A high-efficiency heat-dissipating shield

Abstract

The utility model belongs to the field of electronic equipment heat dissipation technology especially relates to a high -efficient heat dissipation shield, including cover body, circuit assembly and heat dissipation subassembly. Cover body is equipped with first vent and second vent. Circuit assembly includes circuit mainboard and signal connection end. Heat dissipation subassembly includes heat dissipation board. Heat dissipation board includes heat dissipation roof, heat dissipation bottom plate. The high -efficient heat dissipation shield that the present application provides, through setting up multiple groups of parallel, interval first vent and second vent at cover body both sides, forms good air convection channel, simultaneously, the heat dissipation board that multiple even settings in heat dissipation subassembly and the unique diamond type upper heat dissipation hole and lower heat dissipation hole on heat dissipation board increase the contact area of air and heat dissipation board, improve the heat exchange efficiency, realize high -efficient heat dissipation, effectively reduce the temperature inside electronic equipment, guarantee electronic component steady operation in the appropriate temperature range.

Description

Technical Field

[0001] This utility model belongs to the field of heat dissipation technology for electronic devices, and in particular relates to a high-efficiency heat dissipation shield. Background Technology

[0002] In the field of electronic equipment, shielding covers play a crucial role. They are primarily used to shield electronic signals, prevent external electromagnetic waves from interfering with internal circuits, and also prevent internally generated electromagnetic waves from radiating outwards and affecting the normal operation of other electronic devices. As electronic components develop towards higher speeds and greater integration, the heat generated by electronic devices during operation has increased dramatically, leading to a corresponding increase in the requirements for heat dissipation.

[0003] Traditional shielding covers often employ perforations for heat dissipation. For example, some shielding covers have a certain number and size of ventilation holes on their main body, hoping to carry away internal heat through natural air convection. However, this method of relying solely on natural convection results in low heat exchange efficiency and ineffective heat dissipation. Utility Model Content

[0004] The purpose of this invention is to provide a high-efficiency heat dissipation shield, which aims to solve the technical problem that the heat exchange efficiency of air is low and the heat dissipation effect is poor in the existing heat dissipation method with holes.

[0005] To achieve the above objectives, the present invention provides a high-efficiency heat dissipation shield, comprising a shield body, a circuit assembly, and a heat dissipation assembly. The circuit assembly is respectively disposed on the shield body and the heat dissipation assembly, and dissipates heat through the heat dissipation assembly. The heat dissipation assembly is respectively disposed on the shield body and the circuit assembly, and conducts heat out of the circuit assembly.

[0006] The cover is provided with a first ventilation hole and a second ventilation hole, the first ventilation hole being located on one side of the cover and the second ventilation hole being located on the other side of the cover;

[0007] The circuit assembly includes a circuit main board and a signal connection terminal. The circuit main board is respectively disposed on the cover and the heat dissipation assembly. The signal connection terminal is disposed on the cover and electrically connected to the circuit main board.

[0008] The heat dissipation assembly includes multiple heat dissipation plates, which are evenly arranged within the cover. Adjacent heat dissipation plates are connected in sequence. Each heat dissipation plate includes a top heat dissipation plate and a bottom heat dissipation plate. The bottom heat dissipation plate is connected to the top heat dissipation plate and the cover, respectively. The top heat dissipation plate has upper heat dissipation holes, which together form an upper heat dissipation channel. The bottom heat dissipation plate has lower heat dissipation holes, which together form a lower heat dissipation channel.

[0009] As an optional solution of this utility model, multiple first ventilation holes are provided and are evenly distributed on the side of the cover, with the multiple first ventilation holes arranged in parallel and at intervals.

[0010] As an optional solution of this utility model, multiple second ventilation holes are provided and are evenly arranged on the side of the cover. The multiple second ventilation holes are arranged in parallel and at intervals, and the first ventilation hole is arranged in parallel and at intervals with the second ventilation hole.

[0011] As an optional solution of this utility model, two signal connection terminals are provided, both of which are fixedly connected to the cover, and both signal connection terminals are electrically connected to the circuit board; the signal connection terminals are rectangular connectors.

[0012] As an optional solution of this utility model, the circuit assembly further includes signal indicator lights. Multiple signal indicator lights are provided and are all fixedly connected to the cover. The multiple signal indicator lights are arranged in parallel and at intervals and are all electrically connected to the circuit main board.

