A non-metallic enclosure apparatus
By combining a non-metallic casing with a circuit board, a ring-shaped conductive component, and a metal base, the problem of high cost and weight of all-metal casings is solved. This achieves the integration of electromagnetic shielding and heat dissipation, resulting in a lighter product and lower cost.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SUZHOU KEDA TECH
- Filing Date
- 2025-09-19
- Publication Date
- 2026-08-04
AI Technical Summary
Existing technologies using all-metal die-cast housings to achieve electrostatic shielding are costly and heavy, failing to meet the product's cost and weight requirements.
The device uses a non-metallic casing and a circuit board, a first annular conductive component, and a metal base to form a closed shield. Electromagnetic shielding is achieved by combining the electrostatic balance principle of the Faraday cage, and heat dissipation is achieved through the cooperation of the heat sink and the metal base.
While achieving electromagnetic shielding, the product also achieved the goal of lightweighting, successfully passed the electrostatic discharge test, and integrated shielding and heat dissipation, thus reducing costs.
Smart Images
Figure CN224596857U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of electrical components technology, specifically to a non-metallic housing device. Background Technology
[0002] With the rapid development of semiconductor technology, chip integration is increasing and operating speeds are getting faster. On the one hand, high-speed devices like DDR are becoming increasingly susceptible to interference, leading to instability. On the other hand, the market is demanding lighter products and greater cost control, necessitating the design of entirely new electrical architectures to achieve these lightweight goals.
[0003] In existing technologies, a closed shielding chamber is constructed using a metal casing to enclose the circuit board and other internal components of the device, thereby effectively preventing external electromagnetic waves from intruding and interfering with the circuit board, ultimately achieving electromagnetic shielding.
[0004] However, while the existing technology using an all-metal die-cast shell can effectively solve the problem of electrostatic interference, the cost of metal die-cast parts is relatively high and the product is relatively heavy, which can no longer meet the current product requirements in terms of cost and weight. Utility Model Content
[0005] In view of this, the present invention provides a non-metallic housing device to solve the problems of high cost and heavy weight in the existing all-metal die-cast housing solution for electrostatic shielding.
[0006] This utility model provides a non-metallic housing device, comprising: Non-metallic outer shell with an internal metal base; The circuit board is supported on the metal base by a first annular conductive element, and the first annular conductive element is electrically connected to the circuit board and the metal base respectively. The chip is connected to the circuit board. Optionally, a heat sink is also provided inside the non-metallic casing, and the other side of the circuit board is electrically connected to the heat sink through a second annular conductive element, with the chip located in the space surrounded by the second annular conductive element. Optionally, a first thermally conductive pad is provided between the circuit board and the metal base within the space surrounded by the first annular conductive element.
[0007] Optionally, a second thermally conductive pad is provided between the chip and the heat sink.
[0008] Optionally, the side of the heat sink away from the chip has a fin structure.
[0009] Optionally, there is a gap between the fin structure and the inner wall of the non-metallic shell.
[0010] Optionally, the first annular conductive element is conductive foam, a metal spring, or conductive adhesive.
[0011] Optionally, the second annular conductive element is conductive foam, a metal spring, or conductive adhesive.
[0012] Optionally, the metal base is an aluminum plate or copper plate with a thickness between 0.5 and 1 mm.
[0013] Optionally, one side of the circuit board has a first copper leakage area for electrical connection with the first annular conductive element, and the other side of the circuit board has a second copper leakage area for electrical connection with the second annular conductive element.
[0014] Optionally, the outer wall of the non-metallic casing has vent holes opposite to the metal base.
[0015] Beneficial effects: The present invention uses a circuit board, a first annular conductive element and a metal base to form a closed shield. Utilizing the electrostatic balance principle of the Faraday cage, under the action of an external electric field, the free charges inside the shield will be rapidly redistributed to form an opposite electric field, making the total electric field inside the shield approach zero, thereby shielding against external high-frequency interference.
[0016] The utility model's technical solution achieves both electromagnetic shielding and product lightweighting. After testing, it successfully passed the electrostatic discharge test (8kV contact discharge) and air gap discharge test (6kV) certifications.
[0017] In addition, the technical solution of this utility model integrates shielding and heat dissipation. In terms of heat dissipation, the large metal area of the heat sink and the metal base is used to conduct the heat of the chip on the circuit board to the metal base and the heat sink, thereby dissipating the heat.
[0018] This solution reduces the number of metal die-casting molds and achieves effective heat dissipation by using low-cost aluminum or copper plates in conjunction with the heat sink. Attached Figure Description
[0019] To more clearly illustrate the specific embodiments of this utility model or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.
[0020] Figure 1 A front view of the internal structure of a non-metallic casing device provided in an embodiment of this utility model; Figure 2 for Figure 1 The front sectional view of the internal structure of the non-metallic enclosure device shown.
[0021] Explanation of reference numerals in the attached figures: 1. Non-metallic casing; 2. Metal base; 3. Heat sink; 4. Circuit board; 5. Chip; 6. First annular conductive component; 7. Second annular conductive component; 8. First thermally conductive pad; 9. Second thermally conductive pad; 10. Vent hole. Detailed Implementation
[0022] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.
