A fin limiting structure and a radiator assembly

Abstract

A heat sink limiting structure and a heat sink assembly are disclosed, including an L-shaped substrate and a mounting groove for a heat sink to be installed on the L-shaped substrate. The shape of the L-shaped substrate matches the stepped structure of the heat sink, and the shape of the heat sink matches the shape of the mounting groove. In implementing this invention, the shape of the L-shaped substrate matches the stepped structure of the heat sink, thus the L-shaped substrate fits snugly against the stepped structure. Because the shape of the heat sink matches the mounting groove on the L-shaped substrate, when the heat sink is attached to the horizontal stepped surface of the stepped structure, the heat sink is accommodated in the mounting groove and limited by the mounting groove, thus preventing displacement of the heat sink and preventing heat dissipation failure of electronic components.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation in charging modules, and more specifically, to a heat sink limiting structure and a heat sink assembly. Background Technology

[0002] In high-power charging modules, heat sinks are typically required to dissipate heat from the electronic components on the printed circuit board. To reduce the size of the charging module, the space for the electronic components on the printed circuit board is generally quite limited. Therefore, the heat sinks for some electronic components have to be placed on the edge of the heat sink's step, which can easily cause the heat sink to shift, leading to heat dissipation failure for the electronic components. Utility Model Content

[0003] The technical problem to be solved by this utility model is to provide a heat sink limiting structure and a heat sink assembly that can ensure that the heat sink does not shift, in view of the above-mentioned defects of the prior art.

[0004] The technical solution adopted by this utility model to solve its technical problem is: to construct a heat sink limiting structure, including an L-shaped base plate and a mounting groove for the heat sink to be installed on the L-shaped base plate; the shape of the L-shaped base plate matches the stepped structure of the heat sink, and the shape of the heat sink matches the shape of the mounting groove.

[0005] In the heat sink limiting structure of this utility model, the L-shaped substrate is an insulating substrate and includes a horizontal substrate and a vertical substrate extending vertically along the first side of the horizontal substrate; the step structure includes a horizontal step surface and a vertical step surface; the horizontal substrate is attached and fixed to the horizontal step surface, and the vertical substrate is attached to the vertical step surface.

[0006] In the heat sink limiting structure of this utility model, the mounting groove is disposed on the side of the horizontal substrate close to the vertical substrate, and the abutting edge of the horizontal substrate and the vertical substrate forms a limiting stop edge of the mounting groove for limiting the heat sink.

[0007] In the heat sink limiting structure described in this utility model, the mounting groove is a rectangular groove; the heat sink is a rectangular ceramic heat sink.

[0008] In the heat sink limiting structure of this utility model, the length of the horizontal substrate is equal to the length of the horizontal step surface, and the width of the horizontal substrate is greater than the width of the heat sink and less than the width of the horizontal step surface; the length of the vertical substrate is equal to the length of the vertical step surface, and the width of the vertical substrate is less than the width of the vertical step surface.

[0009] In the heat sink limiting structure of this utility model, multiple sets of mounting slots are horizontally spaced on the L-shaped substrate; each set of mounting slots includes two adjacent mounting slots; a fixing screw hole is provided between each set of mounting slots; the L-shaped substrate is fixed to the horizontal step surface by fixing screws through the fixing screw holes.

[0010] The heat sink limiting structure of this utility model has a shape that matches the shape of the mounting groove; therefore, the L-shaped substrate fits into the stepped structure; when the heat sink is attached to the horizontal step surface of the stepped structure, the heat sink is accommodated in the mounting groove and the mounting groove limits the heat sink.

[0011] Another technical solution adopted by this utility model to solve its technical problem is: constructing a heat sink assembly, including a heat sink, multiple heat sinks, and a heat sink limiting structure; the heat sink includes a stepped structure; the heat sink limiting structure includes an L-shaped base plate and multiple mounting slots disposed on the L-shaped base plate; one heat sink corresponds to one mounting slot; the shape of the L-shaped base plate matches the stepped structure, and the L-shaped base plate is in contact with the stepped structure; when the multiple heat sinks are attached to the horizontal stepped surface of the stepped structure, each heat sink is accommodated in a corresponding mounting slot and the mounting slot limits the heat sink.

