Cross section tooth type heat dissipation structure
By designing a cross-toothed heat dissipation structure, multi-directional heat conduction and phase change heat transfer are utilized to solve the problem of limited heat conduction paths in existing heat spreaders, achieving efficient heat dissipation and liquid reflux, and improving the heat dissipation performance and service life of the equipment.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- HUIZHOU CHUYUE THERMAL TECH CO LTD
- Filing Date
- 2025-09-10
- Publication Date
- 2026-08-04
AI Technical Summary
Existing heat exchangers have limited heat conduction paths, high thermal resistance, and cannot quickly dissipate heat. They also have a single liquid return path and low return efficiency, making it difficult to cope with transient high power loads. This can easily lead to local overheating and dry burning, affecting heat dissipation performance and equipment lifespan.
The device employs a cross-toothed heat dissipation structure, including a base column, an intermediate column, and a surface column, forming multiple interconnected heat dissipation spaces and a sealed heat dissipation cavity. It utilizes the phase change heat transfer of the metal thermally conductive material and the heat dissipation fluid to achieve multi-directional heat conduction and rapid diffusion.
It significantly reduces thermal resistance, improves heat conduction and heat dissipation efficiency, enhances liquid reflux efficiency, reduces energy consumption, extends equipment life, and adapts to transient high power loads.
Smart Images
Figure CN224596844U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of radiator technology, specifically to a cross-toothed heat dissipation structure. Background Technology
[0002] Heat dissipation technology is a crucial aspect of modern electronic devices, especially in high-power chips such as CPUs and GPUs, where efficient heat dissipation directly impacts device performance and lifespan. Currently, mainstream heat dissipation solutions include air cooling, liquid cooling, and vapor chambers. Among these, vapor chambers, due to their highly efficient two-phase heat transfer mechanism, are widely used in high-end electronic devices.
[0003] Existing vapor chambers use only copper or aluminum pillars in their evaporation zone, resulting in limited heat conduction paths and high thermal resistance. This prevents heat from dissipating quickly and can easily lead to localized overheating. Furthermore, the liquid return path in the evaporation zone of existing vapor chambers is singular, with low return efficiency and few return paths, making it difficult to cope with transient high-power loads. This can easily lead to dry burning, causing transient overheating, which in turn affects heat dissipation performance and may even damage the equipment. Utility Model Content
[0004] To address the shortcomings of existing technologies, this application provides a cross-toothed heat dissipation structure.
[0005] The cross-tooth heat dissipation structure disclosed in this application includes: a surface body and a plurality of substrates arranged at intervals along the X-axis direction. Each substrate includes a base pillar and a plurality of intermediate pillars arranged at intervals along the Y-axis direction. One end of each of the intermediate pillars is connected to the base pillar. A first heat dissipation space is formed between two adjacent base pillars, and a second heat dissipation space is formed between the plurality of intermediate pillars. The first heat dissipation space and the second heat dissipation space are connected. The surface body includes a plurality of surface pillars arranged at intervals along the Y-axis direction. Each surface pillar is connected to the other end of one of the intermediate pillars of the plurality of substrates. A third heat dissipation space is formed between two adjacent surface pillars, and the third heat dissipation space is connected to the second heat dissipation space.
[0006] Preferably, multiple base pillars are arranged side by side along the X-axis to form a heat dissipation bottom surface; multiple surface pillars are arranged side by side along the Y-axis to form a heat dissipation surface; and multiple intermediate pillars are arranged in a matrix, with each intermediate pillar perpendicular to the heat dissipation bottom surface and the heat dissipation surface.
[0007] Preferably, multiple base columns are arranged side by side at equal intervals along the X-axis, and multiple surface columns are arranged side by side at equal intervals along the Y-axis.
[0008] Preferably, the heat dissipation bottom surface and the heat dissipation surface are square, circular, rectangular or irregular in shape.
[0009] Preferably, sealed heat dissipation cavities are provided inside the base column, intermediate column, and surface column.
[0010] Preferably, the sealed heat dissipation cavity of the intermediate column, the sealed heat dissipation cavity of the base column, and the sealed heat dissipation cavity of the surface column are connected and form a heat dissipation channel, and the heat dissipation channel contains heat dissipation liquid.
[0011] Preferably, the spacing between two adjacent base columns, the spacing between two adjacent surface columns, and the gap between two adjacent intermediate columns are all greater than 0.1 mm.
[0012] Preferably, the cross-sectional width of the base column, the cross-sectional width of the intermediate column, and the cross-sectional width of the surface column are all greater than 0.1 mm.
[0013] Preferably, the base column, intermediate column, and surface column are integrally formed.
[0014] Preferably, the base column, intermediate column, and surface column are all made of thermally conductive metallic materials.
