A flat pressing film pasting mechanism

Abstract

The utility model relates to wafer film pasting technical field, in order to solve the technical problem that Taiko wafer film is easy to produce bubble and film material is easy to appear wrinkle in outer ring in prior art, the utility model discloses a flat pressure pasting film mechanism is provided with corner attachment mechanism, and the corner attachment mechanism includes upper fixed plate, and its below is equipped with corner moving lead screw, the left and right sides of corner moving lead screw are equipped with inclined jack sliding block mechanism respectively, the end of upper fixed plate is fixed with fixed side plate, and the fixed side plate below is installed with rotating shaft, and the rotating portion of rotating shaft is connected with attachment bottom plate, and the attachment bottom plate can swing around rotating shaft center under the drive of corner moving lead screw horizontal motion, and is driven by inclined jack sliding block mechanism, the above of attachment bottom plate is installed with guide mechanism and pressure ring air cylinder, and the below of attachment bottom plate is installed with adsorption platform, and the below of guide mechanism is equipped with outer ring pressure ring. Effectively improve the bubble production problem after wafer film pasting, reduce the wrinkle of film material on the ring step and other adverse problems simultaneously.

Description

Technical Field

[0001] This utility model relates to the field of wafer lamination technology, and in particular to a flat-pressure lamination mechanism. Background Technology

[0002] In existing technologies, the Taiko process is a processing method that preserves the wafer edge region during wafer thinning. Specifically, when thinning the wafer, only the inner edge region is processed, retaining an outer edge portion approximately 3mm wide. The thickness of this edge portion generally maintains the original wafer thickness or is moderately thinned according to specific process requirements. The wafer processed by this method has a disk-like structure, with its edges forming a reinforced support region of a certain height (approximately 0.3–0.8mm), while the central region is the thinned area. This structural design effectively prevents wafer warpage in subsequent electroplating, dicing, and other processes, improving processing stability and yield.

[0003] However, when performing film lamination on unremoved Taiko wafers, the unique wafer structure presents significant technical challenges with existing methods. The commonly used method involves directly laminating the film to the wafer. This method, however, easily leads to air bubbles forming between the film and the wafer after lamination, which are difficult to completely remove, affecting the bonding effect. Furthermore, due to the stepped structure at the edges of Taiko wafers, wrinkles and other defects easily occur when the film is attached to the outer edge of the wafer, negatively impacting the stability of subsequent processing steps and product yield.

[0004] Therefore, there is an urgent need for a film application mechanism that can adapt to the characteristics of the Taiko wafer structure in order to achieve high-quality and high-reliability film application operations. Utility Model Content

[0005] The purpose of this invention is to provide a flat-pressure film application mechanism to solve the technical problems in the prior art where Taiko wafer film application is prone to generating air bubbles and the film material is prone to wrinkles on the outer ring.

[0006] To achieve the above objectives, this utility model provides a flat-pressure film application mechanism, including support frames located on the left and right sides respectively. An upper frame is fixedly installed above the support frames, and a motor for Z-axis film application is mounted on the upper frame. A movable seat and an upper cavity are connected from top to bottom to the inner side of the support frames via a slide rail mechanism. A lower cavity, which cooperates with and is closed to the upper cavity, is provided at the bottom of the upper cavity. The motor is connected to the movable seat via a lifting screw. A buffer mechanism is connected between the movable seat and the top of the upper cavity. A corner application mechanism is provided in the upper cavity. The corner application mechanism includes an upper fixed plate, which is convex in shape, and a corner moving screw is provided below it. The left and right sides of the corner moving screw are respectively... It is equipped with an inclined sliding block mechanism; a fixed side plate is fixed to the end of the upper fixed plate, and a rotating shaft is installed below the fixed side plate; the rotating part of the rotating shaft is connected to an attachment base plate, which can swing around the center of the rotating shaft by being driven by the horizontal movement of the angular moving screw; a guide mechanism and a pressure ring cylinder are installed above the attachment base plate, and an adsorption platform is installed below the attachment base plate; an outer ring pressure ring is provided below the guide mechanism; the pressure ring cylinder is used to drive the outer ring pressure ring to move up and down, wherein when the pressure ring cylinder is in the contracted state, the outer ring pressure ring is pressed down, and when the pressure ring cylinder is in the extended state, the outer ring pressure ring is lifted up under the action of the compression spring.