[0012] In the heat sink assembly of this utility model, the L-shaped substrate is an insulating substrate and includes a horizontal substrate and a vertical substrate extending vertically along a first side of the horizontal substrate; the stepped structure includes a horizontal stepped surface and a vertical stepped surface; the horizontal substrate is attached and fixed to the horizontal stepped surface, and the vertical substrate is attached to the vertical stepped surface.

[0013] In the heat sink assembly of this utility model, the plurality of mounting slots are horizontally spaced on one side of the horizontal substrate near the vertical substrate, and the abutting edges of the horizontal substrate and the vertical substrate respectively form limiting stops for limiting the corresponding heat sinks of each mounting slot.

[0014] In the heat sink assembly of this utility model, the mounting slot is a rectangular slot; the heat sink is a rectangular ceramic heat sink; every two mounting slots are arranged adjacent to each other to form a set of mounting slots; a fixing screw hole is provided between each set of mounting slots; the L-shaped substrate is fixed to the horizontal step surface by fixing screws through the fixing screw hole.

[0015] The heat sink assembly implementing this utility model has an L-shaped substrate whose shape matches the stepped structure of the heat sink, so the L-shaped substrate fits into the stepped structure. Because the shape of the heat sink fin matches the mounting groove provided on the L-shaped substrate, when the heat sink fin is attached to the horizontal stepped surface of the stepped structure, the heat sink fin is accommodated in the mounting groove and the mounting groove limits the heat sink fin, thus preventing the heat sink fin from shifting and thereby preventing heat dissipation failure of electronic components. Attached Figure Description

[0016] The present invention will be further described below with reference to the accompanying drawings and embodiments. In the accompanying drawings:

[0017] Figure 1 This is a preferred embodiment of the heat sink limiting structure of this utility model;

[0018] Figure 2 yes Figure 1 Enlarged view of the structure of part A in the image;

[0019] Figure 3 This is a schematic diagram of the heat sink limiting structure of this utility model from another angle;

[0020] Figure 4 This is a front view of the heat sink limiting structure of this utility model;

[0021] Figure 5 This is an exploded view of a preferred embodiment of the heat sink assembly of this utility model;

[0022] Figure 6 This is an assembly diagram of a preferred embodiment of the heat sink assembly of this utility model;

[0023] Figure 7 This is a cross-sectional view of a preferred embodiment of the heat sink assembly of this utility model. Detailed Implementation

[0024] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present utility model and are not intended to limit the present utility model.

[0025] Figure 1 This is a preferred embodiment of the heat sink limiting structure of this utility model. Figure 2 yes Figure 1 Enlarged view of the structure of part A in the image. Figure 3 This is a schematic diagram of the heat sink limiting structure of this utility model from another angle. Figure 4 This is a front view of the heat sink limiting structure of this utility model. Figure 5This is an exploded view of a preferred embodiment of the heat sink assembly of this utility model. Figure 6 This is an assembly diagram of a preferred embodiment of the heat sink assembly of this utility model. Figure 7 This is a cross-sectional view of a preferred embodiment of the heat sink assembly of this utility model.

[0026] like Figures 1-7 As shown, the heat sink limiting structure 100 of this utility model includes an L-shaped substrate 110 and a mounting groove 120 for a heat sink 300 to be installed on the L-shaped substrate 110. The shape of the L-shaped substrate 110 matches the stepped structure 210 of the heat sink 200, and the shape of the heat sink 300 matches the shape of the mounting groove 210. Therefore, the L-shaped substrate 110 is in contact with the stepped structure 210. When the heat sink 300 is attached to the horizontal stepped surface 211 of the stepped structure 210, the heat sink 300 is accommodated in the mounting groove 120 and the mounting groove 120 limits the heat sink 300.

[0027] Here, the L-shaped substrate 110 is preferably an insulating substrate, thus simultaneously providing insulation and limiting the position of the heat sink. The stepped structure 210 of the heat sink 200 refers to the stepped main structure of the heat sink used to mount the heat sink 300, such as the stepped shell of the heat sink. It is precisely because heat sinks typically have such a stepped structure that displacement problems easily occur when the heat sink is arranged on the stepped main structure of the heat sink.