[0015] The beneficial effects of this application are as follows: by setting up multiple spaced base columns, intermediate columns and surface columns, the heat dissipation surface area of the base columns, intermediate columns and surface columns is increased, that is, it has a larger heat conduction cross-sectional area, which can significantly reduce thermal resistance. At the same time, by setting up a first heat dissipation space, a second heat dissipation space and a third heat dissipation space, and since the first heat dissipation space, the second heat dissipation space and the third heat dissipation space are interconnected, multi-directional heat conduction can be realized, so that heat can be rapidly diffused in multiple directions, further improving heat conduction and heat dissipation efficiency.
[0016] In addition, sealed heat dissipation cavities are provided in the base column, intermediate column and surface column, and heat dissipation liquid is provided in the sealed heat dissipation cavities, so that the heat dissipation efficiency can be further improved by the interconversion of liquid phase and gas phase. Attached Figure Description
[0017] The accompanying drawings, which are included to provide a further understanding of this application and form part of this application, illustrate exemplary embodiments of this application and are used to explain this application, but do not constitute an undue limitation of this application. In the drawings: Figure 1 This is a schematic diagram of the cross-tooth heat dissipation structure in the embodiment; Figure 2 This is a side view of the cross-toothed heat dissipation structure in the embodiment; Figure 3 This is another side view of the cross-toothed heat dissipation structure in the embodiment.
[0018] Figure label: 1. Substrate; 11. Base column; First heat dissipation space; 12. Intermediate column; 121. Second heat dissipation space; 2. Surface body; 21. Surface column; 211. Third heat dissipation space. Detailed Implementation
[0019] The following drawings disclose several embodiments of this application. For clarity, many practical details will be described in the following description. However, it should be understood that these practical details should not be used to limit this application. That is, in some embodiments of this application, these practical details are not essential. In addition, for the sake of simplicity, some conventional structures and components will be shown in the drawings in a simple schematic manner.
[0020] It should be noted that all directional indications in the embodiments of this application, such as up, down, left, right, front, back, etc., are only used to explain the relative positional relationship and movement of the components in a specific posture as shown in the attached figure. If the specific posture changes, the directional indication will also change accordingly.
[0021] Furthermore, the use of terms such as "first" and "second" in this application is for descriptive purposes only and does not specifically refer to any order or sequence, nor is it intended to limit this application. They are merely used to distinguish components or operations described using the same technical terms and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the technical solutions of various embodiments can be combined with each other, but only if they are feasible for those skilled in the art. If a combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed in this application.
[0022] To further understand the content, features, and effects of this application, the following embodiments are provided, and detailed descriptions are given in conjunction with the accompanying drawings.
[0023] Reference Figures 1-3 , Figure 1 This is a schematic diagram of the cross-tooth heat dissipation structure in the embodiment. Figure 2 This is a side view of the cross-toothed heat dissipation structure in the embodiment. Figure 3This is another side view of the cross-toothed heat dissipation structure in this embodiment. The cross-toothed heat dissipation structure in this embodiment includes a surface body 2 and a plurality of base bodies 1 arranged sequentially at intervals along the X-axis. Each base body 1 includes a base pillar 11 and a plurality of intermediate pillars 12 arranged sequentially at intervals along the Y-axis. One end of each of the intermediate pillars 12 is connected to the base pillar 11. A first heat dissipation space 111 is formed between two adjacent base pillars 11, and a second heat dissipation space 121 is formed between the plurality of intermediate pillars 12. The first heat dissipation space 111 and the second heat dissipation space 121 are connected. The surface body 2 includes a plurality of surface pillars 21 arranged sequentially at intervals along the Y-axis. Each surface pillar 21 is connected to the other end of one of the intermediate pillars 12 of the plurality of base bodies 1. A third heat dissipation space 211 is formed between two adjacent surface pillars 21, and the third heat dissipation space 211 is connected to the second heat dissipation space 121.
[0024] The cross-tooth heat dissipation structure of this embodiment is applied to high-power chips such as CPUs and GPUs that require heat dissipation. This embodiment is set in the heat dissipation area of the component to be dissipated. The bottoms of multiple base pillars 11 are in contact with the heat dissipation area. The heat in the heat dissipation area is transferred to the base pillars 11 and then sequentially to the intermediate pillars 12 and the surface pillars 21. By setting multiple base pillars 11, intermediate pillars 12 and surface pillars 21 at intervals, the heat dissipation surface area of the base pillars 11, intermediate pillars 12 and surface pillars 21 is increased, that is, it has a larger heat conduction cross-sectional area, which can significantly reduce thermal resistance. At the same time, by setting the first heat dissipation space 111, the second heat dissipation space 121 and the third heat dissipation space 211, and since the first heat dissipation space 111, the second heat dissipation space 121 and the third heat dissipation space 211 are interconnected, multi-directional heat conduction can be realized, so that heat can spread rapidly in multiple directions, further improving heat conduction and heat dissipation efficiency. Specifically, in this embodiment, the X-axis direction is the direction of the sequential connection of multiple base pillars 11, the Y-axis direction is the direction of the sequential connection of multiple surface pillars 21, and the X-axis direction is perpendicular to the Y-axis direction.
