of the battery pack, the cells may deform and thus displace. This causes the aforementioned circuit board assembly connected to the cells to be stretched / compressed and deformed, reducing the reliability of the connection. More seriously, it may cause cracks extending to the wires, causing the wires to break and resulting in the failure of the thermal element connection. Utility Model Content
[0004] In order to solve or improve the problems existing in the prior art, the first aspect of this application provides a circuit board assembly, which specifically includes a first region, a second region and a redundant structure.
[0005] One end of the redundant structure is connected to the first region and the other end is connected to the second region. The first region and the second region are also connected by at least one micro-connection structure.
[0006] The first and / or second regions have reinforcing lines installed near the micro-connection structure.
[0007] Optionally, it also includes a conductor, which is configured to pass through at least two of the first region, the second region, and the redundant structure; a reinforcing line is disposed between the micro-connection structure and the conductor.
[0008] Optionally, the reinforcement circuit includes a first reinforcement circuit and a second reinforcement circuit; the first reinforcement circuit is disposed between the micro-connection structure and the portion of the conductor passing through the first region; the second reinforcement circuit is disposed between the micro-connection structure and the portion of the conductor passing through the second region.
[0009] Optionally, the length of the redundant structure is greater than the distance between the first region and the second region; the redundant structure includes a first redundant structure arm, which is connected to the first region and extends in a direction away from the first region and the second region.
[0010] And / or
[0011] The redundant structure includes a second redundant structure arm, which is connected to a second region and extends in a direction away from the first and second regions.
[0012] Optionally, the thickness and / or width of the micro-connection structure are set such that the micro-connection structure can break before the redundant structure when the first region and the second region are relatively displaced.
[0013] Alternatively, the redundant structure can be made of flexible circuit boards or flexible flat cables.
[0014] Optionally, the first region is provided with a first pad and a second pad; the conductor includes a first conductor and a second conductor, the first pad is electrically connected to the first conductor, and the second pad is electrically connected to the second conductor; the first pad and the second pad are staggered along the X-axis and Y-axis, the X-axis and Y-axis are orthogonal, the X-axis and Y-axis are perpendicular to the thickness direction of the first region, and the X-axis is parallel to the direction in which the first pad and / or the second pad extends.
[0015] Optionally, at least one of the first and second pads is provided with a through-hole.
[0016] Optionally, through-holes include vias with a cross-sectional shape extending along the X-axis.
[0017] Optionally, through-holes include at least two circular through-holes located on the same pad.
[0018] Optionally, a separator hole is provided between the first pad and the second pad.
[0019] Optionally, the separator hole is an oblong through hole with a length greater than 1.5 times the width of the first or second pad, and the length direction is perpendicular to the X-axis.
[0020] Optionally, the length of the partition hole is greater than or equal to 2 mm, and / or the width of the partition hole is greater than or equal to 1 mm.
[0021] Optionally, the separator hole is a circular through hole with a radius greater than or equal to 1 mm.
[0022] Optionally, the spacing between the separator hole and the surrounding conductor is greater than or equal to 1 mm.
[0023] Optionally, the gap between the first pad and the second pad along the X-axis is greater than or equal to 3.5 mm, and / or the gap between the first pad and the second pad along the Y-axis is greater than or equal to 0.4 mm; the conductor portion of at least one of the first pad and the second pad is greater than or equal to 1 mm from the edge of the circuit board assembly.
[0024] Optionally, the second area is provided with a thermal pad, a silicone thermal pad observation hole, and a fixing hole; the thermal pad is electrically connected to the wire; at least one of the silicone thermal pad observation hole and the fixing hole is a through hole.
[0025] Optionally, it also includes a first reinforcing structure; the first reinforcing structure is attached to one side of the second region where the thermal pad is located, and at least one of the silicone thermal pad observation hole and the fixing hole penetrates the first reinforcing structure.
[0026] Optionally, the first reinforcement structure is equipped with a traceability identifier.
[0027] Optionally, the first reinforcing structure is provided with a thermal protection hole for exposing the thermal element and for filling with UV-curable adhesive.
[0028] Optionally, it also includes a second reinforcing structure; the second reinforcing structure is attached to the side of the second region away from the thermal pad; at least one of the silicone thermal pad observation hole and the fixing hole penetrates through the second reinforcing structure.
[0029] Optionally, the second reinforcement structure is equipped with a traceability identifier.