[0028] By adding the heat sink limiting structure 100 of this invention, the shape of the L-shaped substrate 110 matches the stepped structure 210 of the heat sink 200, and the L-shaped substrate 110 is in contact with the stepped structure 210. Therefore, when the heat sink 300 is attached to the horizontal stepped surface 211 of the stepped structure 210, the heat sink 300 is accommodated in the mounting groove 120 and limited by the mounting groove 120, thus preventing displacement of the heat sink 300 and preventing heat dissipation failure of electronic components. Furthermore, the heat sink limiting structure of this invention can also be designed with insulating materials, so the concept is very ingenious. With a very simple structural design, it can be installed at the stepped position and prevent the heat sink from shifting, while also achieving insulation. Therefore, it can effectively reduce the size of the charging module and reduce the manufacturing and design costs of the charging module.

[0029] Further as Figures 1-7As shown, the L-shaped substrate 110 includes a horizontal substrate 111 and a vertical substrate 112 extending vertically along a first side of the horizontal substrate 111; the stepped structure 210 includes a horizontal stepped surface 211 and a vertical stepped surface 212; the horizontal substrate 111 is attached to the horizontal stepped surface 211, and the vertical substrate 112 is attached to the vertical stepped surface 212. The mounting groove 120 is disposed on the side of the horizontal substrate 111 near the vertical substrate 112. The abutting edges of the horizontal substrate 111 and the vertical substrate 112 form a limiting stop 113 for limiting the heat sink 300 in the mounting groove 120, thereby preventing the heat sink 300 from sliding outward. At the same time, the remaining sidewalls of the mounting groove 120 can also limit and fix the heat sink 300.

[0030] In a preferred embodiment of this utility model, the heat sink 300 is a rectangular ceramic heat sink 300; the mounting groove 120 is a rectangular groove. Of course, in other preferred embodiments of this utility model, the heat sink 300 may also be made of other materials and shapes. Correspondingly, the mounting groove 120 may be designed according to the shape of the heat sink 300, as long as it can meet the limiting requirements.

[0031] Further as Figures 1-7 As shown, in a preferred embodiment of this invention, the length of the horizontal substrate 111 is equal to the length of the horizontal step surface 211, and the width of the horizontal substrate 111 is greater than the width of the heat sink 300 but less than the width of the horizontal step surface 211. That is, the horizontal substrate 111 only partially covers the horizontal step surface 211. This is because the volume of the heat sink 300 is relatively small, and to save materials and facilitate installation, the width of the horizontal substrate 111 only needs to be designed to be slightly larger than the width of the heat sink 300. Of course, in other preferred embodiments of this invention, the horizontal substrate 111 of other shapes or sizes can also be designed according to actual insulation requirements.

[0032] Further as Figures 1-7 As shown, in a preferred embodiment of this invention, the length of the vertical substrate 112 is equal to the length of the vertical step surface 212, and the width of the vertical substrate 112 is smaller than the width of the vertical step surface 212. Here, designing the length of the vertical substrate 112 to be equal to the length of the vertical step surface 212, and designing the width of the vertical substrate 112 to be slightly smaller than the width of the vertical step surface 212, allows for a closer fit between the two and facilitates installation.

[0033] Further as Figures 1-7As shown, multiple sets of mounting slots 120 can be horizontally spaced on the horizontal substrate 111 of the L-shaped substrate 110; each set of mounting slots 120 includes two adjacent mounting slots 120; a fixing screw hole 114 is provided between each set of mounting slots 120; the horizontal substrate 111 of the L-shaped substrate is fixed to the horizontal stepped surface 211 of the heat sink 200 by fixing screws 115 through the fixing screw holes.

[0034] Figure 5 This is an exploded view of a preferred embodiment of the heat sink assembly of this utility model. Figure 6 This is an assembly diagram of a preferred embodiment of the heat sink assembly of this utility model. Figure 7 This is a cross-sectional view of a preferred embodiment of the heat sink assembly of this utility model. (See attached image.) Figures 5-7 As shown, the heat sink assembly of this utility model includes a heat sink 200, a plurality of heat sink fins 300, and a heat sink limiting structure 100. The heat sink 200 includes a stepped structure 210.