[0025] Rereference Figure 2Preferably, multiple base pillars 11 are arranged side-by-side along the X-axis to form a heat dissipation bottom surface; multiple surface pillars 21 are arranged side-by-side along the Y-axis to form a heat dissipation surface. Multiple intermediate pillars 12 are arranged in a matrix, and each intermediate pillar 12 is perpendicular to both the heat dissipation bottom surface and the heat dissipation surface. In specific applications, a first heat dissipation space 111 is formed between two adjacent base pillars 11, meaning the heat dissipation bottom surface has multiple spaced-apart first heat dissipation spaces 111. The multiple intermediate pillars 12 are arranged in a matrix, meaning each base pillar 11 surface has multiple intermediate pillars 12 arranged at intervals, and all the intermediate pillars 12 are arranged in a matrix. The gaps between the multiple intermediate pillars 12 together form a second heat dissipation space 121, which is connected to the first heat dissipation space 111. A third heat dissipation space 211 is formed between two adjacent surface pillars 21. That is, the heat dissipation surface has multiple third heat dissipation spaces 211 arranged side-by-side at intervals. The third heat dissipation space 211 is connected to the second heat dissipation space 121. It can be understood that in this embodiment, the multiple base pillars 11 are arranged in a crisscross pattern with the multiple surface pillars 21, allowing heat to diffuse rapidly in multiple directions, facilitating rapid heat transfer and improving heat dissipation efficiency. Specifically, the heat dissipation bottom surface and heat dissipation surface are square, circular, rectangular, or irregular in shape. In this embodiment, the heat dissipation bottom surface and heat dissipation surface are square, meaning that both the surface and bottom of the cross-toothed heat dissipation structure are square, suitable for heat dissipation areas in square regions. Of course, in other embodiments, the heat dissipation bottom surface and heat dissipation surface can also be circular, rectangular, or irregular in shape. The specific shape of the cross-toothed heat dissipation structure can be determined according to actual heat dissipation needs, broadening the application scenarios. No limitation is made here.
[0026] Rereference Figure 2 and Figure 3 Preferably, multiple base pillars 11 are arranged side-by-side at equal intervals along the X-axis, and multiple surface pillars 21 are arranged side-by-side at equal intervals along the Y-axis. In specific applications, the spacing between two adjacent base pillars 11, the spacing between two adjacent surface pillars 21, and the gap between two adjacent intermediate pillars 12 are all greater than 0.1 mm. This greater than 0.1 mm ensures that the gaps between two adjacent base pillars 11, two adjacent surface pillars 21, and two adjacent intermediate pillars 12 are not too small, meaning that the arrangement of adjacent base pillars 11, two adjacent surface pillars 21, and two adjacent intermediate pillars 12 is not too dense. This ensures that the volume of the three heat dissipation spaces is large enough for heat dissipation, improving heat dissipation efficiency. Of course, in other embodiments, the size of the gaps can be set according to actual heat dissipation requirements, and is not limited here.
[0027] Preferably, the base column 11, the intermediate column 12, and the surface column 21 are all provided with sealed heat dissipation cavities. In specific applications, the sealed heat dissipation cavities of the intermediate column 12, the base column 11, and the surface column 21 are connected and form heat dissipation channels containing heat dissipation liquid. In specific applications, when the heat dissipation area begins to generate heat, the heat is transferred to the base column 11. At this time, the heat can be transferred to the heat dissipation surface of the surface column 21 via the intermediate column 12 for heat dissipation, and can also be dissipated via the first heat dissipation space 111 and then by the second heat dissipation space 121 and the third heat dissipation space 211. Furthermore, when heat is transferred to the base column 11, the heat dissipation liquid in the sealed heat dissipation cavity of the base column 11 will evaporate into gas upon heating. After passing through the sealed heat dissipation cavity of the intermediate column 12, it will move to the sealed heat dissipation cavity of the surface column 21. After releasing heat in the sealed heat dissipation cavity of the surface column 21, it will liquefy back into liquid and flow back to the sealed heat dissipation cavity of the intermediate column 12 or the sealed heat dissipation cavity of the base column 11. This cycle achieves efficient heat dissipation. Moreover, since all the sealed heat dissipation cavities are interconnected and form heat dissipation channels, the liquid can flow back to the sealed heat dissipation cavity of the base column 11 from all directions, greatly improving the efficiency and reliability of liquid return. At the same time, multi-directional liquid return can also effectively reduce the resistance of the liquid during the return process, reduce the energy consumption required for liquid return, and further improve heat dissipation performance and service life. Specifically, the cross-sectional width of the base column 11, the cross-sectional width of the intermediate column 12, and the cross-sectional width of the surface column 21 are all greater than 0.1 mm, thus ensuring the volume of the sealed heat dissipation cavity, which can accommodate more heat dissipation liquid and further improve heat dissipation efficiency. Of course, in other embodiments, the size of the gap can be set according to the actual heat dissipation requirements, and is not limited here.