[0023] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.
[0024] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.
[0025] Furthermore, the technical features involved in the different embodiments of this utility model described below can be combined with each other as long as they do not conflict with each other.
[0026] like Figure 1 , Figure 2 The image shows a specific implementation of the non-metallic housing device provided in this embodiment. Specifically, the non-metallic housing device can be an integrated conference terminal or other electrical equipment.
[0027] like Figure 1 , Figure 2 As shown, in this embodiment, the non-metallic housing device includes a non-metallic housing 1. It should be noted that in this embodiment, the non-metallic housing 1 is made of plastic. Of course, the above description is not limiting; in some alternative embodiments, the non-metallic housing 1 may also be made of other non-metallic materials, such as carbon fiber, ceramics, etc.
[0028] like Figure 1 , Figure 2 As shown, the non-metallic casing 1 has a metal base 2 and a heat sink 3 spaced apart inside. Specifically, in this embodiment, the heat sink 3 is spaced apart from the inner wall of the non-metallic casing 1. This arrangement is more conducive to heat dissipation of the heat sink 3 and the metal base 2. Of course, the above description is not limiting; in some alternative embodiments, the heat sink 3 can be omitted.
[0029] like Figure 1 , Figure 2 As shown, a circuit board 4 is disposed between the metal base 2 and the heat sink 3 inside the non-metallic casing 1. The circuit board 4 is disposed parallel to the metal base 2 and the heat sink 3 respectively. One side of the circuit board 4 is supported on the metal base 2 by a first annular conductive member 6. The first annular conductive member 6 is electrically connected to the circuit board 4 and the metal base 2 respectively. Specifically, a first copper leakage area may be provided on the circuit board 4 for electrical connection with the first annular conductive member 6, so that when the first annular conductive member 6 abuts against the first copper leakage area of the circuit board 4, an electrical connection is formed.
[0030] like Figure 1 , Figure 2 As shown, the other side of the circuit board 4 is electrically connected to the heat sink 3 through the second annular conductive member 7; similarly, the other side of the circuit board 4 may be provided with a second copper leakage area for electrical connection with the second annular conductive member 7, thereby forming an electrical connection when the second annular conductive member 7 abuts against the circuit board 4.
[0031] Additionally, it should be noted that in some alternative embodiments, the second annular conductive element 7 can be omitted. A closed shield can be formed solely through the electrical connection between the first annular conductive element 6 and the circuit board 4 and the metal base 2, thereby providing electromagnetic shielding for the side of the circuit board 4 facing the metal base 2.
[0032] like Figure 1 , Figure 2As shown, a chip 5 is connected to the circuit board 4, and the chip 5 is located within the space surrounded by the second annular conductive element 7. This arrangement creates a second layer of closed shielding through the heat sink 3, the second annular conductive element 7, and the circuit board 4. Placing the chip 5 within this shielding layer can block external high-frequency interference.
[0033] It should be noted that the above description is not restrictive. In some embodiments, the chip 5 may also be located inside the first annular conductive element 6, that is, on the other side of the circuit board 4, all of which are within the protection scope of this utility model.
[0034] Additionally, it should be noted that in this embodiment, the heat sink 3 needs to have a non-electroplated copper base to facilitate electrical connection when the second annular conductive element 7 comes into contact. Of course, the above description is not limiting; in some embodiments, the heat sink 3 may also have a portion of its bottom reserved for electrical connection.
[0035] Additionally, it should be noted that in this embodiment, the main function of the first annular conductive element 6 and the second annular conductive element 7 is to ensure continuous conductivity at the joint. Since the final design of the integrated shielding cover requires a fully enclosed shell, conductive foam with better continuity and fit is selected. Of course, the above description is not limiting. In some alternative embodiments, other conductive elements, such as metal springs or conductive adhesives, can be used for the first annular conductive element 6 and the second annular conductive element 7.
[0036] Additionally, it should be noted that in this embodiment, the metal base 2 is an aluminum plate with a thickness between 0.5-1mm. The metal base plate needs to be made of a highly conductive material, and the choice of aluminum plate is based on considerations of overall cost and initial weight reduction. Of course, the above description is not limiting; in some embodiments, other metal plates, such as copper plates, can also be used.
[0037] like Figure 1 , Figure 2 As shown, in some embodiments, a first thermally conductive pad 8 is provided between the circuit board 4 and the metal base 2 within the space surrounded by the first annular conductive element 6. A second thermally conductive pad 9 is provided between the chip 5 and the heat sink 3.
[0038] There are gaps between the circuit board 4 and the metal base 2, and between the circuit board 4 and the heat sink 3. The first thermally conductive pad 8 and the second thermally conductive pad 9 can effectively fill these gaps. Air has a relatively low thermal conductivity, while the thermal conductivity of the thermally conductive pads is usually much higher than that of air. Filling the gaps prevents the formation of an insulating layer from air, allowing heat to be transferred more smoothly from the circuit board 4 to the metal base 2 and the heat sink 3.
