A four-in-one bracket with built-in IC high-efficiency heat dissipation

Abstract

This utility model discloses a four-in-one bracket for high-efficiency heat dissipation of built-in ICs, including a substrate and a cup fixed on the substrate. The inner cavity of the cup is provided with several partitions, dividing its inner cavity into four independent chambers. A first pad is located in the first chamber, and a second pad and a third pad are also located in the first chamber. A fourth pad and a fifth pad span the first chamber and the second chamber. A sixth pad is located in the second chamber. A seventh pad is located in the third chamber, and an eighth pad is also located in the third chamber, spanning the third chamber and the first chamber. A ninth pad, a tenth pad, and an eleventh pad span the fourth chamber and the first chamber, respectively. A twelfth pad is also located in the fourth chamber. Each LED bead has an independent pad, and the heat generated can be dissipated through the independent pads, allowing the heat to be quickly dissipated and reducing heat accumulation. Furthermore, the method of using pads spanning the chambers enables short-distance connections of gold wires, reducing production difficulty.

Description

Technical Field

[0001] This utility model belongs to the field of LED bracket technology, specifically a four-in-one bracket with built-in IC high-efficiency heat dissipation. Background Technology

[0002] With the widespread application of LED technology in lighting, display and other fields, higher requirements have been placed on the integration, performance stability and cost control of LED devices. Traditional four-in-one LED brackets, which typically combine red, green, blue and white light-emitting chips with external driver ICs, have the following obvious drawbacks:

[0003] 1. Integration and space limitations: External ICs occupy additional PCB space, making it difficult to reduce the size of LED modules and meet the needs of miniaturized devices (such as smart wearable devices and micro projectors);

[0004] 2. High signal transmission loss: The chip and IC are connected by a long gold wire, which is prone to electromagnetic interference during signal transmission, resulting in a decrease in color control accuracy and affecting the display effect;

[0005] The above problems can be effectively solved by embedding an IC in the existing technology. For example, the published technical document "CN218586009U, a surface-mount RGB plus white light embedded IC color LED bead" has a better light emission effect, more concentrated brightness, and lower thermal resistance by setting a bracket base, cup, cup-in-cup step, bar isolation wall and heat dissipation hole. The LED bead bracket base has a cup and bar isolation wall, which is conducive to heat dissipation of the LED bead, reduces light decay of the LED bead, extends the life of the LED bead, and improves product performance.

[0006] However, the main heat source is the LED beads. In the above solution, the three LED beads are bonded to the same pad, which generates a lot of heat during use and may even affect the working efficiency of the IC chip. Secondly, the above technical solution sets up a bar-shaped isolation wall, but it does not mention how to form the bar-shaped isolation wall. There is a problem here. To connect the W chip 604 and the IC chip, it is necessary to either use a connecting wire to bypass the bar-shaped isolation wall, or connect it with a connecting wire first and then perform secondary injection molding or use a shell. No matter which method is used, the processing technology will become more complicated and the cost will increase. Utility Model Content

[0007] The purpose of this utility model is to provide a four-in-one bracket for high-efficiency heat dissipation of built-in ICs, so as to solve the problems mentioned in the background art.

[0008] To achieve the above objectives, this utility model provides the following technical solution:

[0009] A four-in-one bracket for high-efficiency heat dissipation of built-in IC includes a substrate and a bowl fixed on the substrate. The inner cavity of the bowl is provided with several partitions to divide its inner cavity into four independent chambers.

[0010] The first pad is located in the first chamber and is used to solder the first LED bead. The first chamber also has a second pad and a third pad for fixing and soldering the IC controller, and for connecting to the IC controller.

[0011] The fourth and fifth pads span the first and second chambers and are used for wiring; the second chamber has a sixth pad for soldering the second LED chip.

[0012] The seventh pad is located in the third chamber and is used to solder the third LED bead. The third chamber also has an eighth pad, which spans the third chamber and the first chamber and is used for wiring.

[0013] The ninth, tenth, and eleventh pads span the fourth and first chambers respectively and are used for wiring. The eleventh pad is also used for soldering the fourth LED chip.

[0014] The fourth chamber also contains a twelfth solder pad for connecting the fourth LED bead in the fourth chamber.

[0015] In a further technical solution, the first pad, the sixth pad, the seventh pad, and the twelfth pad are respectively formed as conductive pins for supplying power to the LED chips;

[0016] The second, third, fourth, and tenth pads form control pins for sending signals to the IC controller;

[0017] The eleventh pad forms a power supply pin for supplying power to the IC controller;

[0018] The fifth, seventh, eighth, and ninth pads form fixed pins.

[0019] In a further technical solution, one end of the first LED bead located in the first chamber is connected to the first pad via a wire, and the other end is connected to the control terminal of the IC controller via a wire, so that the control terminal of the IC controller and the remote connection terminal of the first LED bead form an "S"-shaped layout.

