Semiconductor cleaning solution processing device

Abstract

The utility model discloses a semiconductor cleaning solution processing device, it includes: the sedimentation tank, the upper surface fixed connection of sedimentation tank has slide rail, the inner surface sliding connection of slide rail has sliding block, and the sliding block is rotationally connected with the adapter pipe through the connecting component no.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor cleaning fluid treatment technology, and in particular to a semiconductor cleaning fluid treatment device. Background Technology

[0002] Semiconductor cleaning fluid treatment equipment is used to purify cleaning wastewater generated during semiconductor manufacturing. By removing acidic and alkaline substances, metal ions, organic pollutants, and particulate impurities from the wastewater, it enables the wastewater to meet emission standards or achieve resource recovery. It is a key piece of equipment for green semiconductor production.

[0003] In traditional treatment devices, the mixing of the treatment agent and the waste liquid often relies on a fixed-position stirring paddle, which can only form agitation in a local area, easily creating mixing dead zones, resulting in uneven dispersion of the treatment agent and local concentration imbalance. At the same time, the treatment agent is often directly injected into the waste liquid through a single pipe, making it difficult to quickly mix with the waste liquid, affecting reaction efficiency and treatment effect. This makes it difficult to meet the requirements of efficient and uniform treatment of semiconductor cleaning fluid, limiting the practicality and treatment quality of the treatment device. Utility Model Content

[0004] The purpose of this invention is to solve at least one of the technical problems existing in the prior art, and to provide a semiconductor cleaning fluid treatment device that solves the problems of dead corners, uneven dispersion, and fixed stirring range in the mixing of treatment agent and waste liquid in the existing device.

[0005] This utility model also provides a semiconductor cleaning fluid treatment device, comprising: a sedimentation tank, a slide rail fixedly connected to the upper surface of the sedimentation tank, a slider slidably connected to the inner surface of the slide rail, a connecting pipe rotatably connected to the slider via a connecting component one, and a stirring blade fixedly connected to the lower end of the connecting pipe; a flow channel communicating with the connecting pipe is provided inside the stirring blade, and a water spray hole communicating with the flow channel is provided on the stirring blade; a connector is rotatably connected to the connecting pipe via a connecting component two; and a linkage component is provided between the connecting pipe and the slide rail.

[0006] According to the semiconductor cleaning fluid treatment device of the present invention, the connecting component one includes: a rotating groove one and a rotating block one. The rotating groove one is disposed on the slider, the rotating block one is fixedly connected to the outer wall of the connecting tube, and the rotating block one is rotatably connected to the inside of the rotating groove one.

[0007] According to the semiconductor cleaning fluid treatment device of this utility model, the second connecting component includes: a second rotating groove and a second rotating block. The second rotating groove is disposed on the connecting pipe, the second rotating block is fixedly connected to the outer wall of the connector, and the second rotating block is rotatably connected to the inside of the second rotating groove.

[0008] According to the semiconductor cleaning fluid treatment device of this utility model, a sealing coating is provided at the contact position between the connector and the connecting tube.

[0009] According to the semiconductor cleaning fluid treatment device of this utility model, the linkage component includes: a fixed ring, multiple first transmission teeth, and multiple second transmission teeth. The fixed ring is fixedly connected to the outer wall of the connecting tube, the multiple first transmission teeth are fixedly connected to the outer wall of the fixed ring, and the multiple second transmission teeth are fixedly connected to the inner surface of the slide rail. The first transmission teeth and the second transmission teeth are meshed together.

[0010] According to the semiconductor cleaning fluid treatment device of this utility model, the inner surface of the slide rail is rotatably connected to a lead screw threadedly connected to the slider, and the side surface of the slide rail is fixedly connected to a motor, and the lead screw is driven by the motor.

[0011] Beneficial effects:

[0012] The semiconductor cleaning fluid treatment device of this technical solution expands the stirring range through the cooperation of slider, slide rail and linkage components. When the slider moves along the slide rail, the first transmission gear and the second transmission gear mesh to drive the connecting pipe to rotate, so that the stirring blade moves and rotates at the same time, covering a larger area of ​​the sedimentation tank and eliminating mixing dead corners.

[0013] Through the combination of connecting pipe, stirring blade, guide channel and spray hole, the treatment agent enters the guide channel of stirring blade through the connecting pipe, and is sprayed out from the spray hole as the stirring blade rotates. It is immediately dispersed by rotation after injection, which improves the mixing uniformity and avoids local concentration imbalance. Attached Figure Description

[0014] The present invention will be further described below with reference to the accompanying drawings and embodiments;

[0015] Figure 1 This is a front view structural diagram of the semiconductor cleaning fluid treatment device of this utility model;

[0016] Figure 2 This is a front cross-sectional view of the semiconductor cleaning fluid treatment device of this utility model;

[0017] Figure 3 This utility model relates to a semiconductor cleaning solution treatment device. Figure 2 Enlarged view of the internal structure of the slider at point A;

[0018] Figure 4 This is a rear cross-sectional view of the semiconductor cleaning fluid treatment device of this utility model.