[0013] As an optional embodiment of this invention, both the upper and lower heat dissipation holes are diamond-shaped.

[0014] As an optional solution of this utility model, a fixing block is provided on the top of the cover, and multiple fixing blocks are provided in an arc shape. The multiple fixing blocks are evenly fixedly connected to the cover, and fixing holes are provided on the fixing blocks.

[0015] As an optional solution of this utility model, a top cover is provided on the top side of the cover body, the top cover is installed on the cover body, the top cover is provided with a top hole, there are multiple top holes, and they are evenly distributed on the top cover, the top holes are concentrically arranged with the fixing hole.

[0016] The high-efficiency heat dissipation shielding cover provided in this embodiment of the present invention has at least one of the following technical effects:

[0017] The high-efficiency heat dissipation shield provided in this application forms a good air convection channel by setting multiple sets of parallel and spaced first and second ventilation holes on both sides of the shield. At the same time, multiple evenly arranged heat dissipation plates in the heat dissipation component, as well as the unique diamond-shaped upper and lower heat dissipation holes on the heat dissipation plates, increase the contact area between the air and the heat dissipation plates, improve the heat exchange efficiency, achieve high-efficiency heat dissipation, effectively reduce the internal temperature of electronic equipment, and ensure that electronic components operate stably within a suitable temperature range. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 A perspective view of the high-efficiency heat dissipation shield provided in an embodiment of this utility model.

[0020] Figure 2 A perspective view of the high-efficiency heat dissipation shield provided in an embodiment of this utility model.

[0021] Figure 3 A perspective view of the high-efficiency heat dissipation shield provided in this embodiment of the utility model, omitting the top cover.

[0022] Figure 4 A perspective view of the high-efficiency heat dissipation shield provided in this embodiment of the utility model, omitting the top cover and the circuit board.

[0023] Figure 5 for Figure 4 A magnified view of part A in the image.

[0024] Figure 6 A perspective view of the heat dissipation component of the high-efficiency heat dissipation shield provided in an embodiment of this utility model.

[0025] Figure 7 A perspective view of the heat sink plate of the high-efficiency heat dissipation shield provided in an embodiment of this utility model.

[0026] The following are the labeling elements in the figure:

[0027] 1. Housing; 2. Circuit assembly; 3. Heat dissipation assembly; 4. Fixing block; 5. Top cover;

[0028] 11. First ventilation hole; 12. Second ventilation hole;

[0029] 21. Circuit board; 22. Signal connection terminal; 23. Signal indicator light;

[0030] 31. Heat sink; 32. Top heat sink; 33. Bottom heat sink;

[0031] 41 fixing holes;

[0032] 51. Top hole;

[0033] 321. Top ventilation holes;

[0034] 331. Lower heat dissipation holes. Detailed Implementation

[0035] The embodiments of this utility model are described in detail below. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the embodiments of this utility model, and should not be construed as limiting the utility model.

[0036] In the description of the embodiments of this utility model, it should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. They are only for the convenience of describing the embodiments of this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0037] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of embodiments of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.

[0038] In this embodiment of the invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this embodiment of the invention according to the specific circumstances.

[0039] In one embodiment of this utility model, such as Figures 1-7 As shown, a high-efficiency heat dissipation shield is provided, including a shield body 1, a circuit assembly 2 and a heat dissipation assembly 3. The circuit assembly 2 is respectively disposed on the shield body 1 and the heat dissipation assembly 3, and dissipates heat through the heat dissipation assembly 3. The heat dissipation assembly 3 is respectively disposed on the shield body 1 and the circuit assembly 2, and conducts heat out of the circuit assembly 2.

[0040] The cover 1 is provided with a first ventilation hole 11 and a second ventilation hole 12. The first ventilation hole 11 is located on one side of the cover 1, and the second ventilation hole 12 is located on the other side of the cover 1.

[0041] The circuit assembly 2 includes a circuit main board 21 and a signal connection terminal 22. The circuit main board 21 is respectively disposed on the cover 1 and the heat dissipation assembly 3. The signal connection terminal 22 is disposed on the cover 1 and electrically connected to the circuit main board 21.

[0042] The heat dissipation assembly 3 includes multiple heat dissipation plates 31, which are evenly arranged within the cover 1, with adjacent heat dissipation plates 31 being fixedly connected in sequence. Each heat dissipation plate 31 includes a top heat dissipation plate 32 and a bottom heat dissipation plate 33. The bottom heat dissipation plate 33 is connected to both the top heat dissipation plate 32 and the cover 1. The top heat dissipation plate 32 has upper heat dissipation holes 321, forming an upper heat dissipation channel. The bottom heat dissipation plate 33 has lower heat dissipation holes 331, forming a lower heat dissipation channel.