[0030] In a second aspect of this application, a temperature acquisition device is provided, wherein the device includes the technical solution of the first aspect described above, and the circuit board assembly described in any of its optional embodiments.
[0031] In a third aspect of this application, a battery pack is provided, which includes the temperature acquisition device described in the aforementioned second aspect.
[0032] In a fourth aspect of this application, a vehicle is provided that includes the battery pack described in the aforementioned third aspect.
[0033] By implementing the aforementioned technical solution, the circuit board assembly can have a certain deformation margin when the connected battery cells are displaced. Furthermore, due to the reinforcement circuit, even if cracks appear in the circuit board assembly, the cracks can be prevented from expanding further to the wires. Attached Figure Description
[0034] Figure 1 This is a schematic diagram of a circuit board assembly provided in an embodiment of this application, showing the various regions of the circuit board assembly as well as redundant structures and micro-interconnect structures;
[0035] Figure 2 This is a schematic diagram of the structure of a circuit board assembly provided in an embodiment of this application, illustrating various specific structures disposed on the circuit board assembly;
[0036] Figure 3 This is a perspective view of a circuit board assembly provided in an embodiment of this application, illustrating the relevant structure disposed in the second region of the circuit board assembly;
[0037] Figure 4This is a partially enlarged schematic diagram of a circuit board assembly provided in an embodiment of this application. The diagram is used to illustrate the dimensional features of each structure disposed in the first region of the circuit board assembly.
[0038] Figure 5 This is an example of the topology of a range-extended electric vehicle.
[0039] The image is labeled as follows:
[0040] 10: First region, 20: Second region, 30: Redundant structure, 40: Micro-interconnection structure, 50: Reinforcing circuit, 60: First reinforcing structure, 70: Second reinforcing structure, 80: Thermistor;
[0041] 00: Wire, 01: First wire, 02: Second wire;
[0042] 11: First pad, 12: Second pad, 13: Through hole, 14: Separator hole;
[0043] 21: Thermal pad; 22: Observation hole for silicone thermal pad; 23: Fixing hole; 24: Traceability label;
[0044] 31: First redundant structural arm; 32: Second redundant structural arm;
[0045] 51: First reinforcement line; 52: Second reinforcement line;
[0046] 61: Thermal protection hole. Detailed Implementation
[0047] This application will now be described more fully below with reference to the accompanying drawings. However, this application can be implemented in many different ways and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided herein to make this application more detailed and complete. The same reference numerals denote the same objects throughout the drawings.
[0048] In the specification of this application, when a region / structure / line is referred to as "connected to" other regions / structures / lines relative to other regions / structures / lines, the region / structure / line may be directly connected to or directly coupled to other regions / structures / lines, or there may be an intermediate third region / structure / line; in addition, in the embodiments of this application, "connection" may be an electrical connection, a structural connection, or a connection between layers.
[0049] This application defines "X-axis" and "Y-axis" as orientation references. These definitions are for the purpose of more accurately disclosing the technical solutions of this application and do not constitute a limitation thereof. It should be understood that, in the embodiments of this application, unless otherwise specified, descriptions such as "along the X-axis" or "along the Y-axis" include both setting and arranging along the positive direction of the axis and setting and arranging along the negative direction of the axis.
[0050] Although in the appendix Figure 2 The diagram shows the X-axis pointing to the left, the Y-axis pointing upwards, and the axis pointing inwards. Figure 4 The image shows a downward-facing Y-axis, but this application is not limited to this. The X-axis described in the embodiments of this application can be along... Figure 2 or Figure 4 The Y-axis, as described in the embodiments of this application, can be along either the horizontal direction to the left or right. Figure 2 or Figure 4 The center is oriented vertically upwards or downwards in either direction, unless otherwise specified in the description.
[0051] To address or improve the problems existing in the prior art, embodiments of this application provide a circuit board assembly, such as... Figure 1 As shown, the component includes a first region 10, a second region 20, and a redundant structure 30.
[0052] like Figure 1 As shown, one end of the redundant structure 30 is connected to the first region 10 and the other end is connected to the second region 20. The first region 10 and the second region 20 are also connected by at least one micro-connection structure 40.
[0053] like Figure 2 As shown, the first region 10 and / or the second region 20 have reinforcing lines 50 in the portion near the micro-connection structure 40.