[0019] Legend:

[0020] 1. Slide rail; 2. Sedimentation tank; 3. Agitator blade; 4. Spray hole; 5. Flow guide channel; 6. Lead screw; 7. Motor; 8. Connector; 9. Rotating block one; 10. Rotating groove one; 11. Fixing ring; 12. Rotating block two; 13. Rotating groove two; 14. Sliding block; 15. Connecting pipe; 16. Transmission gear one; 17. Transmission gear two. Detailed Implementation

[0021] This section will describe in detail the specific embodiments of the present utility model. The preferred embodiments of the present utility model are shown in the accompanying drawings. The purpose of the drawings is to supplement the textual description with graphics, so that people can intuitively and vividly understand each technical feature and the overall technical solution of the present utility model, but they should not be construed as limiting the scope of protection of the present utility model.

[0022] Reference Figure 1-4 This utility model provides a semiconductor cleaning fluid treatment device, which includes a sedimentation tank 2. Considering the need to provide a moving track and installation foundation for the stirring component, a slide rail 1 is fixedly connected to the upper surface of the sedimentation tank 2. A slider 14 is slidably connected to the inner surface of the slide rail 1. A connecting pipe 15 is rotatably connected to the slider 14 through a connecting component. A stirring blade 3 is fixedly connected to the lower end of the connecting pipe 15. The slider 14 moves along the slide rail 1, which drives the stirring blade 3 to move, thereby expanding the stirring range.

[0023] Considering the need for the treatment agent to be injected synchronously and dispersed evenly during stirring, a guide channel 5 connected to the connecting pipe 15 is provided inside the stirring blade 3. A water spray hole 4 connected to the guide channel 5 is provided on the stirring blade 3. A connector 8 is rotatably connected inside the connecting pipe 15 through the connecting component 2. The treatment agent is sprayed out from the water spray hole 4 through the connector 8, the connecting pipe 15, and the guide channel 5 during stirring, thereby achieving the effect of rapid mixing of the treatment agent and the waste liquid.

[0024] Considering that the slider 14 can drive the stirring blade 3 to rotate to enhance mixing when it moves, a linkage component is provided between the connecting pipe 15 and the slide rail 1. The linkage component includes: a fixed ring 11, multiple transmission teeth 16, and multiple transmission teeth 17. The fixed ring 11 is fixedly connected to the outer wall of the connecting pipe 15, the multiple transmission teeth 16 are fixedly connected to the outer wall of the fixed ring 11, and the multiple transmission teeth 17 are fixedly connected to the inner surface of the slide rail 1. The transmission teeth 16 and the transmission teeth 17 are meshed together. When the slider 14 moves, the transmission teeth 16 and the transmission teeth 17 mesh together to drive the connecting pipe 15 to rotate, so as to achieve the effect of the stirring blade 3 moving and rotating at the same time.

[0025] In summary, the improvement of this embodiment lies in:

[0026] By cooperating with slider 14, slide rail 1, and linkage components, the stirring range is expanded. When slider 14 moves along slide rail 1, transmission gear 16 and transmission gear 2 mesh to drive connecting pipe 15 to rotate, so that stirring blade 3 moves and rotates at the same time, covering a larger area of ​​sedimentation tank 2 and eliminating mixing dead corners.

[0027] Through the combination of connecting pipe 15, stirring blade 3, guide channel 5 and spray hole 4, the treatment agent enters the guide channel 5 of stirring blade 3 through connecting pipe 15, and is sprayed out from spray hole 4 as stirring blade 3 rotates. It is immediately dispersed by rotation upon injection, improving the mixing uniformity and avoiding local concentration imbalance.

[0028] Based on the above, other structures also need to be disclosed in detail, such as:

[0029] Reference Figure 3 Considering the need for the connecting tube 15 to rotate stably within the slider 14, the connecting component includes: a rotating groove 10 and a rotating block 9. The rotating groove 10 is mounted on the slider 14, and the rotating block 9 is fixedly connected to the outer wall of the connecting tube 15. The rotating block 9 is rotatably connected to the inside of the rotating groove 10. The connecting tube 15 rotates within the rotating groove 10 via the rotating block 9, thus achieving the effect of flexible rotation of the connecting tube 15.

[0030] Reference Figure 3 Considering that the connector 8 needs to rotate relative to the connecting pipe 15 without affecting the liquid supply, the second connecting component includes: a second rotating groove 13 and a second rotating block 12. The second rotating groove 13 is set on the connecting pipe 15, and the second rotating block 12 is fixedly connected to the outer wall of the connector 8. The second rotating block 12 is rotatably connected to the inside of the second rotating groove 13. The connector 8 rotates in the second rotating groove 13 through the second rotating block 12, so as to achieve the effect of fixing the liquid supply of the connector 8 when the connecting pipe 15 rotates.

