A mold for hot-press bonding a chip with a luer connector structure

Abstract

The utility model discloses a kind of mould of hot-press bonding luer connector structure chip, it is related to microfluidic chip hot-press mould technical field, including mould one, the top surface of mould one has chip slot and is set in the luer connector avoidance through-hole of chip slot bottom surface;Mould two, the top surface of mould two is arranged corresponding to the bottom surface of mould one;Elastic piece one, elastic piece one one end is connected with mould two, the other end is connected with mould one to provide reverse elastic force when mould one and mould two are mutually close;Elastic piece two, elastic piece two one end is connected with mould two, the other end is arranged corresponding luer connector avoidance through-hole, and constitutes luer connector abutting end;Mould three, mould three can be pressed in the top surface of mould one to carry out hot-press bonding to the chip to be hot-pressed placed in chip slot.The utility model can effectively guarantee the stress uniformity of microfluidic chip containing luer connector structure in hot-press process, and then ensure the effect of hot-press bonding.

Description

Technical Field

[0001] This utility model relates to the field of microfluidic chip hot pressing mold technology, and in particular to a mold for hot pressing and bonding chips with Luer connector structure. Background Technology

[0002] Microfluidics is a field of technology and science that precisely manipulates and controls microfluidics at the microscale (typically micrometer-level channels). It integrates engineering, physics, chemistry, biology, and materials science, and through integrated and miniaturized design, it condenses traditional laboratory functions onto chips of centimeter or even millimeter size, known as "lab-on-a-chip".

[0003] Microfluidic thermocompression technology is closely related to the miniaturization and high-precision manufacturing requirements of microfluidic chips. As the demands for chip functional integration and reliability continue to increase in fields such as biomedical detection and chemical analysis, traditional packaging technologies (such as UV adhesive bonding and plasma bonding) are gradually revealing their limitations. For example, reliance on chemical adhesives may introduce contamination, complex processes lead to high costs, or insufficient material compatibility limits application scenarios. Thermocompression bonding technology has emerged to address this need. Its core principle is to utilize thermoplastic polymer materials (such as PMMA, PC, and COC) to soften when heated above their glass transition temperature. External pressure causes the molecular chains on the surfaces of the upper and lower substrates to diffuse and entangle, forming a seamless, permanent bond upon cooling. This process eliminates the need for additional adhesives, avoiding the risk of chemical contamination, and possesses the potential for high efficiency, low cost, and mass production, thus becoming the mainstream choice for microfluidic chip packaging.

[0004] The development of thermoforming technology has been in tandem with advancements in materials science and precision manufacturing. Early microfluidic chips primarily used rigid materials such as silicon and glass, but the emergence of thermoplastic polymers revolutionized chip manufacturing. These materials are not only inexpensive and easy to process, but also possess excellent optical transparency and biocompatibility. For example, carbon dioxide (COC) is widely used in biochips due to its low water absorption and chemical resistance. The thermoforming process, through integrated mold imprinting and bonding, can complete microchannel molding and encapsulation within minutes, significantly shortening the manufacturing cycle. With the maturity of precision temperature control systems and high-rigidity platen technology, thermoforming equipment has gradually achieved precise control of temperature-pressure curves, laying the foundation for the stable replication of complex microstructures.

[0005] Throughout its technological evolution, the core objective of hot pressing has consistently revolved around "mechanical control at the microscale." For example, to meet the fidelity requirements of microchannel structures, mold processing technology has evolved from traditional mechanical engraving to laser micro / nano processing and electrochemical etching, enabling the creation of high-precision microstructures with aspect ratios exceeding 5:1. For the thermodynamic properties of polymer materials, a multi-stage heating-pressing-cooling process has been developed to balance material flowability and structural stability. In recent years, the integration of surface modification technologies (such as plasma treatment and chemical functional group grafting) has further reduced the temperature and pressure requirements for bonding, allowing hot pressing to be adapted to more sensitive bioactive components (such as immobilized enzymes or cell scaffolds). These accumulated technologies have collectively propelled hot pressing from laboratory prototype manufacturing to industrial-scale mass production, becoming a crucial manufacturing foundation for cutting-edge applications of microfluidic chips, including high-throughput analysis, point-of-care diagnostics, and organ-on-a-chip technology.