[0028] Rereference Figure 1 Preferably, the base pillar 11, intermediate pillar 12, and surface pillar 21 are integrally formed. This integrally formed structure further enhances the structural strength of the cross-toothed heat dissipation structure. In specific applications, the base pillar 11, intermediate pillar 12, and surface pillar 21 are all made of thermally conductive metal materials, such as copper, aluminum, and stainless steel, improving heat dissipation efficiency while minimizing manufacturing costs. The specific choice can be made according to actual usage requirements, which will not be elaborated further here.
[0029] In summary, the arrangement of multiple spaced-apart base pillars 11, intermediate pillars 12, and surface pillars 21 increases their heat dissipation surface area, resulting in a larger heat conduction cross-sectional area and significantly reduced thermal resistance. Furthermore, the interconnectedness of the first, second, and third heat dissipation spaces 111, 121, and 211 enables multi-directional heat conduction, allowing heat to diffuse rapidly in multiple directions and further improving heat conduction and dissipation efficiency. Additionally, each of the base pillars 11, intermediate pillars 12, and surface pillars 21 contains a sealed heat dissipation cavity filled with a cooling liquid, allowing for further enhancement of heat dissipation efficiency through the interconversion of liquid and gas phases.
[0030] The above description is merely an embodiment of this application and is not intended to limit the scope of this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the scope of the claims of this application.
Claims
1. A cross-toothed heat dissipation structure, characterized in that, include: A plurality of substrates (1) are arranged at intervals along the X-axis. Each substrate (1) includes a base pillar (11) and a plurality of intermediate pillars (12) arranged at intervals along the Y-axis. One end of each of the intermediate pillars (12) is connected to the base pillar (11). A first heat dissipation space (111) is formed between two adjacent base pillars (11), and a second heat dissipation space (121) is formed between the plurality of intermediate pillars (12). The first heat dissipation space (111) and the second heat dissipation space (121) are connected. The surface body (2) includes a plurality of surface pillars (21) arranged sequentially at intervals along the Y-axis. Each surface pillar (21) is connected to the other end of one of the intermediate pillars (12) of the plurality of substrates (1). A third heat dissipation space (211) is provided between two adjacent surface pillars (211), and the third heat dissipation space (211) is connected to the second heat dissipation space (121).
2. The cross-tooth heat dissipation structure according to claim 1, characterized in that, Multiple base pillars (11) are arranged side by side along the X-axis and form a heat dissipation bottom surface; multiple surface pillars (21) are arranged side by side along the Y-axis and form a heat dissipation surface; multiple intermediate pillars (12) are arranged in a matrix and are perpendicular to the heat dissipation bottom surface and the heat dissipation surface.
3. The cross-tooth heat dissipation structure according to claim 2, characterized in that, The multiple base columns (11) are arranged side by side at equal intervals along the X-axis, and the multiple surface columns (21) are arranged side by side at equal intervals along the Y-axis.
4. The cross-tooth heat dissipation structure according to claim 2, characterized in that, The heat dissipation bottom surface and the heat dissipation surface are square, circular, rectangular or irregular in shape.
5. The cross-tooth heat dissipation structure according to claim 1, characterized in that, The base column (11), the intermediate column (12), and the surface column (21) are all provided with sealed heat dissipation cavities.
6. The cross-tooth heat dissipation structure according to claim 5, characterized in that, The sealed heat dissipation cavity of the intermediate column (12), the sealed heat dissipation cavity of the base column (11), and the sealed heat dissipation cavity of the surface column (21) are connected and form a heat dissipation channel, which contains heat dissipation liquid.
7. The cross-tooth heat dissipation structure according to claim 1, characterized in that, The spacing between two adjacent base pillars (11), the spacing between two adjacent surface pillars (21), and the gap between two adjacent intermediate pillars (12) are all greater than 0.1 mm.
8. The cross-tooth heat dissipation structure according to claim 1, characterized in that, The cross-sectional width of the base column (11), the cross-sectional width of the intermediate column (12), and the cross-sectional width of the surface column (21) are all greater than 0.1 mm.
9. The cross-tooth heat dissipation structure according to claim 1, characterized in that, The base column (11), the intermediate column (12), and the surface column (21) are integrally formed.
10. The cross-tooth heat dissipation structure according to claim 1, characterized in that, The base pillar (11), the intermediate pillar (12), and the surface pillar (21) are all made of thermally conductive metallic materials.