[0031] Reference Figure 3 Considering the need to prevent leakage at the rotating joint of connector 8 and connecting pipe 15, a sealing coating is provided at the contact position between connector 8 and connecting pipe 15. The sealing coating prevents liquid leakage and achieves the effect of no leakage of the treatment agent.

[0032] Reference Figure 1-2 Considering the need to drive the slider 14 to move automatically, the inner surface of the slide rail 1 is rotatably connected to the lead screw 6, which is threadedly connected to the slider 14. The side surface of the slide rail 1 is fixedly connected to the motor 7. The lead screw 6 is driven by the motor 7. The motor 7 drives the lead screw 6 to rotate and drive the slider 14 to move, thus achieving the effect of automatic movement of the slider 14.

[0033] Working principle: When the semiconductor cleaning fluid treatment device is working, the semiconductor cleaning waste liquid is first introduced into the sedimentation tank 2, and the external treatment agent supply pipe is connected to the connector 8.

[0034] Start the motor 7. The motor 7 drives the lead screw 6 to rotate, causing the slider 14 to slide along the slide rail 1. When the slider 14 moves, the transmission tooth 16 on the fixed ring 11 meshes with the transmission tooth 17 on the slide rail 1, driving the connecting pipe 15 to rotate in the rotating groove 10 of the slider 14 through the rotating block 9, thereby causing the stirring blade 3 to move and rotate at the same time.

[0035] Meanwhile, the treatment agent enters the connecting pipe 15 through the connector 8. The connector 8 rotates with the connecting pipe 15 in the rotating groove 13 of the connecting pipe 15 through the rotating block 12. The sealing coating at the contact point between the two prevents leakage. The treatment agent is then sprayed out from the spray hole 4 of the stirring blade 3 through the guide channel 5 and quickly mixed with the waste liquid in the sedimentation tank 2.

[0036] By adjusting the movement range of slider 14 and rotating the stirring blades 3, a larger area of ​​sedimentation tank 2 is covered, eliminating mixing dead zones, improving the mixing uniformity of the treatment agent and waste liquid, avoiding local concentration imbalance, and completing the mixing treatment process of the cleaning liquid.

[0037] The embodiments of the present utility model have been described in detail above with reference to the accompanying drawings. However, the present utility model is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of the present utility model.

Claims

1. A semiconductor cleaning fluid treatment apparatus, comprising: Sedimentation tank (2), characterized in that: The upper surface of the sedimentation tank (2) is fixedly connected to a slide rail (1), and the inner surface of the slide rail (1) is slidably connected to a slider (14). The slider (14) is rotatably connected to a connecting pipe (15) through a connecting assembly. The lower end of the connecting pipe (15) is fixedly connected to a stirring blade (3). The stirring blade (3) is provided with a flow channel (5) communicating with the connecting pipe (15), and the stirring blade (3) is provided with a water spray hole (4) communicating with the flow channel (5). The connecting pipe (15) is rotatably connected with a connector (8) through a connecting component two. A linkage component is provided between the connecting pipe (15) and the slide rail (1).

2. The semiconductor cleaning solution treatment apparatus according to claim 1, characterized in that, The first connecting component includes: a first rotating groove (10) and a first rotating block (9). The first rotating groove (10) is disposed on the slider (14). The first rotating block (9) is fixedly connected to the outer wall of the connecting pipe (15). The first rotating block (9) is rotatably connected to the inside of the first rotating groove (10).

3. The semiconductor cleaning solution treatment apparatus according to claim 1, characterized in that, The second connecting component includes: a second rotating groove (13) and a second rotating block (12). The second rotating groove (13) is disposed on the connecting pipe (15). The second rotating block (12) is fixedly connected to the outer wall of the connector (8). The second rotating block (12) is rotatably connected to the inside of the second rotating groove (13).

4. The semiconductor cleaning solution treatment apparatus according to claim 1, characterized in that, A sealing coating is provided at the contact position between the connector (8) and the connecting pipe (15).

5. The semiconductor cleaning solution treatment apparatus according to claim 1, characterized in that, The linkage assembly includes: a fixed ring (11), multiple transmission teeth one (16), and multiple transmission teeth two (17). The fixed ring (11) is fixedly connected to the outer wall of the connecting pipe (15), the multiple transmission teeth one (16) are fixedly connected to the outer wall of the fixed ring (11), and the multiple transmission teeth two (17) are fixedly connected to the inner surface of the slide rail (1). The transmission teeth one (16) and the transmission teeth two (17) are meshed together.

6. The semiconductor cleaning solution treatment apparatus according to claim 1, characterized in that, The inner surface of the slide rail (1) is rotatably connected to a lead screw (6) that is threadedly connected to the slider (14), and the side surface of the slide rail (1) is fixedly connected to a motor (7). The lead screw (6) is driven by the motor (7).

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