Wafer probe card carrier device

Abstract

The utility model relates to probe card technical field, concretely is a wafer probe card bearing device, including test box, the bearing device includes: setting up in the bearing seat of test box top, the bearing seat swing setting is in the top of test box, setting up in the locating cover of bearing seat top, setting up the probe card bearing adjustment mechanism on the side wall of locating cover, the utility model discloses through design can flexibly adjust to wafer probe card clamping bearing angle and the bearing device of position, make through bearing adjustment mechanism can firmly and accurately clamping probe card, the test angle of probe card can be flexibly adjusted simultaneously, satisfy the test demand of diversification, and the drive mechanism adopts the way that horizontal and longitudinal screw rod module combines, can accurate adjustment bearing seat in horizontal and vertical direction's position, make probe card can reach the specified test position accurately and quickly, has improved the efficiency and accuracy of test.

Description

Technical Field

[0001] This utility model relates to the field of probe card technology, specifically a wafer probe card carrier device. Background Technology

[0002] In the field of semiconductor manufacturing and testing, wafer probe cards are key components that connect test equipment to chips on wafers. Their function is to perform electrical performance tests on chips during chip manufacturing to ensure that the quality and performance of chips meet design requirements. Existing probe card carrier devices generally adopt fixed clamping mechanisms, such as locking the probe card to a specific position on the carrier stage with multiple bolts, or using rigid clamps to clamp the probe card from several fixed directions.

[0003] Traditional support devices hold wafer probe cards in place using bolts or clamps. This method cannot flexibly adjust the angle and position of the wafer probe card, resulting in the wafer probe card being unable to adapt to testing different test chips. Utility Model Content

[0004] This utility model addresses the technical problems existing in the prior art by providing a wafer probe card carrier device to solve the problem that the wafer probe card carrier device cannot flexibly adjust the angle and position of the wafer probe card carrier.

[0005] The technical solution of this utility model to solve the above-mentioned technical problems is as follows: A wafer probe card carrier device is provided, including a test box, the carrier device comprising: A support seat is provided on the top of the test chamber, and the support seat is movably disposed on the top of the test chamber; A positioning cover is disposed on the top of the carrier, the positioning cover being a disc-shaped structure, the positioning cover being used to support the wafer probe card; A probe card support adjustment mechanism is provided on the side wall of the positioning cover; the support adjustment mechanism is used to clamp the probe card and adjust the test angle of the probe card. A drive mechanism located on the top of the test chamber is used to adjust the position of the support.

[0006] Furthermore, the load-bearing adjustment mechanism includes: A support platform is provided at the bottom of the positioning cover, and the cross-section of the support platform is I-shaped. Four pneumatic push rods are installed on the side wall of the positioning cover. The output end of each pneumatic push rod is equipped with a clamping block. The clamping block has a C-shaped cross-section and is compatible with the probe card. A rotating shaft is installed in the middle of the bearing seat, and the rotating shaft is connected to the bearing seat bearing; and The drive assembly located in the middle of the support base is used to drive the rotating shaft to rotate.

[0007] Furthermore, the driving component includes: A sliding frame is disposed in the middle of the support base; A movable lead screw is provided in the middle of the slide frame, and a drive motor is provided at one end of the movable lead screw. The drive motor is bolted to the side wall of the slide frame. A slider is disposed inside the sliding frame, and the slider is threadedly connected to the movable lead screw. A rack fixedly mounted on the side wall of the slider; and The gear is located in the middle of the rotating shaft, and the rack meshes with the gear.

[0008] Furthermore, the drive mechanism includes: A transverse lead screw module mounted on top of the test chamber; and A longitudinal screw module is disposed at the moving end of the transverse screw module, and the bearing seat is mounted on the moving end of the longitudinal screw module.

[0009] Furthermore, an observation camera is provided at the bottom of the positioning cover, and the observation camera is located at the center of the positioning cover. A display screen is provided on the side wall of the test box, and the observation camera is electrically connected to the display screen.

[0010] Furthermore, an angle ruler is provided on the top of the support platform, and a scale strip is provided on the side wall of the positioning cover.

[0011] Furthermore, a shield is provided on the top of the test chamber.

