Chip package post-dicing process integration apparatus

Abstract

The utility model provides a kind of each process integration equipment after chip packaging cutting, it is related to chip manufacturing equipment technical field.The equipment includes stand, material conveying module, each process module and control module;The material conveying module and each process module are respectively connected with control module communication, the material conveying module is configured to transport material between each process module, each process module includes feeding module, glue dissolving module, defective product rejection module, good product collection module and recycling module which are sequentially arranged on stand.The utility model realizes the integration of five function modules, and can carry out automatic operation, solves the limitation problem of traditional each process implementation mode and existing automation equipment after chip packaging cutting.

Description

Technical Field

[0001] This utility model relates to the field of chip manufacturing equipment technology, specifically to an integrated equipment for various processes after chip packaging and cutting. Background Technology

[0002] Chips are the core components of modern electronic devices. Through high integration and collaborative work, they support all aspects of modern technology and daily life, and have been widely used in numerous fields. In the packaging stage of chip manufacturing, the processes of bonding, cutting, debinding, sorting, and picking are sequentially required. Specifically:

[0003] In the bonding process before dicing, to ensure the chip remains stable during subsequent dicing, prevent displacement or deformation, and guarantee dicing accuracy and quality, the encapsulated substrate (e.g., lead frame, wafer) containing the chip needs to be bonded to a blue film, which in turn is bonded to a metal ring. This allows the metal ring and blue film to work together to fix and support the chip. In practice, multiple encapsulated substrates with chips are typically bonded to a single metal ring. During the dicing process, the encapsulated substrate is diced at high speed according to a preset dicing path. The resulting chips remain arranged in an array via the blue film and metal ring for automated processing in subsequent steps. In the debonding process after dicing, the adhesive layer on the blue film needs to lose its stickiness to allow for the chip to be detached from the blue film without damage. In the sorting process, defective chips need to be removed to ensure product yield. In the material handling process, good chips, discarded blue films, and metal rings need to be collected separately to ensure the quality of good chips and subsequent processes, and to achieve the classified recycling and reuse of waste materials.

[0004] However, traditional methods for each process after chip packaging and cutting rely on manual operation. For example, in the sorting process, operators need to visually inspect the ink dots on the chips and compare them with paper maps to manually identify and remove defective products. This manual operation method has the following limitations: First, it is inefficient and labor-intensive, and manual operation is difficult to match the needs of large-scale production; second, the work effect is easily affected by factors such as human fatigue, leading to high errors and large fluctuations in yield; third, work data needs to be recorded manually, making traceability difficult and preventing real-time monitoring of production data and process optimization. To address these issues, although some automated equipment has been proposed in the prior art, most of the current equipment is an independent single-function module, such as the UV degumming machine for chips proposed in patent CN216849858U and the chip sorting machine proposed in patent CN220604621U. These devices lack full-process integration in practical applications, resulting in low equipment coordination efficiency, which in turn limits the overall work effect, production efficiency, and capacity.

[0005] In summary, this utility model provides an integrated equipment for each process after chip packaging and cutting. Utility Model Content

[0006] The purpose of this invention is to provide an integrated equipment for each process after chip packaging and cutting, in order to solve the problem mentioned in the background art that the traditional methods of implementing each process after chip packaging and cutting and the existing automated equipment have limitations.

[0007] This utility model is achieved using the following technical solution:

[0008] An integrated equipment for chip packaging and dicing processes includes a stand, a material conveying module, process modules, and a control module. The material conveying module and each process module are communicatively connected to the control module. The material conveying module is configured to convey materials between the process modules. Each process module includes a feeding module, a de-adhesive module, a defective product rejection module, a good product collection module, and a recycling module, which are sequentially arranged on the stand.

[0009] Furthermore, the material conveying module includes a translational conveying mechanism and a material conveying robot mechanism; the material conveying robot mechanism includes several lifting material conveying robots, which are respectively connected to the translational conveying mechanism, and the material conveying robots are respectively movably located between the corresponding process modules.

[0010] Furthermore, the feeding module includes a feeding mechanism and a receiving mechanism; the receiving mechanism is located on one side of the feeding mechanism, the feeding mechanism includes a lifting platform and a material container located on the lifting platform, the receiving mechanism includes a receiving robot and a robot power component; the robot power component is configured to drive the receiving robot to take out materials from the material container.

