Energy and computing power integrated liquid cooling cabinet

Abstract

The utility model relates to liquid cooling technical field more specifically, relate to a kind of energy and computing power integrated liquid cooling cabinet.The utility model aims to meet the heat dissipation needs of different modules by a cabinet.The utility model includes cabinet and the spray liquid cooling tank, immersion liquid cooling tank, server module and power module arranged in the inside of cabinet;Server module is arranged in the inside of spray liquid cooling tank, and spray liquid cooling tank is cooled by spraying first cooling medium to server module;Power module is arranged in the inside of immersion liquid cooling tank, and second cooling medium is contained in immersion liquid cooling tank, and second cooling medium immerses power module;Server module is electrically connected with power module.

Description

Technical Field

[0001] This utility model relates to the field of liquid cooling technology, and more specifically, to an integrated liquid cooling cabinet that combines energy and computing power. Background Technology

[0002] Statistics show that data centers consume approximately 2% of the total energy consumption of society. Reducing the energy consumption of data centers is an inevitable path for their development. To improve operational efficiency and respond to the call for energy conservation and emission reduction, some small and medium-sized enterprises are considering using liquid cooling for their data centers. Currently, server liquid cooling equipment is mainly designed for larger data centers. Because different heat-generating components (such as servers, power supplies, and switches) have different temperature control targets and requirements, multiple cabinets are typically used to house these components. Clearly, this multi-cabinet liquid cooling system has a complex overall structure and occupies a large space, making it unsuitable for small-scale data centers. Utility Model Content

[0003] The present invention aims to overcome at least one of the defects of the prior art and provide an integrated energy and computing power cabinet to meet the heat dissipation requirements of different modules.

[0004] This utility model proposes an integrated liquid-cooled cabinet for energy and computing power, including a cabinet body and a spray liquid-cooled box, an immersion liquid-cooled box, a server module and a power module disposed inside the cabinet body;

[0005] The server module is located inside the spray liquid cooling box, and the spray liquid cooling box cools the server module by spraying a first cooling medium.

[0006] The power module is located inside the immersion liquid cooling box, which contains a second cooling medium that immerses the power module.

[0007] The server module is electrically connected to the power supply module.

[0008] In this solution, for power modules with high temperature uniformity requirements, immersion liquid cooling is used to achieve uniform heat dissipation. For server modules with high local temperature control requirements, spray liquid cooling is used to achieve efficient heat dissipation for core heat-generating components. This simultaneously meets the heat dissipation needs of both the power module and the computing module of the server system. Multiple modules of the server system can be housed in a single cabinet, avoiding a complex server liquid cooling system structure and reducing space occupation.

[0009] In some embodiments, the cabinet is equipped with a first heat exchange system, which includes a condenser a, a circulating pump a, a circulating pipeline a, and a liquid storage tank a. The condenser a, the circulating pump a, and the liquid storage tank a are all located outside the spray liquid cooling tank and the immersion liquid cooling tank. The condenser a, the liquid storage tank a, the circulating pump a, and the spray liquid cooling tank are sequentially connected in a closed loop through the circulating pipeline a. The circulating pump a drives the first cooling medium to circulate among the liquid storage tank a, the spray liquid cooling tank, and the condenser a.

[0010] In some embodiments, the cabinet is further provided with a second heat exchange system for exchanging heat with the second cooling medium.

[0011] In some embodiments, the second heat exchange system includes an evaporator a, a condenser b, a circulating pump b, a circulating pipeline b, and a heat exchange medium a. The evaporator a is located inside the immersion liquid cooling tank and is immersed in the second cooling medium. The condenser b and the circulating pump b are located outside the immersion liquid cooling tank. The evaporator a, the condenser b, and the circulating pump b are sequentially connected in a closed loop through the circulating pipeline b. The circulating pump b drives the heat exchange medium a to circulate between the evaporator a and the condenser b.

[0012] In some embodiments, the second heat exchange system includes an evaporator b, a condenser c, a compressor a, a throttling device a, a circulation pipeline c, and a refrigerant a. The evaporator b is located inside the immersion liquid cooling tank and is immersed in the second cooling medium. The condenser c, the compressor a, and the throttling device a are located outside the immersion liquid cooling tank. The evaporator b, the compressor a, the condenser c, and the throttling device a are sequentially connected in a closed loop through the circulation pipeline c. The refrigerant a circulates among the compressor a, the condenser c, the throttling device a, and the evaporator b.

[0013] In this scheme, the refrigerant exchanges heat efficiently with the second cooling medium immersed in the liquid cooling box through the evaporation of the evaporator, thereby improving the heat exchange rate of the power module.

