Refrigeration type infrared movement module and thermal imaging equipment

Abstract

The utility model discloses a kind of refrigeration type infrared core module and thermal imaging equipment, the refrigeration type infrared core module includes signal relay board, circuit board assembly, support, the detector body and refrigerator of being arranged on the support, the refrigerator is parallelly arranged with the detector body;The outer periphery of the head of the detector body is equipped with the signal relay board, the signal relay board is vertically set relative to the support, and forms frame structure with the support, and the circuit board assembly is arranged on the outside of the frame structure.

Description

Technical Field

[0001] This utility model relates to the field of infrared technology, and in particular to a cooled infrared core module and thermal imaging equipment. Background Technology

[0002] Cooled infrared detector modules, with their high sensitivity and other advantages, are indispensable in high-end fields such as UAV reconnaissance and aerial remote sensing. However, their traditional designs, due to the integration of components such as refrigerators and insulation structures, result in a bulky size, making it difficult to meet the stringent requirements of "small size and light weight" for lightweight scenarios such as small and medium-sized UAVs and single-person equipment. Therefore, how to achieve efficient cooling, precise temperature control, and highly integrated design within limited space has become a key technical challenge that urgently needs to be overcome in this field. Innovative design is urgently needed to promote the application of cooled infrared detection technology in lightweight scenarios. Utility Model Content

[0003] To address the existing technical problems, this application provides a small-volume, lightweight, highly integrated cooled infrared core module and thermal imaging equipment.

[0004] To achieve the above objectives, the technical solution of this application embodiment is implemented as follows:

[0005] A cooled infrared core module, comprising:

[0006] The device includes a signal relay board, a circuit board assembly, a support, a detector body mounted on the support, and a cooler, with the cooler and the detector body arranged side by side. The signal relay board is fitted around the outer periphery of the head of the detector body. The signal relay board is an upright device relative to the support, forming a frame structure with the support. The circuit board assembly is located on the outside of the frame structure.

[0007] The cooled infrared core module provided in the above embodiment uses a support as the basic load-bearing component, with the detector body and the cooler mounted side by side on the support. A signal relay board is sleeved on the outer periphery of the detector body head. This signal relay board and the support work together to form a frame structure, which can house the detector body and the cooler within the frame structure, providing mechanical protection and spatial limitation for the core components such as the detector body and the cooler. The circuit board assembly is installed on the outside of the frame, which facilitates integrated layout.

[0008] A thermal imaging device includes the cooled infrared core module described in any embodiment of this application.

[0009] The thermal imaging equipment provided in the above embodiments belongs to the same concept as the corresponding cooled infrared core module embodiments, and thus has the same technical effect as the corresponding cooled infrared core module embodiments, which will not be repeated here. Attached Figure Description

[0010] Figure 1 This is a schematic diagram of the structure of a cooled infrared core module in one embodiment.

[0011] Figure 2 for Figure 1 The diagram shows a structural schematic of the cooled infrared core module from another angle.

[0012] Figure 3 for Figure 1 The diagram shows a cooled infrared module in which the detector body and the cooler are arranged side by side.

[0013] Figure 4 This is a schematic diagram of the structure after an arc-shaped plate is installed on the head of the detector body in one embodiment.

[0014] Figure 5 This is a schematic diagram of the structure after an arc-shaped cover plate is further installed on the head of the detector body in one embodiment.

[0015] Figure 6 This is a schematic diagram of the detector body and the cooler installed on the support in one embodiment.

[0016] Figure 7 This is a schematic diagram of the structure after a detector heat sink is further installed at the tail of the detector body in one embodiment.

[0017] Figure 8 This is a schematic diagram of the structure after the detector pressure ring is installed on top of the detector body in one embodiment.

[0018] Figure 9 This is a schematic diagram of the structure after the front pressure ring of the refrigeration unit is installed above the refrigeration unit in one embodiment.

[0019] Figure 10 This is a schematic diagram of the structure after the rear pressure ring of the refrigeration unit is further installed above the refrigeration unit in one embodiment.

[0020] Figure 11 This is a schematic diagram of the structure after a cooling machine drive circuit board is further installed in a cooling infrared core module in one embodiment.

[0021] Figure 12 This is a schematic diagram of the structure after further installing an ADC circuit board in a cooled infrared core module in one embodiment.