[0043] The high-efficiency heat dissipation shield provided in this application forms a good air convection channel by setting multiple sets of parallel and spaced first ventilation holes 11 and second ventilation holes 12 on both sides of the shield body 1; at the same time, the multiple uniformly arranged heat dissipation plates 31 in the heat dissipation assembly 3, as well as the unique diamond-shaped upper heat dissipation holes 321 and lower heat dissipation holes 331 on the heat dissipation plates 31, increase the contact area between the air and the heat dissipation plates 31, improve the heat exchange efficiency, realize high-efficiency heat dissipation, effectively reduce the internal temperature of electronic equipment, and ensure that electronic components operate stably within a suitable temperature range.

[0044] In another embodiment of this utility model, multiple first ventilation holes 11 are provided and evenly distributed on the side of the cover 1, with the multiple first ventilation holes 11 arranged in parallel and spaced apart. Multiple second ventilation holes 12 are provided and evenly distributed on the side of the cover 1, with the multiple second ventilation holes 12 arranged in parallel and spaced apart. The first ventilation holes 11 and second ventilation holes 12 are arranged in parallel and spaced apart. The diameter of the first ventilation holes 11 and second ventilation holes 12 is 1-3 mm. The arrangement of the first ventilation holes 11 and second ventilation holes 12 ensures effective air convection on both sides of the cover 1, aiding heat dissipation, while maintaining the shielding performance of the shielding cover while meeting heat dissipation requirements.

[0045] In another embodiment of this utility model, two signal connection terminals 22 are provided, both fixedly connected to the cover 1, and both signal connection terminals 22 are electrically connected to the circuit board 21; the signal connection terminals 22 are rectangular connectors. The two rectangular connector-type signal connection terminals 22 are stably electrically connected to the circuit board 21, enabling reliable transmission of multiple signals simultaneously, meeting the signal interaction requirements between electronic devices and external devices. The rectangular structure makes the connection more stable, reducing poor contact caused by vibration, ensuring the stability and continuity of signal transmission, and ensuring smooth communication between the circuit component 2 and external devices.

[0046] In another embodiment of this utility model, the circuit assembly 2 further includes signal indicator lights 23. Multiple signal indicator lights 23 are provided and fixedly connected to the cover 1. The multiple signal indicator lights 23 are arranged in parallel and at intervals, and are all electrically connected to the main circuit board 21. The multiple parallel and at intervals signal indicator lights 23 electrically connected to the main circuit board 21 can intuitively reflect the working status of the main circuit board 21.

[0047] In another embodiment of this utility model, both the upper heat dissipation hole 321 and the lower heat dissipation hole 331 are diamond-shaped, which increases the heat dissipation area.

[0048] In another embodiment of this utility model, a fixing block 4 is provided on the top of the cover 1. Multiple fixing blocks 4 are provided and arranged in an arc shape. The multiple fixing blocks 4 are evenly fixedly connected to the cover 1, and fixing holes are provided on the fixing blocks 4. A top cover 5 is provided on the top side of the cover 1. The top cover 5 is installed on the cover 1 and is provided with a top hole 41 fixing hole; 51, multiple top holes 41 fixing holes; 51 are provided and evenly arranged on the top cover 5, and the top holes 41 fixing holes; 51 are concentrically arranged with the fixing holes.

[0049] Multiple arc-shaped fixing blocks 4 are evenly connected to the top of the cover 1, and their fixing holes cooperate with the concentric top holes 41 fixing holes 51 on the top cover 5. The shield can be firmly installed on the electronic equipment by bolts or other connecting parts, enhancing the installation's stability. The arc design can distribute the stress during installation, protecting the structure of the cover 1. At the same time, the even placement of multiple fixing blocks 4 and top holes 41 fixing holes 51 makes the force more balanced, ensuring that the shield is not easily loosened during equipment operation, guaranteeing the stable operation of internal components, and facilitating subsequent disassembly and maintenance.