[0014] In some embodiments, the second heat exchange system is located inside the immersion liquid cooling box, and the second heat exchange system includes an evaporator c, a condenser d, a compressor b, a throttling device b, a circulation pipeline d, and a refrigerant b;

[0015] The immersion liquid cooling box is divided into an immersion zone and a non-immersion zone. The power module and the second cooling medium are both located in the immersion zone. The evaporator c is located in the immersion zone and is immersed in the second cooling medium. The condenser d, the compressor b, and the throttling device b are located in the non-immersion zone. The evaporator c, the compressor b, the condenser d, and the throttling device b are sequentially connected in a closed loop through the circulation pipeline d. The refrigerant b circulates among the compressor b, the condenser d, the throttling device b, and the evaporator c.

[0016] In some embodiments, the second heat exchange system is located inside the immersion liquid cooling box, and the second heat exchange system includes an evaporator d, a condenser e, a circulating pump c, a circulating pipeline e, and a heat exchange medium b;

[0017] The immersion liquid cooling box is divided into an immersion zone and a non-immersion zone. The power module and the second cooling medium are both located in the immersion zone. The condenser e and the circulating pump c are located in the non-immersion zone. The evaporator d, the condenser e, and the circulating pump c are connected in a closed loop through the circulating pipeline e. The circulating pump c drives the heat exchange medium b to circulate between the evaporator d and the condenser e.

[0018] In some embodiments, the second heat exchange system is located inside the immersion liquid cooling box, and the second heat exchange system includes a condenser f, a circulation pump d, and a circulation pipeline f;

[0019] The immersion liquid cooling tank is divided into an immersion zone and a non-immersion zone. The power module and the second cooling medium are both located in the immersion zone. The condenser f and the circulation pump d are located in the non-immersion zone. The condenser f, the immersion zone, and the circulation pump d are connected in a closed loop through the circulation pipeline f. The circulation pump d drives the second cooling medium to circulate between the immersion zone and the condenser f.

[0020] By integrating the second heat exchange system with the power module and the second cooling medium in the immersion liquid cooling box, the number of modules in the energy and computing power integrated cabinet can be reduced, making it easier to install, remove and move, and improving practicality.

[0021] In some embodiments, the circulation pipeline f includes an outlet pipe and a return pipe, the outlet pipe outputting the second cooling medium from the immersion zone to the condenser f, and the return pipe transporting the second cooling medium from the condenser f back to the immersion zone;

[0022] Both the outlet pipe and the return pipe are submerged in the second cooling medium, with the outlet pipe extending into the submerged area at the upper part of the submerged area and the return pipe extending into the submerged area at the lower part of the submerged area.

[0023] During the heat exchange process between the second cooling medium and the power module, the higher-temperature second cooling medium floats to the top, while the lower-temperature second cooling medium sinks. This solution can ensure that the relatively high-temperature second cooling medium in the upper layer is continuously transported to the second condenser in the non-immersion zone for cooling, and can also pump the cooled second cooling medium into the lower layer of the immersion zone to promote the flow of the second cooling medium in the lower layer, thereby improving the heat exchange efficiency of the power module.

[0024] In some embodiments, the cabinet is further provided with a heat exchange system, which includes a condenser g, a circulation pump e, a circulation pipeline g, a liquid storage tank b, an evaporator e, a circulation pump f, a circulation pipeline h, and a heat exchange medium c.

[0025] The condenser g, the circulating pump e, and the liquid storage tank b are all located outside the spray liquid cooling tank and the immersion liquid cooling tank. The condenser g is provided with a first condensation channel and a second condensation channel. The first condensation channel, the liquid storage tank b, the circulating pump e, and the spray liquid cooling tank are sequentially connected in a closed loop through the circulating pipeline g. The circulating pump e drives the first cooling medium to circulate between the liquid storage tank b, the spray liquid cooling tank, and the first condensation channel.

[0026] The evaporator e is located inside the immersion liquid cooling box and is immersed in the second cooling medium. The second condensation channel and the circulation pump f are located outside the immersion liquid cooling box and the spray liquid cooling box. The evaporator e, the second condensation channel, and the circulation pump f are sequentially connected in a closed loop through the circulation pipeline h. The circulation pump f drives the heat exchange medium c to circulate between the evaporator e and the second condensation channel.

[0027] In this solution, the heat exchange system can circulate heat exchange between the first cooling medium in the immersion liquid cooling box via circulation pipe g, and between the second cooling medium in the spray liquid cooling box via circulation pipe h, thereby improving the liquid cooling level of the power module, server, and switch. Furthermore, using different condensation channels of a single condenser to simultaneously cool the first and second cooling media reduces the number of modules in the heat exchange system, resulting in a more compact internal layout for the energy and computing integrated cabinet.

[0028] In some embodiments, the cabinet is further provided with a heat exchange system, which includes a condenser h, a circulation pump g, a circulation pipeline i, a liquid storage tank c, an evaporator f, a compressor c, a throttling device c, a circulation pipeline j, and a refrigerant c.