[0035] Here, the heat sink can be any known heat sink with a stepped structure in the art. The stepped structure 210 of the heat sink 200 refers to the stepped main body structure of the heat sink for mounting the heat sink 300, such as the stepped shell of the heat sink. As mentioned above, it is precisely because heat sinks usually have such a stepped structure that displacement problems easily occur when the heat sink is arranged on the stepped main body structure of the heat sink. The heat sink 300 can be any known heat sink in the art, such as commonly used ceramic heat sinks. It should be noted that in Figure 5 In the embodiment shown, the heat sink 200 actually has two stepped structures 210. Therefore, the heat sink limiting structure 100 can be set on any one or both of the two stepped structures 210. These can be determined according to the actual power module structure and all fall within the protection scope of this utility model.

[0036] The heat sink limiting structure 100 includes an L-shaped substrate 110 and a plurality of mounting slots 120 disposed on the L-shaped substrate 110; one heat sink 300 corresponds to one mounting slot 120; the shape of the L-shaped substrate 110 matches the step structure 210, and the L-shaped substrate 110 is in contact with the step structure 210; when the plurality of heat sinks 300 are attached to the horizontal step surface 211 of the step structure 210, each heat sink 300 is accommodated in a corresponding mounting slot 120 and the mounting slot 120 limits the heat sink 300.

[0037] Combination Figures 1-7It is known that the L-shaped substrate 110 is an insulating substrate and includes a horizontal substrate 111 and a vertical substrate 112 extending vertically along the first side of the horizontal substrate 111; the step structure 210 includes a horizontal step surface 211 and a vertical step surface 212; the horizontal substrate 111 is attached and fixed to the horizontal step surface 211, and the vertical substrate 112 is attached to the vertical step surface 212.

[0038] like Figures 5-7 As shown, the plurality of mounting slots 120 are horizontally spaced on one side of the horizontal substrate 111 near the vertical substrate 112, and the abutting edges of the horizontal substrate 111 and the vertical substrate 112 respectively form limiting stops for limiting the corresponding heat sinks 300 in each of the mounting slots 120.

[0039] In a preferred embodiment of this utility model, the heat sink 300 is a rectangular ceramic heat sink 300; the mounting groove 120 is a rectangular groove. Of course, in other preferred embodiments of this utility model, the heat sink 300 may also be made of other materials and shapes. Correspondingly, the mounting groove 120 may be designed according to the shape of the heat sink 300, as long as it can meet the limiting requirements.

[0040] In a preferred embodiment of this invention, the length of the horizontal substrate 111 is equal to the length of the horizontal step surface 211, and the width of the horizontal substrate 111 is greater than the width of the heat sink 300 but less than the width of the horizontal step surface 211; that is, the horizontal substrate 111 only partially covers the horizontal step surface 211. This is because the volume of the heat sink 300 is relatively small, and to save materials and facilitate installation, the width of the horizontal substrate 111 only needs to be designed to be slightly larger than the width of the heat sink 300. Of course, in other preferred embodiments of this invention, the horizontal substrate 111 of other shapes or sizes can also be designed according to actual insulation requirements.

[0041] In a preferred embodiment of this invention, the length of the vertical substrate 112 is equal to the length of the vertical step surface 212, and the width of the vertical substrate 112 is smaller than the width of the vertical step surface 212. Designing the length of the vertical substrate 112 to be equal to the length of the vertical step surface 212, and designing the width of the vertical substrate 112 to be slightly smaller than the width of the vertical step surface 212, allows for a closer fit between the two and facilitates installation.

[0042] Multiple sets of mounting slots 120 can be horizontally spaced on the horizontal substrate 111 of the L-shaped substrate 110; each set of mounting slots 120 includes two adjacent mounting slots 120; a fixing screw hole 114 is provided between each set of mounting slots 120; the horizontal substrate 111 of the L-shaped substrate is fixed to the horizontal stepped surface 211 of the heat sink 200 by fixing screws 115 through the fixing screw holes.