[0054] Preferred, such as Figure 2 As shown, it also includes a conductor 00, which is configured to pass through at least two of the first region 10, the second region 20 and the redundant structure 30.
[0055] In the aforementioned embodiments, the redundant structure 30 provides more displacement travel for the first region 10 and the second region 20. In specific implementation, one region of the first region 10 and the second region 20 can be connected to the battery cell in the battery pack, and the other region can be connected to the temperature measuring device (constituted on a flexible printed circuit board FPC). When the battery cell is displaced relative to the temperature measuring device, due to the existence of the redundant structure 30, the circuit board assembly as a whole has more deformation margin and can adapt to the displacement of the battery cell without failure.
[0056] During the assembly stage, the battery cell does not shift, so the redundant structure 30 is not needed. The micro-connection structure 40 can fix the first region 10 and the second region 20, which can improve the assembly efficiency of the circuit board assembly.
[0057] When one of the first region 10 and the second region 20 moves with the battery cell, the micro-connection structure 40 breaks first to release the travel of the redundant structure 30, thus satisfying the relative displacement requirements of the first region 10 and the second region 20.
[0058] Because a micro-connection structure 40 that is prone to breakage is specially designed, when the first region 10 and the second region 20 are displaced, cracks will only occur at the micro-connection structure 40. In other words, the location of the breakage is controllable. Therefore, a reinforcing line 50 is pre-set between the micro-connection structure 40 and the conductor 00 to prevent the crack from extending further to the conductor 00 and causing the conductor 00 to break.
[0059] In an optional embodiment, the conductor 00 passes through the first region 10, the redundant structure 30 and the second region 20 in sequence, or the conductor 00 passes through the second region 20, the redundant structure 30 and the first region 10 in sequence.
[0060] In an optional embodiment, the wire 00 includes a first wire 01 and a second wire 02, which are used to electrically connect the two electrodes of the thermistor element, respectively.
[0061] In a typical embodiment, such as Figure 2 As shown, the reinforcement line 50 includes a first reinforcement line 51 and a second reinforcement line 52.
[0062] The first reinforcing line 51 is disposed between the micro-connection structure 40 and the portion of the conductor 00 that passes through the first region 10;
[0063] The second reinforcing line 52 is disposed between the micro-connection structure 40 and the portion of the conductor 00 passing through the second region 20.
[0064] like Figure 2 As shown, when the micro-connection structure 40 breaks, the crack may extend toward both sides of the micro-connection structure 40 (i.e., the left and right sides in the figure), which may threaten the conductors near the first region 10 or the conductors near the second region 20 on both sides of the micro-connection structure 40. Therefore, two reinforcing lines 50 are set between the micro-connection structure 40 and the first region 10 and the second region 20, respectively, to prevent the possible cracks from spreading toward the conductor 00.
[0065] In this embodiment, the length and shape of the reinforcing line 50 can be determined according to the actual parameters of the product. Preferably, the shape of the reinforcing line 50 can be similar to that of the adjacent conductor 00.
[0066] The length of the redundant structure 30 is greater than the distance between the first region 10 and the second region 20. In a typical embodiment, such as Figure 2 As shown, the redundant structure 30 includes a first redundant structure arm 31, which is connected to the first region 10 and extends in a direction away from the first region 10 and the second region 20.
[0067] And / or
[0068] The redundant structure 30 includes a second redundant structure arm 32, which is connected to the second region 20 and extends in a direction away from the first region 10 and the second region 20.
[0069] In an optional embodiment, the redundant structure 30 is generally as follows: Figure 2 It presents a "C" shape or an "S" shape, etc.
[0070] The redundant structure arm design of the redundant structure 30 can meet the requirements of bidirectional displacement between the first region 10 and the second region 20 caused by cell expansion.
[0071] In an optional embodiment, the thickness and / or width of the micro-connection structure 40 is set such that when the first region 10 and the second region 20 are displaced relative to each other, the micro-connection structure 40 can break before the redundant structure 30.
[0072] In alternative embodiments, such as Figure 2 As shown, the micro-connection structure 40 is configured as an hourglass shape, which is narrower in the middle and wider on both sides.
[0073] In an alternative embodiment, the thickness and / or width of the micro-connection structure 40 is set to be sufficient to maintain the integrity of the structure during component installation, and to break only after cell displacement.
[0074] In an alternative embodiment, the redundant structure 30 is composed of a flexible printed circuit (FPC) or a flexible flat circuit (FFC).