[0029] The condenser h, the circulating pump g, and the liquid storage tank c are all located outside the spray liquid cooling tank and the immersion liquid cooling tank. The condenser h is provided with a third condensation channel and a fourth condensation channel. The third condensation channel, the liquid storage tank c, the circulating pump g, and the spray liquid cooling tank are sequentially connected in a closed loop through the circulating pipeline i. The circulating pump g drives the first cooling medium to circulate between the liquid storage tank c, the immersion liquid cooling tank, and the third condensation channel.

[0030] The evaporator f is located inside the immersion liquid cooling box and is immersed in the second cooling medium. The fourth condensation channel, the compressor c, and the throttling device c are located outside the immersion liquid cooling box and the spray liquid cooling box. The evaporator f, the compressor c, the fourth condensation channel, and the throttling device c are sequentially connected in a closed loop through the circulation pipeline j. The refrigerant c circulates between the compressor c, the fourth condensation channel, the evaporator f, and the throttling device c.

[0031] In this solution, the heat exchange system can circulate heat exchange between the first cooling medium in the immersion liquid cooling box through circulation pipe i and the second cooling medium in the spray liquid cooling box through circulation pipe j, thereby improving the liquid cooling level of the power module, server, and switch. In addition, by using different condensation channels of a single condenser to cool the first and second cooling media simultaneously, the number of modules in the heat exchange system can be reduced, making the internal layout of the energy and computing integrated cabinet more compact.

[0032] Compared with the prior art, the beneficial effects of this utility model are as follows: spray liquid cooling is used to cool the switch and server through a spray liquid cooling box, and immersion liquid cooling is used to cool the power module through an immersion liquid cooling box, thereby adopting a suitable liquid cooling method for heat-generating devices with different heat dissipation requirements. Furthermore, the server's energy module and computing module can be housed in a single cabinet, simplifying the server's liquid cooling system. By circulating heat exchange between the first and second cooling media through a first heat exchange system and a second heat exchange system, different heat exchange levels can be achieved for the first and second cooling media, further meeting the heat dissipation requirements of different heat-generating devices. Attached Figure Description

[0033] Figure 1 This is a structural diagram of Example 1.

[0034] Figure 2 This is a structural diagram of Example 2.

[0035] Figure 3 The cabinet structure diagram is shown in Examples 3-5.

[0036] Figure 4 This is a structural diagram of the immersion liquid cooling box in Example 3.

[0037] Figure 5 This is a structural diagram of the immersion liquid cooling box in Example 4.

[0038] Figure 6 This is a structural diagram of the immersion liquid cooling box in Example 5.

[0039] Reference numerals: Cabinet 100, First Zone 110, Second Zone 120, First Separator 130, Spray Liquid Cooling Box 200, Switch 210, Server 220, Immersion Liquid Cooling Box 300, Power Module 310, Second Separator 320, Immersion Zone 330, Non-Immersion Zone 340, Condenser A410, Condenser B420, Condenser C430, Condenser I440, Condenser D450, Condenser E451, Condenser F452, Circulation Pump A460, Circulation... Loop pipe a470, liquid storage tank a480, evaporator a510, evaporator b512, evaporator c514, evaporator d515, circulation pump b520, circulation pump c522, circulation pump d523, circulation pipe b530, circulation pipe c532, circulation pipe d534, circulation pipe e535, circulation pipe f536, liquid outlet pipe 537, liquid return pipe 538, compressor a540, compressor b542, throttling device a550, throttling device b552. Detailed Implementation

[0040] The accompanying drawings are for illustrative purposes only and should not be construed as limiting the scope of this invention. To better illustrate the following embodiments, some components in the drawings may be omitted, enlarged, or reduced, and do not represent the actual dimensions of the product. It is understandable to those skilled in the art that some well-known structures and their descriptions may be omitted in the drawings.

[0041] Furthermore, in this utility model, unless otherwise explicitly specified and limited, the terms "connected" and "fixed" should be interpreted broadly. For example, "fixed" can mean fixed connection, detachable connection, or integral; it can mean direct connection or indirect connection through an intermediate medium; it can mean the internal connection of two components or the interaction relationship between two components, unless otherwise explicitly limited. For those skilled in the art, the specific meaning of the above terms in this utility model can be understood according to the specific circumstances.

[0042] Furthermore, in this utility model, descriptions involving "first," "second," or those with suffixes such as "a," "b," or "c" are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, features defined with "first," "second," or with suffixes such as "a," "b," or "c" may explicitly or implicitly include at least one of those features. Additionally, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. If the combination of technical solutions is contradictory or impossible to implement, such a combination of technical solutions should be considered non-existent and not within the scope of protection claimed by this utility model.

