A heat dissipation device and a domain controller

Abstract

A heat dissipation device and a domain controller are disclosed. The heat dissipation device includes a heat sink housing, a base, and a first support member and a second support member disposed on the base. The first support member has a first connection hole. A circuit board assembly is movably connected to the first support member via a first adjusting member and the first connection hole, and a chip is disposed on the circuit board assembly facing the base. The circuit board assembly is movably connected to the second support member. A heat-conducting member is disposed between the base and the chip, and abuts against the chip. The first adjusting member can be rotated to change its height within the first connection hole, thereby adjusting the bending state of the circuit board assembly facing the heat sink housing. By adjusting the position of the circuit board assembly within the first connection hole through rotation of the first adjusting member, the bending state of the circuit board assembly can be adjusted, thereby improving the heat dissipation efficiency of the heat dissipation device.

Description

Technical Field

[0001] This disclosure relates to the field of heat dissipation technology, and in particular to a heat dissipation device and a domain controller. Background Technology

[0002] With the rapid development of intelligent driving, the performance of chips in automotive domain controllers is constantly improving. At the same time, the power consumption of these chips is also increasing, leading to greater heat generation during operation. Domain controllers typically include heat dissipation components to transfer the heat generated by the chips to the outside of the controller for cooling.

[0003] However, during the operation of the vehicle domain controller, if the heat dissipation efficiency of the heat dissipation components on the chip decreases, it can easily lead to a decrease in the chip's computing performance, or even cause the chip to malfunction. Utility Model Content

[0004] To address the aforementioned technical problems, this disclosure provides a heat dissipation device and a domain controller that can continuously reduce the gap between the chip and the heat-conducting component, thereby reducing the thickness of the heat-conducting medium and improving the heat dissipation efficiency of the chip.

[0005] The first aspect of this disclosure provides a heat dissipation device, comprising:

[0006] The heat dissipation housing includes a base and a first support member and a second support member disposed on the base, wherein the first support member is provided with a first connection hole;

[0007] A circuit board assembly is movably connected to a first support member via a first adjusting member and a first connecting hole; the circuit board assembly has a chip facing the base; the circuit board assembly is movably connected to the second support member.

[0008] A heat-conducting component is placed between the base and the chip, and the heat-conducting component abuts against the chip.

[0009] The first adjusting member can be rotated to change its height within the first connecting hole, thereby adjusting the bending state of the circuit board assembly toward the heat sink housing.

[0010] In some examples, the circuit board assembly includes a circuit board and a bracket;

[0011] The chip and the bracket are located on opposite sides of the circuit board;

[0012] One end of the first adjusting member abuts against the bracket, and the other end of the first adjusting member passes through the bracket and the circuit board, and is rotatably connected to one end of the first supporting member through the first connecting hole.

[0013] In some examples, the second support member is provided with a second connecting hole;

[0014] The circuit board abuts against the second support member through the second adjusting member and the second connecting hole.

[0015] In some examples, one end of the second adjustment member abuts against the circuit board, and the other end of the second adjustment member passes through the circuit board and is rotatably connected to one end of the second support member through the second connecting hole.

[0016] In some examples, the second support and the first support are located on the same side of the base, and the height of the second support is greater than the height of the first support.

[0017] In some examples, when the circuit board is in a non-bent state, there is a first gap between the first support and the circuit board, the height of which is the height difference between the second support and the first support. The first gap is used to provide space for the circuit board to bend.

[0018] In some examples, when the circuit board assembly is in a non-bent state, the end of the first adjustment member located within the first connection hole has a second gap with the bottom of the first connection hole, the second gap being greater than or equal to the first gap.

[0019] In some examples, a thermally conductive medium layer is also included;

[0020] A thermally conductive medium layer is placed between the thermally conductive component and the chip;

[0021] The thermally conductive component contacts the chip through a thermally conductive medium layer.

[0022] In some examples, the first adjustment element is a self-tapping screw.

[0023] A second aspect of this disclosure provides a domain controller, comprising:

[0024] The heat dissipation device is provided in the first aspect of this disclosure.

[0025] The heat dissipation device and domain controller disclosed herein include a heat sink housing, which comprises a base and a first support member and a second support member disposed on the base. The first support member supports a circuit board assembly, and a heat-conducting component is disposed between the base and the circuit board assembly. The first support member has a first connecting hole, allowing the circuit board assembly to be movably connected to the first support member via a first adjusting member and the first connecting hole. The circuit board assembly has a chip disposed thereon and is movably connected to the second support member. The first adjusting member can be rotated to change its length within the first connecting hole, thereby adjusting the distance between the circuit board assembly and the heat sink housing. Therefore, by adjusting the first adjusting member to increase its length within the first connecting hole, the distance between the circuit board assembly and the first support member is tightened, causing the outer region of the circuit board assembly to bend away from the base with the second support member at its support position on the circuit board assembly as a fulcrum, while the middle region of the circuit board assembly moves closer to the heat-conducting component on the base. This results in the chip on the circuit board assembly being in close contact with the heat-conducting component, reducing the gap between the heat-conducting component and the chip, and improving the heat dissipation efficiency of the heat-conducting component for the chip. Attached Figure Description

[0026] Figure 1 An exploded cross-sectional view of a heat dissipation device provided for some examples of this disclosure;

[0027] Figure 2 A first example assembly cross-sectional view of a heat dissipation device provided for some examples of this disclosure;

[0028] Figure 3 A second example assembly cross-sectional view of a heat dissipation device provided for some examples of this disclosure;

[0029] Figure 4 Another exploded cross-sectional view of a heat dissipation device provided for some examples of this disclosure;

[0030] Figure 5 A cross-sectional view of an assembly of a third example of a heat dissipation device provided for some examples of this disclosure;