[0011] Furthermore, the side of the material container facing the receiving mechanism is open, and the inner surface of the material container is provided with multiple sets of vertically spaced material placement steps. Each set of material placement steps includes two strip plates symmetrically arranged on the two inner surfaces of the material container. The receiving robot includes a clamping component and a connecting component. The clamping component is connected to the robot power component through the connecting component. The robot power component is configured to drive the clamping component to perform translational motion.

[0012] Furthermore, the degumming module includes a degumming chamber, a support frame, and a transmission power assembly; the support frame is located on one side of the degumming chamber, and the side of the degumming chamber facing the support frame is open; the support frame is configured to extend into or out of the degumming chamber under the drive of the transmission power assembly; a degumming light source is provided in the degumming chamber, and the degumming light source is configured to irradiate the bottom surface of the material carried on the support frame.

[0013] Furthermore, the defective product rejection module includes a visual inspection mechanism, a rejection mechanism, an XY motion carrier platform, and a defective product receiving unit; a defective product receiving unit is provided on one side of the XY motion carrier platform, a visual inspection mechanism is provided above the XY motion carrier platform, and a rejection mechanism is provided on one side of the visual inspection mechanism; the rejection mechanism includes a translatable and lifting picking robot, which is configured to remove defective products from the XY motion carrier platform and send them to the defective product receiving unit.

[0014] Furthermore, the good product collection module includes a turning mechanism, a vibrating feeding mechanism, and a good product receiving component; the good product receiving component is located on one side of the turning mechanism; the turning mechanism includes a turning platform, a turning power component, and a material fixing component, the turning platform is connected to the turning power component, and the turning platform is provided with a material fixing component; the vibrating feeding mechanism includes an ultrasonic vibrating head and a vibrating head power component, the ultrasonic vibrating head is configured to move above the turning platform under the drive of the vibrating head power component.

[0015] Furthermore, the material fixing component includes a rotary clamping cylinder, the rotary clamping element of the rotary clamping cylinder is disposed above the tilting platform, the cylinder body of the rotary clamping cylinder is disposed below the tilting platform, and the surface of the tilting platform is provided with corresponding openings for the piston of the rotary clamping cylinder to pass through.

[0016] Furthermore, the recycling module includes a tamping mechanism and a collecting mechanism; the tamping mechanism includes a support frame, a waste collecting component, and a tamping element that can be moved horizontally and vertically, the tamping element being located above the support frame and the waste collecting component being located below the support frame; the collecting mechanism includes a collecting platform and a collecting robot that can be moved horizontally and vertically, the collecting platform being located on one side of the support frame, and the collecting robot being configured to remove material from the support frame and deliver it to the collecting platform.

[0017] Furthermore, the tamping component and the collecting robot are respectively connected to the mounting plate, and the mounting plate is connected to the translational force assembly; the tamping component includes a tamping plate and a tamping drive cylinder, and the tamping plate is connected to the output end of the tamping drive cylinder; the collecting robot includes a collecting suction cup and a collecting drive cylinder, and the collecting suction cup is connected to the output end of the collecting drive cylinder.

[0018] The beneficial effects achieved by this utility model are:

[0019] This invention provides an integrated device for various processes after chip packaging and dicing. It includes a material conveying module, process modules, and a control module. The process modules include a feeding module, a debinding module, a defective product rejection module, a good product collection module, and a recycling module. Based on this, the device integrates five major functional modules and can perform automated operations. Compared with traditional methods relying on manual operation and existing equipment with single functional modules, this invention, due to its integrated and automated features, can effectively improve work efficiency, ensure operational accuracy, and reduce labor costs, thus better adapting to market development needs. Attached Figure Description

[0020] Figure 1 This is a front view schematic diagram of the overall structure of the device described in this embodiment of the utility model;

[0021] Figure 2 This is a three-dimensional schematic diagram of the overall structure of the device described in this embodiment of the utility model;

[0022] Figure 3 This is a schematic diagram of the material conveying module in the equipment described in this embodiment of the utility model;

[0023] Figure 4 This is a schematic diagram of the structural composition of the material described in an embodiment of this utility model;