[0022] Figure 13 This is a schematic diagram of the structure after installing an FPGA circuit board and a heat sink in a cooled infrared core module in one embodiment.

[0023] Figure 14This is a schematic diagram of the structure after a temperature sensor is further installed in a cooled infrared core module in one embodiment.

[0024] Component Symbol Explanation

[0025] Support 10, detector body 11, refrigerator 12, circuit board assembly 13, positioning hole 101, positioning component 102, detector pressure ring 110, detector heat sink 111, buffer pad 112, first thermal pad 113, second thermal pad 114, refrigerator pressure ring 120, refrigerator front pressure ring 121, refrigerator rear pressure ring 122, third thermal pad 123, ADC circuit board 130, refrigerator drive circuit board 131, FPGA circuit board 132, heat sink 133, user circuit board 134, user circuit board cover 135, first slot 141, second slot 142, signal relay board 20, first bow plate 201, second bow plate 202, bow plate cover 21, temperature sensor 30, copper pin 41, copper sleeve 42, flexible flat cable 43, screw 50, copper pillar 51. Detailed Implementation

[0026] The technical solution of the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0027] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the ways in which the invention may be implemented. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0028] In the description of this utility model, it should be understood that the terms "center," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. In the description of this utility model, unless otherwise stated, "a plurality of" means two or more.

[0029] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0030] In the following description, the phrase "some embodiments" refers to a subset of all possible embodiments. It should be noted that "some embodiments" can be the same subset or different subsets of all possible embodiments, and can be combined with each other without conflict.

[0031] In the following description, the terms "first, second, and third" are used merely to distinguish similar objects and do not represent a specific ordering of objects. It is understood that "first, second, and third" may be interchanged in a specific order or sequence where permitted, so that the embodiments of this application described herein can be implemented in an order other than that illustrated or described herein.

[0032] Please refer to the following: Figures 1 to 4 This is a schematic diagram of a cooled infrared core module provided in an embodiment of this application. The cooled infrared core module includes: a signal relay board 20, a circuit board assembly 13, a support 10, a detector body 11 disposed on the support 10, and a cooler 12. The cooler 12 and the detector body 11 are arranged side by side. The signal relay board 20 is sleeved on the outer periphery of the head of the detector body 11. The signal relay board 20 is vertically disposed relative to the support 10 and together with the support 10 forms a frame structure. The circuit board assembly 13 is disposed on the outside of the frame structure.

[0033] In the above embodiment, the cooled infrared core module includes a signal relay board 20, a circuit board assembly 13, a support 10, a detector body 11 mounted on the support 10, and a cooler 12. Using the support as a stable foundation, the detector body 11 and cooler 12 are arranged side-by-side on the support 10. The signal relay board 20 is fitted around the head of the detector body 11, and the signal relay board 20 and the support 10 cooperate to form a frame structure. This frame structure can house the detector body 11 and cooler 12, providing mechanical protection for the core components such as the detector body 11 and cooler 12, and also providing precise spatial positioning for them. The circuit board assembly 13 is mounted on the outside of the frame. This layout greatly improves the integration of the overall structure and achieves dual optimization of function and space utilization.

[0034] In some embodiments, the circuit board assembly 13 includes an ADC circuit board 130, a cooler drive circuit board 131, and an FPGA circuit board 132. The ADC circuit board 130 is disposed on one side of the detector body 11, the cooler drive circuit board 131 is disposed on the same side as the cooler 12 and the ADC circuit board 130, the cooler drive circuit board 131 and the cooler 12 are connected by a cable, a preset height difference is formed between the cooler drive circuit board 131 and the ADC circuit board 130, and the FPGA circuit board 132 is installed in the installation space formed by the preset height difference.