[0020] One end of the second LED located in the second chamber is connected to the sixth pad via a wire, and the other end is combined with the fifth pad and the wire, so that the control terminal of the IC controller and the remote connection terminal of the second LED form an "S"-shaped layout.

[0021] The third LED (located in the third chamber) is connected to the seventh pad at one end via a wire, and the other end is connected to the eighth pad and a wire, so that the control terminal of the IC controller and the remote connection terminal of the third LED form an "S"-shaped layout.

[0022] The fourth LED located in the fourth chamber is connected to the twelfth pad at one end via a connecting line, and the other end is connected to the ninth pad and the connecting line, so that the control terminal of the IC controller and the remote connection terminal of the fourth LED form an "S"-shaped layout.

[0023] In a further technical solution, the first LED bead is white, the second LED bead is blue, the third LED bead is green, and the fourth LED bead is red.

[0024] A further technical solution involves an irregularly shaped structure at the end of several pads furthest from the cup body.

[0025] In a further technical solution, the substrate surface is provided with a silver plating layer.

[0026] A further technical solution is that the spacer is flush with the upper edge of the cup body, and the spacer and the cup body are integrally injection molded.

[0027] The beneficial effects of this utility model are:

[0028] After the LED chip bonding and IC controller connection are completed, resin encapsulation is generally used. At this time, the four chambers can completely separate the four LED chips, reducing mutual interference. Each LED chip has an independent solder pad, and the heat generated can be dissipated through the independent solder pad. The heat can be quickly dissipated, reducing heat accumulation. Secondly, the method of using solder pads across the chambers allows for short-distance gold wire connection, and the gold wire does not need to cross the chamber to achieve electrical connection between the LED chip and the IC controller, reducing production difficulty.

[0029] Although the fifth, eighth, and ninth pads are also connected to the PCB board, they do not actually serve any conductive or conductive functions; they only serve a fixing function. In other words, this bracket has twelve pins that connect to the PCB board to form twelve fixing points, greatly increasing the tightness of the connection with the PCB board.

[0030] Other features and advantages of this invention will be described in detail in the following detailed description section. Attached Figure Description

[0031] Figure 1 The three-dimensional structure of this utility model Figure 1 .

[0032] Figure 2 : A schematic diagram of the pad layout structure of this utility model.

[0033] Figure 3 The three-dimensional structure of this utility model Figure 2 .

[0034] Figure 4 The layout diagram of the LED beads, IC controller, and solder pad wiring of this utility model.

[0035] Figure 5 : Wiring layout diagram of this utility model.

[0036] Reference numerals: 11-bowl / cup, 12-spacer, 13-first chamber, 14-second chamber, 15-third chamber, 16-fourth chamber, 211-first pad, 212-second pad, 213-third pad, 214-fourth pad, 215-fifth pad, 216-sixth pad, 217-seventh pad, 218-eighth pad, 219-ninth pad, 220-tenth pad, 221-eleventh pad, 222-twelfth pad. Detailed Implementation

[0037] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention.

[0038] Please refer to Figure 1-5 ;

[0039] The bracket described in this utility model is equipped with four LED beads, corresponding to red, green, blue and white respectively, and realizes the mixing of multiple lights through the built-in IC controller to make the color presentation richer. However, it generates a lot of heat when emitting light, which affects the lifespan. This utility model adopts an independent solder pad method to improve the heat dissipation effect. Specifically, it includes a substrate and a cup 11 fixed on the substrate. In the production process, several substrates and strips are integrated together, and then several solder pads are formed by stamping. Preferably, an electroplating process is also required to form a silver plating layer on the surface of the solder pads to improve their conductivity. Then, the cup 11 is injection molded. Since several solder pads are formed on the substrate through the stamping process, there are gaps between these solder pads. During injection molding, the material enters these gaps to further isolate the solder pads and fix their positions. While the cup 11 is being injection molded, several partitions 12 are provided in the inner cavity of the cup 11 to divide its inner cavity into four independent chambers, and each chamber is bonded with an LED bead.

[0040] The first pad 211 is located in the first chamber 13 and is used for soldering the first LED chip. The first chamber 13 also contains a second pad 212 and a third pad 213 for fixing and soldering the IC controller and its connection. A fourth pad 214 and a fifth pad 215 span the first chamber 13 and the second chamber 14 for wiring. The second chamber 14 contains a sixth pad 216 for soldering the second LED chip. A seventh pad 217 is located in the third chamber 15 and is used for soldering... Connecting to the third LED, the third chamber 15 also has an eighth pad 218, which spans the third chamber 15 and the first chamber 13 and is used for wiring; the ninth pad 219, the tenth pad 220 and the eleventh pad 221 span the fourth chamber 16 and the first chamber 13 respectively and are used for wiring, wherein the eleventh pad 221 is also used for soldering the fourth LED; the fourth chamber 16 also has a twelfth pad 222 for wiring the fourth LED in the fourth chamber 16.