[0024] Figure 5 This is a schematic diagram of the feeding module in the equipment described in this embodiment of the utility model;

[0025] Figure 6 This is a schematic diagram of the material container of the feeding module in the device described in this embodiment of the utility model;

[0026] Figure 7 This is a schematic diagram of the receiving robot arm of the feeding module in the equipment described in this embodiment of the utility model;

[0027] Figure 8 This is a schematic diagram of the structure of the adhesive removal module in the device described in this embodiment of the utility model;

[0028] Figure 9 This is a schematic diagram of the defective product rejection module in the equipment described in this embodiment of the utility model;

[0029] Figure 10 This is a schematic diagram of the visual inspection mechanism and the rejection mechanism of the defective product rejection module in the equipment described in this embodiment of the utility model;

[0030] Figure 11 This is a schematic diagram of the structure of the good product collection module in the device described in this embodiment of the utility model;

[0031] Figure 12This is a schematic diagram of the structure of the recycling module in the device described in this embodiment of the utility model;

[0032] Figure 13 This is a schematic diagram of the material tamping component and the material collection robot in the recycling module of the equipment described in this embodiment of the utility model;

[0033] In the diagram: 1. Stand; 2. Feeding module; 3. Degumming module; 4. Defective product rejection module; 5. Good product collection module; 6. Recycling module; 7. Feeding robot I; 8. Feeding robot II; 9. Feeding robot III; 10. Lifting drive cylinder; 11. Material suction cup; 12. Lifting platform; 13. Material container; 14. Handle; 15. Receiving robot; 16. Material placement step; 17. Positioning plate; 18. Thin cylinder; 19. Clamping plate; 20. Degumming chamber; 21. Support frame; 2. Conveyor rail; 23. XY motion bearing platform; 24. Material placement plate; 25. Defective product receiving component; 26. Industrial camera; 27. Pneumatic suction cup; 28. Rotary clamping cylinder; 29. ​​Tilting platform; 30. Ultrasonic vibrating head; 31. Good product receiving component; 32. Scrap product receiving component; 33. Support frame; 34. Receiving platform; 35. Tamping plate; 36. Tamping drive cylinder; 37. Receiving suction cup; 38. Receiving drive cylinder; 39. Iron ring; 40. Blue film; 41. Plastic sealing carrier. Detailed Implementation

[0034] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention.

[0035] Example 1

[0036] This embodiment provides an integrated equipment for each process after chip packaging and dicing. Please refer to [reference needed]. Figure 1 and Figure 2 It includes a platform 1, a material conveying module, various process modules, and a control module. The material conveying module and each process module are communicatively connected to the control module. The material conveying module is configured to transport materials between the process modules. Each process module includes a feeding module 2, a degumming module 3, a defective product rejection module 4, a good product collection module 5, and a recycling module 6, which are sequentially arranged on the platform 1. Among them:

[0037] The materials after chip packaging and dicing include iron ring 39, blue film 40, and molding substrate 41. For details, please refer to... Figure 4In this embodiment, a blue film 40 is bonded to the iron ring 39, and three uniformly arranged plastic-encapsulated lead frames are bonded to the blue film 40. The three plastic-encapsulated lead frames are cut into several chips of the same size. In this device, the feeding module 2 is used to transport the material with the above complete structure to the de-adhesive module 3. The de-adhesive module 3 is used to make the adhesive layer of the blue film 40 lose its stickiness so that the chips can be separated from the blue film 40 without damage. The defective product rejection module 4 is used to detect and reject defective chips. The good product collection module 5 is used to collect good chips. The recycling module 6 is used to collect the iron ring 39 and the discarded blue film 40.

[0038] The material conveying module includes a translational conveying mechanism and a material conveying robot mechanism. For details, please refer to... Figure 3 In this embodiment, the translational conveying mechanism includes a translational linear module parallel to the upper surface of the platform 1, and the material conveying robot mechanism includes three liftable material conveying robots. The three material conveying robots are respectively connected to three lifting drive cylinders 10, and the three lifting drive cylinders 10 are respectively slidably connected to the translational linear module. Each material conveying robot consists of a square frame and four material-picking suction cups 11 installed on the four corners of the square frame. The three material conveying robots are material conveying robot I7, material conveying robot II8, and material conveying robot III9. Material conveying robot I7 is configured to reciprocate between the feeding module 2 and the degumming module 3, material conveying robot II8 is configured to reciprocate between the degumming module 3, the defective product rejection module 4, and the good product collection module 5, and material conveying robot III9 is ​​configured to reciprocate between the good product collection module 5 and the recycling module 6.