[0035] In the above embodiments, the circuit board assembly 13 includes an ADC circuit board 130, a cooler drive circuit board 131, and an FPGA circuit board 132. In the circuit board assembly 13, the cooler drive circuit board 131 and the ADC circuit board 130 are stacked in a staggered manner in a direction perpendicular to the detector body and the cooler, forming a certain height difference. The size difference between the detector body 11 and the cooler 12 creates a mounting space in the longitudinal space above the support 10, so that the FPGA circuit board 132 can be placed in the mounting space. Of course, the ADC circuit board 130 and the cooler drive circuit board 131 can also be combined on a single circuit board. In this case, the mounting space corresponding to the preset height difference does not exist. In this way, it is not only convenient to complete the electrical connection between the FPGA circuit board 132, the refrigerator drive circuit board 131, and the ADC circuit board 130, but also to make fuller use of the horizontal and vertical space above the support 10, and to plan the installation space of the circuit board in a three-dimensional and hierarchical manner. This allows for a reasonable layout of the core functional modules within the limited volume of the overall product, greatly reducing the size of the equipment and ultimately forming a highly integrated design structure that improves the performance and practicality of the equipment.

[0036] Please refer to Figure 3 and Figure 4 The cooled infrared core module also includes an arc-shaped plate; the arc-shaped plate is sleeved on the outer periphery of the head of the detector body 11, and the support 10 is located at the end of the detector body 11 that is relatively far away from the head; the arc-shaped plate includes a copper sleeve 42 corresponding to the copper needle 41 at the head of the detector body 11, and the copper sleeve 42 is inserted into the copper needle 41; the arc-shaped plate is connected to the ADC circuit board 130 via a cable.

[0037] An arc-shaped plate is fitted around the outer periphery of the head of the detector body 11. A ring of copper needles 41 is provided around the outer periphery of the head of the detector body 11. A ring of copper sleeves 42 matching the copper needles 41 of the head of the detector body 11 is provided in the central area of ​​the arc-shaped plate. The head of the detector body 11 is passed through the central area of ​​the arc-shaped plate, and then the copper needles 41 of the head of the detector body 11 are inserted and tightened with the copper sleeves 42 in the central area of ​​the arc-shaped plate, forming a preliminary physical connection structure between the detector body 11 and the arc-shaped plate. This can form a preliminary positioning during assembly, maintain relative positional accuracy, and help reduce the possibility of mechanical displacement between the two due to vibration or other factors.

[0038] The support 10 is located at the end of the detector body 11 that is relatively far from the head. Thus, the support 10 and the bow-shaped plate are arranged along the length of the detector body 11, providing support to the opposite ends of the detector body 11. In this way, the support 10 and the bow-shaped plate work together to provide good protection for the entire detector body 11. Furthermore, the detector body 11 and the bow-shaped plate are connected by copper pins 41 and copper sleeves 42, and the bow-shaped plate is connected to the ADC circuit board 130 via a cable. Therefore, the bow-shaped plate can act as a signal relay. This design avoids a direct rigid connection between the detector body 11 and the ADC circuit board 130, reducing the impact of circuit board layout limitations on the installation accuracy of the detector body 11.

[0039] In some embodiments, please refer to Figure 5 The bow-shaped plate includes a first bow-shaped plate 1 and a second bow-shaped plate 2. Both the first bow-shaped plate 1 and the second bow-shaped plate 2 have perforations corresponding to the shape of the detector body 11. The first bow-shaped plate 1 and the second bow-shaped plate 2 are respectively located on opposite sides of the detector body 11 and connected by a flexible flat cable 43. The bow-shaped plate, composed of the first bow-shaped plate 1 and the second bow-shaped plate 2, precisely matches the shape of the head of the detector body 11, allowing for a wrap-around fixation of the detector body 11 from both sides. This ensures the detector body 11 maintains a stable posture under conditions such as vibration and temperature changes, and also better accommodates detector bodies 11 of different sizes. Furthermore, the first bow-shaped plate 1 and the second bow-shaped plate 2 are connected by the flexible flat cable 43, forming a rigid-flexible assembly. The connection method of the flexible flat cable 43 allows for slight relative movement of the first bow-shaped plate 1 and the second bow-shaped plate 2 within a certain range, providing a certain elastic buffering effect, absorbing external stress, and protecting the sensitive elements at the head of the detector body 11 from mechanical damage, especially under vibration and impact scenarios.

[0040] Optionally, the bow-shaped plate also includes a bow-shaped plate cover 21, which is positioned on the side of the bow-shaped plate near the head of the detector body 11. The bow-shaped plate cover 21 is positioned on the side of the bow-shaped plate near the head of the detector body 11, passing through the head of the detector body 11 and installed on the surface of the bow-shaped plate. Screws 50 pass through corresponding holes in the bow-shaped plate to lock it onto the front end of the bow-shaped plate cover 21. This screw-locking mechanism creates a stable physical connection between the bow-shaped plate and the detector body 11, ensuring that the head of the detector body 11 maintains positional accuracy under complex conditions such as vibration and impact, and preventing poor signal contact due to mechanical displacement. The bow-shaped plate cover 21 also enhances the overall structural strength of the bow-shaped plate.