[0075] In alternative embodiments, such as Figure 1 As shown, the redundant structure 30 forms a bent protrusion in a direction away from the first region 10 and the second region 20.
[0076] In an optional embodiment, the first region 10, the second region 20, and the redundant structure 30 are all composed of flexible circuit boards or flexible flat cables.
[0077] like Figure 2As shown, the first region 10 serves as a temperature acquisition and welding area, in which a first pad 11 and a second pad 12 are provided; the wire 00 includes a first wire 01 and a second wire 02, the first pad 11 is electrically connected to the first wire 01, and the second pad 12 is electrically connected to the second wire 02.
[0078] In a typical embodiment, the first pad 11 is electrically connected to the first electrode of the thermistor via the first wire 01, and the second pad 12 is electrically connected to the second electrode of the thermistor via the second wire 02.
[0079] In this embodiment, the first pad 11 and the second pad 12 are bidirectionally offset along the X-axis and Y-axis, as follows: Figure 2 or Figure 4 As shown, the X-axis and Y-axis are orthogonal, perpendicular to the thickness direction of the first region 10, and the X-axis is parallel to the direction in which the first pad 11 and / or the second pad 12 extend.
[0080] At least one of the first pad 11 and the second pad 12 is provided with a through hole 13 to facilitate the molten solder to pass through to the pad during soldering, ensuring a reliable solder joint. Optionally, the through hole 13 may include a single elongated through hole or at least two circular through holes disposed on the same pad.
[0081] Typically, the through-hole 13 includes a through-hole with a cross-sectional shape extending along the X-axis.
[0082] like Figure 2 As shown, in a preferred embodiment, a partition hole 14 is provided between the first pad and the second pad.
[0083] In alternative embodiments, such as Figure 4 As shown, the separator hole 14 is an elongated oval through hole with a length D2 greater than 1.5 times the width of the first pad 11 or the second pad 12 to achieve isolation between the pads. Its length direction is perpendicular to the length direction of the first pad 11 and the second pad 12, i.e., the X-axis direction. For example, as... Figure 4 As shown, the length direction of the separator hole 14 is along the Y-axis, and the length directions of the first pad 11 and the second pad 12 are both along the X-axis.
[0084] In alternative embodiments, such as Figure 4 As shown, the length D2 of the separator hole 14 is greater than or equal to 2 mm, and / or the width D1 of the separator hole 14 is greater than or equal to 1 mm, so as to facilitate the cleaning of solder residue on the back side between the first pad 11 and the second pad 12 through the separator hole 14 and prevent short circuit.
[0085] In an optional embodiment, the partition hole 14 is a circular through hole (not shown in the figure) with a radius greater than or equal to 1 mm.
[0086] In an optional embodiment, the distance between the separator hole 14 and any surrounding conductor is greater than or equal to 1 mm to ensure that the electrical performance meets the usage requirements. Specifically, such as... Figure 4 As shown, the distance L4 between the separator hole 14 and the surrounding first pad, second pad or conductor is greater than or equal to 1 mm.
[0087] In an optional embodiment, an insulating protective film is provided on both the upper and lower surfaces of the first pad 10, wherein the upper and lower insulating protective films at corresponding locations of the first pad 11 and the second pad 12 are provided with consistent pad openings.
[0088] In the aforementioned embodiments, the two solder pads are staggered along the X and Y axes in both directions, and the design of the separator holes and through-holes effectively ensures the reliability of the soldering.
[0089] In alternative embodiments, such as Figure 4 As shown, the gap L1 between the first pad 11 and the second pad 12 along the X-axis is greater than or equal to 3.5 mm, and / or the gap L2 between the first pad 11 and the second pad 12 along the Y-axis is greater than or equal to 0.4 mm; the distance L3 between the conductor portion of at least one of the first pad 11 and the second pad 12 and the edge of the circuit board assembly is greater than or equal to 1 mm.
[0090] In a typical embodiment, the second region 20 serves as a heat-sensitive welding region, such as... Figure 2 As shown, the second region 20 is provided with a thermal pad 21, a silicone thermal pad observation hole 22, and a fixing hole 23. The thermal pad 21 is electrically connected to the wire 00; at least one of the silicone thermal pad observation hole 22 and the fixing hole 23 is a through hole, preferably, both the silicone thermal pad observation hole 22 and the fixing hole 23 are through holes.
