An ITO line adhering jig

Abstract

The utility model relates to ITO line fitting technical field discloses a kind of ITO line fitting jigs, including bottom plate, still include: two guide rails being arranged in parallel on the bottom plate, base is slidably arranged on the guide rail;ITO line body is equipped on the base, fixed block is equipped on the ITO line body;Support is also equipped on the bottom plate, air nozzle is equipped on the support, the air nozzle is communicated air source by the blowing hole being opened in the support, for the ITO line body blow air to assist ITO line and carrier piece fit. In the utility model, the adaptation sliding of guide rail and base bottom slider is driven, and the position of base and upper ITO line body is adjusted along guide rail flexibly, then, the design that spring positioning needle on fixed block is passed ITO line positioning hole, thereby effectively solve the problems, such as the large positioning deviation of traditional jig, the close fit, artificial operation efficiency is low, improve the accuracy, stability of ITO line fitting.

Description

Technical Field

[0001] This utility model relates to the field of ITO circuit bonding technology, and in particular to an ITO circuit bonding fixture. Background Technology

[0002] ITO (In-Templates) bonding is a key process in the production of electronic displays, touch screens, and flexible optoelectronic devices. Its core involves precisely bonding a conductive and transparent ITO film to a glass or flexible plastic substrate. With the rapid development of flexible electronics and wearable devices, the requirements for ITO bonding accuracy, efficiency, and adaptability to different substrate shapes have significantly increased. Bonding quality directly affects the conductivity, display effect, and lifespan of electronic devices; therefore, developing efficient and stable bonding fixtures has become a crucial step in optimizing the production process.

[0003] In existing technologies, ITO circuit bonding often employs fixed-base fixtures. The ITO circuits are manually placed on a support platform, and their position is calibrated using rulers or marking lines. The bonding process relies on manual pressing or simple mechanical pressure to achieve bonding between the circuit and the substrate. While some fixtures are equipped with basic positioning components, they primarily secure the circuits with clips or screws, and the pressure of the pressurizing device is controlled manually by adjusting a knob to complete the bonding operation.

[0004] In existing technologies, fixed-base type fixtures lack flexible position adjustment structures. When fine-tuning the relative position of the ITO circuit and the substrate is required, the circuit or substrate must be moved manually, which can easily lead to positioning deviations. This adjustment method is not only cumbersome to operate, but also causes slight displacement of the circuit due to external forces, directly affecting the bonding accuracy and making it difficult to meet the stringent requirements of high-precision electronic devices for circuit bonding. Therefore, an ITO circuit bonding fixture is proposed to solve the above problems. Utility Model Content

[0005] To overcome the above shortcomings, this utility model provides an ITO circuit bonding fixture, which aims to improve the problems of large positioning deviation, loose bonding, and low efficiency of manual operation in existing fixtures.

[0006] To achieve the above objectives, the present invention adopts the following technical solution:

[0007] An ITO circuit bonding fixture includes a base plate and further includes:

[0008] Two guide rails are arranged in parallel on the base plate, and a base is slidably mounted on the guide rails; an ITO circuit body is mounted on the base, and a fixing block is mounted on the ITO circuit body;

[0009] The base plate is also provided with a bracket, and the bracket is provided with an air nozzle. The air nozzle is connected to an air source through a blow hole opened in the bracket, and is used to blow air into the ITO circuit body to assist the ITO circuit to fit with the carrier.

[0010] As a further description of the above technical solution:

[0011] The fixing block is equipped with a spring positioning pin, which is used to pass through the positioning hole of the ITO circuit to accurately position the ITO circuit.

[0012] As a further description of the above technical solution:

[0013] The base has a slider at its bottom that is adapted to the guide rail. The base slides back and forth along the guide rail via the slider to adjust the fit position.