[0041] It should be noted that in the embodiments of this application, in the assembly method of fastening different components with screws, the specific specifications and models of screws 50 can be selected according to actual application requirements, and are not limited to screws of the same specification and model.

[0042] In some embodiments, please refer to Figure 6 The support 10 is provided with a first slot 141 corresponding to the detector body 11 and a second slot 142 corresponding to the refrigerator 12. The detector body 11 and the refrigerator 12 are respectively installed in the first slot 141 and the second slot 142. By setting the first slot 141 that matches the shape of the detector body 11 and the second slot 142 that matches the shape of the refrigerator 12, the support 10 uses the slots to snap the detector body 11 and the refrigerator 12 into them for assembly, and fixes them with screws 50. The support 10 not only realizes the positioning and installation of the core components, but also provides a reliable guarantee for the compact and stable integrated layout of the equipment.

[0043] Please refer to Figure 7 and Figure 8The support 10 is also provided with multiple positioning holes 101, which protrude and are arranged on both sides of the detector body 11. The cooled infrared core module also includes a detector retaining ring 110 located above the detector body 11. The detector retaining ring 110 is fixed to the positioning holes 101 and is used to assist in fixing the detector body 11. The support 10 has positioning holes 101 on both sides of the detector body 11, which facilitates the subsequent installation and fixing of important components to the support 10 by connecting them to the positioning holes 101 through fasteners. The cooled infrared core module also includes a detector retaining ring 110 located above the detector body 11. The detector retaining ring 110 is fixed to the positioning holes 101 on both sides of the detector body 11 on the support 10 by screws 50. The detector retaining ring 110 can form an arc that better matches the outer periphery of the detector body 11, thereby better assisting in fixing the detector body 11. A thermally conductive pad is attached between the contact surfaces of the detector retaining ring 110 and the detector body 11. This facilitates the transfer of heat generated by the detector body 11 to the detector retaining ring 110, and the heat is further dissipated through the heat conduction of the detector retaining ring 110 and the heat dissipation structure on the support 10. For ease of description and distinction, the thermally conductive pad between the detector retaining ring 110 and the detector body 11 is referred to as the second thermally conductive pad 114.

[0044] In some embodiments, please refer to Figure 9 and Figure 10 The cooled infrared core module also includes a detector heat sink 111, which is mounted on the support 10 and fitted around the outer periphery of the rear of the detector body 11. In the cooled infrared core module, the detector heat sink 111 plays a crucial role in efficiently dissipating heat from the detector body 11. In an optional example, the detector heat sink 111 consists of two semi-circular heat dissipation sections. These two sections are tightly fitted to the heat-generating area on the outer periphery of the detector body 11, increasing the heat conduction area between them and achieving good heat dissipation. Furthermore, a thermally conductive pad is installed on the contact surface between the detector heat sink 111 and the detector body 11. For ease of description, this thermally conductive pad between the contact surface of the detector heat sink 111 and the detector body 11 is referred to as the first thermally conductive pad 113, which further enhances heat conduction efficiency.

[0045] Optionally, a buffer pad 112 is provided on the contact surface between the detector body 11 and the support 10, and a thermally conductive pad is provided on the contact surface between the cooler 12 and the support 10. For clarity, the thermally conductive pad between the cooler 12 and the support 10 is referred to as the third thermally conductive pad 123. The detector heat sink 111 is fixed to the support 10 as a whole by screws 50. A buffer pad 112 is also installed on the contact surface between the detector body 11 and the support 10 to achieve good thermal conductivity between the detector body 11 and the support 10, and then the heat is dissipated to the outside through the heat sink on the support 10. This heat dissipation design not only achieves targeted heat dissipation of the heat-generating area of ​​the detector body 11, but also constructs an efficient and reliable heat conduction channel through the tight structural fit, ensuring that the detector body 11 operates within a stable temperature range, and improving the overall performance and service life of the equipment.