[0031] Figure 6 A schematic diagram of the area distribution of a heat dissipation device provided for some examples of this disclosure;

[0032] Figure 7 A fourth example assembly cross-sectional view of a heat dissipation device provided for some examples of this disclosure;

[0033] Figure 8 A partially enlarged view of the first gap of a heat dissipation device provided for some examples of this disclosure;

[0034] Figure 9 A partially enlarged view of the second gap of a heat dissipation device provided for some examples of this disclosure;

[0035] Figure 10 Cross-sectional structural diagrams of the first adjusting member provided for some examples of this disclosure;

[0036] Figure 11 Side and top views of a first adjusting member provided for some examples of this disclosure;

[0037] Figure 12 A first example assembly evolution diagram of an assembled heat dissipation device provided for some examples of this disclosure;

[0038] Figure 13 This disclosure provides a first example flowchart for assembling a heat dissipation device;

[0039] Figure 14 A second example assembly evolution diagram of the heat dissipation device provided for some examples of this disclosure;

[0040] Figure 15 A second example flowchart for assembling a heat dissipation device is provided for some examples of this disclosure.

[0041] Reference numerals: 100-Heat dissipation housing; 110-Base; 120-First support member; 121-First connection hole; 130-Second support member; 131-Second connection hole; 200-Circuit board assembly; 210-Circuit board; 220-Bracket; 300-First adjusting member; 400-Chip; 500-Heat conductive member; 600-Second adjusting member; 700-Heat conductive medium layer;

[0042] A - First gap; B - Second gap;

[0043] C1 - Middle area of ​​the circuit board; C2 - Outer area of ​​the circuit board. Detailed Implementation

[0044] To explain this disclosure, exemplary embodiments of the disclosure will now be described in detail with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the disclosure, and not all of them. It should be understood that the disclosure is not limited to exemplary embodiments.

[0045] To enable those skilled in the art to better understand the technical solutions in this disclosure, the technical solutions in the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this disclosure, and not all embodiments. Based on the embodiments in this disclosure, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of this disclosure.

[0046] It should be noted that many specific details are set forth in the following description in order to provide a full understanding of this disclosure. However, this disclosure may also be implemented in other ways different from those described herein. Therefore, the scope of protection of this disclosure is not limited to the specific embodiments disclosed below.

[0047] In the description of this disclosure, it should be understood that the terms "upper," "lower," "horizontal," "bottom," "inner," and "outer" (if any) indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are used only for the convenience of describing this disclosure and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this disclosure. In this disclosure, unless otherwise expressly specified and limited, the first feature being "upper" or "lower" than the second feature may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium.

[0048] In this disclosure, unless otherwise expressly specified and limited, the terms "connected," "linked," and "fixed," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral unit; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. However, specifying a direct connection indicates that the two entities connected are not linked by a transitional structure, but are connected solely by a connecting structure to form a whole. Those skilled in the art can understand the specific meaning of the above terms in this disclosure according to the specific circumstances.

[0049] In this disclosure, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features.

[0050] In the field of intelligent driving, the domain controller is the core computing hub of the intelligent driving system. The domain controller can be integrated into a closed space such as behind the vehicle's dashboard, below the center console, or in the cavity under the seat. It is responsible for processing multi-source heterogeneous data (including environmental perception signals from cameras, radar, and lidar) in real time, as well as executing path planning and decision control algorithms.

[0051] The domain controller contains an onboard chip that processes artificial intelligence tasks triggered during vehicle operation, such as autonomous driving, environmental perception, voice interaction, and decision control, thereby enabling the management and control of the entire vehicle system.

[0052] With the rapid development of intelligent driving, automotive chips are performing more and more functions, and correspondingly, the computing power requirements of these chips are also increasing. However, the increase in computing power leads to an increase in the power consumption of automotive chips, resulting in more heat being generated during operation.

[0053] Because the domain controller is located in a confined space inside the vehicle, the heat generated by the on-board chip during operation will accumulate in the confined space, causing the domain controller temperature to rise continuously and affecting the operating performance of the on-board chip.

[0054] To address this, the domain controller can use heat dissipation components to transfer the heat generated by the onboard chip to the outside of the domain controller. These components can directly contact the onboard chip or through other media to receive the heat generated and then transfer it to the outside of the domain controller using appropriate cooling methods, such as water cooling, thus creating heat flow and reducing chip performance issues caused by heat buildup.

[0055] Currently, during the operation of the vehicle domain controller, the heat transfer efficiency of the heat dissipation components decreases, affecting the heat dissipation effect of the vehicle chip.

[0056] Figure 1 An exploded cross-sectional view of a heat dissipation device provided for some examples of this disclosure. Figure 2 A first example assembly cross-sectional view of a heat dissipation device provided for some examples of this disclosure.

[0057] Reference Figure 1 and Figure 2 As shown, in some examples, the heat dissipation device includes a heat sink housing 100, which includes a base 110 and a first support member 120 and a second support member 130 disposed on the base. The first support member 120 is provided with a first connection hole 121. The heat dissipation device includes a circuit board assembly 200, which is movably connected to the first support member 120 via a first adjusting member 300 and the first connection hole 121, and is movably connected to the second support member 130. A chip 400 is disposed on the circuit board assembly 200 facing the base 110. The heat dissipation device includes a heat-conducting member 500, which is disposed between the base 110 and the chip 400, and abuts against the chip 400. The first adjusting member 300 can be rotated to change its length within the first connection hole 121, thereby adjusting the bending state of the circuit board assembly 200 toward the heat sink housing 100.

[0058] In some examples, one end of the first support 120 is connected to the base 110, and multiple first supports 120 are connected to the base 110 as a single unit. The base 110 can support other components in the heat dissipation device and provide space to accommodate these components.