[0012] Furthermore, both the transverse lead screw module and the longitudinal lead screw module are provided with limit contact heads on their side walls, and the limit contact heads provide early warning of the movement range of the bearing seat.

[0013] The beneficial effects of this utility model are: This invention features a support device designed to flexibly adjust the clamping angle and position of a wafer probe card. The positioning cover and support platform provide a stable and suitable support structure for the probe card. The support adjustment mechanism securely and accurately clamps the probe card, while the testing angle can be flexibly adjusted to meet diverse testing needs. The drive mechanism combines horizontal and vertical lead screw modules, enabling precise adjustment of the support seat's position in both horizontal and vertical directions. This allows the probe card to quickly and accurately reach the designated testing position, improving testing efficiency and accuracy. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the overall structure of this utility model; Figure 2 This is an exploded view of the structure of this utility model; Figure 3 This is a schematic diagram of the drive mechanism in this utility model; Figure 4 This is a schematic diagram of the load-bearing adjustment mechanism in this utility model; Figure 5 This is a schematic diagram of the disassembly mechanism of the load-bearing adjustment mechanism in this utility model; Figure 6 This is a schematic diagram of the drive component in this utility model; The attached diagram lists the components represented by each number as follows: 1. Test chamber; 2. Support base; 3. Positioning cover; 4. Load-bearing adjustment mechanism; 41. Load-bearing platform; 42. Pneumatic push rod; 43. Clamping block; 44. Rotating shaft; 45. Drive assembly; 451. Slide frame; 452. Moving lead screw; 453. Drive motor; 454. Slider; 455. Rack; 456. Gear; 5. Drive mechanism; 51. Lateral lead screw module; 52. Longitudinal lead screw module; 6. Observation camera; 7. Display screen; 8. Angle ruler; 9. Scale bar; 10. Cover; 11. Limiting contact head. Detailed Implementation

[0015] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model. Furthermore, it should be understood that the specific embodiments described herein are merely for explaining this utility model and are not intended to limit this utility model.

[0016] In the description of this utility model, it should be understood that the terms "length", "width", "upper", "lower", "left", "right", "horizontal", "top", "bottom", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0017] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the stated features. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.

[0018] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection, an electrical connection, or a connection that allows for communication; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0019] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0020] The following disclosure provides numerous different embodiments or examples for implementing various structures of the present invention. To simplify the disclosure, specific examples of components and arrangements are described below. These are merely examples and are not intended to limit the scope of the invention. Furthermore, reference numerals and / or letters may be repeated in different examples; such repetition is for simplification and clarity and does not in itself indicate a relationship between the various embodiments and / or arrangements discussed. In addition, examples of various specific processes and materials are provided, but those skilled in the art will recognize the application of other processes and / or the use of other materials.

[0021] The present invention provides the following preferred embodiments: Example 1: Reference Figure 1 and Figure 2 As shown, a wafer probe card carrier device includes a test box 1, the carrier device comprising: The support seat 2 is set on the top of the test chamber 1, and the support seat 2 is movably set on the top of the test chamber 1; The positioning cover 3 is disposed on the top of the carrier 2. The positioning cover 3 is a disc and is used to support the wafer probe card. The probe card support adjustment mechanism 4 is disposed on the side wall of the positioning cover 3. The support adjustment mechanism 4 is used to clamp the probe card and adjust the testing angle of the probe card. The drive mechanism 5 is located on the top of the test chamber 1 and is used to adjust the position of the support 2.

[0022] During use and testing, the wafer probe card is placed on the positioning cover 3. The drive mechanism 5 operates, adjusting the position of the carrier 2 on the top of the test chamber 1 so that the positioning cover 3 and the probe card are roughly in the appropriate testing position. The probe card carrier adjustment mechanism 4 then operates, clamping and fixing the probe card while adjusting the testing angle of the probe card according to the testing requirements. This achieves precise docking testing between the probe card and the chip on the wafer. By flexibly adjusting the position of the carrier 2 and the angle of the probe card, users can quickly adapt to different testing needs, improving the accuracy and efficiency of wafer probe card testing. By fine-tuning the angle of the probe card, the coplanarity error between the probe and the wafer pad can be accurately compensated, ensuring that each probe can reliably contact the pad, thereby significantly improving the accuracy of test results and chip testing yield.