[0091] In an embodiment, such as Figure 3 As shown, the thermal pad 21 is used to solder the thermal element 80, typically an NTC (Negative Temperature Coefficient).
[0092] In an optional embodiment, a protective film is provided on the upper and lower surfaces of the second region 20, wherein the protective film on the same side as the thermal pad 21 has a corresponding opening, while the protective film on the other side is designed without openings.
[0093] In an alternative embodiment, the second region 20 is made of a flexible circuit board, and a thermal element, such as an NTC, is soldered to the thermal pad 21 of the flexible circuit board using an SMT process.
[0094] In a preferred embodiment, such as Figure 3As shown, it also includes a first reinforcing structure 60; the first reinforcing structure 60 is attached to one side of the second region 20 where the thermal pad 21 is provided, and at least one of the silicone thermal pad observation hole 22 and the fixing hole 23 penetrates the first reinforcing structure 60.
[0095] In an optional embodiment, both the observation hole 22 and the fixing hole 23 of the silicone thermal pad extend through the first reinforcing structure 60.
[0096] In alternative embodiments, such as Figure 3 As shown, the first reinforcing structure 60 is provided with a traceability identifier 24, which can be a QR code or a similar machine-readable code.
[0097] In alternative embodiments, such as Figure 3 As shown, the first reinforcing structure 60 is provided with a thermal protection hole 61, which is used to expose the thermal element 80 and to fill with ultraviolet curing adhesive (UV adhesive) to protect the thermal element 80.
[0098] In alternative embodiments, such as Figure 3 As shown, it also includes a second reinforcing structure 70; the second reinforcing structure 70 is attached to the side of the second region 20 opposite to the thermal pad 21; at least one of the silicone thermal pad observation hole 22 and the fixing hole 23 penetrates the second reinforcing structure 70.
[0099] In an optional embodiment, both the observation hole 22 and the fixing hole 23 of the silicone thermal pad penetrate the second reinforcing structure 70.
[0100] In an alternative embodiment, the second region 20 is made of a flexible circuit board.
[0101] The second reinforcing structure 70 is bonded to the flexible circuit board via a thermosetting adhesive hot-pressing process, increasing the structural strength of the flexible circuit board.
[0102] The first reinforcing structure 60 is bonded to the flexible circuit board on which the thermistor 80 (such as NTC) and the second reinforcing structure 70 are soldered by thermosetting adhesive. Then, UV adhesive is used to fill the thermistor protection hole 61 in the first reinforcing structure 60 to achieve sealing protection for the thermistor.
[0103] In an optional embodiment, there are two fixing holes 23 and they are located at both ends of the second region 20.
[0104] In an optional embodiment, the thermal protection hole 61 is located in the middle of the second region 20, and the silicone thermal pad observation hole 22 and the traceability mark 24 are respectively located on both sides of the thermal protection hole 61.
[0105] In an optional embodiment, the thickness of the first reinforcing structure 60 is significantly greater than that of the second reinforcing structure 70.
[0106] In an optional embodiment, the second reinforcing structure 70 is provided with a traceability identifier 24, which may be a QR code or a similar machine-readable code.
[0107] The aforementioned traceability identifier 24 enables precise traceability of the overall temperature acquisition structure, allowing for rapid identification of the batch of the temperature acquisition structure and the affected vehicle range in the event of quality issues.
[0108] The pads on the flexible printed circuit board (FPC) need to be protected against oxidation using the OSP (Organic Solderability Preservatives) process. The protective film after OSP will fail under high temperature conditions. Thermistors such as NTC require high temperature heating during SMT soldering, which will cause the protective film after OSP to fail. The circuit board assembly provided in the aforementioned embodiment forms an independent branch structure for the connection circuit of the thermistor. After soldering the thermistor, it is then soldered to the FPC body of the temperature measurement device using hotbar or laser soldering processes. This satisfies the cell temperature sampling requirements while eliminating the influence of high temperature on the ultrasonic pads on the FPC, effectively resolving the conflict between the FPC ultrasonic direct soldering process and the NTC SMT soldering process and realizing the industrial production of FFC temperature acquisition.
[0109] This application also provides a temperature acquisition device, which includes a circuit board assembly as described in the foregoing embodiments and any of the optional or preferred embodiments.
[0110] This application also provides a battery pack that includes a temperature acquisition device as described in the foregoing embodiments.