[0059] The base 110 has an internal cavity containing a liquid cooling pipe filled with coolant. The coolant can absorb the heat transferred from the chip 400 to the base 110 via the heat-conducting component 500, and transfer the absorbed heat to the outside of the heat dissipation device by flowing in the cooling pipe.

[0060] In some examples, the base 110 may be provided with multiple first support members 120 and multiple second support members 130, which are used to support the circuit board assembly 200, respectively. The first support members 120 and the second support members 130 can be cylindrical structures, such as cylindrical structures or cuboid structures, so that they can contact the circuit board assembly 200 through the cross-section of the cylindrical structure, thereby increasing the contact area between the first support members 120 and the second support members 130 and the circuit board assembly 200 and improving the stability of supporting the circuit board assembly 200.

[0061] The multiple first support members 120 can be spaced at a fixed distance to form a non-enclosed isolation space to accommodate the chip 400 and the heat-conducting component 500. The first support members 120 can be disposed on the outer periphery of the chip 400 and the heat-conducting component 500.

[0062] In some examples, a first connecting hole 121 may be provided at one end of the first support member 120. The first connecting hole 121 may be located along the axial direction of the first support member 120, and may be a through hole or a non-through hole. The first adjusting member 300 can movably connect the circuit board assembly 200 to the first support member 120 through the first connecting hole 121. Thus, by adjusting the length of the first adjusting member 300 within the first connecting hole 121, the connection state between the circuit board assembly 200 and the first support member 120 can be adjusted. For example, by increasing the length of the first adjusting member 300 within the first connecting hole 121, the circuit board assembly 200 can be brought into contact with the first support member 120; by decreasing the length of the first adjusting member 300 within the first connecting hole 121, the circuit board assembly 200 can be separated from the first support member 120.

[0063] The circuit board assembly 200 can serve as a circuit integration system in a domain controller. The circuit board assembly 200 may also include, but is not limited to, devices such as power supplies, networks, and peripheral connectors (such as camera connectors, radar connectors, etc.), which are not limited in this disclosure example.

[0064] In some examples, the circuit board assembly 200 may be provided with positioning holes for assembly positioning. The circuit board assembly 200 can be assembled and positioned by the positioning holes and the first connecting holes 121 provided on the first support member 120. For example, the circuit board assembly 200 can be assembled onto the first support member 120 by aligning the axis of the positioning hole with the axis of the first connecting hole, thereby improving assembly accuracy and reducing assembly errors.

[0065] Chip 400 is the main heat source in the heat dissipation device. A heat-conducting component 500 is disposed within the space formed by the heat dissipation housing 100 and the circuit board assembly 200. The heat-conducting component 500 abuts against chip 400 and can absorb and transfer the heat generated by chip 400 during operation. It is understood that, in this disclosure, the contact relationship between the heat-conducting component 500 and chip 400 can be direct contact or indirect contact through other media or mediums.

[0066] In some examples, the heat conductor 500 is a copper plate, with one side of the heat conductor 500 attached to the base 110 and the other side of the heat conductor 500 abutting against the chip 400. The heat conductor 500 can absorb the heat generated by the chip 400 and transfer the heat to the base 110, where it is absorbed by the coolant in the receiving cavity within the base 110.

[0067] Figure 3 A second example assembly cross-sectional view of a heat dissipation device provided for some examples of this disclosure. See also Figure 3 To improve the heat dissipation efficiency of chip 400, the first adjusting member 300 can be rotated to adjust its length at the first connecting hole 121, thereby increasing the pressure applied by the first adjusting member 300 to the circuit board assembly 200, so that the circuit board assembly 200 generates a heat dissipation efficiency similar to that of chip 400. Figure 3 The bend shown. See also Figure 3 In some examples, the second support 130 is used to support the circuit board assembly 200. The first adjusting member 300 is rotated to increase its length within the first connecting hole 121, thereby pressing the circuit board assembly 200 and shortening the distance between the circuit board assembly 200 and the first support 120. This causes the peripheral area of ​​the circuit board assembly 200 to bend away from the base 110, with the support position of the second support 130 as a fulcrum, while the middle area of ​​the circuit board assembly 200 moves closer to the heat-conducting element 500 on the base 110. This results in the chip 400 located on the circuit board assembly 200 being in close contact with the heat-conducting element 500, increasing the tightness of the contact between the heat-conducting element 500 and the chip 400, and improving the heat dissipation efficiency of the heat-conducting element 500 for the chip 400.

[0068] In some examples, the first adjusting member 300 may include fastening structures such as screws and pins. Correspondingly, the first connecting hole 121 may be a through hole structure adapted to the fastening structure. The first adjusting member 300 can change the distance between the circuit board assembly 200 and the first support member 120 by rotating, thereby improving the tightness of the fit between the chip 400 and the heat-conducting member 500 and improving the heat dissipation efficiency.

[0069] In the heat dissipation device provided in this embodiment, the circuit board assembly 200 is movably connected to the first support member 120 through the mechanical cooperation between the first adjusting member 300 and the first connecting hole 121 of the first support member 120. The length of the first adjusting member 300 located in the first connecting hole 121 can be adjusted by rotation, thereby changing the pressure applied by the first adjusting member 300 to the circuit board assembly 200. This allows the circuit board assembly 200 to bend with the support position of the second support member 130 as the fulcrum, thereby adjusting the bending state of the circuit board assembly 200 toward the heat dissipation housing 100. This allows the chip 400 to fit tightly against the heat conductor when the circuit board assembly 200 is in a bent state, thereby improving the heat dissipation efficiency of the chip 400.