[0007] By setting up a corner-mounting mechanism, the film material first contacts one end of the concave surface of the Taiko wafer at a certain angle during the mounting process. Then, the corner-moving screw drives the mounting base plate to swing along the rotation axis, realizing the tilted mounting of the film material from one end to the other. In a vacuum environment, air bubbles can be effectively expelled, significantly improving the film mounting quality. After the mounting is completed, the outer ring pressure ring is driven by the pressure ring cylinder to press down, evenly pressing the film material on the outer ring of the adsorption platform onto the outer side of the step of the Taiko wafer, avoiding wrinkling or curling of the film material. This ensures that the film material and the wafer are firmly and reliably attached, improving product yield, adapting to the structural characteristics of the un-removed Taiko wafer, and meeting the requirements of high-quality and high-reliability film mounting processes.

[0008] Furthermore, the support frame includes a left support frame and a right support frame located on the left and right sides respectively, and the slide rail mechanism includes a guide rail fixedly connected to the inner side of the left support frame and the right support frame. An upper slider and a lower slider are installed on the guide rail, and a movable seat and an upper cavity are fixedly connected to the upper slider and the lower slider respectively.

[0009] By setting guide rails between the left and right support frames and installing upper and lower sliders on the guide rails, the moving seat and upper cavity can achieve stable and precise lifting and guiding movements on the guide rails, effectively improving the overall stability and positioning accuracy of the film application mechanism, and ensuring synchronization and structural reliability during the application process.

[0010] Furthermore, a cavity lifting cylinder is fixed above the movable seat, and the telescopic rod of the cavity lifting cylinder is fixedly connected to the upper cavity.

[0011] By setting a cavity lifting cylinder on the moving seat and connecting its telescopic rod to the upper cavity, the upper cavity can be independently and precisely pressed down after the entire upper cavity descends with the moving seat, which enhances the accuracy of the upper cavity closure control and thus improves the reliability of cavity closure and adhesion during the film application process.

[0012] Furthermore, a grating ruler is provided for high-precision position detection and feedback control. The motor and the grating ruler work together to form a closed-loop control system.

[0013] The grating ruler is used to measure the real-time displacement position of the moving seat or corner attachment mechanism driven by the lifting screw; by feeding the displacement back to the motor control system, the motor operation accuracy is improved and position drift is avoided; precise control of the initial contact angle between the film material and the wafer helps to achieve smooth, gradual, and bubble-free attachment of the film material from one end to the other, ensuring the attachment quality.

[0014] The closed-loop control system, consisting of a motor and a grating ruler, ensures that the initial attachment surface of the film is level with the wafer attachment surface. It also enables tilted attachment from one end to the other in a vacuum environment, achieving high-precision alignment between the attachment mechanism and the wafer attachment surface before film application. This improves defoaming efficiency, avoids wrinkles, ensures accurate and stable attachment process, and effectively enhances defoaming effect and film yield.

[0015] Furthermore, the upper cavity has an observation window on its side wall, and the lower cavity has a vacuum adsorption platform.

[0016] By setting a cavity observation window on the side wall of the upper cavity, operators can easily observe the adhesion status and film alignment inside the cavity in real time during the film application process, improving the visibility of the operation and the accuracy of process control; a vacuum adsorption platform is set in the lower cavity for effective adsorption and fixation.

[0017] The flat-pressure film-applying mechanism provided by this utility model has the following advantages:

[0018] The horizontal movement of the corner-mounting mechanism's corner-moving lead screw drives the inclined sliding block mechanism, enabling the mounting base plate to rotate and mount around the central axis of the rotation shaft. During this rotation, the film material first contacts the end of the concave surface of the Taiko wafer, and then gradually unfolds and mounts towards the other end at a certain angle, achieving an inclined bonding between the film material and the wafer mounting surface from one end to the other. Because the mounting process is carried out in a vacuum environment and uses an inclined, gradual bonding method, gas between the film material and the wafer can be effectively expelled, significantly improving the de-bubbling effect and fundamentally solving the problem of air bubbles easily generated during wafer mounting. After the film is mounted, the contraction action of the pressure ring cylinder drives the guiding mechanism, causing the outer pressure ring to press downwards, evenly pressing the film material at the edge of the adsorption platform onto the outer surface of the Taiko wafer step. Due to the uniform force applied by the pressure ring, defects such as wrinkles and curling edges of the film material at the outer mounting area can be effectively prevented, improving the quality and reliability of the mounting. Attached Figure Description