[0006] Microfluidic chips with Luer connectors play a crucial role in biomedicine, chemical analysis, and drug development through standardized fluid interface design. As an internationally recognized connection standard, the Luer connector's precision thread design provides reliable sealing, effectively preventing leaks even under high pressure or prolonged operation—essential for experiments requiring high-precision fluid control. It enables rapid and safe connection between the microfluidic chip and external devices, avoiding leaks or operational errors caused by interface incompatibility. This design not only enhances system flexibility and compatibility but also supports modular integration, such as flexibly integrating the chip with sample pretreatment units, detection modules, or temperature control systems to complete complex multi-step experimental processes, such as cell culture, droplet generation, or real-time monitoring.

[0007] However, microfluidic chips with Luer joint structures face numerous challenges in thermocompression bonding processes. As a raised three-dimensional structure, the Luer joint forms contact points with the mold during thermocompression, causing pressure concentration in the joint area while pressure attenuates in the surrounding microchannel areas. Simultaneously, the contact edge between the joint and the substrate is prone to an "edge effect" due to pressure gradients, leading to incomplete annular gaps at the bonding interface and posing a leakage risk. Furthermore, the contact surface between the pre-fabricated joint base and the chip substrate may have micron-level unevenness; excessively high local contact pressure during thermocompression can compress and soften the material, creating an "extrusion effect" that causes material accumulation around the joint, blocking nearby microchannel inlets.

[0008] After hot pressing, the softened polymer tends to adhere to the mold surface, especially when the joint structure is embedded in the mold groove. The demolding pull may preferentially act on the joint area with higher mechanical strength, causing the bonding layer between the substrate and the joint to delaminate due to uneven stress, or causing the channel wall to fracture under lateral shear force when the demolding direction is not perpendicular to the microchannel axis. Statistics show that the demolding defect rate of chips with pre-fabricated joints is 3-5 times higher than that of ordinary chips.

[0009] Therefore, how to provide a mold for thermocompressing chips containing Luer connector structures, which can effectively ensure the uniformity of stress on microfluidic chips containing Luer connector structures during the thermocompressing process, and thus ensure the effect of thermocompressing bonding, is a problem that urgently needs to be solved by those skilled in the art. Utility Model Content

[0010] In view of this, this utility model proposes a mold for hot-press bonding of chips with Luer joint structures, aiming to solve the technical problem that the above-mentioned traditional chip hot-press molds cannot ensure the uniformity of force on microfluidic chips with Luer joint structures during the hot-pressing process, resulting in poor hot-press bonding effect.

[0011] To achieve the above objectives, the present invention adopts the following technical solution:

[0012] This utility model provides a mold for hot-press bonding chips containing Luer connector structures, comprising:

[0013] Mold 1, the top surface of which has a chip slot and a Luer connector clearance through hole formed on the bottom surface of the chip slot;

[0014] Mold 2, the top surface of which corresponds to the bottom surface of mold 1;

[0015] Elastic element one, one end of which is connected to mold two and the other end of which is connected to mold one, so as to provide a reverse elastic force when mold one and mold two approach each other;

[0016] Elastic component two, one end of which is connected to mold two, and the other end is arranged to correspond to the through hole of Luer joint to form the abutment end of Luer joint;

[0017] Mold three, which can press against the top surface of mold one to perform thermo-press bonding on the chip to be thermo-pressed placed in the chip slot.

[0018] In the use of the mold for hot-press bonding of chips with Luer connector structures according to this utility model, the chip to be hot-pressed is placed in the chip slot, and the Luer connector of the chip to be hot-pressed can be fitted into the Luer connector clearance through hole. During the hot-pressing process, mold three closes with mold one to hot-press the chip to be hot-pressed in the chip slot. Mold three presses against mold one, and mold one presses against and compresses elastic element one and moves close to mold two. The other end of elastic element two serves as the Luer connector abutting end and presses against the Luer connector end of the chip to be hot-pressed, thereby maintaining a certain pressure at the root of the Luer connector to ensure that the entire chip to be hot-pressed (including the Luer connector structure) is subjected to pressure. The uniform force effectively prevents material extrusion, accumulation, and blockage of the microchannel entrance around the connection between the chip and the Luer connector. Furthermore, during chip demolding, the elastic element 2 assists in ejection, effectively preventing delamination of the bonding layer between the chip substrate and the Luer connector due to uneven stress caused by the demolding pull preferentially acting on the Luer connector structure embedded in the groove, or breakage of the microchannel wall inside the chip due to lateral shear force. This invention effectively ensures the uniformity of force on the microfluidic chip containing the Luer connector structure during the hot-pressing process, thereby ensuring the effectiveness of the hot-press bonding.