[0070] Figure 4 Another exploded cross-sectional view of a heat dissipation device provided for some examples of this disclosure. Figure 5 A cross-sectional view of an assembly of a third example of a heat dissipation device provided for some examples of this disclosure. See also Figure 4 and Figure 5 In some examples, the circuit board assembly 200 may include a circuit board 210 and a bracket 220, with the chip 400 and the bracket 220 disposed on opposite sides of the circuit board 210. One end of the first adjusting member 300 abuts against the bracket 220, and the other end of the first adjusting member 300 passes through the bracket 220 and the circuit board 210, and is rotatably connected to one end of the first support member 120 through the first connecting hole 121.

[0071] The first adjusting member 300 is used to pass through the circuit board assembly 200 and movably connect the circuit board assembly 200 to the first support member 120. By rotating the first adjusting member 300, the length of the first adjusting member 300 located in the first connecting hole 121 can be adjusted, thereby adjusting the bending state of the circuit board assembly 200 toward the heat sink 100, further improving the pressure between the chip 400 on the circuit board assembly 200 and the heat sink 100, and increasing the heat dissipation efficiency.

[0072] The pressure applied to the circuit board assembly 200 by the first adjusting member 300 is transmitted to the circuit board 210 through the bracket 220, so that the circuit board 210 bends and the bonding tightness between the chip 400 and the heat-conducting member 500 located on the circuit board 210 is improved.

[0073] Meanwhile, the bracket 220 also provides structural support for the circuit board assembly 200, improving the structural strength of the circuit board assembly 200, thereby preventing the circuit board 210 from being damaged due to excessive deformation when bent.

[0074] In some examples, when the distance between the circuit board 210 and the first support member 120 is adjusted by rotating the first adjustment member 300, the bracket 220 and the circuit board 210 are in contact with each other in the projection area of ​​the bracket 220 and are in a non-bent state. The circuit board 210 located outside the projection area of ​​the bracket 220 will bend with the support position of the second support member 130 on the circuit board assembly 200 as the fulcrum when the distance between the circuit board 210 and the first support member 120 is shortened. In this way, the circuit board 210, the chip 400 and the heat conduction member 500 located in the projection area of ​​the bracket 220 are all tightly connected in a planar contact manner, which can improve the heat dissipation efficiency between the chip 400 and the heat conduction member 500.

[0075] One end of the first adjusting member 300 can abut against the bracket 220 in the circuit board assembly 200. The other end of the first adjusting member 300 can pass through the positioning hole provided on the circuit board assembly 200, pass through the bracket 220 and the circuit board 210 in sequence, and be movably connected to one end of the first support member 120 through the first connecting hole 121.

[0076] When the other end of the first adjusting member 300 is rotatably connected to the first connecting hole 121, the end of the first adjusting member 300 that abuts against the bracket 220 applies pressure to the bracket 220 in the direction of the heat-conducting member 500. By rotating the first adjusting member 300, the length of the first adjusting member 300 within the first connecting hole 121 can be changed, thereby adjusting the amount of pressure applied by the first adjusting member 300 to the bracket 220. The greater the length of the first adjusting member 300 within the first connecting hole 121, the greater the pressure applied by the first adjusting member 300 to the circuit board assembly 200.

[0077] Figure 6 This is a schematic diagram illustrating the zonal distribution of a heat dissipation device, providing some examples of this disclosure. See also... Figure 6 Region C1 is the middle region of circuit board 210, that is, the circuit board 210 region located within the projection area of ​​bracket 220. Region C2 is the outer region of circuit board 210, that is, the circuit board 210 region located outside the projection area of ​​bracket 220. Under the pressure transmitted by bracket 220, circuit board 210 bends at the boundary between the projection area and the non-projection area.

[0078] When the pressure exerted on the circuit board assembly 200 by the first adjusting member 300 exceeds the critical deformation value of the circuit board assembly 200, the circuit board 210 in the circuit board assembly 200 will bend with the support position of the second support member 130 on the circuit board 210 as the fulcrum. Based on the direction of pressure application, the middle region of the circuit board 210 will move closer to the heat sink housing 100. At the same time, the chip 400 located in the middle region of the circuit board 210 will be tightly attached to the heat conductor 500 to reduce the gap between the chip 400 and the heat conductor 500 caused by assembly tolerances, so that the chip 400 can be tightly attached to the heat conductor 500, thereby improving the heat dissipation efficiency of the heat conductor 500 on the chip 400.

[0079] In some examples, the length of the first adjusting member 300 located within the first connecting hole 121 can be adjusted by changing the direction of rotation. For example, when the first adjusting member 300 rotates along the first direction, the portion of the first adjusting member 300 located within the first connecting hole 121 gradually screws into the first connecting hole 121, thereby reducing the height of the heat dissipation device in the thickness direction. At the same time, the pressure of the first adjusting member 300 on the circuit board assembly 200 increases, causing the circuit board 210 of the circuit board assembly 200 to bend towards the heat dissipation housing 100 with the support position of the second support member 130 on the circuit board 210 as the fulcrum, thereby increasing the tightness of the fit between the chip 400 and the heat-conducting member 500.

[0080] In some examples, the circuit board 210 and the bracket 220 have a certain degree of elasticity when in a bent state. When the first adjusting member 300 rotates along the second direction, the portion of the first adjusting member 300 located inside the first connecting hole 121 rotates out of the first connecting hole 121, the heat dissipation device increases in height in the thickness direction, the pressure applied by the first adjusting member 300 to the circuit board assembly 200 decreases, and the peripheral area of ​​the circuit board 210 can return to a non-bent state under the action of its own elasticity.

[0081] It should be noted that the first direction and the second direction can be clockwise and counterclockwise, respectively. The first direction and the second direction are opposite directions of rotation; for example, if the first direction is clockwise, then the second direction is counterclockwise, and vice versa. This disclosure allows for the determination of the rotation directions of the first and second directions based on the actual application requirements of the heat dissipation device.