[0039] The feeding module 2 includes a feeding mechanism and a receiving mechanism. Specifically, please refer to... Figures 5 to 7In this embodiment, the receiving mechanism is located on one side of the feeding mechanism. The feeding mechanism includes a lifting platform 12 driven by a servo motor and a material container 13 located on the lifting platform 12. The receiving mechanism includes a receiving robot 15, a robot power component, and a clamping and positioning component. The robot power component is configured to drive the receiving robot 15 to remove material from the material container 13. The side of the material container 13 facing the receiving mechanism is open, and a handle 14 is provided on its upper surface. Multiple sets of vertically spaced material placement steps 16 are evenly arranged on the inner surface of the material container 13. Each set of material placement steps 16 includes two strip plates symmetrically arranged on the two inner surfaces of the material container 13, and material is placed on each pair of strip plates. The receiving robot 15 includes a clamping component and a connecting component. The clamping component is connected to the robot's power assembly via the connecting component. The robot's power assembly is configured to drive the clamping component to perform translational motion. The robot's power assembly includes a stepper motor and a synchronous belt parallel to the upper surface of the platform 1. The connecting component includes a connecting plate, one end of which is connected to the synchronous belt, and the other end is connected to the clamping component. The clamping component includes a thin cylinder 18 and a clamping plate 19. The clamping plate 19 includes an upper clamping plate and a lower clamping plate. The lower clamping plate is connected to the output end of the thin cylinder 18, so its distance from the upper clamping plate can change with the extension and retraction of the thin cylinder 18. The clamping and positioning assembly includes two symmetrically arranged "L"-shaped positioning plates 17. The clamping plate 19 is located between the two positioning plates 17. The two positioning plates 17 are slidably connected to a lead screw driven by a stepper motor via threaded connecting blocks, wherein the threaded connecting blocks connected to the two positioning plates 17 have opposite thread directions.

[0040] The adhesive release module 3 includes an adhesive release chamber 20, a support frame 21, and a transmission power assembly. Specifically: please refer to... Figure 8 In this embodiment, the support frame 21 is located on one side of the degumming chamber 20. The side of the degumming chamber 20 facing the support frame 21 is open. The support frame 21 is configured to extend into or out of the degumming chamber 20 under the drive of the conveying power assembly. The degumming chamber 20 is equipped with a UVLED degumming light source, which is configured to irradiate the bottom surface of the material carried on the support frame 21 with ultraviolet light. The conveying power assembly includes a conveying guide rail 22 driven by a drive motor and a guide rail symmetrically arranged with the conveying guide rail 22. The conveying guide rail 22 and the guide rail extend into the degumming chamber 20 and are respectively located on one side of the two inner sidewalls of the degumming chamber 20. The two sides of the support frame 21 are respectively connected to the conveying guide rail 22 and the guide rail via connecting blocks.

[0041] The defective product rejection module 4 includes a visual inspection mechanism, a rejection mechanism, an XY motion support platform 23, and a defective product receiving unit 25. For details, please refer to... Figures 9 to 10In this embodiment, a cylindrical defective product receiving component 25 is provided on one side of the XY motion bearing platform 23, and a material placement plate 24 is provided above the XY motion bearing platform 23. A vision inspection mechanism is provided above the material placement plate 24, and a rejection mechanism is provided on one side of the vision inspection mechanism. The rejection mechanism includes a picking robot, which includes a pneumatic suction cup 27, which is slidably connected to the translation linear module. The vision inspection mechanism includes an industrial camera 26, which faces the upper surface of the material placement plate 24 to take pictures. The height of the industrial camera 26 is higher than the height of the pneumatic suction cup 27. A lifting assembly is provided below the material placement plate 24, which is used to lift the material placement plate 24. A material fixing component I is provided on the material placement plate 24. The material fixing component I includes two symmetrically arranged rotary clamping cylinders 28. The rotary clamping parts of the two rotary clamping cylinders 28 are arranged above the material placement plate 24, and the cylinder bodies are arranged below the material placement plate 24. The surface of the material placement plate 24 is provided with corresponding openings for the pistons of the rotary clamping cylinders 28 to pass through.