[0046] Optionally, the support 10 is also provided with a refrigerator pressure ring 120, which is wrapped around the outside of the refrigerator 12 to assist in fixing the refrigerator (12). The refrigerator 12 is provided with a refrigerator pressure ring 120, and the refrigerator drive circuit board 131 is fixed to the refrigerator pressure ring 120 by screws 50. The refrigerator pressure ring 120 is composed of a front pressure ring 121 and a rear pressure ring 122, which are respectively set on the outer front end and the outer rear end of the refrigerator 12 by screws 50. The front pressure ring 121 and the rear pressure ring 122 are approximately semi-circular rings, wrapped around the side of the refrigerator 12 that is relatively far away from the detector body 11 and the side that is relatively far away from the support. The front pressure ring 121 and the rear pressure ring 122 can form an arc that better matches the shape of the refrigerator 12, so as to achieve a more stable auxiliary fixing of the refrigerator 12. The front pressure ring 121 and rear pressure ring 122 of the refrigerator also provide auxiliary heat dissipation for the refrigerator 12. Thermal pads are attached between the contact surfaces of the front pressure ring 121 and the refrigerator 12, and between the rear pressure ring 122 and the refrigerator 12, to improve heat transfer efficiency. In addition, thermal pads are also installed on the contact surfaces of the refrigerator 12 and the support 10 to achieve heat conduction between the refrigerator 12 and the support 10, and then dissipate the heat to the outside through the heat dissipation bracket on the support 10.

[0047] Please see Figure 11 and Figure 12 The detector retaining ring 110 is used to form a stable support structure for the installation of the ADC circuit board 130, and the refrigerator retaining ring 120 is used to form a stable support structure for the installation of the refrigerator drive circuit board 131.

[0048] Please see Figure 13The FPGA circuit board 132 has a notch at the position corresponding to the refrigerator drive circuit board 131, and the FPGA circuit board 132 and the refrigerator drive circuit board 131 are flush; the circuit board assembly 13 also includes a heat sink 133, which covers the FPGA circuit board 132 and the refrigerator drive circuit board 131.

[0049] The cooler drive circuit board 131 and the ADC circuit board 130 are stacked in a staggered manner in the vertical direction perpendicular to the detector body and the cooler arrangement direction, with a height difference between them, leaving a mounting space. The edge of the FPGA circuit board 132 has a notch that matches the shape of the cooler drive circuit board 131, so that the FPGA circuit board 132 can be inserted above the ADC circuit board 130 and can be located exactly in the mounting space between the ADC circuit board 130 and the cooler drive circuit board 131. At this time, the FPGA circuit board 132 can be basically consistent with the height of the cooler drive circuit board 131. The heat sink 133 is covered on top of the FPGA circuit board 132 and the cooler drive circuit board 131. The circuit board assembly 13 can be locked onto the support 10 by screws passing through the heat sink 133, the FPGA circuit board 132, the copper pillar 51, and the ADC circuit board 130. Thus, by designing the detector body 11 and the cooler 12 to be arranged side by side, and taking advantage of the size difference between the detector body 11 and the cooler 12, the space above the detector body 11 and the cooler 12 is used as the assembly space for the circuit board assembly 13. The height difference formed in the vertical direction by the cooler driving circuit board 131 and the ADC circuit board 130 corresponding to the detector body 11 and the cooler 12 respectively is used to complete the installation of the FPGA circuit board 132. The design of the notch on the FPGA circuit board 132 and the setting of the large-area heat sink 133 ultimately achieve the dual optimization of space utilization and heat dissipation efficiency.

[0050] In some embodiments, an FPGA board thermal pad is provided between the heat sink 133 and the FPGA circuit board 132; the FPGA board thermal pad corresponds to the chip surface on the FPGA circuit board 132. Before installing the heat sink 133, thermal pads can be attached to the electronic chips on the FPGA circuit board 132 that require heat dissipation. The isomorphic thermal pads quickly dissipate the heat generated by the chip during operation. The heat sink 133 covers the FPGA circuit board 132 and the cooler drive circuit board 131, and is thermally connected to the electronic chips through the FPGA board thermal pad. In this way, the heat released by the electronic chips is transferred to the thermal pad, then to the heat sink 133, and finally released to the outside with the help of the large surface area of ​​the heat sink 133, thus achieving effective and timely heat dissipation.