[0082] The first adjusting component 300 can adjust the pressure applied to the bracket 220 by adjusting the rotation direction, thereby adapting to the heat dissipation contact pressure requirements under different working conditions and ensuring the stability and reliability of the heat dissipation effect.

[0083] In the heat dissipation device provided in this embodiment, the circuit board assembly 200 includes a circuit board 210 and a bracket 220. When the bending state of the circuit board assembly 200 is adjusted by rotating the first adjusting member 300, the bracket 220 can transmit the pressure applied by the first adjusting member 300 to the bracket 220 to the circuit board 210, so that the circuit board 210 is subjected to force and bends with the support position of the second supporting member 130 on the circuit board 210 as the fulcrum, thereby improving the efficiency of adjusting the bending state of the circuit board assembly 200.

[0084] Continue reading Figure 4 In some examples, the second support member 130 is provided with a second connection hole 131, and the circuit board 210 abuts against the second support member 130 through the second adjustment member 600 and the second connection hole 131.

[0085] The second adjusting member 600 extends through the circuit board 210, movably connecting the circuit board assembly 200 to the second support member 130. Thus, by adjusting the length of the second adjusting member 600 within the second connecting hole 131, the connection state between the circuit board 210 and the second support member 130 can be adjusted. For example, by increasing the length of the second adjusting member 600 within the second connecting hole 131, the circuit board 210 can be brought into contact with the second support member 130; by decreasing the length of the second adjusting member 600 within the second connecting hole 131, the circuit board 210 can be separated from the second support member 130.

[0086] The second connecting hole 131 in the second support member 130 can be set along the axial direction of the second support member 130. The second connecting hole 131 can be a through hole or a non-through hole.

[0087] In some examples, the second adjustment member 600 can be rotatably connected to the second connection hole 131 through the preset mounting hole of the circuit board 210 to limit the horizontal displacement of the circuit board 210 and prevent vibration generated during vehicle operation from causing loosening or misalignment between the circuit board assembly 200 and the heat sink housing 100.

[0088] In some examples, the tightness between the circuit board 210 and the second support member 130 is adjusted by rotating the second adjusting member 600 to adjust its length at the second connecting hole 131. When the length of the second adjusting member 600 at the second connecting hole 131 increases, the pressure applied by the second adjusting member 600 on the peripheral area of ​​the circuit board 210 increases, thus improving the tightness between the circuit board 210 and the second support member 130. Conversely, when the length of the second adjusting member 600 at the second connecting hole 131 decreases, the pressure applied by the second adjusting member 600 on the peripheral area of ​​the circuit board 210 decreases.

[0089] The rotation direction of the second adjusting member 600 and the method of adjusting its length within the second connecting hole 131 by rotation can be referred to the rotation direction of the first adjusting member 300 and the method of adjusting its length within the first connecting hole 121 by rotation, and will not be elaborated here.

[0090] In the heat dissipation device provided in this embodiment, the peripheral area of ​​the circuit board 210 is fixed to the second support member 130 via the second connecting hole 131 provided between the second adjusting member 600 and the second support member 130, so that the second support member 130 can provide support force to the peripheral area of ​​the circuit board assembly 200. At the same time, the support force provided by the second support member 130 can also cooperate with the pressure adjustment applied by the first adjusting member 300 to the bracket 220, further improving the stability of the circuit board assembly 200 installation.

[0091] In some examples, one end of the second adjustment member 600 abuts against the circuit board 210, and the other end of the second adjustment member 600 passes through the circuit board 210 and is rotatably connected to one end of the second support member 130 through the second connection hole 131.

[0092] The end of the second adjusting member 600 that abuts against the circuit board 210 will apply pressure to the circuit board 210 in the direction of the heat sink housing 100 through contact with the circuit board 210, so that the circuit board 210 is fixed on the top of the second support member 130.

[0093] By rotating the second adjusting member 600, the length of the other end of the second adjusting member 600 located in the second connecting hole 131 is adjusted, thereby realizing the pressure adjustment of the outer area of ​​the circuit board 210.

[0094] Figure 7 A fourth example assembly cross-sectional view of a heat dissipation device provided for some examples of this disclosure. See also Figure 7 In some examples, when the circuit board 210 is fixed to the second support 130, the first adjustment member 300 can apply pressure to the circuit board assembly 200 in the direction toward the heat sink housing 100 to create a height difference between the middle region and the outer region of the circuit board 210, thereby causing the circuit board assembly 200 to be bent.

[0095] In the heat dissipation device provided in this embodiment, one end of the second support member 130 and the second adjusting member 600 abuts against the circuit board 210, and the other end of the second adjusting member 600 passes through the circuit board 210 and is rotatably connected to the second connecting hole 131. By rotating, the length of the second adjusting member 600 in the second connecting hole 131 is changed, thereby driving the circuit board 210 to fit tightly against the second support member 130 through the other end of the second adjusting member 600, so as to fix the circuit board 210 on the second support member 130 and improve the tightness of the fit between the circuit board 210 and the second support member 130.

[0096] In some examples, the second support 130 and the first support 120 are located on the same side of the base 110, and the height of the second support 130 is greater than the height of the first support 120.

[0097] When the first adjusting member 300 applies pressure to the circuit board assembly 200, the circuit board assembly 200 can bend with the second support member 130 as the fulcrum, thereby increasing the contact area between the chip 400 and the heat-conducting member 500 disposed on the circuit board assembly 200 and improving the heat dissipation efficiency.

[0098] In the heat dissipation device provided in this embodiment, since the height of the second support member 130 is higher than that of the first support member 120, when the circuit board assembly 200 is in a bent state, the second support member 130 can bear most of the weight of the circuit board assembly 200 (circuit board 210 and bracket 220). Furthermore, through the cooperation between the second adjusting member 600 and the second support member 130, it can be ensured that the tight fit between the circuit board assembly 200 and the second support member 130 will not change due to factors such as vehicle vibration or bumps during long-term use.