[0014] As a further description of the above technical solution:

[0015] The bracket includes a column and a crossbeam. The column is vertically fixed to the base plate, and the crossbeam is connected to the column. The air nozzle is disposed on the crossbeam, and the air hole is opened on the crossbeam at the position corresponding to the air nozzle to guide the air source to the surface of the ITO circuit.

[0016] As a further description of the above technical solution:

[0017] The base is also provided with an injection molded part, which is adapted to the shape of the ITO circuit body and is used to support and pre-position the ITO circuit, thereby helping to improve the bonding accuracy.

[0018] As a further description of the above technical solution:

[0019] The number of air nozzles is at least one, and the air blowing direction of the air nozzles is towards the surface of the ITO circuit body to uniformly apply air pressure to assist bonding.

[0020] This utility model has the following beneficial effects:

[0021] In this invention, the guide rail and the bottom slider of the base slide together, causing the base and the ITO circuit body above it to flexibly adjust their bonding positions along the guide rail. Then, the ITO circuit is precisely positioned on the base by using the spring positioning pin on the fixing block to pass through the ITO circuit positioning hole. At the same time, the air nozzle on the support beam is connected to the air source through the air blowing hole, blowing air directionally onto the surface of the ITO circuit, causing the gas to act evenly on the gap between the ITO circuit and the carrier. Combined with the injection molded part on the base that matches the shape of the ITO circuit body, the circuit is pre-loaded and initially constrained in shape and position. This effectively solves the problems of large positioning deviation, loose bonding, and low efficiency of manual operation in traditional fixtures, improves the accuracy and stability of ITO circuit bonding, as well as the degree of automation and overall efficiency of the production process, and meets the high precision and high efficiency requirements of ITO circuit bonding process in flexible electronics, wearable devices and other scenarios. Attached Figure Description

[0022] Figure 1 This is a three-dimensional schematic diagram of an ITO circuit bonding fixture proposed in this utility model;

[0023] Figure 2 This is a schematic diagram of the support structure of an ITO circuit bonding fixture proposed in this utility model.

[0024] Legend:

[0025] 1. Base plate; 2. Guide rail; 3. Injection molded part; 4. Bracket; 5. Air blower hole; 6. Air nozzle; 7. ITO circuit body; 8. Fixing block; 9. Spring positioning pin; 10. Base. Detailed Implementation

[0026] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0027] Reference Figure 1 and Figure 2This utility model provides an embodiment of an ITO circuit bonding fixture, comprising a base plate 1, and two guide rails 2 parallelly arranged on the base plate 1. The guide rails 2 provide sliding guidance to ensure the smooth movement of the base 10. The base 10 is slidably mounted on the guide rails 2 and is used to support and move the ITO circuit body 7. The ITO circuit body 7 is a circuit component to be bonded. The ITO circuit body 7 is provided with a fixing block 8 for fixing and supporting the ITO circuit body 7. The base plate 1 is also provided with a bracket 4 for supporting an air nozzle 6. The air nozzle 6 is used to blow air into the ITO circuit body 7. The air nozzle 6 is connected to an air source through a blowing hole 5 opened in the bracket 4. The blowing hole 5 guides the airflow to blow air into the ITO circuit body 7 to assist in bonding the ITO circuit with the support component. The fixing block 8 is provided with a spring positioning pin 9. Spring positioning pin 9 is used to pass through the positioning hole of the ITO circuit to accurately position the ITO circuit. The bottom of the base 10 is provided with a slider that is adapted to the guide rail 2. The slider is used to reduce friction and make the base 10 slide more smoothly. The base 10 slides back and forth along the guide rail 2 by the slider to adjust the fitting position. The bracket 4 includes a column and a crossbeam. The column is used to support the crossbeam and is vertically fixed to the base plate 1. The crossbeam is used to install the air nozzle 6. The crossbeam is connected to the column and the air nozzle 6 is set on the crossbeam. The air blowing hole 5 is opened at the position of the air nozzle 6 on the crossbeam to guide the air source to the surface of the ITO circuit. The base 10 is also provided with an injection molded part 3. The injection molded part 3 is used to pre-position the ITO circuit. The injection molded part 3 is adapted to the shape of the ITO circuit body 7 and is used to support and pre-position the ITO circuit to help improve the fitting accuracy. There is at least one air nozzle 6, and the air blowing direction of the air nozzle 6 is set towards the surface of the ITO circuit body 7 to apply air pressure evenly to assist the fitting.