[0051] Please refer to the following: Figure 13 and Figure 14 The support 10 also has a positioning component 102 for mounting the temperature sensor 30. The positioning component 102 is located on the support 10 near the tail of the detector body 11. The temperature sensor 30 is connected to the FPGA circuit board 132 via a cable. In an optional specific example, a cable connector can be provided on the temperature sensor 30, and another cable connector can be provided on the FPGA circuit board 132 on the same side as where the temperature sensor 30 is mounted. By plugging the two ends of the cable between the two cable connectors, the electrical connection between the temperature sensor 30 and the FPGA circuit board 132 can be completed after assembly. The support 10 of this cooled infrared core module has reserved mounting space that matches the shape and size of the temperature sensor 30, and a positioning component 102 for mounting the temperature sensor 30 is designed. The positioning component 102 is located near the tail of the detector body 11. The temperature sensor 30 can be fixed to the positioning component 102 on the support 10 by screws 50, and then the corresponding signal cable of the temperature sensor 30 can be connected, so that the temperature sensor 30 can make full use of the reserved space to complete the scientific layout.

[0052] In some embodiments, please refer again Figure 1 The circuit board assembly 13 also includes a user board assembly, which includes a user board 134. The user board 134 is located on one side of the detector body 11 and the cooler 12 arranged side-by-side. The user board 134 is connected to the FPGA circuit board 132 via a cable. In this cooled infrared core module, the circuit board assembly 13 also includes a user board assembly, which includes a user board 134. The user board 134 is located on the outer side of the detector body 11 and the cooler 12 arranged side-by-side, and is connected to the FPGA circuit board 132 via a cable. In this way, by placing the user board 134 on the outer side of the structure and making it independent of the entire hardware, the device maintains a high degree of integration while allowing for customization of the hardware interface according to customer needs, thus achieving a combination of high integration and application flexibility.

[0053] Please refer to the following again. Figure 1 The user board assembly also includes a user circuit board cover 135, which is located on the outer side of the user circuit board 134, relatively away from the detector body 11, and is connected to the support 11 by a fastener. The user board assembly also includes the user circuit board cover 135, which serves a protective and stabilizing function. Specifically, the user circuit board cover 135 is fitted over the outer side of the user circuit board 134, and is secured to the support 10 by a through-type fixing method, such as screws sequentially passing through the user circuit board cover 135 and the user circuit board 134.

[0054] In summary, the cooled infrared core module provided in this application embodiment has at least the following characteristics:

[0055] First, it is small in size and light in weight. The overall structural dimensions of the cooled infrared core module can be 69.2mm×75.8mm×46.6mm, and the weight can be as low as 364g.

[0056] Secondly, the overall layout is compact and has a high space utilization rate. The cables connecting the circuit board components and various devices can be stored inside the structure, and the circuit boards can be connected with coaxial cables, making the layout flexible and the solution highly compatible.

[0057] Third, it has higher mechanical strength and more stable performance. The head and tail of the detector body are buffered with different auxiliary accessories, which can withstand higher intensity vibration and impact. In addition, the important chips and heat-generating components have heat dissipation treatment to maintain performance stability.

[0058] Fourth, it is highly customizable. The user circuit board is mounted on the outside of the overall structure. The user circuit board and the entire hardware structure of the cooled infrared core module are relatively independent. The hardware interface can be customized according to customer needs, thus expanding the application range. It can be easily applied to core modules, optoelectronic pods, equipment and instruments and many other fields.

[0059] In another aspect, this application provides a thermal imaging device, including the cooled infrared core module described in any of the foregoing embodiments.

[0060] The above are merely specific embodiments of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A refrigeration-type infrared movement module, characterized in that, include: The signal relay board (20), circuit board assembly (13), support (10), detector body (11) and cooler (12) are provided on the support (10), the cooler (12) and the detector body (11) are arranged side by side; the signal relay board (20) is sleeved on the outer periphery of the head of the detector body (11), the signal relay board (20) is erected relative to the support (10) and forms a frame structure with the support (10), and the circuit board assembly (13) is provided on the outside of the frame structure.