[0043] Example 1

[0044] like Figure 1 As shown, this embodiment provides an integrated energy and computing power liquid-cooled cabinet, including a cabinet 100 and a spray liquid cooling box 200, an immersion liquid cooling box 300, a server module, and a power module 310 disposed inside the cabinet 100; the server module is disposed inside the spray liquid cooling box 200, and the spray liquid cooling box 200 cools the server module by spraying a first cooling medium.

[0045] The power module 310 is located inside the immersion liquid cooling box 300, which contains a second cooling medium that immerses the power module 310.

[0046] The server module is electrically connected to the power supply module 310.

[0047] In a specific implementation, the server module includes server 220 and switch 210. In some other implementations, the server module may also include router.

[0048] During operation, the power module 310, which requires high temperature uniformity, is immersed in a liquid cooling box 300 for liquid cooling to achieve overall uniform temperature control. For the server module, whose core heat-generating components require strict temperature control, a spray liquid cooling box 200 is used for spray liquid cooling. This achieves high heat flux density for high-heat-generating components such as the CPU and GPU, improving heat dissipation efficiency. This simultaneously meets the heat dissipation needs of both the power module and the computing module of the server system. This allows multiple modules of the server system to be housed in a single cabinet 100, avoiding a complex liquid cooling system structure and reducing space occupation. Furthermore, placing the switch 210 and server modules together in the spray liquid cooling box 200 facilitates optimized wiring layout between the two modules. Unlike the power module, the server module is preferably partially immersed in the first cooling medium in the spray liquid cooling box 200, where it is continuously sprayed with the first cooling medium for liquid cooling. This method reduces the amount of cooling medium used, lightens the load on the integrated power and computing cabinet, thereby reducing costs and improving ease of installation and removal. In addition, in some embodiments, the server module can also be installed in the spray liquid cooling box 200 without being submerged. In this case, the server module is cooled by continuously spraying the first cooling medium through the spray liquid cooling box 200. This reduces the amount of the first cooling medium used and reduces the load on the spray liquid cooling box 200 and the integrated energy and computing cabinet.

[0049] In practice, the first and second cooling media can be insulating greases such as synthetic oil, transformer oil, silicone oil, and mineral oil.

[0050] like Figure 1 As shown, the cabinet 100 also houses a first heat exchange system, which includes a condenser a410, a circulating pump a460, a circulating pipeline a470, and a liquid storage tank a480. The condenser a410, circulating pump a460, and liquid storage tank a480 are all located outside the spray liquid cooling box 200 and the immersion liquid cooling box 300. The condenser a410, liquid storage tank a480, circulating pump a460, and spray liquid cooling box 200 are sequentially connected in a closed loop via the circulating pipeline a470. The circulating pump a460 drives the first cooling medium to circulate between the liquid storage tank a480, the spray liquid cooling box 200, and the condenser a410. To improve heat dissipation, a condenser fan is installed at a position corresponding to the condenser a410. Furthermore, to promote airflow, the cabinet may also have air inlets and outlets.

[0051] refer to Figure 1The cabinet 100 also houses a second heat exchange system for exchanging heat with the second cooling medium. This second heat exchange system includes an evaporator a510, a condenser b420, a circulating pump b520, a circulating pipe b530, and a heat exchange medium. The evaporator a510 is located inside the immersion liquid cooling tank 300 and is immersed in the second cooling medium. The condenser b420 and the circulating pump b520 are located outside the immersion liquid cooling tank 300. The evaporator a510, condenser b420, and circulating pump b520 are sequentially connected in a closed loop through the circulating pipe b530. The circulating pump b520 drives the heat exchange medium to circulate between the evaporator a510 and the condenser b420. To improve heat dissipation, a condensing fan b is located at a position corresponding to the condenser b420. It is understood that the heat exchange medium undergoes a closed internal circulation through the second heat exchange system; therefore, the heat exchange medium does not come into contact with the second cooling medium. In a preferred embodiment, pure water can be used as the heat exchange medium to reduce costs.

[0052] Continue to refer to Figure 1 The cabinet 100 is divided into a first area 110 and a second area 120 by a first partition 130. The immersion liquid cooling box 300 and the spray liquid cooling box 200 are installed together in the first area 110. The condenser a410, the circulation pump a460, the liquid storage tank a480, the condenser b420, and the circulation pump b520 are installed in the second area 120. During assembly, the immersion liquid cooling box 300 and the spray liquid cooling box 200 in the first area 110 and the heat exchange system in the second area 120 can be installed simultaneously. After installation, the two areas can be put into operation simply by connecting the two areas through the circulation pipe a470 and the circulation pipe b530, thereby improving efficiency.

