A high-safety unloading device based on automatic film pasting of semiconductor chips

Abstract

This invention proposes a high-safety unloading device for automatic semiconductor chip film application, comprising a robotic arm with a mounting rod at its end. A linear drive module is parallel to one side of the mounting rod, with its free end extending below the mounting rod and connected to a support arm. A stop rod parallel to the mounting rod is installed at the end of the support arm. An air guide pipe is located on the other side of the mounting rod, with its top connected to a negative pressure device and its bottom extending below the mounting rod and connected to a suction cup. The suction cup corresponds to the stop rod. In use, the robotic arm drives the suction cup to be vertically positioned directly above the chip to be film-applied, allowing the suction cup to pick up the chip. Then, driven by the robotic arm, the device moves to the film application station. To completely detach the chip from the suction cup, the stop rod can be used to press against the chip with a certain force, ensuring the chip is firmly positioned at the station and preventing the chip from sticking to the suction cup.

Description

Technical Field

[0001] This utility model relates to the field of chip coating technology, specifically a high-safety feeding device for automatic semiconductor chip coating. Background Technology

[0002] Chip lamination is a crucial step in chip manufacturing, involving attaching a thinned wafer to a special adhesive film. This process, primarily involving the application of a photolithography film onto the wafer, must be performed under ambient light because the photolithography film is highly sensitive to natural light. The purpose of lamination is to allow subsequent laser irradiation to induce changes in the physical and chemical properties of the photolithography film, thereby forming the desired image on the wafer surface. Ultimately, this allows for the formation of the chip circuitry through subsequent processing.

[0003] During the chip lamination process, chips need to be picked up and placed into the chip lamination equipment. Since chip lamination is a precise and continuous process, it cannot be completed in batches manually; moreover, chip manufacturing is a delicate process, and manual operation is more prone to damage. Therefore, we propose a high-safety unloading device based on automated semiconductor chip lamination. Utility Model Content

[0004] This invention provides a high-safety feeding device for automatic semiconductor chip film application, which has the advantages of automatic chip picking and placement, and solves the problems mentioned in the background art.

[0005] The technical solution of this utility model is implemented as follows: A high-safety unloading device for automatic film application of semiconductor chips is designed, including a robotic arm. The end of the robotic arm is provided with a mounting rod. A linear drive module is provided parallel to one side of the mounting rod. The free end of the linear drive module extends to the bottom of the mounting rod and is connected to the support arm. A stop rod parallel to the mounting rod is installed at the end of the support arm. An air guide pipe is provided on the other side of the mounting rod. The top of the air guide pipe is connected to a negative pressure device, and the bottom of the air guide pipe extends to the bottom of the mounting rod and is connected to a suction cup. The suction cup corresponds to the stop rod.

[0006] Preferably, the mounting rod is detachably mounted on the end of the robotic arm via a connecting plate.

[0007] Preferably, the bottom of the abutment is provided with a protective sleeve.

[0008] Preferably, an anti-collision sensor is provided on one side of the mounting rod to prevent the suction cup from colliding with other objects.

[0009] Preferably, a pressure detector is installed on the air duct.

[0010] Preferably, the linear drive module includes a guide rail, a slider slidably mounted on the guide rail, a lead screw parallel to one side of the guide rail, a nut threaded onto the lead screw, the top of the lead screw rotatably mounted in a first support, the first support also being equipped with a drive motor for driving the lead screw to rotate, the bottom of the lead screw rotatably mounted in a second support, both the second and first supports being mounted on a mounting rod, the nut and the slider being connected by a connecting plate, a guide shaft parallel to the lead screw being mounted on the connecting plate, the guide shaft extending downward and movably positioned within the second support, and a support arm mounted below the guide shaft.

[0011] Preferably, a pressure detector is installed at the bottom of the guide shaft, and the support arm is installed below the pressure detector.

[0012] Preferably, the suction cup is annular, and the push rod is coaxial with the suction cup, allowing the push rod to pass through the suction cup under the drive of the linear drive module.

[0013] Preferably, a PLC control system is also included.

[0014] Preferably, a displacement sensor is provided on one side of the guide rail, and the free end of the displacement sensor is connected to the connecting plate.

[0015] Compared with the prior art, in use, the robotic arm drives the suction cup to be vertically positioned directly above the chip to be coated, allowing the suction cup to pick up the chip. Then, driven by the robotic arm, the chip is moved to the coating station. In order to completely detach the chip from the suction cup, a rod can be used to press against the chip with a certain force, so that the chip is firmly positioned at the station and the chip is prevented from sticking to the suction cup. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a structural schematic diagram of one side of the present invention.

[0018] Figure 2 This is a schematic diagram of the structure on the other side of this utility model.

[0019] Figure 3 This is a schematic diagram of the specific structure of the mounting rod of this utility model. Figure 1 .

[0020] Figure 4 This is a schematic diagram of the specific structure of the mounting rod of this utility model. Figure 2 .