2. The cooled infrared core module according to claim 1, characterized in that, The circuit board assembly (13) includes an ADC circuit board (130), a refrigerator drive circuit board (131), and an FPGA circuit board (132). The ADC circuit board (130) is disposed on one side of the detector body (11). The refrigerator drive circuit board (131) is disposed on the same side as the refrigerator (12). The refrigerator drive circuit board (131) and the refrigerator (12) are connected by a cable. A preset height difference is formed between the refrigerator drive circuit board (131) and the ADC circuit board (130). The FPGA circuit board (132) is installed in the installation space formed by the preset height difference.

3. The refrigeration-type infrared module according to claim 2, characterized in that, The signal relay plate (20) is an arc-shaped plate; the arc-shaped plate is sleeved on the outer periphery of the head of the detector body (11), and the support (10) is located at the end of the detector body (11) that is relatively far away from the head; The bow-shaped plate includes a copper sleeve (42) corresponding to the copper needle (41) at the head of the detector body (11), and the copper sleeve (42) is inserted into the copper needle (41); the bow-shaped plate is connected to the ADC circuit board (130) via a cable.

4. The refrigeration-type infrared module according to claim 3, characterized in that, The bow-shaped plate includes a first bow-shaped plate (201) and a second bow-shaped plate (202). The first bow-shaped plate (201) and the second bow-shaped plate (202) are provided with perforations corresponding to the shape of the detector body (11). The first bow-shaped plate (201) and the second bow-shaped plate (202) are respectively located on opposite sides of the detector body (11) and are connected by a flexible flat cable (43); and / or, It also includes an arc-shaped cover plate (21), which covers the side of the arc-shaped plate near the head of the detector body (11).

5. The refrigeration-type infrared module according to claim 1, characterized in that, The support (10) is provided with a first slot corresponding to the detector body (11) and a second slot corresponding to the refrigerator (12). The detector body (11) and the refrigerator (12) are respectively installed in the first slot and the second slot.

6. The refrigeration-type infrared module according to claim 5, characterized in that, The support (10) is also provided with a plurality of positioning holes (101), which are arranged protrudingly on both sides of the detector body (11). The cooled infrared core module also includes a detector retaining ring (110) disposed above the detector body (11). The detector retaining ring (110) is fixed on the positioning holes (101) and is used to assist in fixing the detector body (11); and / or, The support (10) is also provided with a refrigeration press ring (120), which is wrapped around the outside of the refrigeration unit (12) to help fix the refrigeration unit (12).

7. The refrigeration-type infrared module according to claim 5, characterized in that, It also includes a detector heat sink (111), which is mounted on the support (10) and sleeved on the outer periphery of the tail of the detector body (11); and / or, The contact surface between the detector body (11) and the support (10) is provided with a buffer pad (112), and the contact surface between the refrigerator (12) and the support (10) is provided with a heat-conducting pad.

8. The refrigeration-type infrared module according to claim 2, characterized in that, The FPGA circuit board (132) has a notch, which corresponds to the position of the refrigerator drive circuit board (131), and the FPGA circuit board (132) and the refrigerator drive circuit board (131) are flush; and / or, The circuit board assembly (13) also includes a heat sink (133), which covers the FPGA circuit board (132) and the refrigerator drive circuit board (131).

9. A refrigeration-type infrared module according to claim 8, characterized in that, An FPGA board thermal pad is provided between the heat sink (133) and the FPGA circuit board (132); the FPGA board thermal pad corresponds to the chip surface on the FPGA circuit board (132).

10. The refrigeration-type infrared module according to claim 2, characterized in that, The support (10) is also provided with a positioning component (102) for mounting the temperature sensor (30). The positioning component (102) is located on the support (10) near the tail of the detector body (11). The temperature sensor (30) is connected to the FPGA circuit board (132) via a cable.

11. The refrigeration-type infrared module according to claim 2, characterized in that, The circuit board assembly (13) also includes a user board assembly, which includes a user board (134). The user board (134) is located on one side of the detector body (11) and the refrigerator (12) in a parallel arrangement direction. The user board (134) is connected to the FPGA circuit board (132) via a cable.

12. The refrigeration-type infrared module according to claim 11, characterized in that, The user board assembly also includes a user circuit board cover (135), which is located on the outside of the user circuit board (134) relatively away from the detector body (11), and the user circuit board cover (135) is connected to the support (10) by a fastener.

13. A thermal imaging apparatus characterized by comprising: Includes the cooled infrared core module as described in any one of claims 1-12.

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