[0039] like Figure 1 , Figure 2 As shown, in some embodiments, the side of the heat sink 3 away from the chip 5 is provided with a fin structure, which can improve the heat dissipation efficiency of the heat sink 3.
[0040] It should be noted that in this embodiment, the fin structure can be a conventional fin, or a needle-shaped fin, or a corrugated fin, etc., and no specific limitation is made here. In addition, in some embodiments, the fin structure can be omitted.
[0041] like Figure 1 , Figure 2 As shown, in some embodiments, the outer wall of the non-metallic shell 1 has a vent 10 opposite to the metal base 2. The vent 10 can effectively dissipate the heat on the metal base 2.
[0042] Specifically, the vent 10 is positioned opposite the metal base 2 on the outer wall of the non-metallic casing 1, providing a direct channel for heat dissipation. When the temperature of the metal base 2 rises, the hot air tends to move due to the density difference. The vent 10 allows the hot air to escape from the casing, while external cold air can flow in from other gaps or air inlets to supplement and cool the metal base 2, forming a natural convection circulation. Compared to a closed casing without vent 10, the vent 10 significantly increases the heat exchange area and efficiency between the metal base 2 and the outside air. The heat of the metal base 2 is no longer limited to slow conduction through the casing, but can be quickly exhausted with the help of the vent 10, accelerating the heat dissipation rate.
[0043] It should be noted that, in this embodiment, the specific form of the air inlet is not limited, and it can be a conventional matrix-type hole, a grille-type vent 10, or an adjustable vent 10, etc. Furthermore, in some embodiments, the vent 10 may be omitted.
[0044] This embodiment provides a technical solution that integrates shielding and heat dissipation, achieving the goal of product lightweighting. Furthermore, the product has successfully passed electrostatic discharge testing (8kV contact discharge and 6kV air gap discharge) and environmental temperature testing (55 degrees Celsius).
[0045] Working principle: In terms of heat dissipation, the large metal area of the heat sink 3 and the metal base 2 is utilized to conduct the heat from the chip 5 on the circuit board 4 to the metal base 2 and the heat sink 3, thereby dissipating the heat. This solution reduces the need for a large number of metal die-casting molds and uses low-cost aluminum or copper plates in conjunction with the heat sink 3 to achieve effective heat dissipation.
[0046] In the electromagnetic shielding method, a closed shielding cover is formed by a heat sink 3, an annular conductive element, and a metal base 2. The circuit board 4 is electrically connected to the heat sink 3 and the metal base plate through exposed copper openings. Utilizing the electrostatic balance principle of the Faraday cage, under the action of an external electric field, the free charges inside the shielding cover will rapidly redistribute, forming an opposite electric field, causing the total electric field inside the shielding cover to approach zero, thereby shielding against external high-frequency interference.
[0047] Although embodiments of the present invention have been described in conjunction with the accompanying drawings, those skilled in the art can make various modifications and variations without departing from the spirit and scope of the present invention, and such modifications and variations all fall within the scope defined by the present invention.
Claims
1. A non-metallic enclosure apparatus, comprising: include: A non-metallic outer shell (1) with an internal metal base (2); The circuit board (4) is supported on the metal base (2) by a first annular conductive element (6), and the first annular conductive element (6) is electrically connected to the circuit board (4) and the metal base (2) respectively. The chip (5) is connected to the circuit board (4).
2. The non-metallic enclosure device of claim 1, wherein, The non-metallic casing (1) is also provided with a heat sink (3). The other side of the circuit board (4) is electrically connected to the heat sink (3) through a second annular conductive element (7). The chip (5) is located in the space surrounded by the second annular conductive element (7).
3. The non-metallic housing device of claim 1, wherein, A first thermally conductive pad (8) is provided between the circuit board (4) and the metal base (2) within the space surrounded by the first annular conductive element (6).
4. The non-metallic enclosure device of claim 2, wherein, A second thermal pad (9) is provided between the chip (5) and the heat sink (3).
5. The non-metallic enclosure device of claim 2, wherein, The heat sink (3) has a fin structure on the side away from the chip (5).
6. The non-metallic enclosure device of claim 5, wherein, There is a gap between the fin structure and the inner wall of the non-metallic shell (1).
7. The non-metallic housing device of claim 1, wherein, The first annular conductive element (6) is conductive foam, metal spring, or conductive adhesive.
8. The non-metallic housing device of claim 2, wherein, The second annular conductive element (7) is conductive foam, metal spring or conductive adhesive.
9. The non-metallic housing device of claim 2, wherein, One side of the circuit board (4) has a first copper leakage area for electrical connection with the first annular conductive element (6), and the other side of the circuit board (4) has a second copper leakage area for electrical connection with the second annular conductive element (7).
10. The non-metallic enclosure device of any of claims 1-9, wherein, The outer wall of the non-metallic shell (1) has a vent (10) opposite to the metal base (2).