[0023] Example 2: Reference Figure 4 and Figure 5 As shown, the load-bearing adjustment mechanism 4 includes: The support platform 41 is located at the bottom of the positioning cover 3, and the cross-section of the support platform 41 is I-shaped. Four pneumatic push rods 42 are provided on the side wall of the positioning cover 3. The output end of the pneumatic push rod 42 is provided with a clamping block 43. The clamping block 43 has a C-shaped cross section and is adapted to the probe card. A rotating shaft 44 is installed in the middle of the bearing 2, and the rotating shaft 44 is connected to the bearing 2 of the bearing 2; and The drive assembly 45 is located in the middle of the support 2 and is used to drive the rotating shaft 44 to rotate.

[0024] In use, when the load adjustment mechanism 4 is working, the four pneumatic push rods 42 extend, pushing the C-shaped clamping block 43 at the output end towards the center, clamping and fixing the probe card onto the load platform 41, while ensuring that the probe card is fixed in the center position of the load platform 41. When it is necessary to adjust the test angle of the probe card, the drive component 45 drives the rotating shaft 44 to rotate. The rotating shaft 44 drives the positioning cover 3 and the load platform 41 to rotate, thereby changing the angle of the probe card. The I-shaped cross-section design of the load platform 41 increases the connection stability with the positioning cover 3, and at the same time provides a stable load platform for the probe card. In this way, through the flexible adjustment of the pneumatic push rods 42 and the support of the load platform 41, probe cards of different specifications can be accurately clamped, and the angle adjustment is more convenient, reducing human operation error and improving test stability. The rotating shaft 44 and the drive component 45 work together to achieve precise rotation and angle adjustment, so that the test angle can be finely adjusted, improving the accuracy of the test results.

[0025] Example 3: Reference Figure 6 As shown, the drive component 45 includes: The sliding frame 451 is disposed in the middle of the bearing seat 2; A movable lead screw 452 is provided in the middle of the slide frame 451. One end of the movable lead screw 452 is provided with a drive motor 453, and the drive motor 453 is bolted to the side wall of the slide frame 451. A slider 454 is disposed inside the sliding frame 451, and the slider 454 is threadedly connected to the moving lead screw 452. A rack 455 is fixedly installed on the side wall of the slider 454; and The gear 456 is located in the middle of the rotating shaft 44, and the rack 455 meshes with the gear 456.

[0026] In use, when the drive assembly 45 is working, the drive motor 453 starts, driving the moving lead screw 452 to rotate. Since the slider 454 is threadedly connected to the moving lead screw 452, under the rotation of the moving lead screw 452, the slider 454 moves along the slide frame 451. The rack 455 on the side wall of the slider 454 moves with the slider 454 and engages with the gear 456 in the middle of the rotating shaft 44, thereby driving the rotating shaft 44 to rotate, realizing the angle adjustment of the positioning cover 3 and the probe card. In this way, through the transmission method of the lead screw, slider 454, rack 455 and gear 456, the rotational motion of the drive motor 453 is converted into the precise rotational motion of the rotating shaft 44, which can realize the precise adjustment of the probe card angle. The transmission process is smooth and the angle adjustment accuracy is high, which is conducive to improving the accuracy of the test.

[0027] Example 4: Reference Figure 3 As shown, the drive mechanism 5 includes: The transverse lead screw module 51 installed on the top of the test chamber 1; and The longitudinal screw module 52 is disposed at the moving end of the transverse screw module 51, and the bearing seat 2 is installed at the moving end of the longitudinal screw module 52.

[0028] In use, when the drive mechanism 5 operates, the transverse lead screw module 51 starts first, and its moving end drives the longitudinal lead screw module 52 to move horizontally, thereby adjusting the position of the support seat 2 in the transverse direction. Then, the longitudinal lead screw module 52 starts, and its moving end drives the support seat 2 to move in a direction perpendicular to the transverse direction, thereby adjusting the position of the support seat 2 in the longitudinal direction. Through the coordinated work of the transverse and longitudinal lead screw modules 52, the support seat 2 is precisely moved to the desired position. Thus, by using a combination of transverse and longitudinal lead screw modules 52, the position of the support seat 2 can be adjusted, meeting the requirements for probe card position in different testing scenarios and improving the versatility and adaptability of the device.

