Intelligent communication management machine

Abstract

The utility model relates to an intelligent communication management machine belongs to communication management machine technical field, including the casing, the bottom installation of casing is handled mainboard, its characterized in that: the bottom of casing is equipped with the air inlet, rotates and is installed in the air inlet and has the air guide mechanism, the top of casing is fixed with exhaust component, and the exhaust component includes the exhaust box fixed in the top of casing, and the bottom of exhaust box and the inside of casing are communicated, and the lateral wall on exhaust box is fixed with exhaust fan, and one side of casing is equipped with the power connection through the power line, the utility model bottom air inlet and air guide mechanism, top exhaust component form high -efficient airflow channel, can discharge the heat that handled mainboard produced quickly, guarantees its stable operation, prolongs the life, the heat dissipation fin component increases the heat dissipation area, and the air flow is optimized in the vent, and the heat dissipation efficiency is further improved, the air guide mechanism makes cooling air accurate effect in handled mainboard, and the heat dissipation pertinence is enhanced.

Description

Technical Field

[0001] This utility model relates to the field of communication management machine technology, and in particular to an intelligent communication management machine. Background Technology

[0002] In the current era of continuous development of industrial automation systems, intelligent communication management units play a crucial role as core hub devices. With their multi-interface design, they can efficiently acquire real-time data from multiple devices, providing strong data support for industrial production monitoring and management. Simultaneously, their protocol conversion capabilities effectively solve the interoperability problem between heterogeneous devices, enabling different types of equipment to work collaboratively and significantly improving the overall operating efficiency of industrial automation systems. Furthermore, most intelligent communication management units can remotely receive and forward master station commands, achieving unattended operation and reducing labor costs and the risk of human error.

[0003] However, industrial environments place extremely high demands on the reliability and stability of intelligent communication management machines. Because these machines need to operate continuously, their internal electronic components generate a significant amount of heat during operation. Existing heat dissipation methods for intelligent communication management machines are clearly inadequate. Some devices rely solely on passive cooling, using a metal casing for auxiliary heat conduction, but this method has limited efficiency and cannot meet the heat dissipation requirements of prolonged high-load operation. Although some intelligent communication management machines are equipped with cooling fans, heat loss still exists, leading to heat accumulation. This not only affects the performance and lifespan of electronic components but may also cause equipment failure, thereby impacting the normal operation of the entire industrial automation system. Therefore, developing an efficient heat dissipation technology is of significant practical importance for the development of intelligent communication management machines. Utility Model Content

[0004] To overcome the technical defects of the existing technology, this utility model provides an intelligent communication management machine that can solve the problem of heat dead zones in the active heat dissipation of the existing technology.

[0005] The technical solution adopted by this utility model is as follows: It includes a housing, which is entirely enclosed and provides a processing motherboard. The processing motherboard is installed at the bottom inside the housing. An air inlet is provided at the bottom inside the housing to introduce external cooling air into the housing. An air guiding mechanism is rotatably installed inside the air inlet. An exhaust assembly is fixed at the top of the housing. The exhaust assembly includes an exhaust box fixed at the top of the housing. The bottom of the exhaust box communicates with the inside of the housing. An exhaust fan is fixed on the side wall of the exhaust box to draw out the gas inside the exhaust box. A power connector is provided on one side of the housing via a power cord.

[0006] Preferably, in order to facilitate the installation and fixation of the housing and external equipment, an assembly plate is fixed to one side of the exhaust box, the assembly plate has an assembly hole, and a support foot is fixed to the bottom of the housing.

[0007] Preferably, in order to improve the heat dissipation effect, the exhaust fans are arranged in a mirror image on both sides of the housing and both face the top of the housing. The exhaust box on the side of the mounting hole is provided with a recess. The mirror image arrangement and orientation of the exhaust fans can form an efficient airflow channel to accelerate the discharge of hot air. The recess can avoid interference problems during installation.

[0008] Preferably, a heat dissipation fin assembly is fixed to the top of the housing. The heat dissipation fin assembly includes a partition plate located between the exhaust fans. A heat dissipation support plate is fixed to the partition plate. The heat dissipation support plate is arranged sequentially on the side wall of the partition plate. An opening is provided on the heat dissipation support plate. The heat dissipation fin assembly can increase the heat dissipation area, and the opening facilitates airflow, further improving the heat dissipation efficiency.

[0009] Preferably, the air guiding mechanism includes a vertical pipe located inside the air inlet, with its bottom end extending below the bottom of the housing. A rotating ring is threaded onto the bottom end of the vertical pipe, and a snap-fit ​​portion is provided at the bottom of the rotating ring. A limiting ring is fixed on the outer wall of the vertical pipe, located inside the housing. The vertical pipe guides cooling air in, and the rotating ring, in conjunction with the upper limiting ring, prevents the vertical pipe from dislodging.

[0010] Preferably, the top end of the vertical tube is connected to a horizontal tube, one end of the horizontal tube extends above the processing motherboard, and a cooling hole is provided at the bottom of the horizontal tube; the horizontal tube can guide cooling air to the top of the processing motherboard, and the cooling hole can make the cooling air act precisely on the processing motherboard, thereby enhancing the heat dissipation effect.