[0099] Figure 8 A partially enlarged view of the first gap of a heat dissipation device provided for some examples of this disclosure. See also Figure 8 In some examples, when the circuit board 210 is in a non-bent state, there is a first gap A between the first support 120 and the circuit board 210. The height of the first gap A is the height difference between the second support 130 and the first support 120, and the first gap A is used to provide space for the circuit board 210 to bend.

[0100] When the circuit board 210 is in a non-bent state, since the height of the second support member 130 is greater than the height of the first support member 120, the circuit board 210 will first contact the second support member 130 and maintain a distance of the first gap A from the first support member 120.

[0101] In some examples, when the first adjusting member 300 increases the length of the first connecting hole 121 by rotation, it will apply pressure to the circuit board assembly 200. During the process of being stressed, the circuit board 210 will bend with the support position of the second support member 130 as the fulcrum. At this time, the first gap A will gradually shrink as the degree of bending of the circuit board 210 increases until the circuit board 210 abuts against the first support member 120, forming a stable bending support structure. This allows the chip 400 to maintain a tight and good contact with the heat-conducting member 500, thereby improving the heat transfer efficiency of the chip 400.

[0102] In some examples, the height of the first gap A can be controlled by pre-setting the height parameters of the second support member and the first support member.

[0103] In some examples, based on different application scenarios of the heat dissipation device, different combinations of the heights of the first support 120 and the second support 130 can be selected to adjust the height of the first gap A in each application scenario.

[0104] In some examples, the first support member 120 and the second support member 130 can also be extended away from the base 110 to dynamically adjust the relative height of the first support member 120 and the second support member 130, thereby adjusting the height of the first gap A. For example, while keeping the first support member 120 unchanged, the relative height of the second support member 130 can be increased by extending the second support member 130, thereby increasing the height of the first gap A. As another example, while keeping the second support member 120 unchanged, the relative height of the first support member 120 can be decreased by shortening the first support member 130, thereby increasing the height of the first gap A.

[0105] It should be noted that the method for reducing the first gap A can refer to the execution process in the above example, and will not be repeated here. In addition, in some examples, the height of the first gap A can also be adjusted by adjusting the relative height of the first support member 120 and the second support member 130. However, it is necessary to ensure that the height of the first support member 120 is always lower than the height of the second support member 130.

[0106] In the heat dissipation device provided in this embodiment, the first gap A provides space for the circuit board assembly 200 to bend, allowing the circuit board assembly 200 to bend within the first gap A, forming a stable bending support structure, and enabling the chip 400 to form a good contact state with the heat-conducting component 500, thereby improving heat dissipation efficiency.

[0107] Figure 9 A partially enlarged view of the second gap of a heat dissipation device provided for some examples of this disclosure. See also Figure 9In some examples, when the circuit board assembly 200 is in a non-bent state, the end of the first adjustment member 300 located in the first connection hole 121 has a second gap B with the bottom of the first connection hole 121, and the second gap B may be greater than or equal to the first gap A.

[0108] The second gap B provides space for the first adjusting member 300 to enter the first connecting hole 121 when the circuit board assembly 200 changes from a non-bent state to a bent state. When the circuit board assembly 200 is in a non-bent state and the first adjusting member 300 continues to rotate, the length of the first adjusting member 300 in the first connecting hole 121 increases, and part of the first adjusting member 300 is located in the second gap B. At this time, the second gap B will decrease as the length of the first adjusting member 300 in the first connecting hole 121 increases, until the first adjusting member 300 is completely located in the first connecting hole 121.

[0109] In some instances, the height corresponding to the bottom of the second gap B may be less than the maximum height to which the first adjusting member 300 can enter the first connecting hole 121. The maximum height is the height to which the first adjusting member 300 is screwed into the first connecting hole 121 when the circuit board assembly 200 can withstand the maximum pressure applied by the first adjusting member 300.

[0110] In the heat dissipation device provided in this embodiment, the second gap B provides sufficient space for the first adjusting member 300 to screw into the first connecting hole 121, allowing the first adjusting member 300 to smoothly enter the first connecting hole 121 when adjusting the bending state of the circuit board assembly 200 within the first gap A. By adjusting the setting range of the second gap B, the bending adjustment accuracy of the circuit board assembly 200 can be improved, enabling the circuit board assembly 200 to increase the contact area between the chip 400 and the heat-conducting component 500 through precise bending, thereby improving heat dissipation efficiency.

[0111] See you again Figures 4 to 7 The heat dissipation device also includes a thermally conductive medium layer 700, which is disposed between the thermally conductive component 500 and the chip 400. The thermally conductive component 500 abuts against the chip 400 through the thermally conductive medium layer 700.

[0112] The thermally conductive layer 700 can be made of a material with high thermal conductivity, such as thermal grease, thermal gel, or thermal pads. Based on the high thermal conductivity of the thermally conductive layer 700, the heat transfer between the chip 400 and the thermally conductive component 500 can be improved.

[0113] In some examples, the thermal conductive element 500 abuts against the chip 400 through the thermal conductive medium layer 700. By abutting contact, the thermal conductive medium layer 700 fills the gap between the chip 400 and the thermal conductive element 500 caused by assembly errors, reducing heat transfer loss caused by assembly errors. This allows the heat generated by the chip 400 during operation to be evenly transferred to the thermal conductive element 500 through the thermal conductive medium layer 700, and then the thermal conductive element 500 dissipates the heat to the external environment of the domain controller.

[0114] In some examples, when the first adjusting member 300 adjusts the bending state of the circuit board assembly 200, the bent circuit board assembly 200 causes the chip 400 to press against the thermally conductive layer 700, so that the thermally conductive layer 700... Figure 5 The thickness shown is reduced to the following: Figure 7 The thickness shown indicates that by reducing the thickness of the thermally conductive medium layer 700, the efficiency of heat transfer in the thermally conductive medium layer 700 can be improved.