[0042] Good product collection module 5 includes a turning mechanism, a vibrating feeding mechanism, and a good product receiving component 31. Specifically: please refer to... Figure 11 In this embodiment, the good product receiving component 31 includes a funnel portion and a cylindrical portion connected below the funnel portion. The good product receiving component 31 is located on one side of the turning mechanism and is configured to be able to move horizontally to the bottom of the turning mechanism. The turning mechanism includes a turning platform 29, a turning power component, and a material fixing component II. The turning platform 29 is connected to the turning power component, which adopts a cylinder and gear rack mechanism. The good product receiving component 31 is fixedly mounted on a moving plate, and the moving plate is connected to the output end of the translation drive component. The material fixing component II includes four rotary clamping cylinders 28, which are symmetrically arranged on both sides of the turning platform 29. The rotary clamping parts of the four rotary clamping cylinders 28 are located above the turning platform 29, and the cylinder bodies are located below the turning platform 29. The surface of the turning platform 29 is provided with corresponding openings for the pistons of the rotary clamping cylinders 28 to pass through. The oscillating feeding mechanism includes an ultrasonic oscillating head 30 and an oscillating head power assembly. The ultrasonic oscillating head 30 is configured to move above the flipping platform 29 under the drive of the oscillating head power assembly. The oscillating head power assembly includes an XY two-axis servo module.

[0043] The recycling module 6 includes a tamping mechanism and a collecting mechanism. Specifically: please refer to... Figures 12 to 13In this embodiment, the material tamping mechanism includes a support frame 33, a waste material receiving component 32, and a material tamping component that can be moved horizontally and vertically. The material tamping component is located above the support frame 33, and the waste material receiving component 32 is located below the support frame 33. An unobstructed material unloading channel (with holes opened on the frame 1) is provided between the waste material receiving component 32 and the support frame 33. The material receiving mechanism includes a material receiving platform 34 and a material receiving robot that can be moved horizontally and vertically. The material receiving platform 34 is located on one side of the support frame 33, and the material receiving robot is configured to take the material from the support frame 33 and send it to the material receiving platform 34. The material tamping component and the material collecting robot are respectively connected to the mounting plate, which is connected to the translational force assembly. The material tamping component includes a tamping plate 35 and a tamping drive cylinder 36, with the tamping plate 35 connected to the output end of the tamping drive cylinder 36. There are two material collecting robots, which are symmetrically arranged on both sides of the material tamping component. Each material collecting robot includes a material collecting suction cup 37 and a material collecting drive cylinder 38. The material collecting suction cup 37 is connected to the output end of the material collecting drive cylinder 38 and includes two material picking suction cups 11.

[0044] Based on the above structure, the workflow of this integrated device is as follows:

[0045] (1) Feeding module 2 feeds materials: After the staff places the material container 13 onto the lifting platform 12, the feeding module 2 starts working (either manually started by the staff or automatically started by setting a corresponding trigger switch). Specifically: the receiving robot 15, driven by the robot power component, moves closer to the material container 13 through translational movement. After reaching the receiving position, the thin cylinder 18 drives the clamping plate 19 to clamp the material. After clamping the material, the receiving robot 15 moves in the opposite direction with the material and places the material on two positioning plates 17. The two positioning plates 17 then clamp and position the material bidirectionally under the action of the stepper motor and the lead screw. Then, the conveying robot Ⅰ7 conveys the material to the bearing frame 21 in the degumming module 3. When the previous material is taken away by the receiving robot 15, the lifting platform 12 will automatically rise so that the receiving robot 15 can smoothly take away the next material.

[0046] (2) Degumming module 3 performs degumming: After the material is conveyed to the support frame 21, the degumming module 3 starts to work. Specifically, the support frame 21 moves along the conveyor rail 22 and the guide rail under the drive of the conveying power component, and then extends into the degumming chamber 20. Then, the UVLED degumming light source in the degumming chamber 20 irradiates the bottom surface of the material with ultraviolet light so that the blue film 40 adhesive layer loses its stickiness. After the degumming is completed, the support frame 21 moves in the opposite direction with the material to extend out of the degumming chamber 20. Then, the material conveying robot II 8 conveys the material to the placement plate 24 in the defective product rejection module 4.