[0053] In some embodiments, the spray liquid cooling box 200 is provided with a first support component for placing the switch 210 and a second support component for placing the server 220. It is also provided with a spray component that sprays a second cooling medium toward the switch 210 and the server 220. The spray liquid cooling box 200 has a liquid outlet channel, and the circulation pipe b530 is connected to the spray component and the liquid outlet channel. This ensures that the second cooling medium, after being cooled by the condenser b420, can spray the switch 210 and the server 220 with liquid cooling through the spray component, and that the second cooling medium, after heat exchange and heating, can enter the condenser a410 for condensation and cooling through the liquid outlet channel.

[0054] In some implementations, reference Figure 1To understand this, it is possible to achieve the functions of condenser a410 and condenser b420 simultaneously using only one condenser. In this case, the aforementioned first and second heat exchange systems are integrated into a single heat exchange system, including condenser g, circulating pump e, circulating pipeline g, liquid storage tank b, evaporator e, circulating pump f, circulating pipeline h, and heat exchange medium c. Specifically, condenser g is provided with a first condensation channel and a second condensation channel. The first condensation channel, liquid storage tank b, circulating pump e, and spray liquid cooling box 200 are sequentially connected in a closed loop through circulating pipeline g. Circulating pump e drives the first cooling medium to circulate between liquid storage tank b, immersion liquid cooling box 300, and the first condensation channel. Evaporator e, the second condensation channel, and circulating pump f are sequentially connected in a closed loop through circulating pipeline h. Circulating pump f drives the heat exchange medium to circulate between evaporator e and the second condensation channel.

[0055] It is understandable that simultaneously cooling the first and second coolant media through different condensation channels of a single condenser can reduce the number of modules in the heat exchange system, resulting in a more compact internal layout for the energy and computing integrated cabinet. Furthermore, in this embodiment, condenser fans can be installed at the locations corresponding to the condenser to improve cooling efficiency. To ensure proper airflow and heat exchange between the inside and outside, the cabinet is also equipped with air inlets and outlets.

[0056] Example 2

[0057] like Figure 2 As shown, this embodiment provides an integrated liquid-cooled cabinet for both energy and computing power. The spray liquid-cooled box 200, the immersion liquid-cooled box 300, and the first heat exchange system in this embodiment are basically the same as those in Embodiment 1. The difference lies in the second heat exchange system. Specifically, the second heat exchange system in this embodiment includes an evaporator b512, a condenser c430, a compressor a540, a throttling device a550, a circulation pipeline c532, and refrigerant a. The evaporator b512 is located inside the immersion liquid-cooled box 300 and is immersed in the second cooling medium. The condenser c430, the compressor a540, and the throttling device a550 are located outside the immersion liquid-cooled box 300. The evaporator b512, the compressor a540, the condenser c430, and the throttling device a550 are sequentially connected in a closed loop through the circulation pipeline c532. The refrigerant a circulates between the compressor a540, the condenser c430, the evaporator b512, and the throttling device a550. In practice, refrigerant a can be Freon or other conventional refrigerants, and the throttling device a550 can be an expansion valve or a capillary tube.

[0058] During operation, refrigerant a is cooled by condenser c430 and throttling device a550 and then enters evaporator b512. Refrigerant a undergoes efficient heat exchange with the second cooling medium in the immersion liquid cooling box 300 through the evaporation of evaporator b512, thereby improving the heat exchange rate of power module 310.

[0059] Continue to refer to Figure 2 Similar to Embodiment 1, this embodiment can also achieve the functions of both a first condenser and a second condenser using only one condenser. The aforementioned first and second heat exchange systems are integrated into a single heat exchange system, including a condenser h, a circulating pump g, a circulating pipeline i, a liquid receiver c, an evaporator f, a compressor c, a throttling device c, a circulating pipeline j, and a refrigerant c. Specifically, the condenser h is provided with a third condensation channel and a fourth condensation channel. The third condensation channel, the liquid receiver c, the circulating pump g, and the spray liquid cooling box 200 are sequentially connected through the circulating pipeline i. In a closed-loop connection, the circulating pump g drives the first cooling medium to circulate between the liquid storage tank c, the immersion liquid cooling box 300, and the third condensing channel; the evaporator f is located inside the immersion liquid cooling box 300 and immersed in the second cooling medium; the fourth condensing channel, the compressor c, and the throttling device c are located outside the immersion liquid cooling box 300 and the spray liquid cooling box 200. The evaporator f, the compressor c, the fourth condensing channel, and the throttling device c are sequentially connected in a closed loop through the circulating pipeline j, and the refrigerant c circulates between the compressor c, the fourth condensing channel, the evaporator f, and the throttling device c.