[0111] This application also provides a vehicle including a battery pack as described in the foregoing embodiments.
[0112] The aforementioned circuit board assembly, temperature acquisition device, and battery pack are particularly suitable for range-extended electric vehicles, and the vehicle involved in the foregoing embodiments is preferably a range-extended electric vehicle. To provide a more comprehensive disclosure of this application, the following is an illustrative description of range-extended electric vehicles.
[0113] Range-extended electric vehicles have the following topology: Figure 5 As shown.
[0114] The core component of a range-extended electric vehicle is the range extender. Its main function is to activate the range extender when the battery charge drops to a certain level, causing the engine to drive a generator to produce electricity. Part of the generated electricity can be used to power the drive motor, and the other part can be used to charge the battery.
[0115] Range-extended electric vehicles (REEVs) have many advantages. For example, in daily urban commuting, REEVs can be driven purely on electricity, achieving zero emissions, reducing exhaust pollution, and meeting environmental protection requirements. They are also more energy-efficient than fuel-powered vehicles, reducing energy consumption and operating costs. REEVs are equipped with an engine as a range extender. When the battery is low, the engine can start to generate electricity, providing continuous power to the vehicle. This avoids the range anxiety problem caused by the limited range of pure electric vehicles, making long-distance travel more convenient.
[0116] Furthermore, range-extended electric vehicles (REEVs) offer numerous advantages in terms of driving experience. Essentially, a REEV is a pure electric drive system where the vehicle's power comes entirely from the electric motor. The engine does not directly drive the vehicle but instead acts as a generator, starting when the battery is low to convert fuel into electricity to power the electric motor or charge the battery. This pure electric drive method ensures a single and pure power source, consistent with the driving mechanism of pure electric vehicles, fundamentally guaranteeing a comfortable driving experience.
[0117] On the other hand, the characteristics of electric motors determine that they can output maximum torque instantly. In range-extended electric vehicles, when the driver presses the accelerator pedal, the electric motor can respond quickly and output powerful force to achieve rapid start and acceleration. This instantaneous power response is far superior to that of traditional fuel vehicles, allowing the driver to feel a more direct and rapid push-back feeling. Whether it is in the frequent start-stop of urban roads or overtaking operations on highways, it can easily cope with the situation and bring a smooth driving experience.
[0118] On the other hand, during the driving process of a range-extended vehicle, since it is always driven by an electric motor, there is no power interruption problem when shifting gears as in traditional fuel vehicles. Whether driving at low speed or high speed, the power output remains continuous and stable. Even when the battery is low, during the process of the engine starting to generate electricity, the system can ensure that the power output of the electric motor is not affected through a precise control strategy, without any jerking or power interruption. This provides the driver with a consistently stable driving experience, improving driving comfort and safety.
[0119] This application also discloses the following technical solutions:
[0120] A circuit board assembly, the circuit board assembly comprising: a flexible circuit board;
[0121] The flexible circuit board is provided with a first pad and a second pad;
[0122] The first pad and the second pad are misaligned in a first direction, and the first pad and the second pad are misaligned in a second direction. The first direction and the second direction intersect, and both the first direction and the second direction are parallel to the plane where the flexible circuit board is located.
[0123] The flexible circuit board is also provided with an isolation hole. In the first direction, the isolation hole has a first side and a second side opposite to each other. The first pad is located on the first side of the isolation hole, and the second pad is located on the second side of the isolation hole.
[0124] Optionally, the first pad is provided with a first through hole, the second pad is provided with a second through hole, and the flexible circuit board is provided with a third through hole and a fourth through hole, wherein the first through hole is connected to the third through hole, and the second through hole is connected to the fourth through hole.
[0125] Optionally, in the first direction, the distance between the first pad and the second pad is L1, satisfying: L1≥3.5mm; in the second direction, the distance between the first pad and the second pad is L2, satisfying: L2≥0.4mm.
[0126] A circuit board assembly, the circuit board assembly comprising: a flexible circuit board, the flexible circuit board including a temperature acquisition section, an expansion redundancy section and a thermal soldering section;
[0127] The temperature acquisition unit, the expansion redundancy unit, and the thermal welding unit are connected in sequence. The temperature acquisition unit is provided with a first solder pad and a second solder pad. The thermal welding unit is used to connect the thermal component. The expansion redundancy unit is deformable.