[0021] In the diagram: 1. Robotic arm; 2. Connecting plate; 3. Mounting rod; 4. Guide rail; 5. Suction cup; 6. Guide shaft; 7. Lead screw; 8. Drive motor; 9. Air pressure detector; 10. Anti-collision sensor; 11. Support arm; 12. Air duct; 13. First support; 14. Connecting plate; 15. Lead screw nut; 16. Second support; 17. Pressure detector; 18. Support rod. Detailed Implementation

[0022] The technical solution of this utility model will be clearly and completely described below with reference to its embodiments. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0023] Reference Figures 1 to 4 This utility model provides a technical solution: a high-safety unloading device for automatic film application of semiconductor chips, including a robotic arm 1. The robotic arm 1 is a six-axis robotic arm with an accuracy of ±0.03 mm or even higher, which can meet the requirements for handling semiconductor chips. The robotic arm 1 is electrically connected to a PLC control system. The PLC control system is widely used in the field of intelligent control, so the PLC control system controls the robotic arm 1 to operate according to a set path.

[0024] All components for handling the chip are concentrated at the end of the robotic arm; that is, the end of robotic arm 1 is equipped with mounting rod 3, such as... Figure 3 As shown, a connecting plate 2 is provided at the top of the mounting rod, and the mounting rod 3 is detachably mounted on the end of the robotic arm 1 via the connecting plate 2; A linear drive module is provided parallel to one side of the mounting rod 3, such as Figure 3 and Figure 4 As shown, the linear drive module includes a guide rail 4, which is mounted on a mounting rod 3. A slider is slidably mounted on the guide rail 4. A lead screw 7 is parallel to one side of the guide rail 4. The top of the lead screw 7 is rotatably mounted in a first support 13. A drive motor 8 for driving the lead screw 7 to rotate is also mounted on the first support 13. The bottom of the lead screw 7 is rotatably mounted in a second support 16. Both the second support 16 and the first support 13 are mounted on the mounting rod 3. Therefore, when the drive motor 8 rotates, it can drive the lead screw 7 to rotate. A nut 15 is threaded onto the lead screw 7. The lead screw 7 is a high-precision ball screw, and the nut 15 is also a corresponding ball nut. The lead screw nut 15 is connected to the slider via the connecting plate 14, which allows the guide rail 4 to support the connecting plate 14, so that the connecting plate 14 can only reciprocate along the guide rail 4. A guide shaft 6 parallel to the lead screw 7 is also installed on the connecting plate 14. The guide shaft 6 extends downward and is movably placed in the second support 16. The second support 16 is provided with a linear bearing sleeved on the guide shaft 6 to reduce friction, and the support arm 11 is installed below the guide shaft 6. Guide shaft 6 can extend and retract under the drive of lead screw 7. Guide shaft 6 can be understood as the free end of the linear drive module, such as... Figure 3 and Figure 4 As shown, the free end of the linear drive module extends below the mounting rod 3 and is connected to the support arm 11. That is, the lower end of the guide shaft 6 is connected to the support arm 11. The support arm 11 extends downward toward the mounting rod 3. A stop rod 18 parallel to the mounting rod 3 is installed at the end of the support arm 11. The stop rod 18 is a thin rod, and a protective sleeve is provided at the bottom of the stop rod 18. The protective sleeve is made of sponge or rubber.

[0025] Furthermore, on the other side of the mounting rod 3, there is an air guide pipe 12. The air guide pipe 12 is a rigid pipe, and its top is connected to a negative pressure device. The negative pressure device includes a pipe connected to the air guide pipe 12 and a control valve installed on the pipe. This pipe is installed on the negative pressure pump body, such as... Figure 3 and Figure 4 As shown, the bottom of the air guide tube 12 extends to the bottom of the mounting rod 3 and is connected to the suction cup 5. The suction cup 5 corresponds to the push rod 18. The suction cup 5 is annular and has a protective pad at the bottom. The protective pad and the bottom of the suction cup 5 have at least one suction hole. The push rod 18 is coaxial with the suction cup 5. Under the drive of the linear drive module, the push rod 18 can pass through the suction cup 5. Specifically, when the PLC control system controls the robotic arm 1 to operate according to the set path, the robotic arm 1 drives the mounting rod 3 to be vertically positioned directly above the chip to be coated. At this time, the suction cup 5, driven by the negative pressure device, adsorbs the chip. Then, driven by the robotic arm 1, it moves to the coating station, with the suction cup facing the station. At this time, the negative pressure device stops, allowing the chip to pick up the adsorption force. However, in order to completely detach the chip from the suction cup 5, the drive motor 8 drives the abutment rod 18 into the suction cup 5, allowing the abutment rod 18 to press the chip against the chip with a certain force, so that the chip is firmly located at the station and does not stick to the suction cup. In actual operation, after the abutment 18 presses against the chip, the robotic arm 1 drives the suction cup 5 to lift slightly upward, allowing the suction cup to separate from the chip. Then the abutment 18 separates from the suction cup. The protective sleeve at the end of the abutment 18 is pointed and its area is very small compared to that of the suction cup 5. When the abutment 18 separates from the chip, it can ensure that the two separate smoothly.

