Flexible wiring board resistant to bending

Abstract

The utility model discloses a kind of flexible circuit board of bending resistance, including flexible circuit board body, including internal circuit, substrate being set at circuit bottom, cover layer being set at circuit top;Buffer layer, including silicon rubber layer A being set at the top of cover layer, silicon rubber layer B being set at the bottom surface of substrate;By respectively setting silicon rubber layer A and silicon rubber layer B at the outside of substrate and cover layer, when flexible circuit board body is bent, buffer layer formed by silicon rubber layer A and silicon rubber layer B can first bear a part of external force, and by the elastic deformation of itself, the force transmitted to flexible circuit board body is dispersed and weakened, reduce the stress concentration generated by bending of flexible circuit board body, to improve the bending resistance of flexible circuit board body, while through the adhesive layer and reinforcement assembly designed, the connection strength between layers can be strengthened, to avoid dislocation delamination between layers when bending.

Description

Technical Field

[0001] This utility model belongs to the field of flexible circuit board technology, specifically relating to a flexible circuit board that is resistant to bending. Background Technology

[0002] Flexible printed circuit boards (FPCBs) are printed circuit boards made with flexible insulating materials as the substrate, also known as flexographic circuit boards or flexible circuit boards. They use flexible materials such as polyimide or polyester as the substrate, form conductive lines by etching copper foil, and protect the lines with a capping layer. FPCBs are characterized by their thinness, flexibility, and bendability, allowing them to adapt to complex spatial layouts and are widely used in consumer electronics, automotive electronics, medical devices, aerospace, and other fields. With their excellent electrical performance and flexibility, they save internal space while ensuring stable signal transmission, making them a key component for miniaturization, weight reduction, and high integration in modern electronic devices.

[0003] During installation, flexible circuit boards are often bent due to space constraints. Existing circuit boards are prone to damage, breakage, or even fracture of their internal circuitry during prolonged bending, which hinders their normal use. Therefore, a new type of flexible circuit board needs to be designed to solve this problem. Utility Model Content

[0004] The purpose of this invention is to provide a flexible circuit board that is resistant to bending, in order to solve the problem mentioned in the background art that the existing flexible circuit boards have poor bending resistance and their internal circuits are easily damaged after bending.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a flexible circuit board resistant to bending, comprising... The flexible circuit board body includes internal circuitry, a substrate disposed at the bottom of the circuitry, and a cover layer disposed at the top of the circuitry. The buffer layer includes a silicone rubber layer A disposed on top of the cover layer and a silicone rubber layer B disposed on the bottom surface of the substrate; An adhesive layer that bonds the substrate, cover layer, silicone rubber layer A, and silicone rubber layer B together; The reinforcement component includes a rectangular sleeve that fits over the outside of the flexible circuit board body.

[0006] Preferably, the reinforcing component further includes a rectangular seat disposed on the surface of the silicone rubber layer A, a screw hole opened inside the rectangular seat, and a bolt that passes through the rectangular sleeve and is threadedly connected to the screw hole.

[0007] Preferably, the reinforcing component further includes a rectangular groove formed on the surface of the silicone rubber layer A, and the rectangular seat is fixed inside the rectangular groove.

[0008] Preferably, the flexible circuit board body is provided with a heat dissipation component, which includes a heat dissipation outer hole and a heat dissipation inner hole. The heat dissipation outer hole is formed on the surface of the silicone rubber layer A, and the heat dissipation inner hole is formed on the surface of the cover layer and is aligned with the heat dissipation outer hole.

[0009] Preferably, the heat dissipation outer hole is open at both the top and bottom, and the bottom of the heat dissipation inner hole is closed.

[0010] Preferably, the heat dissipation assembly further includes a through groove and a heat sink, wherein the through groove is formed inside the cover layer and the silicone rubber layer A, and the heat sink is fixedly disposed inside the through groove.

[0011] Preferably, the bottom of the through groove is closed and the top is open, the bottom of the heat sink is placed inside the closed bottom of the through groove, and the top of the heat sink extends out of the opening of the through groove.

[0012] Compared with the prior art, the beneficial effects of this utility model are: By setting silicone rubber layer A and silicone rubber layer B on the outer side of the substrate and the cover layer respectively, when the flexible circuit board body is bent, the buffer layer composed of silicone rubber layer A and silicone rubber layer B can first bear part of the external force, and disperse and weaken the force transmitted to the flexible circuit board body through its own elastic deformation, reducing the stress concentration caused by bending of the flexible circuit board body, thereby improving the bending resistance of the flexible circuit board body. At the same time, through the designed adhesive layer and reinforcing components, the connection strength between the layers can be strengthened, and misalignment and delamination between the layers can be avoided when bending. Attached Figure Description

[0013] Figure 1 This is a three-dimensional schematic diagram of the present invention; Figure 2 This is a front sectional view of the flexible circuit board body and the reinforcing components of this utility model; Figure 3 This is a three-dimensional schematic diagram of the rectangular base of this utility model; Figure 4 This is a front sectional view of the heat dissipation component of this utility model; In the diagram: 100, Flexible Circuit Board Body; 101, Circuit; 102, Substrate; 103, Cover Layer; 104, Silicone Rubber Layer A; 105, Silicone Rubber Layer B; 106, Adhesive Layer; 200, Reinforcing Component; 201, Rectangular Sleeve; 202, Rectangular Groove; 203, Rectangular Seat; 204, Screw Hole; 205, Bolt; 300, Heat Dissipation Component; 301, Heat Dissipation Outer Hole; 302, Heat Dissipation Inner Hole; 303, Through Groove; 304, Heat Dissipation Fin. Detailed Implementation