[0019] Figure 1 A three-dimensional structural diagram of the flat-pressure film-applying mechanism provided by this utility model;

[0020] Figure 2 A schematic diagram of the cavity opening state of the flat pressure film applicator provided by this utility model;

[0021] Figure 3 A schematic diagram of the cavity closure state of the flat-pressure film-applying mechanism provided by this utility model;

[0022] Figure 4 A three-dimensional structural diagram of the corner attaching mechanism provided by this utility model;

[0023] Figure 5 The diagram shows the initial state of the attachment mechanism from left to right after the upper and lower cavities are closed, the attachment mechanism after corner attachment, and the attachment mechanism after the outer pressure ring is pressed down.

[0024] In the diagram: 11. Lifting guide rail for film application mechanism; 12. Lifting guide rail for cavity mechanism; 13. Upper cavity; 14. Right support frame; 15. Lower vacuum adsorption platform; 16. Lower cavity; 17. Left support frame; 18. Upper frame; 19. Motor; 22. Moving seat; 23. Cavity lifting cylinder; 24. Lifting and moving screw cylinder; 25. Grating ruler; 26. Lifting screw; 27. Cavity buffer mechanism; 28. Cavity observation window; 30. Corner attachment mechanism; 301. Corner moving screw; 302. Fixed side plate; 303. Rotating shaft; 304. Adsorption platform; 305. Guide mechanism; 306. Compression spring; 307. Attachment base plate; 308. Outer ring pressure ring; 309. Pressure ring cylinder; 310. Clearance spring; 311. Upper fixed plate; 312. Inclined top slider mechanism. Detailed Implementation

[0025] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain this utility model and are not intended to limit this utility model.

[0026] See Figures 1 to 5 This utility model provides a flat-pressure film application mechanism, including support frames located on the left and right sides respectively. An upper frame 18 is fixedly installed on the upper support frame, and a motor 19 for Z-axis film application is installed on the upper frame 18. A movable seat 22 and an upper cavity 13 are connected from top to bottom on the inner side of the support frame through a slide rail mechanism. A lower cavity 16 is provided at the bottom of the upper cavity 13. The motor 19 is connected to the movable seat 22 through a lifting screw 26. A buffer mechanism is connected between the movable seat 22 and the top of the upper cavity 13. A corner application mechanism 30 is provided in the upper cavity 13. The corner application mechanism 30 includes an upper fixed plate 311, and a corner moving screw 301 is provided below it. An inclined sliding block mechanism 312 is provided on the left and right sides of the corner moving screw 301; a fixed side plate 302 is fixed to the end of the upper fixed plate 311, and a rotating shaft 303 is installed below the fixed side plate 302; the rotating part of the rotating shaft 303 is connected to an attachment base plate 307, which can swing around the center of the rotating shaft 303 by being driven by the horizontal movement of the corner moving screw 301 through the inclined sliding block mechanism 312; a guide mechanism 305 and a pressure ring cylinder 309 are installed above the attachment base plate 307, an adsorption platform 304 is installed below the attachment base plate 307, and an outer ring pressure ring 308 is provided below the guide mechanism 305;

[0027] The compression ring cylinder 309 is used to drive the outer ring compression ring 308 to move up and down. When the compression ring cylinder 309 is in the contracted state, the outer ring compression ring 308 is pressed down. When the compression ring cylinder 309 is in the extended state, the outer ring compression ring 308 is lifted up by the compression spring 306.

[0028] The motor 19 is connected to the lifting screw 26 to provide the overall lifting movement of components such as the upper cavity 13 and the moving seat 22. The moving seat 22 is guided to lift and lower via the lifting guide rail 11 of the film-applying mechanism.