[0028] Working principle: The guide rail 2 on the base plate 1 and the slider at the bottom of the base 10 are matched to drive the base 10, the injection molded part 3 above it, and the ITO circuit body 7 to slide back and forth along the guide rail 2 to achieve flexible adjustment of the fitting position. Then, the ITO circuit is placed on the injection molded part 3 on the base 10. The shape of the injection molded part 3 and the ITO circuit body 7 are matched to drive the ITO circuit to complete the pre-load and initial shape and position constraint. Then, the spring positioning pin 9 on the fixing block 8 passes through the positioning hole of the ITO circuit, which drives the ITO circuit to be accurately positioned on the base 10 to avoid positional deviation. At the same time, the column of the bracket 4 is fixed to the crossbeam of the base plate 1 and connected to the vertical support. The air nozzle 6 on the column beam is connected to the air source through the air blowing hole 5 at the corresponding position. The air blowing direction of the air nozzle 6 is towards the surface of the ITO circuit body 7. At least one air nozzle 6 works synchronously to drive the gas to act evenly on the surface of the ITO circuit, which helps the ITO circuit to fit tightly with the carrier. Through the above-mentioned structure, the sliding of the linkage guide rail 2 and the slider drives the position adjustment spring positioning pin 9 to drive the precise positioning of the air nozzle 6 and the air blowing hole 5 to drive the air pressure to assist the bonding of the injection molded part 3 and the pre-load constraint. All components work together to realize the complete process of ITO circuit from positioning to bonding, ensuring that the bonding process is stable and efficient and meets the high-precision bonding requirements.

[0029] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. An ITO circuit adhering jig comprising a base plate (1), characterized in that: Also includes: Two guide rails (2) are arranged in parallel on the base plate (1), and a base (10) is slidably arranged on the guide rails (2); The base (10) is provided with an ITO circuit body (7), and the ITO circuit body (7) is provided with a fixing block (8); The base plate (1) is also provided with a bracket (4), and the bracket (4) is provided with an air nozzle (6). The air nozzle (6) is connected to an air source through a blow hole (5) opened on the bracket (4) and is used to blow air into the ITO circuit body (7) to assist the ITO circuit to fit with the carrier.

2. The ITO routing fixture of claim 1, wherein: The fixing block (8) is provided with a spring positioning pin (9), which is used to pass through the positioning hole of the ITO line to accurately position the ITO line.

3. The ITO routing fixture of claim 1, wherein: The base (10) has a slider at the bottom that is adapted to the guide rail (2). The base (10) slides back and forth along the guide rail (2) via the slider to adjust the fitting position.

4. The ITO routing fixture of claim 1, wherein: The bracket (4) includes a column and a crossbeam. The column is vertically fixed to the base plate (1), and the crossbeam is connected to the column. The air nozzle (6) is disposed on the crossbeam, and the air hole (5) is opened on the crossbeam at the position corresponding to the air nozzle (6) to guide the air source to the surface of the ITO line.

5. The ITO routing fixture of claim 1, wherein: The base (10) is also provided with an injection molded part (3), which is adapted to the shape of the ITO circuit body (7) and is used to support and pre-position the ITO circuit to help improve the bonding accuracy.

6. The ITO routing fixture of claim 1, wherein: The number of the air nozzles (6) is at least one, and the air blowing direction of the air nozzles (6) is towards the surface of the ITO circuit body (7) to uniformly apply air pressure to assist bonding.

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