[0060] Example 3

[0061] like Figure 3 , 4 As shown, this embodiment provides an integrated liquid-cooled cabinet for both energy and computing power. The spray liquid-cooled box 200, the immersion liquid-cooled box 300, and the first heat exchange system in this embodiment are basically the same as those in Embodiment 1. The difference lies in the second heat exchange system. Specifically, the first heat exchange system includes a condenser a440, a circulating pump a460, a circulating pipeline a470, and a liquid storage tank a480. The condenser a440, the circulating pump a460, and the liquid storage tank a480 are all located outside the spray liquid-cooled box 200 and the immersion liquid-cooled box 300. The condenser a440, the liquid storage tank a480, the circulating pump a460, and the spray liquid-cooled box 200 are sequentially connected in a closed loop through the circulating pipeline a470. The circulating pump a460 drives the first cooling medium to circulate between the liquid storage tank a480, the spray liquid-cooled box 200, and the condenser a440.

[0062] refer to Figure 4In this embodiment, the second heat exchange system is located inside the immersion liquid cooling box 300. The second heat exchange system includes an evaporator c514, a condenser d450, a compressor b542, a throttling device b552, a circulation pipeline d534, and refrigerant b. The immersion liquid cooling box 300 is provided with an immersion zone 330 and a non-immersion zone 340. The power module 310 and the second cooling medium are both located in the immersion zone 330. The evaporator c514 is located in the immersion zone 330 and is immersed in the second cooling medium. The condenser d450, the compressor b542, and the throttling device b552 are located in the non-immersion zone 340. The evaporator c514, the compressor b542, the condenser d450, and the throttling device b552 are sequentially connected in a closed loop through the circulation pipeline d534. The compressor b542 drives the refrigerant b to circulate between the condenser d450, the evaporator c514, and the throttling device b552. In specific implementation, the refrigerant b in this embodiment can be Freon or other conventional refrigerants. Furthermore, to improve condensation efficiency, a condensing fan is provided for cooling the condenser d450. Additionally, an air inlet channel and an air outlet channel are provided between the non-immersion zone 340 and the cabinet 100 to ensure heat exchange between the inside and outside air when the condenser d450 is operating. Specifically, the air outlet is located on the surface of the immersion liquid cooling box 300 corresponding to the air outlet direction of the condensing fan. The immersion zone 330 and the non-immersion zone 340 are separated by a second separator 320, which prevents the second cooling medium in the immersion zone 330 from entering the non-immersion zone 340.

[0063] In this embodiment, the second heat exchange system, power module 310, and second cooling medium are integrated into the immersion liquid cooling box 300, which can reduce the number of modules in the energy and computing power integrated cabinet, facilitate loading, unloading and transfer, and improve practicality.

[0064] Example 4

[0065] like Figure 3 , 5As shown, this embodiment provides an integrated liquid-cooled cabinet for both energy and computing power. The spray liquid-cooled box 200, the immersion liquid-cooled box 300, and the first heat exchange system in this embodiment are basically the same as those in embodiment 3. The difference lies in the second heat exchange system. Specifically, the second heat exchange system in this embodiment is located inside the immersion liquid-cooled box 300. The second heat exchange system includes an evaporator d515, a condenser e451, a circulating pump c522, a circulating pipeline e535, and a heat exchange medium. The immersion liquid-cooled box 300 has an immersion zone 330 and a non-immersion zone 340. The power module 310 and the second cooling medium are both located in the immersion zone 330. The condenser e451 and the circulating pump c522 are located in the non-immersion zone 340. The evaporator d515, the condenser e451, and the circulating pump c522 are connected in a closed loop through the circulating pipeline e535. The circulating pump c522 drives the heat exchange medium to circulate between the evaporator d515 and the condenser e451. The immersion zone 330 and the non-immersion zone 340 are separated by a second partition 320, which prevents the second cooling medium from entering the non-immersion zone 340. Furthermore, to improve condensation efficiency, a condensing fan is provided for cooling the condenser e451. The immersion zone 330 and the non-immersion zone 340 are separated by the second partition 320, which prevents the second cooling medium from entering the non-immersion zone 340.

[0066] It is understood that the heat exchange medium circulates in a closed loop through the second heat exchange system. Therefore, the heat exchange medium does not come into contact with the second cooling medium. In a preferred embodiment, pure water can be used as the heat exchange medium to reduce costs.

[0067] Example 5

[0068] like Figure 3 , 6As shown, this embodiment provides an integrated liquid-cooled cabinet for both energy and computing power. The spray liquid-cooled box 200, the immersion liquid-cooled box 300, and the first heat exchange system in this embodiment are the same as in embodiment 3. The difference lies in the second heat exchange system. Specifically, the second heat exchange system in this embodiment is located inside the immersion liquid-cooled box 300. The second heat exchange system includes a condenser f452, a circulating pump d523, and a circulating pipeline f536. The immersion liquid-cooled box 300 has an immersion zone 330 and a non-immersion zone 340. The power module 310 and the second cooling medium are both located in the immersion zone 330. The condenser f452 and the circulating pump d523 are located in the non-immersion zone 340. The condenser f452, the immersion zone 330, and the circulating pump d523 are connected in a closed loop through the circulating pipeline f536. The circulating pump d523 drives the second cooling medium to circulate between the immersion zone 330 and the condenser f452. In addition, to improve condensation efficiency, a condenser fan 452 is provided for cooling the condenser f452. The immersion zone 330 and the non-immersion zone 340 are separated by a second partition 320, which prevents the second cooling medium in the immersion zone 330 from entering the non-immersion zone 340.