[0029] The wafer is fixed on the lower vacuum adsorption platform 15 by manual operation or equipment. The film material is fixed by manual operation or equipment on the corner attachment mechanism 30. Before the film is attached, the motor 19 rotates, driving the lifting screw 26 to move the moving seat 22 and the upper cavity 13 downward to the attachment area. Then, the cavity lifting cylinder 23 extends, and the upper cavity 13 moves downward through the guide rail 12 of the cavity mechanism, closing the upper and lower cavities 16. When the cavities are closed, there is still a certain distance between the corner attachment mechanism 30 and the lower vacuum adsorption platform 15. At this time, the closed-loop control system of the motor 19 and the grating ruler 25 works to make the rotating axis plane of the corner attachment mechanism 30 level with the wafer attachment surface of the lower vacuum adsorption platform 15. In this state, the adsorption platform 304 in the corner attachment mechanism 30 adsorbs the film material relative to the lower vacuum adsorption platform 15. When the wafer is at a certain angle, the corner moving screw 301 in the corner attachment mechanism 30 moves horizontally and drives the inclined top slider mechanism 312 to rotate the attachment base plate 307 along the center of the rotation axis 303 for attachment. During this rotation, the film material will first contact the end face of the concave surface of the Taiko, and then slowly tilt so that the film material is attached from one end to the other relative to the wafer attachment surface. Because it is in a vacuum environment and is attached from one end to the other, this attachment process has a high bubble removal capacity. After the overall attachment is completed, the pressure ring cylinder 309 retracts, driving the guide mechanism 305 to press down the outer ring pressure ring 308. In this way, the film material on the outer ring of the adsorption platform 304 will be pressed to the outer side of the Taiko wafer step by the outer ring pressure ring 308. Because the force applied to the outer ring surface is uniform, no abnormalities such as wrinkles will occur after the outer ring film material is attached to the wafer.

[0030] Specifically, the support frame includes a left support frame 17 and a right support frame 14 located on the left and right sides respectively. The slide rail mechanism includes a guide rail fixedly connected to the inner sides of the left support frame 17 and the right support frame 14. An upper slider and a lower slider are installed on the guide rail. The upper slider and the lower slider are fixedly connected to the moving seat 22 and the upper cavity 13 respectively. Functionally, the guide rail is divided into two parts: the film application mechanism lifting guide rail 11 and the cavity mechanism lifting guide rail 12.

[0031] By setting guide rails between the left and right support frames 14 and installing upper and lower sliders on the guide rails, the movable seat 22 and the upper cavity 13 can achieve stable and precise lifting and guiding movements on the guide rails, effectively improving the overall stability and positioning accuracy of the film application mechanism, and ensuring the synchronization and structural reliability during the application process.

[0032] A cavity lifting cylinder 23 is fixed above the movable seat 22, and the telescopic rod of the cavity lifting cylinder 23 is fixedly connected to the upper cavity 13.

[0033] By setting a cavity lifting cylinder 23 on the movable seat 22 and connecting its telescopic rod to the upper cavity 13, the upper cavity 13 can be independently and precisely pressed down after the entire upper cavity 13 descends with the movable seat 22, which enhances the accuracy of the upper cavity 13 closure control and thus improves the reliability of cavity closure and adhesion during the film application process.

[0034] A grating ruler 25 is provided for high-precision position detection and feedback control. The motor 19 and the grating ruler 25 work together to form a closed-loop control system.

[0035] The grating ruler 25 is used to measure the real-time displacement position of the moving seat 22 or the corner attachment mechanism 30 driven by the lifting screw 26; by feeding the displacement back to the control system of the motor 19, the motor 19 can operate with higher precision and avoid position drift; precise control of the initial contact angle between the film material and the wafer helps to achieve smooth, gradual and bubble-free attachment of the film material from one end to the other, ensuring the attachment quality.

[0036] The closed-loop control system consisting of motor 19 and grating ruler 25 ensures that the initial attachment surface of the film material is level with the wafer attachment surface, and achieves tilted attachment from one end to the other in a vacuum environment. This enables high-precision alignment between the attachment mechanism and the wafer attachment surface before film application, thereby improving defoaming efficiency and avoiding wrinkles. It ensures that the attachment process is accurate and stable, effectively improving the defoaming effect and film application yield.