[0019] As a further improvement to the above technical solution, the three bottom surfaces of the mold are planes that can be adapted to fit and adhere to the top surface of the mold.

[0020] The beneficial effects of the above technical solution are: the three bottom surfaces of the mold are flat, which further increases the uniformity of the hot-pressing force on the chip to be hot-pressed, thereby ensuring the effect of hot-pressing bonding.

[0021] As a further improvement to the above technical solution, the top surface of the mold 2 is provided with a fixing groove 1 and a fixing groove 2 on one side of the fixing groove; the bottom surface of the mold 1 is provided with a fixing groove 3 corresponding to one of the fixing grooves; one end of the elastic element 1 is embedded in the fixing groove 1 and the other end is embedded in the fixing groove 3; one end of the elastic element 2 is embedded in the fixing groove 2.

[0022] The beneficial effects of the above technical solution are: both ends of the elastic element are embedded in the fixing groove, which can provide stable elastic force; the fixing groove plays a role in stabilizing one end of the elastic element to improve its stability in pressing the end of the Luer connector of the chip to be heated.

[0023] As a further improvement to the above technical solution, both the first elastic element and the second elastic element are springs.

[0024] As a further improvement to the above technical solution, the elastic coefficient of the first elastic element is greater than that of the second elastic element.

[0025] As a further improvement to the above technical solution, there are multiple elastic elements, and the multiple elastic elements are arranged at intervals along the top surface of the mold.

[0026] The beneficial effects of the above technical solution are: multiple elastic elements are arranged circumferentially along the top surface of the mold, which can further improve the stability of elastic support and hot pressing pressure.

[0027] As a further improvement to the above technical solution, when the first mold and the second mold are close to each other, the other end of the second elastic element can be movably inserted into the Luer joint clearance through hole.

[0028] The beneficial effect of the above technical solution is that the through hole of the Luer joint can play the role of guiding and stabilizing the other end of the second elastic element, thereby making the pressure of the second elastic element on the Luer joint of the chip to be heat-pressed more stable.

[0029] As a further improvement to the above technical solution, both mold one and mold two are metal molds.

[0030] As a further improvement to the above technical solution, the mold three is a mirror panel.

[0031] As can be seen from the above technical solution, compared with the prior art, this utility model discloses a mold for hot-press bonding of chips containing Luer connector structures, which has the following advantages and beneficial effects:

[0032] 1. This utility model adopts the idea of ​​Luer joint groove combined with pressure spring to ensure that different structures on the chip can be subjected to uniform force during hot pressing, thereby ensuring good hot pressing effect and hot pressing yield.

[0033] 2. This utility model effectively solves the problem that during the hot pressing process, chips containing Luer joint structures suffer from uneven stress due to insufficient flatness and "edge effect", resulting in hot pressing bonding failure. Attached Figure Description

[0034] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort.

[0035] Figure 1 This utility model presents a three-dimensional structural diagram of a mold for hot-press bonding of chips containing Luer connectors;

[0036] Figure 2This utility model presents a three-dimensional structural diagram of a mold for hot-press bonding of chips containing Luer connectors from another perspective.

[0037] Figure 3 A top view of a mold for hot-press bonding of chips with Luer connector structure according to this utility model;

[0038] Figure 4 This utility model provides a schematic diagram showing the state in which elastic element one and elastic element two are installed on mold two in a mold for hot-press bonding of chips containing Luer joint structures.

[0039] Figure 5 This utility model provides a schematic diagram of the fixing groove one and fixing groove two of a mold for hot-press bonding of chips containing Luer connectors.

[0040] Figure 6 This utility model discloses a schematic diagram of a Luer joint avoidance through hole structure in a mold for hot-press bonding of chips containing Luer joint structures.