[0043] The heat sink assembly implementing this utility model has an L-shaped substrate whose shape matches the stepped structure of the heat sink, and the L-shaped substrate is in close contact with the stepped structure. Therefore, when the heat sink is attached to the horizontal stepped surface of the stepped structure, the heat sink is accommodated in the mounting groove and the mounting groove limits the heat sink, thus preventing displacement of the heat sink and preventing heat dissipation failure of electronic components. Furthermore, the heat sink limiting structure of this utility model can also be designed with insulating material, making the concept very ingenious. With a very simple structural design, it can be installed at the stepped position and prevent heat sink displacement while achieving insulation. Therefore, it can effectively reduce the size of the charging module and lower the manufacturing and design costs of the charging module.

[0044] Although this utility model has been described through specific embodiments, those skilled in the art should understand that various modifications and equivalent substitutions can be made to this utility model without departing from its scope. Furthermore, various modifications can be made to this utility model for specific situations or materials without departing from its scope. Therefore, this utility model is not limited to the specific embodiments disclosed, but should include all embodiments falling within the scope of the claims of this utility model.

[0045] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A heat sink limiting structure, characterized in that, It includes an L-shaped substrate and a mounting groove for a heat sink to be installed on the L-shaped substrate; the shape of the L-shaped substrate matches the stepped structure of the heat sink, and the shape of the heat sink matches the shape of the mounting groove.

2. The heat sink limiting structure according to claim 1, characterized in that, The L-shaped substrate is an insulating substrate and includes a horizontal substrate and a vertical substrate extending vertically along a first side of the horizontal substrate; the step structure includes a horizontal step surface and a vertical step surface; the horizontal substrate is attached to the horizontal step surface, and the vertical substrate is attached to the vertical step surface.

3. The heat sink limiting structure according to claim 2, characterized in that, The mounting groove is disposed on the side of the horizontal substrate near the vertical substrate, and the abutting edge of the horizontal substrate and the vertical substrate forms a limiting stop edge of the mounting groove for limiting the heat sink.

4. The heat sink limiting structure according to claim 3, characterized in that, The mounting slot is a rectangular slot; the heat sink is a rectangular ceramic heat sink.

5. The heat sink limiting structure according to any one of claims 2 to 4, characterized in that, The length of the horizontal substrate is equal to the length of the horizontal step surface, and the width of the horizontal substrate is greater than the width of the heat sink and less than the width of the horizontal step surface; the length of the vertical substrate is equal to the length of the vertical step surface, and the width of the vertical substrate is less than the width of the vertical step surface.

6. The heat sink limiting structure according to claim 5, characterized in that, Multiple sets of mounting slots are horizontally spaced on the L-shaped substrate; each set of mounting slots includes two adjacent mounting slots; a fixing screw hole is provided between each set of mounting slots; the L-shaped substrate is fixed to the horizontal step surface by fixing screws through the fixing screw hole.

7. A heat sink assembly, characterized in that, The device includes a heat sink, multiple heat sinks, and a heat sink limiting structure. The heat sink includes a stepped structure. The heat sink limiting structure includes an L-shaped base plate and multiple mounting slots disposed on the L-shaped base plate. Each heat sink corresponds to one mounting slot. The shape of the L-shaped base plate matches the stepped structure, and the L-shaped base plate is in contact with the stepped structure. When the multiple heat sinks are attached to the horizontal stepped surface of the stepped structure, each heat sink is accommodated in a corresponding mounting slot and the mounting slot limits the heat sink position.

8. The heat sink assembly according to claim 7, characterized in that, The L-shaped substrate is an insulating substrate and includes a horizontal substrate and a vertical substrate extending vertically along a first side of the horizontal substrate; the step structure includes a horizontal step surface and a vertical step surface; the horizontal substrate is attached to the horizontal step surface, and the vertical substrate is attached to the vertical step surface.

9. The heat sink assembly according to claim 8, characterized in that, The plurality of mounting slots are horizontally spaced apart on one side of the horizontal substrate near the vertical substrate, and the abutting edges of the horizontal substrate and the vertical substrate respectively form limiting stops for the corresponding heat sinks of each mounting slot.

10. The heat sink assembly according to claim 9, characterized in that, The mounting slot is a rectangular slot; the heat sink is a rectangular ceramic heat sink; every two mounting slots are arranged adjacent to each other to form a set of mounting slots; a fixing screw hole is provided between each set of mounting slots; the L-shaped substrate is fixed to the horizontal step surface by fixing screws through the fixing screw hole.

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