[0069] Continue to refer to Figure 6 In specific implementation, the circulation pipeline f536 includes an outlet pipe 537 and a return pipe 538. The outlet pipe 537 outputs the second cooling medium from the immersion zone 330 to the condenser f452, and the return pipe 538 transports the second cooling medium from the condenser f452 back to the immersion zone 330. The inlet of the outlet pipe 537 extending into the immersion zone 330 and the inlet of the return pipe 538 extending into the immersion zone 330 are both immersed in the second cooling medium. The inlet of the outlet pipe 537 extending into the immersion zone 330 is located at the upper part of the immersion zone 330, and the inlet of the return pipe 538 extending into the immersion zone 330 is located at the lower part of the immersion zone 330.

[0070] During the heat exchange process between the second cooling medium and the power module 310, the second cooling medium with a higher temperature floats to the top, while the second cooling medium with a lower temperature sinks. This solution can ensure that the relatively high temperature second cooling medium in the upper layer is continuously transported to the second condenser 420 in the non-immersion zone 340 for cooling, and can also pump the cooled second cooling medium into the lower layer of the immersion zone 330 to promote the flow of the second cooling medium in the lower layer, thereby improving the heat exchange efficiency of the power module 310.

[0071] Obviously, the above embodiments of this utility model are merely examples for clearly illustrating the technical solution of this utility model, and are not intended to limit the specific implementation of this utility model. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the claims of this utility model should be included within the protection scope of the claims of this utility model.

Claims

1. A liquid-cooled cabinet integrating energy and computing power, characterized in that, It includes a cabinet and a spray liquid cooling box, an immersion liquid cooling box, a server module, and a power module located inside the cabinet; The server module is located inside the spray liquid cooling box, and the spray liquid cooling box cools the server module by spraying a first cooling medium. The power module is located inside the immersion liquid cooling box, which contains a second cooling medium that immerses the power module. The server module is electrically connected to the power supply module.

2. The integrated energy and computing power liquid-cooled cabinet according to claim 1, characterized in that, The cabinet is equipped with a first heat exchange system, which includes a condenser a, a circulating pump a, a circulating pipeline a, and a liquid storage tank a. The condenser a, the circulating pump a, and the liquid storage tank a are all located outside the spray liquid cooling tank and the immersion liquid cooling tank. The condenser a, the liquid storage tank a, the circulating pump a, and the spray liquid cooling tank are sequentially connected in a closed loop through the circulating pipeline a. The circulating pump a drives the first cooling medium to circulate between the liquid storage tank a, the spray liquid cooling tank, and the condenser a.

3. The integrated energy and computing power liquid-cooled cabinet according to claim 1 or 2, characterized in that, The cabinet is equipped with a second heat exchange system for exchanging heat with the second cooling medium.

4. The integrated energy and computing power liquid-cooled cabinet according to claim 3, characterized in that, The second heat exchange system includes an evaporator a, a condenser b, a circulating pump b, a circulating pipeline b, and a heat exchange medium a. The evaporator a is located inside the immersion liquid cooling tank and is immersed in the second cooling medium. The condenser b and the circulating pump b are located outside the immersion liquid cooling tank. The evaporator a, the condenser b, and the circulating pump b are sequentially connected in a closed loop through the circulating pipeline b. The circulating pump b drives the heat exchange medium a to circulate between the evaporator a and the condenser b.

5. The integrated energy and computing power liquid-cooled cabinet according to claim 3, characterized in that, The second heat exchange system includes an evaporator b, a condenser c, a compressor a, a throttling device a, a circulation pipeline c, and refrigerant a. The evaporator b is located inside the immersion liquid cooling tank and is immersed in the second cooling medium. The condenser c, the compressor a, and the throttling device a are located outside the immersion liquid cooling tank. The evaporator b, the compressor a, the condenser c, and the throttling device a are sequentially connected in a closed loop through the circulation pipeline c. The refrigerant a circulates among the compressor a, the condenser c, the throttling device a, and the evaporator b.