[0041] During production, the first LED bead is bonded to the first pad 211 and connected to the first pad 211 via gold wire. The first pad 211 forms conductive pins that connect to the PCB board. Preferably, the first LED bead is white (W). The other end of the first LED bead is connected to the first control terminal of the IC controller via gold wire. The IC controller is bonded to the second pad 212. At the same time, the first signal terminal, second signal terminal, third signal terminal, fourth signal terminal, and power supply terminal of the IC controller are respectively connected to the second pad 212, the third pad 213, the fourth pad 214, the tenth pad 220, and the eleventh pad 221 via gold wire. The second pad 212, the third pad 213, the fourth pad 214, and the tenth pad 220 form control pins that connect to the PCB board. In addition, the second output terminal, the third output terminal, and the fourth output terminal of the IC controller are respectively connected to the fifth pad 215, the eighth pad 218, and the ninth pad 219 via gold wire.

[0042] The second LED is bonded to the sixth pad 216. Preferably, the second LED is blue (B). One end of the LED is connected to the sixth pad 216 through a gold wire. The sixth pad 216 forms a conductive pin connected to the PCB board. The other end is connected to the fifth pad 215 through a gold wire and is connected to the second control terminal of the IC controller through the fifth pad 215.

[0043] The third LED is bonded to the seventh pad 217. Preferably, the third LED is green (G). One end of the LED is connected to the seventh pad 217 via a gold wire. The seventh pad 217 forms a conductive pin connected to the PCB board. The other end of the LED is connected to the eighth pad 218 via a gold wire and is connected to the third control terminal of the IC controller via the eighth pad 218.

[0044] The fourth LED is bonded to the eleventh pad 221. Preferably, the fourth LED is red (R). One end of the LED is connected to the twelfth pad 222 through a gold wire. The twelfth pad 222 forms a conductive pin connected to the PCB board. The other end is connected to the ninth pad 219 through a gold wire and is connected to the fourth control terminal of the IC controller through the ninth pad 219.

[0045] While the fifth pad 215, the eighth pad 218, and the ninth pad are also connected to the PCB board, they do not actually serve any conductive or conductive functions; they only serve a fixing function. In other words, this bracket has twelve pins that connect to the PCB board to form twelve fixing points, greatly increasing the tightness of the connection with the PCB board.

[0046] More specifically, the pin of the eleventh pad 221 supplies power to the IC controller, and then transmits signals to the IC controller through the pins of the second pad 212, the third pad 213, the fourth pad 214 and the tenth pad 220 to realize the switching, that is, to realize the lighting and turning off of the four LEDs.

[0047] After the LED chips are bonded and connected to the IC controller, they are generally encapsulated with resin. At this time, the four chambers can completely separate the four LED chips, reducing mutual interference. Each LED chip has an independent solder pad, and the heat generated can be dissipated through the independent solder pad. The heat can be quickly dissipated, reducing heat accumulation. Secondly, the method of using solder pads across the chambers allows for short-distance connection of gold wires, and the gold wires do not need to cross the chambers to achieve electrical connection between the LED chips and the IC controller, reducing production difficulty.

[0048] Furthermore, one end of the first LED located in the first chamber 13 is connected to the first pad 211 via a wire, and the other end is connected to the control terminal of the IC controller via a wire, so that the control terminal of the IC controller and the remote connection terminal of the first LED form an "S"-shaped layout. One end of the second LED located in the second chamber 14 is connected to the sixth pad 216 via a wire, and the other end is connected to the fifth pad 215 and a connecting wire, so that the control terminal of the IC controller and the remote connection terminal of the second LED form an "S"-shaped layout. One end of the third LED located in the third chamber 15 is connected to the seventh pad 217 via a wire, and the other end is connected to the eighth pad 218 and a connecting wire, so that the control terminal of the IC controller and the remote connection terminal of the third LED form an "S"-shaped layout. One end of the fourth LED located in the fourth chamber 16 is connected to the twelfth pad 222 via a connecting wire, and the other end is connected to the ninth pad 219 and a connecting wire, so that the control terminal of the IC controller and the remote connection terminal of the fourth LED form an "S"-shaped layout.

[0049] When in use, the four LEDs are isolated by several spacers 12, which can reduce electromagnetic interference. Secondly, the “S”-shaped layout effectively reduces signal transmission delay and electromagnetic interference.

[0050] It should be noted that the "S"-shaped pattern refers to a meandering, serpentine layout, not a completely "S" shape.