[0011] The beneficial effects of this utility model are: 1. Highly efficient heat dissipation: An air intake and air guide mechanism are installed at the bottom of the chassis, and an exhaust component is set at the top, which can form a highly efficient airflow channel from intake to exhaust. This can quickly dissipate the heat generated by the motherboard inside the chassis, ensuring that the motherboard operates stably in a suitable temperature environment, effectively extending the service life of the motherboard, and reducing the hardware damage and failure rate caused by overheating.

[0012] 2. Convenient and reasonable installation: The mounting plate and mounting holes on one side of the exhaust box facilitate the installation and fixation of the housing to external equipment; the support feet at the bottom of the housing provide stable support; the recessed part on the exhaust box avoids interference problems during installation, making the entire device easier and more efficient to install, saving installation time and labor costs.

[0013] 3. Increased heat dissipation area and optimized airflow: The heat dissipation fin assembly increases the heat dissipation area. The sequentially arranged heat dissipation support plates and their openings on the partition plate help the air to flow better inside the casing, further improving heat dissipation efficiency and enabling the heat to be dissipated more quickly, thus improving the overall heat dissipation performance of the device.

[0014] 4. Precise and stable airflow: The vertical tube of the airflow mechanism guides cooling air into the housing, and the rotating ring and the limiting ring prevent the vertical tube from dislodging, ensuring the stability of the airflow mechanism; the horizontal tube guides the cooling air to the top of the mainboard, and the cooling holes allow the cooling air to act precisely on the mainboard, enhancing the heat dissipation effect on the mainboard and improving the targeting and effectiveness of heat dissipation. Attached Figure Description

[0015] Figure 1 This is a three-dimensional structural diagram of the present invention.

[0016] Figure 2 This is a schematic diagram of the bottom structure of this utility model.

[0017] Figure 3 for Figure 2 A magnified structural diagram of point A in the middle.

[0018] Figure 4 This is a schematic diagram of the heat dissipation fin assembly structure of this utility model.

[0019] Figure 5 This is a schematic diagram of the air guiding mechanism of this utility model.

[0020] Explanation of reference numerals in the attached drawings: 1. Housing; 2. Air duct mechanism; 201. Vertical pipe; 202. Rotating ring; 203. Limiting ring; 204. Horizontal pipe; 205. Cooling hole; 3. Exhaust assembly; 301. Exhaust box; 302. Exhaust fan; 303. Assembly plate; 304. Recessed part; 4. Heat dissipation fin assembly; 401. Partition plate; 402. Heat dissipation support plate. Detailed Implementation

[0021] The present invention will be further described below with reference to the accompanying drawings: like Figures 1-5As shown, this embodiment provides an intelligent communication management unit, including a housing 1. The housing 1 is completely enclosed and provides a processing motherboard. The processing motherboard is installed at the bottom inside the housing 1. An air inlet is provided at the bottom inside the housing 1 to introduce external cooling air into the housing 1. An air guide mechanism 2 is rotatably installed inside the air inlet. An exhaust assembly 3 is fixed at the top of the housing 1. The exhaust assembly 3 includes an exhaust box 301 fixed at the top of the housing 1. The bottom of the exhaust box 301 communicates with the inside of the housing 1. An exhaust fan 302 is fixed on the side wall of the exhaust box 301 to draw out the gas inside the exhaust box 301. A power connector is provided on one side of the housing 1 through a power cord.

[0022] A mounting plate 303 is fixed to one side of the exhaust box 301. The mounting plate 303 has mounting holes. Support feet are fixed to the bottom of the housing 1, which facilitates the installation and fixation of the housing 1 and external equipment. The exhaust fans 302 are arranged in a mirror image on both sides of the housing 1, and both face the top of the housing 1. The exhaust box 301 on the mounting hole side is provided with a relief part 304. The mirror image arrangement and orientation of the exhaust fans 302 can form an efficient airflow channel to accelerate the exhaust of hot air. The relief part 304 can avoid interference problems during installation, thus improving the heat dissipation effect.

[0023] The heat dissipation fin assembly 4 includes a partition plate 401 located between the exhaust fans 302. A heat dissipation support plate 402 is fixed on the partition plate 401. The heat dissipation support plate 402 is arranged sequentially on the side wall of the partition plate 401. An opening is provided on the heat dissipation support plate 402. The heat dissipation fin assembly 4 can increase the heat dissipation area. The opening helps air flow and further improves the heat dissipation efficiency. The heat dissipation fin assembly 4 is fixed on the top of the casing 1.