6. The integrated energy and computing power liquid-cooled cabinet according to claim 3, characterized in that, The second heat exchange system is located inside the immersion liquid cooling box. The second heat exchange system includes an evaporator c, a condenser d, a compressor b, a throttling device b, a circulation pipeline d, and a refrigerant b. The immersion liquid cooling box is divided into an immersion zone and a non-immersion zone. The power module and the second cooling medium are both located in the immersion zone. The evaporator c is located in the immersion zone and is immersed in the second cooling medium. The condenser d, the compressor b, and the throttling device b are located in the non-immersion zone. The evaporator c, the compressor b, the condenser d, and the throttling device b are sequentially connected in a closed loop through the circulation pipeline d. The refrigerant b circulates among the compressor b, the condenser d, the throttling device b, and the evaporator c.

7. The integrated energy and computing power liquid-cooled cabinet according to claim 3, characterized in that, The second heat exchange system is located inside the immersion liquid cooling box. The second heat exchange system includes an evaporator d, a condenser e, a circulating pump c, a circulating pipeline e, and a heat exchange medium b. The immersion liquid cooling box is divided into an immersion zone and a non-immersion zone. The power module and the second cooling medium are both located in the immersion zone. The condenser e and the circulating pump c are located in the non-immersion zone. The evaporator d, the condenser e, and the circulating pump c are connected in a closed loop through the circulating pipeline e. The circulating pump c drives the heat exchange medium b to circulate between the evaporator d and the condenser e.

8. The integrated energy and computing power liquid-cooled cabinet according to claim 3, characterized in that, The second heat exchange system is located inside the immersion liquid cooling box, and the second heat exchange system includes a condenser f, a circulating pump d, and a circulating pipeline f; The immersion liquid cooling tank is divided into an immersion zone and a non-immersion zone. The power module and the second cooling medium are both located in the immersion zone. The condenser f and the circulation pump d are located in the non-immersion zone. The condenser f, the immersion zone, and the circulation pump d are connected in a closed loop through the circulation pipeline f. The circulation pump d drives the second cooling medium to circulate between the immersion zone and the condenser f.

9. The integrated energy and computing power liquid-cooled cabinet according to claim 8, characterized in that, The circulation pipeline f includes an outlet pipe and a return pipe. The outlet pipe outputs the second cooling medium from the immersion zone to the condenser f, and the return pipe transports the second cooling medium from the condenser f back to the immersion zone. Both the outlet pipe and the return pipe are submerged in the second cooling medium, with the outlet pipe extending into the submerged area at the upper part of the submerged area and the return pipe extending into the submerged area at the lower part of the submerged area.

10. The integrated energy and computing power liquid-cooled cabinet according to claim 1, characterized in that, The cabinet is also equipped with a heat exchange system, which includes a condenser g, a circulating pump e, a circulating pipeline g, a liquid storage tank b, an evaporator e, a circulating pump f, a circulating pipeline h, and a heat exchange medium c. The condenser g, the circulating pump e, and the liquid storage tank b are all located outside the spray liquid cooling tank and the immersion liquid cooling tank. The condenser g is provided with a first condensation channel and a second condensation channel. The first condensation channel, the liquid storage tank b, the circulating pump e, and the spray liquid cooling tank are sequentially connected in a closed loop through the circulating pipeline g. The circulating pump e drives the first cooling medium to circulate between the liquid storage tank b, the spray liquid cooling tank, and the first condensation channel. The evaporator e is located inside the immersion liquid cooling tank and is immersed in the second cooling medium. The second condensation channel and the circulating pump f are located outside the immersion liquid cooling tank and the spray liquid cooling tank. The evaporator e, the second condensation channel, and the circulating pump f are sequentially connected in a closed loop through the circulating pipeline h. The circulating pump f drives the heat exchange medium c to circulate between the evaporator e and the second condensation channel; or... The cabinet is also equipped with a heat exchange system, which includes a condenser h, a circulation pump g, a circulation pipeline i, a liquid storage tank c, an evaporator f, a compressor c, a throttling device c, a circulation pipeline j, and a refrigerant c. The condenser h, the circulating pump g, and the liquid storage tank c are all located outside the spray liquid cooling tank and the immersion liquid cooling tank. The condenser h is provided with a third condensation channel and a fourth condensation channel. The third condensation channel, the liquid storage tank c, the circulating pump g, and the spray liquid cooling tank are sequentially connected in a closed loop through the circulating pipeline i. The circulating pump g drives the first cooling medium to circulate between the liquid storage tank c, the immersion liquid cooling tank, and the third condensation channel. The evaporator f is located inside the immersion liquid cooling box and is immersed in the second cooling medium. The fourth condensation channel, the compressor c, and the throttling device c are located outside the immersion liquid cooling box and the spray liquid cooling box. The evaporator f, the compressor c, the fourth condensation channel, and the throttling device c are sequentially connected in a closed loop through the circulation pipeline j. The refrigerant c circulates between the compressor c, the fourth condensation channel, the evaporator f, and the throttling device c.

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