[0115] In the heat dissipation device provided in this embodiment, a thermally conductive medium layer 700 with high thermal conductivity can fill the gap between the thermally conductive component 500 and the chip 400 caused by assembly tolerance, thereby improving the thermal conductivity between the thermally conductive component 500 and the chip 400.

[0116] Figure 10 A cross-sectional structural diagram of a first adjusting member provided for some examples of this disclosure. Figure 11 Side and top views of a first adjusting member provided for some examples of this disclosure. See also Figure 10 and Figure 11 In some examples, such as Figure 11 (a) and Figure 10 As shown in (b), the first adjusting member 300 can be a self-tapping screw, wherein, Figure 11 Image (a) is a side view of a self-tapping screw. Figure 11 (b) is a top view of the self-tapping screw.

[0117] Figure 10 In the diagram, the circular dashed line represents the area corresponding to the first connecting hole 121. When the first adjusting member 300 enters the first connecting hole 121, its external thread can tap the inner wall of the first connecting hole 121 during the screwing process. The external thread can compress the inner wall of the first connecting hole 121 during tapping, causing plastic deformation of the inner wall material, which then detaches from the inner wall of the first connecting hole 121, forming debris. This debris can then enter... Figure 10The area indicated by the arrow in the diagram is pressed against the thread of the first adjusting member 300 to achieve an anti-loosening effect between the first adjusting member 300 and the first connecting hole 121, thereby improving the tightness of the connection between the first adjusting member 300 and the first connecting hole 121. Simultaneously, based on the pressing and fastening characteristics of the self-tapping screw, when the heat dissipation device adjusts the bending state of the circuit board assembly 200 by rotating the first adjusting member 300, the tight combination of the self-tapping screw thread and the debris material provides stable support for the circuit board assembly 200, ensuring that the bending state of the circuit board assembly 200 is always maintained within the range of the first gap A. This ensures the stability of the thickness of the thermally conductive layer 700, allowing the heat generated by the chip 400 to be continuously transferred to the heat-conducting member 500 through the thermally conductive layer 700.

[0118] In some examples, the second adjustment member 600 may employ the same self-tapping screw structure as the first adjustment member 300.

[0119] In some embodiments of this disclosure, the assembly process of the heat dissipation device can be performed by an installation device, which can be a robotic arm, an industrial robot, or other automated assembly equipment. The installation device can assemble the components in the heat dissipation device according to a preset program and precision requirements.

[0120] Figure 12 A first example assembly evolution diagram of an assembly heat dissipation device provided for some examples of this disclosure. Figure 13 This is a first example flowchart illustrating the assembly of a heat dissipation device, providing some examples for this disclosure. (Combined with...) Figure 12 and Figure 13 The heat dissipation device provided in this disclosure can be assembled through steps S100-S300.

[0121] S100: Place the circuit board assembly in the heat sink housing.

[0122] See Figure 12 Image (a) is an exploded view of the heat dissipation device. The mounting equipment allows the circuit board assembly 200 to be placed on the heat dissipation housing 100 to obtain... Figure 12 In the assembly structure of (b), the positioning standard for assembly can be that the circuit board assembly 200 is placed when the chip 400 contacts the thermal conductive medium layer 700, or when the circuit board assembly 200 contacts the second support member 130 (not shown in the figure).

[0123] S200: Install the first and second adjusting components.

[0124] like Figure 12As shown in (c), after placing the circuit board assembly 200, the mounting device can rotatably connect the first adjusting member 300 through the positioning hole provided on the circuit board assembly 200 and the first connecting hole 121. At this time, one end of the first adjusting member 300 abuts against the circuit board assembly, and the other end of the first adjusting member 300 is screwed into the first connecting hole 121 by rotation, so as to movably connect the circuit board assembly 200 to the first support member 120. The mounting device can rotatably connect the second adjusting member 600 through the positioning hole provided on the circuit board assembly 200 and the second connecting hole 131, so as to fix the area of ​​the circuit board assembly 200 to the second support member 130.

[0125] S300: Adjust the bending state of the circuit board assembly by means of the first adjusting member.

[0126] After installing the first adjusting member 300 and the second adjusting member 600, the first connecting hole 121 is pre-drilled with the following: Figure 9 As shown in the second gap B, the mounting equipment can continue to rotate the first adjusting member 300 so that the first adjusting member 300 enters the second gap B. Simultaneously, the end of the first adjusting member 300 that abuts against the circuit board assembly 200 will apply pressure to the circuit board assembly 200 as it enters the second gap B, causing the circuit board assembly 200 to bend, resulting in... Figure 12 The heat dissipation device shown in (d) completes the assembly process. At this time, the chip 400 on the circuit board assembly 200 can be in close contact with the heat-conducting component 500, thereby improving the heat dissipation efficiency of the chip 400.

[0127] It should be noted that, Figure 12 The process of assembling the first adjusting member 300 and the second adjusting member 600 in (c) is not limited to a specific order.

[0128] In some examples, during the assembly process, the mounting equipment can also adjust the bending state of the circuit board assembly 200 via external components. Figure 14 A second example assembly evolution diagram of the heat dissipation device provided for some examples of this disclosure. Figure 15 A second example flowchart of assembling a heat dissipation device is provided for some examples of this disclosure.

[0129] See Figure 14 Image (a) is an exploded view of the heat dissipation device. The mounting equipment allows the circuit board assembly 200 to be placed on the heat dissipation housing 100 to obtain... Figure 14 The assembly structure of (b) in section (b). Combined with... Figure 14 and Figure 15 After performing step S100 of the above method, the heat dissipation device can also be assembled by performing steps S400-S700 on the installation equipment.