[0024] The vertical pipe 201 is located inside the air inlet, and its bottom end extends to the bottom of the housing 1. A rotating ring 202 is threaded onto the bottom end of the vertical pipe 201. The bottom of the rotating ring 202 has a snap-fit ​​part. A limiting ring 203 is fixed on the outer wall of the vertical pipe 201. The limiting ring 203 is located inside the housing 1. The vertical pipe 201 is used to guide cooling air in. The rotating ring 202 can cooperate with the upper limiting ring 203 to prevent the vertical pipe 201 from dislodging. The air guiding mechanism 2 includes the vertical pipe 201. One end of the horizontal pipe 204 extends to the top of the main processing board. A cooling hole 205 is opened at the bottom of the horizontal pipe 204. The horizontal pipe 204 can guide the cooling air to the top of the main processing board. The cooling hole 205 can make the cooling air act precisely on the main processing board, enhancing the heat dissipation effect. The top end of the vertical pipe 201 is connected to the horizontal pipe 204. A protective net or filter layer can be set at the bottom end of the vertical pipe 201.

[0025] When this intelligent communication management unit is working, the power connector is connected to the power supply to start the processing motherboard, which generates heat during operation.

[0026] When in use, the air guiding mechanism 2 inside the air inlet begins to function. The vertical pipe 201 guides external cooling air into the housing 1. The rotating ring 202, in conjunction with the limiting ring 203, prevents the vertical pipe 201 from dislodging, ensuring the stable operation of the air guiding mechanism 2. The cooling air enters the horizontal pipe 204 through the vertical pipe 201. The horizontal pipe 204 guides the cooling air to the top of the main processing board, and then acts precisely on the main processing board through the cooling hole 205, carrying away the heat it generates.

[0027] At the same time, the exhaust fan 302 of the exhaust assembly 3 on the top of the casing 1 is activated. Since the exhaust fan 302 is relatively mirrored on both sides of the casing 1 and faces the top of the casing 1, it forms an efficient airflow channel, which can accelerate the exhaust of hot air inside the casing 1 to the exhaust box 301, and then lead it out of the casing 1 by the exhaust fan 302. The heat dissipation fin assembly 4 on the top of the casing 1 also further assists in heat dissipation. The heat dissipation support plates 402 arranged sequentially on the partition plate 401 increase the heat dissipation area. The openings on the heat dissipation support plates 402 help airflow and further improve heat dissipation efficiency. The partition plate 401 can also prevent the heat dissipation fans on both sides from interfering with each other's work.

[0028] In addition, the design of the mounting plate 303 and mounting holes on one side of the exhaust box 301 facilitates the installation and fixation of the housing 1 with external equipment, and the support feet at the bottom of the housing 1 provide stable support; the recessed part 304 on the exhaust box 301 avoids interference problems during installation, making the installation of the entire device smoother, ensuring that the device can stably and efficiently dissipate heat for the mainboard, and ensuring that the mainboard operates normally in a suitable temperature environment.

[0029] The foregoing has shown and described the basic principles, main features, and advantages of this invention. Those skilled in the art should understand that this invention is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this invention. Various changes and modifications may be made to this invention without departing from its spirit and scope. All such changes and modifications fall within the scope of this invention as defined by the appended claims and their equivalents.

Claims

1. An intelligent communication management machine, comprising a machine shell (1), a processing mainboard is installed at the bottom in the machine shell (1), characterized in that: An air inlet is provided at the bottom of the housing (1), and an air guide mechanism (2) is rotatably installed inside the air inlet. An exhaust assembly (3) is fixed at the top of the housing (1). The exhaust assembly (3) includes an exhaust box (301) fixed at the top of the housing (1). The bottom of the exhaust box (301) is connected to the inside of the housing (1). An exhaust fan (302) is fixed on the side wall of the exhaust box (301). A power connector is provided on one side of the housing (1) via a power cord.

2. The intelligent communication manager of claim 1, wherein: An assembly plate (303) is fixed to one side of the exhaust box (301), and an assembly hole is provided on the assembly plate (303). A support foot is fixed to the bottom of the housing (1).

3. The intelligent communication manager of claim 2, wherein: The exhaust fan (302) is arranged in a mirror image on both sides of the housing (1) and both face the top of the housing (1). The exhaust box (301) on the side of the mounting hole is provided with a recess (304).

4. The intelligent communication manager of claim 3, wherein: The top of the housing (1) is fixed with a heat dissipation fin assembly (4), the heat dissipation fin assembly (4) includes a partition plate (401) located between the exhaust fans (302), a heat dissipation support plate (402) is fixed on the partition plate (401), the heat dissipation support plate (402) is arranged sequentially on the side wall of the partition plate (401), and an opening is provided on the heat dissipation support plate (402).

5. The intelligent communication manager of claim 1, wherein: The air guiding mechanism (2) includes a vertical tube (201), which is located inside the air inlet. The bottom end of the vertical tube (201) extends to the bottom of the housing (1). A rotating ring (202) is installed at the bottom end of the vertical tube (201) by means of a thread. A snap-fit ​​part is provided at the bottom of the rotating ring (202). A limiting ring (203) is fixed on the outer wall of the vertical tube (201). The limiting ring (203) is located inside the housing (1).

6. The intelligent communication manager of claim 5, wherein: The top end of the vertical tube (201) is connected to a horizontal tube (204), one end of the horizontal tube (204) extends to the top of the processing motherboard, and a cooling hole (205) is provided at the bottom of the horizontal tube (204).

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