[0047] (3) Defective product rejection module 4 performs defective product identification and rejection: After the material is conveyed to the material placement plate 24, the defective product rejection module 4 starts to work. The vision inspection mechanism identifies the defective chip on the material through image acquisition and processing, and locates the coordinate position of the defective chip. According to the obtained coordinate position, the XY motion bearing platform 23 moves to make the defective chip reach the bottom of the rejection mechanism. Then the lifting component lifts the material placement plate 24 upward so that the picking robot can pick up the defective chip. Subsequently, the picking robot moves through translation to transfer the defective chip to the defective product receiving component 25, and resets after the transfer is completed. After the picking robot picks up the defective chip, the conveying robot II 8 conveys the material to the flipping platform 29 in the good product collection module 5. When the material is conveyed onto the material placement plate 24, the two rotary clamping cylinders 28 in the material fixing component I will rotate and clamp to stabilize the material. When the picking robot picks up the defective chip, the two rotary clamping cylinders 28 will release the clamp and rotate to avoid it, so that the conveying robot II 8 can convey the material to the next module.

[0048] (4) Good product collection module 5 collects good products: After the material is transported to the flipping platform 29, the good product collection module 5 starts to work. Specifically: the four rotary clamping cylinders 28 in the material fixing component II clamp the iron ring 39 in the material. Then, the flipping power component drives the flipping platform 29 to flip 180°. The good product receiving component 31 moves to the bottom of the flipping platform 29 through translational movement. Then, the oscillating head power component drives the ultrasonic oscillating head 30 to move in an orderly manner above the material and generate appropriate vibration waves so that the good product chips in the material can fall into the good product receiving component 31. After the good product chips are released, the flipping platform 29 flips again and resets. The good product receiving component 31 resets through translational movement. The four rotary clamping cylinders 28 release the clamping and rotate to avoid. The conveying robot III 9 transports the material to the support frame 33 of the recycling module 6.

[0049] (5) The recycling module 6 collects the iron ring 39 and the waste blue film 40: After the material is transported to the support frame 33, the recycling module 6 starts to work. Specifically, the tamping drive cylinder 36 drives the tamping plate 35 to press down to tamp the blue film 40 into the waste collection part 32; then, the collection drive cylinder 38 drives the collection robot to move downward to obtain the iron ring 39; then, the translational force component drives the mounting plate to move the collection robot to make a translational movement, so that the collection robot transfers the iron ring 39 to the collection platform 34 and resets after the transfer is completed.

[0050] In summary, this integrated equipment can automatically complete the entire process of feeding, degumming, rejecting defective products, collecting good products, and recycling waste.

[0051] It should be specifically noted that the parts not described in detail or elaborated in the above solutions are all prior art and do not constitute improvements made by this utility model to existing technology, nor are they within the protection scope of this utility model's technical solutions. Therefore, they will not be elaborated upon further in this document. Of course, the above content is only a preferred embodiment of this utility model and should not be considered as limiting the scope of the embodiments of this utility model. This utility model is also not limited to the above examples. Equivalent changes and improvements made by those skilled in the art within the substantial scope of this utility model should all fall within the patent coverage of this utility model.

Claims

1. An integrated equipment for each process after chip packaging and dicing, characterized in that: It includes a platform (1), a material conveying module, various process modules and a control module; the material conveying module and various process modules are respectively connected to the control module in communication. The material conveying module is configured to convey materials between various process modules. Each process module includes a feeding module (2), a degumming module (3), a defective product rejection module (4), a good product collection module (5) and a recycling module (6) arranged sequentially on the platform (1).

2. The integrated equipment for each process after chip packaging and dicing according to claim 1, characterized in that: The material conveying module includes a translational conveying mechanism and a material conveying robot mechanism; the material conveying robot mechanism includes several lifting material conveying robots, which are respectively connected to the translational conveying mechanism and are movably located between the corresponding process modules.