[0128] Optionally, the expansion redundancy section includes a first redundant arm and a second redundant arm, a first end of the first redundant arm is connected to the temperature acquisition section, a second end of the first redundant arm is connected to the first end of the second redundant arm, and a second end of the second redundant arm is connected to the heat-sensitive welding section.
[0129] Both the first redundant arm and the second redundant arm are bent, and there is a gap between the first redundant arm and the second redundant arm so that the expansion redundant part can be deformed.
[0130] Optionally, the first end of the first redundant arm is connected to the second end of the second redundant arm through a connecting structure, and the first redundant arm, the connecting structure, and the second redundant arm enclose a closed space.
[0131] Optionally, along the direction from the second end of the second redundant arm to the first redundant arm, the connection structure has opposing first and second sides, at least one of the first side and the second side being provided with reinforcing lines.
[0132] Optionally, the temperature acquisition unit is provided with a first reinforcing line, the second redundant arm is provided with a second reinforcing line, and the connection structure has a first side and a second side opposite to each other, with the first reinforcing line located on the first side of the connection structure and the second reinforcing line located on the second side of the connection structure.
[0133] A circuit board assembly includes: a flexible circuit board, the flexible circuit board including a thermal solder joint for connecting a thermally sensitive component;
[0134] The heat-sensitive welding part has a first surface, and a first reinforcing member is provided on the first surface, the first reinforcing member covering the first surface;
[0135] The first reinforcing member is provided with a clearance hole, and the heat-sensitive element is disposed on the first surface and located in the clearance hole.
[0136] Optionally, the clearance hole is filled with protective adhesive, which covers the heat-sensitive element.
[0137] Optionally, a scanning code is provided on the surface of the first reinforcing member opposite to the heat-sensitive welded part.
[0138] Optionally, the heat-sensitive welding part further has a second surface opposite to the first surface, the second surface being provided with a second reinforcing member, the second reinforcing member covering the second surface.
[0139] Optionally, the first reinforcing member is provided with at least one first through hole, the heat-sensitive welding part is provided with at least one second through hole, and the second reinforcing member is provided with at least one third through hole;
[0140] A second through hole connects a first through hole and a third through hole.
[0141] A temperature acquisition device, the temperature acquisition device comprising a thermistor and the aforementioned circuit board assembly;
[0142] The thermal element is disposed on the circuit board assembly.
[0143] A battery pack, the battery pack comprising a housing, a cell module, a temperature transfer component, the aforementioned circuit board assembly, and a temperature acquisition device;
[0144] The battery cell module, the temperature transfer component, and the circuit board assembly are all located in the housing. The temperature transfer component is disposed in the battery cell module, and the circuit board assembly is connected to the temperature transfer component.
[0145] A vehicle comprising a vehicle body and the aforementioned battery pack, the battery pack being mounted on the vehicle body.
[0146] The above description is only a partial embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in the embodiments of this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.
Claims
1. A circuit board assembly, characterized in that, It includes a first region (10), a second region (20), and a redundant structure (30); One end of the redundant structure (30) is connected to the first region (10), and the other end is connected to the second region (20); The first region (10) and the second region (20) are also connected by at least one micro-connection structure (40); The first region (10) and / or the second region (20) are provided with reinforcing lines (50) in the portion near the micro-connection structure (40).
2. The circuit board assembly according to claim 1, characterized in that, It also includes a conductor (00) configured to pass through at least two of the first region (10), the second region (20), and the redundant structure (30); The reinforcing line (50) is disposed between the micro-connection structure (40) and the conductor (00).
3. The circuit board assembly according to claim 2, characterized in that, The reinforcement line (50) includes a first reinforcement line (51) and a second reinforcement line (52); The first reinforcing line (51) is disposed between the micro-connection structure (40) and the portion of the conductor (00) passing through the first region (10); The second reinforcing line (52) is disposed between the micro-connection structure (40) and the portion of the conductor (00) passing through the second region (20).
4. The circuit board assembly according to any one of claims 1 to 3, characterized in that, The length of the redundant structure (30) is greater than the distance between the first region (10) and the second region (20); The redundant structure (30) includes a first redundant structure arm (31), which is connected to the first region (10) and extends in a direction away from the first region (10) and the second region (20); And / or The redundant structure (30) includes a second redundant structure arm (32), which is connected to the second region (20) and extends in a direction away from the first region (10) and the second region (20).