[0130] Step S400: Adjust the bending state of the circuit board assembly using external components.

[0131] In this example, the pressure head is used as an external component for illustrative purposes. After step S200, the installation device can be installed as follows: Figure 14 The pressure head shown in (c) actively applies pressure to the circuit board assembly 200 to bend the circuit board assembly 200 and abut against the first support member 120.

[0132] It is worth noting that, in order to avoid damage to the circuit board assembly 200 due to excessive pressure, the pressure applied by the pressure head to the circuit board assembly 200 should not exceed the total pressure of the circuit board assembly 200, or the maximum pressure that any component of the circuit board assembly 200 can withstand.

[0133] S500: Install the first adjustment component.

[0134] After the circuit board assembly 200 becomes bent, such as Figure 14 As shown in (d), the installation device can first pass the first adjusting member 300 through the bent circuit board assembly 200 and connect it to the first connecting hole 121 by rotation. At this time, since the circuit board assembly 200 is in a bent state and abuts against the first support member 120, one end of the first adjusting member 300 can directly enter the second gap B of the first connecting hole 121 by rotation. The other end of the first adjusting member 300 abuts against the circuit board assembly 200 and continuously applies pressure to the circuit board assembly 200 to maintain the bent state of the circuit board assembly 200 and ensure that the chip 400 can continuously fit tightly against the heat-conducting member 500.

[0135] S600: Remove external components.

[0136] After the assembly of the first adjusting component 300 is completed, as follows Figure 14 As shown in (e), the installation equipment can remove the pressure head to facilitate the continuation of subsequent assembly.

[0137] S700: Install the second adjustment component.

[0138] See also Figure 14 As shown in (f), after the pressure head is removed, the installation device can pass the second adjustment member 600 through the circuit board assembly 200 in the bent state and into the second connection hole 131 to fix the circuit board assembly 200, thereby completing the assembly of the heat dissipation device.

[0139] It should be noted that, Figure 14The description only uses the pressure head as one of the external components for adjusting the bending state of the circuit board assembly 200. In practical applications, any device or structure with pressure application function can be used to replace the pressure head to carry out the above assembly process. This disclosure does not limit the external components that can apply pressure.

[0140] In some examples, this disclosure also provides a domain controller including the heat dissipation device described above. The domain controller can be installed in a sealed space inside a vehicle, and the heat dissipation device can be installed inside the domain controller to dissipate the heat generated by the chip 400 during computation to the outside of the domain controller via a heat-conducting component 500. The domain controller can achieve heat dissipation for the chip 400 through the heat dissipation device; for details, please refer to the description of the heat dissipation device, which will not be repeated here.

[0141] The basic principles of this disclosure have been described above with reference to specific embodiments. However, the advantages, benefits, and effects mentioned in this disclosure are merely examples and not limitations, and should not be considered as essential features of each embodiment of this disclosure. Furthermore, the specific details disclosed above are for illustrative and facilitative purposes only, and are not limitations. These details do not limit the scope of this disclosure to the necessity of employing the aforementioned specific details for implementation.

[0142] Various modifications and variations can be made to this disclosure without departing from the spirit and scope of this application. Therefore, if such modifications and variations fall within the scope of the claims of this disclosure and their equivalents, this disclosure is also intended to include such modifications and variations.

Claims

1. A heat dissipation device, characterized in that, include: The heat dissipation housing includes a base and a first support member and a second support member disposed on the base, wherein the first support member is provided with a first connection hole; A circuit board assembly is movably connected to the first support member via a first adjusting member and a first connecting hole; the circuit board assembly has a chip disposed facing the base; the circuit board assembly is movably connected to the second support member. A heat-conducting component is disposed between the base and the chip, and the heat-conducting component abuts against the chip; The first adjusting member can be rotated to change its height within the first connecting hole, thereby adjusting the bending state of the circuit board assembly toward the heat sink housing.

2. The heat dissipation device according to claim 1, characterized in that, The circuit board assembly includes a circuit board and a bracket; The chip and the bracket are respectively disposed on opposite sides of the circuit board; One end of the first adjusting member abuts against the bracket, and the other end of the first adjusting member passes through the bracket and the circuit board, and is rotatably connected to one end of the first supporting member through the first connecting hole.

3. The heat dissipation device according to claim 2, characterized in that, The second support member is provided with a second connecting hole; The circuit board abuts against the second support member through the second adjusting member and the second connecting hole.

4. The heat dissipation device according to claim 3, characterized in that, One end of the second adjusting member abuts against the circuit board, and the other end of the second adjusting member passes through the circuit board and is rotatably connected to one end of the second supporting member through the second connecting hole.

5. The heat dissipation device according to claim 3, characterized in that, The second support member and the first support member are located on the same side of the base, and the height of the second support member is greater than the height of the first support member.

6. The heat dissipation device according to claim 5, characterized in that, When the circuit board is in a non-bent state, there is a first gap between the first support member and the circuit board. The height of the first gap is the height difference between the second support member and the first support member. The first gap is used to provide space required for the circuit board to bend.

7. The heat dissipation device according to claim 6, characterized in that, When the circuit board assembly is in a non-bent state, the end of the first adjusting member located inside the first connecting hole has a second gap with the bottom of the first connecting hole, the second gap being greater than or equal to the first gap.

8. The heat dissipation device according to claim 1, characterized in that, It also includes a thermally conductive medium layer; The thermally conductive medium layer is disposed between the thermally conductive component and the chip; The thermally conductive component abuts against the chip through the thermally conductive medium layer.

9. The heat dissipation device according to claim 1, characterized in that, The first adjusting component is a self-tapping screw.

10. A domain controller, characterized in that, Includes the heat dissipation device as described in any one of claims 1-9.

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