[0014] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model. Example

[0015] Please see Figures 1 to 4 This embodiment provides a technical solution: a bend-resistant flexible circuit board, comprising... The flexible circuit board body 100 includes an internal circuit 101, a substrate 102 disposed at the bottom of the circuit 101, and a cover layer 103 disposed at the top of the circuit 101. The substrate 102 and the cover layer 103 clamp and seal the circuit 101 in the middle. The buffer layer includes a silicone rubber layer A104 disposed on the top of the cover layer 103 and a silicone rubber layer B105 disposed on the bottom of the substrate 102. The buffer layer buffers and weakens the bending force generated during bending. An adhesive layer 106 is bonded between the substrate 102, the cover layer 103, the silicone rubber layer A104 and the silicone rubber layer B105 to bond and fix the layers together. The reinforcing component 200 includes a rectangular sleeve 201 that is fitted onto the outside of the flexible circuit board body 100. By fitting the rectangular sleeve 201 onto the outside of the flexible circuit board body 100, the layers can be further reinforced to prevent misalignment and delamination during bending.

[0016] In this embodiment, preferably, the reinforcement component 200 further includes a rectangular seat 203 disposed on the surface of the silicone rubber layer A104, a screw hole 204 opened inside the rectangular seat 203, and a bolt 205 passing through the rectangular sleeve 201 and threadedly connected to the screw hole 204. By tightening the bolt 205, the rectangular sleeve 201 can be fixedly connected to the outside of the flexible circuit board body 100.

[0017] In this embodiment, preferably, the reinforcing component 200 further includes a rectangular groove 202 formed on the surface of the silicone rubber layer A104, and a rectangular seat 203 is fixed inside the rectangular groove 202 to fix the rectangular seat 203. At the same time, the design of the rectangular structure can prevent the rectangular seat 203 from rotating when the rotating bolt 205 is turned.

[0018] In this embodiment, preferably, a heat dissipation component 300 is provided on the flexible circuit board body 100. The heat dissipation component 300 includes a heat dissipation outer hole 301 and a heat dissipation inner hole 302. The heat dissipation outer hole 301 is formed on the surface of the silicone rubber layer A104, and the heat dissipation inner hole 302 is formed on the surface of the cover layer 103 and is aligned with the heat dissipation outer hole 301. Through the heat dissipation outer hole 301 and the heat dissipation inner hole 302, the heat dissipation performance of the flexible circuit board body 100 can be improved.

[0019] In this embodiment, preferably, the heat dissipation outer hole 301 is open at both the top and bottom, and the bottom of the heat dissipation inner hole 302 is closed to protect the internal circuit 101.

[0020] In this embodiment, preferably, the heat dissipation component 300 further includes a through groove 303 and a heat sink 304. The through groove 303 is formed inside the cover layer 103 and the silicone rubber layer A104. The heat sink 304 is fixedly disposed inside the through groove 303. The heat sink 304 is made of copper foil. The heat sink 304 can conduct heat out of the flexible circuit board body 100, further improving the heat dissipation effect of the flexible circuit board body 100.

[0021] In this embodiment, preferably, the bottom of the through groove 303 is closed and the top is open. The bottom of the heat sink 304 is placed inside the closed bottom of the through groove 303, and the top of the heat sink 304 extends out of the opening of the through groove 303. The heat sink 304 will not interfere with the normal use of the circuit 101.

[0022] Although embodiments of the present invention have been shown and described (see the detailed description above), it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A flexible wiring board resistant to bending, characterized by: include The flexible circuit board body (100) includes an internal circuit (101), a substrate (102) disposed at the bottom of the circuit (101), and a cover layer (103) disposed at the top of the circuit (101). The buffer layer includes a silicone rubber layer A (104) disposed on top of the cover layer (103) and a silicone rubber layer B (105) disposed on the bottom surface of the substrate (102). An adhesive layer (106) is bonded between a substrate (102), a cover layer (103), a silicone rubber layer A (104), and a silicone rubber layer B (105). The reinforcing component (200) includes a rectangular sleeve (201) fitted over the outside of the flexible circuit board body (100).

2. The flexible wiring board according to claim 1, wherein: The reinforcement component (200) also includes a rectangular seat (203) disposed on the surface of the silicone rubber layer A (104), a screw hole (204) opened inside the rectangular seat (203), and a bolt (205) that passes through the rectangular sleeve (201) and is threadedly connected to the screw hole (204).

3. The flexible wiring board according to claim 2, wherein: The reinforcement component (200) also includes a rectangular groove (202) formed on the surface of the silicone rubber layer A (104), and the rectangular seat (203) is fixed inside the rectangular groove (202).

4. The flexible wiring board according to claim 3, wherein: The flexible circuit board body (100) is provided with a heat dissipation component (300). The heat dissipation component (300) includes a heat dissipation outer hole (301) and a heat dissipation inner hole (302). The heat dissipation outer hole (301) is opened on the surface of the silicone rubber layer A (104), and the heat dissipation inner hole (302) is opened on the surface of the cover layer (103) and is aligned with the heat dissipation outer hole (301).

5. The flexible wiring board according to claim 4, wherein: The heat dissipation outer hole (301) is open at both the top and bottom, while the bottom of the heat dissipation inner hole (302) is closed.

6. The flexible wiring board according to claim 5, wherein: The heat dissipation assembly (300) also includes a through groove (303) and a heat sink (304). The through groove (303) is formed inside the cover layer (103) and the silicone rubber layer A (104). The heat sink (304) is fixedly disposed inside the through groove (303).

7. The flexible wiring board according to claim 6, wherein: The bottom of the through groove (303) is closed and the top is open. The bottom of the heat sink (304) is placed inside the closed bottom of the through groove (303), and the top of the heat sink (304) extends out of the opening of the through groove (303).

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