5. The circuit board assembly according to any one of claims 1 to 3, characterized in that, The thickness and / or width of the micro-connection structure (40) are set such that when the first region (10) and the second region (20) are relatively displaced, the micro-connection structure (40) can break before the redundant structure (30).
6. The circuit board assembly according to any one of claims 1 to 3, characterized in that, The redundant structure (30) is composed of a flexible circuit board or a flexible flat cable.
7. The circuit board assembly according to claim 2 or 3, characterized in that, The first region (10) is provided with a first pad (11) and a second pad (12); the conductor (00) includes a first conductor (01) and a second conductor (02), the first pad (11) is electrically connected to the first conductor (01), and the second pad (12) is electrically connected to the second conductor (02); The first pad (11) and the second pad (12) are offset along the X-axis and Y-axis, the X-axis and Y-axis are orthogonal, the X-axis and Y-axis are perpendicular to the thickness direction of the first region (10), and the X-axis is parallel to the direction in which the first pad (11) and / or the second pad (12) extend.
8. The circuit board assembly according to claim 7, characterized in that, The first pad (11) and / or the second pad (12) are provided with through holes (13).
9. The circuit board assembly according to claim 8, characterized in that, The through-hole (13) includes a through-hole with a cross-sectional shape extending along the X-axis.
10. The circuit board assembly according to claim 8, characterized in that, The through-hole (13) includes at least two circular through holes disposed on the same pad.
11. The circuit board assembly according to claim 7, characterized in that, A separation hole (14) is provided between the first pad and the second pad.
12. The circuit board assembly according to claim 11, characterized in that, The partition hole (14) is an oblong through hole with a length greater than 1.5 times the width of the first pad (11) or the second pad (12), and its length direction is perpendicular to the X-axis.
13. The circuit board assembly according to claim 12, characterized in that, The length of the partition hole (14) is greater than or equal to 2 mm, and / or the width of the partition hole (14) is greater than or equal to 1 mm.
14. The circuit board assembly according to claim 11, characterized in that, The partition hole (14) is a circular through hole with a radius greater than or equal to 1 mm.
15. The circuit board assembly according to any one of claims 11 to 14, characterized in that, The distance between the partition hole (14) and the surrounding conductor is greater than or equal to 1 mm.
16. The circuit board assembly according to claim 7, characterized in that, The gap between the first pad (11) and the second pad (12) along the X-axis is greater than or equal to 3.5 mm, and / or the gap between the first pad (11) and the second pad (12) along the Y-axis is greater than or equal to 0.4 mm; The conductor portion of at least one of the first pad (11) and the second pad (12) is greater than or equal to 1 mm from the edge of the circuit board assembly.
17. The circuit board assembly according to claim 2 or 3, characterized in that, The second area (20) is provided with a thermal pad (21), a silicone thermal pad observation hole (22) and a fixing hole (23); The thermal pad (21) is electrically connected to the wire (00); At least one of the observation hole (22) and fixing hole (23) of the silicone thermal pad is a through hole.
18. The circuit board assembly according to claim 17, characterized in that, It also includes the first reinforcing structure (60); The first reinforcing structure (60) is attached to the side of the second region (20) where the thermal pad (21) is located, and at least one of the silicone thermal pad observation hole (22) and fixing hole (23) penetrates the first reinforcing structure (60).
19. The circuit board assembly according to claim 18, characterized in that, The first reinforcing structure (60) is provided with a traceability identifier (24).
20. The circuit board assembly according to claim 18 or 19, characterized in that, The first reinforcing structure (60) is provided with a thermal protection hole (61), which is used to expose the thermal element (80) and to fill with ultraviolet curable adhesive.
21. The circuit board assembly according to claim 17, characterized in that, It also includes a second reinforcing structure (70); the second reinforcing structure (70) is attached to the side of the second region (20) away from the thermal pad (21); At least one of the silicone thermal pad observation hole (22) and fixing hole (23) penetrates the second reinforcing structure (70).
22. The circuit board assembly according to claim 21, characterized in that, The second reinforcement structure (70) is equipped with a traceability identifier (24).
23. A temperature acquisition device, characterized in that, Includes the circuit board assembly as described in any one of claims 1 to 22.
24. A battery pack, characterized in that, Includes the temperature acquisition device as described in claim 23.
25. A vehicle, characterized in that, Includes the battery pack as described in claim 24.