[0029] Example 5: Reference Figure 5 As shown, an observation camera 6 is provided at the bottom of the positioning cover 3, and the observation camera 6 is located at the center of the positioning cover 3. A display screen 7 is provided on the side wall of the test box 1, and the observation camera 6 is electrically connected to the display screen 7.

[0030] During use, the observation camera 6 is installed at the bottom center of the positioning cover 3. It captures real-time images of the docking status between the probe card and the chip on the wafer during the test. The captured image information is transmitted to the display screen 7 on the side wall of the test chamber 1 via an electrical connection. The operator can intuitively observe the test docking status through the display screen 7 and promptly identify any problems that occur during the test. In this way, the combination of the observation camera 6 and the display screen 7 enables real-time monitoring, improving the operability and reliability of the device. The operator can understand the position and contact status of the wafer probe card through the display screen without touching the device, and make timely adjustments, thereby improving the accuracy and efficiency of the test.

[0031] Example 6: Reference Figure 4 As shown, an angle ruler 8 is provided on the top of the support platform 41, and a scale strip 9 is provided on the side wall of the positioning cover 3.

[0032] In use, the angle ruler 8 is set on the top of the support platform 41, and the scale strip 9 is set on the side wall of the positioning cover 3. When adjusting the angle of the probe card, the operator can intuitively understand the current angle of the probe card and the amount of change in the angle of rotation by observing the angle ruler 8 and the scale strip 9, so as to more accurately adjust the probe card to the required test angle. In this way, the combined use of the angle ruler 8 and the scale strip 9 provides an intuitive reference for angle adjustment, improves the accuracy and efficiency of angle adjustment, and further enhances the accuracy of the test.

[0033] Example 7: Reference Figure 1As shown, a shield 10 is provided on the top of the test box 1.

[0034] When in use, the shield 10 is installed on top of the test chamber 1 to provide a certain degree of protection for the entire load-bearing device and prevent external factors from interfering with the test process.

[0035] Example 8: Reference Figure 3 As shown, limit contact heads 11 are provided on the side walls of both the transverse lead screw module 51 and the longitudinal lead screw module 52. The limit contact heads 11 provide early warning of the movement range of the bearing seat 2.

[0036] In use, the limit contact 11 is installed on the side walls of the transverse lead screw module 51 and the longitudinal lead screw module 52. When the bearing seat 2 reaches the preset limit position, the limit contact 11 can issue a warning signal to prevent the bearing seat 2 from moving excessively. In this way, the setting of the limit contact 11 can effectively prevent the bearing seat 2 from exceeding the predetermined range of motion, ensuring the safety of the device. The warning mechanism reduces the occurrence of accidents during operation, improves the reliability and operational safety of the equipment, and reduces the risk of equipment damage.

[0037] Working Principle: In use, the wafer probe card to be tested is first placed on the support platform 41 inside the positioning cover 3, ensuring the probe card is placed stably. The pneumatic push rod 42 is activated, causing the four clamping blocks 43 to simultaneously approach and clamp the probe card, firmly fixing it inside the positioning cover 3. According to the test requirements, the horizontal lead screw module 51 and the vertical lead screw module 52 are controlled to adjust the position of the support seat 2 in the horizontal and vertical directions, so that the probe card is approximately in the required test position. Referring to the angle ruler 8 on the support platform 41 and the scale strip 9 on the side wall of the positioning cover 3, the drive motor 453 is started, driving the moving lead screw 452 to rotate. The slider 454, threaded with the moving lead screw 452, then performs precise linear motion within the slide frame 451. The rack 455 on the slider 454 converts the linear motion into the rotational motion of the gear 456. The gear 456 is coaxially fixed with the rotating shaft 44, ultimately driving the rotating shaft 44 to rotate precisely, adjusting... The probe card's testing angle is monitored in real time using the observation camera 6 and display screen 7. Based on the observation results, the position of the carrier 2 and the angle of the probe card are further fine-tuned to ensure that the probe card accurately reaches the testing position and that the angle meets the testing requirements. Once the position and angle of the probe card are adjusted, the testing equipment is started to test the wafer probe card. Thus, the positioning cover 3 and the carrier platform 41 provide a stable and suitable carrier structure for the wafer probe card. The cooperation of the pneumatic push rod 42 and the C-shaped clamping block 43 can firmly and accurately clamp the probe card. At the same time, the drive assembly 45 drives the rotating shaft 44 to rotate, which can flexibly adjust the testing angle of the probe card to meet diverse testing needs. The drive mechanism 5 adopts a combination of horizontal and vertical lead screw modules 52, which can accurately adjust the position of the carrier 2 in the horizontal and vertical directions, so that the probe card can quickly and accurately reach the designated testing position, improving the efficiency and accuracy of the test.