[0037] The upper cavity 13 has a cavity observation window 28 on its side wall, and the lower cavity 16 has a vacuum adsorption platform 304.

[0038] By setting a cavity observation window 28 on the side wall of the upper cavity 13, the operator can observe the bonding status and film alignment inside the cavity in real time during the film application process, thereby improving the visibility of the operation and the accuracy of process control; a vacuum adsorption platform 304 is set in the lower cavity 16 for effective adsorption and fixation.

[0039] The flat-pressure film-applying mechanism provided by this utility model has the following advantages:

[0040] The horizontal movement of the corner moving screw in the corner attaching mechanism drives the inclined top slider mechanism to rotate the attaching base plate along the center of the rotation axis for attaching. During this rotation, the film material will first contact the end face of the concave Taiko surface, and then slowly tilt so that the film material is attached from one end to the other relative to the wafer attachment surface. Because it is in a vacuum environment and is attached from one end to the other at an angle, this attachment process has a high de-bubbling capability, solving the problem of bubble generation after wafer film attachment.

[0041] After the entire bonding process is completed, the pressure ring cylinder contracts, driving the guide mechanism to press down the outer pressure ring. In this way, the film material on the outer ring of the adsorption platform will be pressed onto the outer side of the Taiko wafer step by the outer pressure ring. Because the force applied to the outer ring surface is uniform, no abnormalities such as wrinkles will occur after the outer ring film material is bonded to the wafer.

[0042] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A flat pressing film pasting mechanism, comprising a support frame, an upper frame body (18) being fixedly installed above the support frame, characterized in that, The upper frame (18) is equipped with a motor (19) for Z-axis film application. The inner side of the support frame is connected from top to bottom to a movable seat (22) and an upper cavity (13) via a slide rail mechanism. The bottom of the upper cavity (13) is provided with a lower cavity (16) that cooperates with and closes it. The motor (19) is connected to the movable seat (22) via a lifting screw (26). The movable seat (22) is connected to the top of the upper cavity (13) by a buffer mechanism (27). The upper cavity (13) is provided with a corner application mechanism (30). The corner application mechanism (30) includes: The upper fixed plate (311) has a corner moving screw (301) below it; The left and right sides of the angle moving screw (301) are respectively provided with inclined top slider mechanism (312); The upper fixing plate (311) is fixed with a fixing side plate (302) at its end, and a rotating shaft (303) is installed below the fixing side plate (302); The rotating part of the rotating shaft (303) is connected to an attachment base plate (307). The attachment base plate (307) can swing around the center of the rotating shaft (303) under the drive of the horizontal movement of the corner moving screw (301) and the inclined top slider mechanism (312). A guide mechanism (305) and a pressure ring cylinder (309) are installed above the attachment base plate (307), an adsorption platform (304) is installed below the attachment base plate (307), and an outer ring pressure ring (308) is provided below the guide mechanism (305).

2. The flat pressing film pasting mechanism according to claim 1, characterized in that, The support frame includes a left support frame (17) and a right support frame (14) located on the left and right sides respectively. The slide rail mechanism includes a guide rail fixedly connected to the inner side of the left support frame (17) and the right support frame (14). An upper slider and a lower slider are installed on the guide rail. The upper slider and the lower slider are fixedly connected to the movable seat (22) and the upper cavity (13) respectively.

3. The flat pressing film pasting mechanism according to claim 1, characterized in that, A cavity lifting cylinder (23) is fixed above the movable seat (22), and the telescopic rod of the cavity lifting cylinder (23) is fixedly connected to the upper cavity (13).

4. The flat pressing film pasting mechanism according to claim 1, characterized in that, A grating ruler (25) is provided for high-precision position detection and feedback control. The motor (19) and the grating ruler (25) cooperate to form a closed-loop control system.

5. The flat pressing film pasting mechanism according to claim 1, characterized in that, The upper cavity (13) is provided with a cavity observation window (28) on its side wall, and the lower cavity (16) is provided with a vacuum adsorption platform (15).

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