[0051] In a circuit, different lines of the same group of signals may arrive at the receiving end at different times due to different path lengths. If the delay difference is too large, it will cause the system to read data incorrectly. The serpentine routing can compensate for the smaller delay part of the same group of signal lines by increasing the wiring length, ensuring that the time difference of each signal arriving at the receiving end is within the allowable range, realizing signal synchronization, ensuring that the system can read data correctly, and thus reducing signal transmission delay problems.

[0052] Furthermore, in a serpentine routing pattern, adjacent lines experience equal and opposite currents at the same time, and are parallel to each other. The resulting magnetic fields cancel each other out, acting similarly to a filter inductor to filter out interference and noise. Properly setting the spacing between serpentine lines, such as maintaining a spacing no less than twice the line width, can reduce inter-line coupling, decrease crosstalk, and thus reduce electromagnetic interference.

[0053] Furthermore, the ends of several pads away from the cup body are irregularly shaped, which can better fix the cup body and pads after injection molding. Secondly, the spacer 12 is flush with the upper edge of the cup body. Since the connecting line does not need to cross the spacer 12 to achieve electrical connection, the spacer 12 and the cup body can be integrally injection molded during production, reducing the difficulty of the production process.

[0054] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or substrate characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0055] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style of the specification is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A four-in-one bracket with built-in IC high-efficiency heat dissipation, characterized in that: It includes a substrate and a bowl (11) fixed on the substrate. The bowl (11) has a plurality of partitions (12) in its inner cavity, which divide its inner cavity into four independent chambers. The first pad (211) is located in the first chamber (13) for soldering the first lamp bead. The first chamber (13) also has a second pad (212) and a third pad (213) for fixing and soldering the IC controller and connecting to the IC controller. The fourth pad (214) and the fifth pad (215) span the first chamber (13) and the second chamber (14) for wiring; the second chamber (14) is provided with a sixth pad (216) for soldering the second LED bead; The seventh pad (217) is located in the third chamber (15) for soldering the third LED bead. The third chamber (15) also has an eighth pad (218) that spans the third chamber (15) and the first chamber (13) for wiring. The ninth pad (219), the tenth pad (220) and the eleventh pad (221) span across the fourth chamber (16) and the first chamber (13) respectively, and are used for wiring. The eleventh pad (221) is also used for soldering the fourth LED. A twelfth pad (222) is also provided in the fourth chamber (16) for connecting the fourth lamp bead in the fourth chamber (16).

2. The four-in-one bracket for high-efficiency heat dissipation of built-in ICs according to claim 1, characterized in that: The first pad (211), the sixth pad (216), the seventh pad (217) and the twelfth pad (222) respectively form conductive pins for supplying power to the lamp beads; The second pad (212), the third pad (213), the fourth pad (214) and the tenth pad (220) form control pins for sending signals to the IC controller; The eleventh pad (221) forms a power supply pin for supplying power to the IC controller; The fifth pad (215), the seventh pad (217), the eighth pad (218), and the ninth pad (219) form fixed pins.

3. The four-in-one bracket for high-efficiency heat dissipation of built-in ICs according to claim 2, characterized in that: One end of the first LED bead located in the first chamber (13) is connected to the first pad (211) via a wire, and the other end is connected to the control terminal of the IC controller via a wire, so that the control terminal of the IC controller and the remote connection terminal of the first LED bead form an "S"-shaped layout. One end of the second LED located in the second chamber (14) is connected to the sixth pad (216) via a wire, and the other end is combined with the fifth pad (215) and the wire, so that the control terminal of the IC controller and the remote connection terminal of the second LED form an "S"-shaped layout. One end of the third LED located in the third chamber (15) is connected to the seventh pad (217) via a wire, and the other end is combined with the eighth pad (218) and the wire, so that the control terminal of the IC controller and the remote connection terminal of the third LED form an "S"-shaped layout. The fourth LED located in the fourth chamber (16) is connected to the twelfth pad (222) at one end via a connecting line, and the other end is combined with the ninth pad (219) and the connecting line, so that the control terminal of the IC controller and the remote connection terminal of the fourth LED form an "S"-shaped layout.

4. The four-in-one bracket for high-efficiency heat dissipation of built-in ICs according to claim 1, characterized in that: The first LED is white, the second LED is blue, the third LED is green, and the fourth LED is red.

5. The four-in-one bracket for high-efficiency heat dissipation of built-in ICs according to claim 1, characterized in that: Several pads have an irregular shape at the end furthest from the cup body.

6. The four-in-one bracket for high-efficiency heat dissipation of built-in ICs according to claim 1, characterized in that: The substrate surface is provided with a silver plating layer.

7. The four-in-one bracket for high-efficiency heat dissipation of built-in ICs according to claim 1, characterized in that: The spacer (12) is flush with the upper edge of the cup body, and the spacer (12) and the cup body are integrally injection molded.

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