[0038] The beneficial effects of this utility model are specifically reflected in the fact that the above description is only a preferred embodiment of this utility model and is not intended to limit this utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A wafer probe card carrier device, comprising a test box (1), characterized in that, The supporting device includes: A support seat (2) is provided on the top of the test box (1), and the support seat (2) is movably provided on the top of the test box (1); The positioning cover (3) is set on the top of the carrier (2). The positioning cover (3) is a disc and is used to carry the wafer probe card. The probe card bearing adjustment mechanism (4) is disposed on the side wall of the positioning cover (3). The bearing adjustment mechanism (4) is used to clamp the probe card and adjust the test angle of the probe card; and The drive mechanism (5) is located on the top of the test box (1) and is used to adjust the position of the support (2).

2. The wafer probe card carrier device according to claim 1, characterized in that, The load-bearing adjustment mechanism (4) includes: The support platform (41) is set at the bottom of the positioning cover (3), and the cross section of the support platform (41) is I-shaped. Four pneumatic push rods (42) are set on the side wall of the positioning cover (3). The output end of the pneumatic push rod (42) is provided with a clamping block (43). The clamping block (43) has a C-shaped cross section and is adapted to the probe card. A rotating shaft (44) is installed in the middle of the bearing seat (2), and the rotating shaft (44) is connected to the bearing seat (2) bearing; and The drive assembly (45) is located in the middle of the support (2) and is used to drive the rotating shaft (44) to rotate.

3. The wafer probe card carrier device according to claim 2, characterized in that, The driving component (45) includes: The sliding frame (451) is located in the middle of the support (2); A movable lead screw (452) is provided in the middle of the slide frame (451), and a drive motor (453) is provided at one end of the movable lead screw (452). The drive motor (453) is bolted to the side wall of the slide frame (451). A slider (454) is disposed inside the sliding frame (451), and the slider (454) is threadedly connected to the moving lead screw (452); A rack (455) is fixedly mounted on the side wall of the slider (454); and The gear (456) is located in the middle of the shaft (44), and the rack (455) meshes with the gear (456).

4. The wafer probe card carrier device according to claim 1, characterized in that, The drive mechanism (5) includes: The transverse lead screw module (51) installed on the top of the test box (1); and The longitudinal screw module (52) is disposed at the moving end of the transverse screw module (51), and the bearing seat (2) is installed at the moving end of the longitudinal screw module (52).

5. The wafer probe card carrier device according to claim 1, characterized in that, An observation camera (6) is provided at the bottom of the positioning cover (3). The observation camera (6) is located at the center of the positioning cover (3). A display screen (7) is provided on the side wall of the test box (1). The observation camera (6) is electrically connected to the display screen (7).

6. The wafer probe card carrier device according to claim 2, characterized in that, An angle ruler (8) is provided on the top of the support platform (41), and a scale strip (9) is provided on the side wall of the positioning cover (3).

7. The wafer probe card carrier device according to claim 1, characterized in that, The test chamber (1) is equipped with a shield (10) on top.

8. The wafer probe card carrier device according to claim 4, characterized in that, Both the transverse lead screw module (51) and the longitudinal lead screw module (52) are provided with limit contact heads (11) on their side walls. The limit contact heads (11) provide early warning of the movement range of the bearing seat (2).

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