[0026] Furthermore, an anti-collision sensor 10 is provided on one side of the mounting rod 3. The anti-collision sensor 10 is provided to prevent the suction cup 5 from colliding with other objects. A pressure detector 9 is installed on the air duct 12. The pressure detector 9 is used to detect the pressure inside the air duct 12, so that the suction force of the suction cup 5 is kept constant under the control of the PLC control system. In order to accurately monitor the force of the push rod 18 against the chip, the bottom of the guide shaft 6 is connected to the support arm 11 through the pressure detector 17. That is, the pressure detector 17 is installed at the bottom of the guide shaft 6, and the support arm 11 is installed below the pressure detector 17. In this way, when the push rod 18 contacts the chip, the force generated between the push rod 18 and the chip will be monitored in real time by the pressure detector 17, so as to prevent the pressure applied by the push rod 18 to the chip from exceeding the preset value. A displacement sensor is installed on one side of the guide rail 4. The displacement sensor is a grating sensor, which can accurately monitor the movement distance of the abutment rod 18. During installation, the free end of the displacement sensor is connected to the connecting plate 14. The aforementioned drive motor 8, air pressure detector 9, anti-collision sensor 10, pressure detector 17, and negative pressure device are electrically connected to the PLC control system. The PLC control system can receive feedback information from each sensing element and then accurately control the operation of the robotic arm 1 and each component based on this information. Due to the high movement precision of the robotic arm 1, it can safely pick up the chip and then stably place the chip at the film-applying station via the abutment rod 18. The whole process is both safe and efficient.

[0027] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A high-safety unloading device for automatic film application of semiconductor chips, comprising a robotic arm (1), characterized in that, The robotic arm (1) has a mounting rod (3) at its end; A linear drive module is provided parallel to one side of the mounting rod (3). The free end of the linear drive module extends to the bottom of the mounting rod (3) and is connected to the support arm (11). A stop rod (18) parallel to the mounting rod (3) is installed at the end of the support arm (11). The other side of the mounting rod (3) has an air guide tube (12). The top of the air guide tube (12) is connected to the negative pressure device. The bottom of the air guide tube (12) extends to the bottom of the mounting rod (3) and is connected to the suction cup (5). The suction cup (5) corresponds to the push rod (18).

2. The high-safety feeding device based on automatic semiconductor chip film application as described in claim 1, characterized in that, The mounting rod (3) is detachably mounted on the end of the robotic arm (1) via the connecting plate (2).

3. The high-safety feeding device based on automatic semiconductor chip film application as described in claim 1, characterized in that, The bottom of the abutment (18) is provided with a protective sleeve.

4. The high-safety feeding device based on automatic semiconductor chip film application as described in claim 2 or 3, characterized in that, The mounting rod (3) is equipped with an anti-collision sensor (10) on one side to prevent the suction cup (5) from colliding with other objects.

5. The high-safety feeding device based on automatic semiconductor chip film application as described in claim 4, characterized in that, A pressure detector (9) is installed on the air duct (12).

6. The high-safety feeding device based on automatic semiconductor chip film application as described in claim 5, characterized in that, The linear drive module includes a guide rail (4), and a slider is slidably provided on the guide rail (4); A lead screw (7) is provided parallel to one side of the guide rail (4). A nut (15) is threaded on the lead screw (7). The top of the lead screw (7) is rotatably set in the first support (13). The first support (13) is also provided with a drive motor (8) for driving the lead screw (7) to rotate. The bottom of the lead screw (7) is rotatably set in the second support (16). The second support (16) and the first support (13) are both set on the mounting rod (3). The lead screw (15) is connected to the slider through the connecting plate (14). A guide shaft (6) parallel to the lead screw (7) is also installed on the connecting plate (14). The guide shaft (6) extends downward and is movably placed inside the second support (16). The support arm (11) is installed below the guide shaft (6).

7. The high-safety feeding device based on automatic semiconductor chip film application as described in claim 6, characterized in that, A pressure detector (17) is installed at the bottom of the guide shaft (6), and the support arm (11) is installed below the pressure detector (17).

8. The high-safety feeding device based on automatic semiconductor chip film application as described in claim 7, characterized in that, The suction cup (5) is ring-shaped, and the push rod (18) is coaxial with the suction cup (5). Under the drive of the linear drive module, the push rod (18) can pass through the suction cup (5).

9. The high-safety feeding device based on automatic semiconductor chip film application as described in claim 1, characterized in that, It also includes a PLC control system.

10. The high-safety feeding device based on automatic semiconductor chip film application as described in claim 1, characterized in that, A displacement sensor is provided on one side of the guide rail (4), and the free end of the displacement sensor is connected to the connecting plate (14).

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