[0050] The high-efficiency heat dissipation shield provided in this application operates as follows:

[0051] When the electronic device is running, the main circuit board 21 in circuit assembly 2 generates heat. This heat is absorbed and conducted through the heat sink 31, which is in close contact with the main circuit board 21. The upper and lower heat dissipation channels formed by the upper and lower heat dissipation holes 321 and 331 on the heat sink 31 allow air to flow between the heat sinks, carrying away heat. Simultaneously, the first ventilation hole 11 and the second ventilation hole 12 on both sides of the housing 1 create air convection. External cool air enters the housing 1 through the first ventilation hole 11, absorbs heat through the heat sink 31, and is then exhausted through the second ventilation hole 12, thus achieving a continuous heat dissipation process. The signal connection terminal 22 is responsible for transmitting signals between the main circuit board 21 and external devices, ensuring normal communication between electronic devices. The signal indicator light 23 illuminates according to the operating status of the main circuit board 21, providing users with intuitive information about the device's operating status.

[0052] The high-efficiency heat dissipation shield provided in this application forms a good air convection channel by setting multiple sets of parallel and spaced first ventilation holes 11 and second ventilation holes 12 on both sides of the shield body 1; at the same time, the multiple uniformly arranged heat dissipation plates 31 in the heat dissipation assembly 3, as well as the unique diamond-shaped upper heat dissipation holes 321 and lower heat dissipation holes 331 on the heat dissipation plates 31, increase the contact area between the air and the heat dissipation plates 31, improve the heat exchange efficiency, realize high-efficiency heat dissipation, effectively reduce the internal temperature of electronic equipment, and ensure that electronic components operate stably within a suitable temperature range.

[0053] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A high efficiency heat dissipating shield characterized by, It includes a cover, a circuit assembly, and a heat dissipation assembly. The circuit assembly is respectively disposed on the cover and the heat dissipation assembly, and dissipates heat through the heat dissipation assembly. The heat dissipation assembly is respectively disposed on the cover and the circuit assembly, and conducts heat away from the circuit assembly. The cover is provided with a first ventilation hole and a second ventilation hole, the first ventilation hole being located on one side of the cover and the second ventilation hole being located on the other side of the cover; The circuit assembly includes a circuit main board and a signal connection terminal. The circuit main board is respectively disposed on the cover and the heat dissipation assembly. The signal connection terminal is disposed on the cover and electrically connected to the circuit main board. The heat dissipation assembly includes multiple heat dissipation plates, which are evenly arranged within the cover. Adjacent heat dissipation plates are connected in sequence. Each heat dissipation plate includes a top heat dissipation plate and a bottom heat dissipation plate. The bottom heat dissipation plate is connected to the top heat dissipation plate and the cover, respectively. The top heat dissipation plate has upper heat dissipation holes, which together form an upper heat dissipation channel. The bottom heat dissipation plate has lower heat dissipation holes, which together form a lower heat dissipation channel.

2. A high efficiency heat dissipating shield according to claim 1, wherein Multiple first ventilation holes are provided and are evenly distributed on the side of the cover, with the multiple first ventilation holes arranged in parallel and at intervals.

3. The high efficiency heat dissipating shield of claim 1, wherein, Multiple second ventilation holes are provided and are evenly distributed on the side of the cover. The multiple second ventilation holes are arranged in parallel and at intervals, and the first ventilation hole is arranged in parallel and at intervals with the second ventilation hole.

4. The high efficiency heat dissipating shield of claim 1, wherein, The signal connection terminal is provided in two parts, both of which are fixedly connected to the cover. Both signal connection terminals are electrically connected to the circuit board. The signal connection terminal is a rectangular connector.

5. The high efficiency heat dissipating shield of claim 1, wherein, The circuit assembly also includes multiple signal indicator lights, all of which are fixedly connected to the cover. The multiple signal indicator lights are arranged in parallel and at intervals, and are all electrically connected to the circuit main board.

6. The high efficiency heat dissipating shield of claim 1, wherein, Both the upper and lower heat dissipation holes are diamond-shaped.

7. The high efficiency heat dissipating shield of claim 1 wherein, The top of the cover is provided with a fixing block, and there are multiple fixing blocks arranged in an arc shape. The multiple fixing blocks are evenly fixed to the cover, and the fixing blocks are provided with fixing holes.

8. A high efficiency heat dissipating shield according to claim 7, wherein A top cover is provided on the top side of the cover body. The top cover is installed on the cover body. The top cover is provided with multiple top holes, which are evenly distributed on the top cover. The top holes are concentric with the fixing holes.

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