3. The integrated equipment for each process after chip packaging and dicing according to claim 1, characterized in that: The feeding module (2) includes a feeding mechanism and a receiving mechanism; the receiving mechanism is located on one side of the feeding mechanism, the feeding mechanism includes a lifting platform (12) and a material container (13) located on the lifting platform (12), the receiving mechanism includes a receiving robot (15) and a robot power component; the robot power component is configured to drive the receiving robot (15) to take out materials from the material container (13).

4. The integrated equipment for each process after chip packaging and dicing according to claim 3, characterized in that: The side of the material container (13) facing the receiving mechanism is open. The inner surface of the material container (13) is provided with multiple sets of vertically spaced material placement steps (16). Each set of material placement steps (16) includes two strip plates symmetrically arranged on the two inner surfaces of the material container (13). The receiving robot (15) includes a clamping component and a connecting component. The clamping component is connected to the robot power component through the connecting component. The robot power component is configured to drive the clamping component to perform translational motion.

5. The integrated equipment for each process after chip packaging and dicing according to claim 1, characterized in that: The degumming module (3) includes a degumming chamber (20), a support frame (21), and a transmission power assembly; the support frame (21) is located on one side of the degumming chamber (20), and the side of the degumming chamber (20) facing the support frame (21) is an open design; the support frame (21) is configured to extend into or out of the degumming chamber (20) under the drive of the transmission power assembly; a degumming light source is provided in the degumming chamber (20), and the degumming light source is configured to irradiate the bottom surface of the material carried on the support frame (21).

6. The integrated equipment for each process after chip packaging and dicing according to claim 1, characterized in that: The defective product rejection module (4) includes a visual inspection mechanism, a rejection mechanism, an XY motion carrier platform (23), and a defective product receiving component (25). The defective product receiving component (25) is provided on one side of the XY motion carrier platform (23), and a visual inspection mechanism is provided above the XY motion carrier platform (23). The rejection mechanism is provided on one side of the visual inspection mechanism. The rejection mechanism includes a translatable and lifting robotic arm, which is configured to take defective products from the XY motion carrier platform (23) and send them to the defective product receiving component (25).

7. The integrated equipment for each process after chip packaging and dicing according to claim 1, characterized in that: The good product collection module (5) includes a turning mechanism, a vibrating feeding mechanism and a good product receiving component (31); the good product receiving component (31) is located on one side of the turning mechanism; the turning mechanism includes a turning platform (29), a turning power component and a material fixing component, the turning platform (29) is connected to the turning power component and the turning platform (29) is provided with a material fixing component; the vibrating feeding mechanism includes an ultrasonic vibrating head (30) and a vibrating head power component, the ultrasonic vibrating head (30) is configured to move above the turning platform (29) under the drive of the vibrating head power component.

8. The integrated equipment for each process after chip packaging and dicing according to claim 7, characterized in that: The material fixing component includes a rotary clamping cylinder (28), the rotary clamping part of the rotary clamping cylinder (28) is disposed above the flipping platform (29), the cylinder body of the rotary clamping cylinder (28) is disposed below the flipping platform (29), and the surface of the flipping platform (29) is provided with a corresponding opening for the piston of the rotary clamping cylinder (28) to pass through.

9. The integrated equipment for each process after chip packaging and dicing according to claim 1, characterized in that: The recycling module (6) includes a tamping mechanism and a receiving mechanism; the tamping mechanism includes a support frame (33), a waste receiving component (32), and a tamping component that can be translated and lifted, the tamping component being located above the support frame (33), and the waste receiving component (32) being located below the support frame (33); the receiving mechanism includes a receiving platform (34) and a receiving robot that can be translated and lifted, the receiving platform (34) being located on one side of the support frame (33), and the receiving robot being configured to take materials from the support frame (33) and send them to the receiving platform (34).

10. The integrated equipment for each process after chip packaging and dicing according to claim 9, characterized in that: The tamping component and the collecting robot are respectively connected to the mounting plate, which is connected to the translational force assembly; the tamping component includes a tamping plate (35) and a tamping drive cylinder (36), and the tamping plate (35) is connected to the output end of the tamping drive cylinder (36); the collecting robot includes a collecting suction cup (37) and a collecting drive cylinder (38), and the collecting suction cup (37) is connected to the output end of the collecting drive cylinder (38).

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