[0041] Figure 7 This utility model discloses a perspective schematic diagram of a mold for hot-press bonding of chips containing Luer joint structures;

[0042] In the diagram: 1. Mold 1; 11. Chip slot; 12. Luer connector clearance through hole; 13. Fixing slot 3; 2. Mold 2; 21. Fixing slot 1; 22. Fixing slot 2; 3. Elastic component 1; 4. Elastic component 2. Detailed Implementation

[0043] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain this utility model, and should not be construed as limiting this utility model.

[0044] In the description of this utility model, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0045] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.

[0046] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0047] According to the embodiments of this utility model, such as Figures 1 to 7 As shown, a mold for hot-press bonding of chips with Luer connector structures includes: mold 1, mold 2, elastic element 3, elastic element 4, and mold 3 (not shown in the figure).

[0048] The top surface of mold 1 has a chip slot 11 and a Luer connector clearance through hole 12 opened on the bottom surface of the chip slot 11.

[0049] The top surface of mold 2 corresponds to the bottom surface of mold 1.

[0050] One end of the elastic element 3 is connected to the mold 2 and the other end is connected to the mold 1, so as to provide a reverse elastic force when the mold 1 and the mold 2 approach each other.

[0051] One end of the elastic element 24 is connected to the mold 22, and the other end is arranged to correspond to the Luer joint avoidance through hole 12, forming the abutment end of the Luer joint.

[0052] Mold 3 can press against the top surface of mold 1 to perform thermo-press bonding on the chip to be thermo-pressed placed in chip slot 11.

[0053] In this embodiment, when using a mold for hot-press bonding a chip with a Luer connector structure, the chip to be hot-pressed is placed in the chip slot 11, and the Luer connector of the chip to be hot-pressed can be fitted into the Luer connector clearance through hole 12. During the hot-pressing process, mold three and mold one 1 close together to hot-press the chip to be hot-pressed in the chip slot 11. Mold three presses against mold one 1, and mold one presses against and compresses elastic element one 3 and approaches mold two 2. The other end of elastic element two 4 serves as the Luer connector abutting end and presses against the Luer connector end of the chip to be hot-pressed, thereby maintaining a certain pressure at the root of the Luer connector to balance the local force on the Luer connector during the hot-pressing process of the chip to be hot-pressed, so as to ensure that the chip to be hot-pressed... The hot-pressed chip, including the Luer connector structure, experiences uniform stress, effectively preventing material extrusion, accumulation, and blockage of nearby microchannel entrances around the connection between the chip and the Luer connector. Furthermore, during chip demolding, the elastic element 4 assists in ejection, effectively preventing delamination of the bonding layer between the chip substrate and the Luer connector due to uneven stress caused by the demolding pull preferentially acting on the Luer connector structure embedded in the groove, or breakage of the microchannel walls inside the chip due to lateral shear force. This invention effectively ensures the uniformity of stress on the microfluidic chip containing the Luer connector structure during hot pressing, thereby ensuring the effectiveness of hot-press bonding.

[0054] In some embodiments, the bottom surface of the mold is a plane that can be adapted to fit the top surface of the mold.

[0055] The mold has three flat bottom surfaces, which further increases the uniformity of the hot-pressing force on the chip to be hot-pressed, thus ensuring the effect of hot-pressing bonding.

[0056] In some embodiments, the top surface of mold 2 is provided with a fixing groove 21 and a fixing groove 22 on the side of the fixing groove 21; the bottom surface of mold 1 is provided with a fixing groove 3 13 corresponding to the fixing groove 21; one end of elastic member 3 is fixed in the fixing groove 21 and the other end is fixed in the fixing groove 3 13; one end of elastic member 4 is fixed in the fixing groove 22 by a screw.

[0057] Both ends of the elastic element 3 are embedded in the fixing groove, which can provide stable elastic force; the fixing groove 22 plays the role of stabilizing one end of the elastic element 4, so as to improve its stability in pressing the end of the Luer connector of the chip to be heated.

[0058] Specifically, the two ends of the elastic element 3 can be fixed in the fixing groove 21 and the fixing groove 13 by screws.

[0059] In some embodiments, both elastic element 3 and elastic element 4 are springs.

[0060] In some embodiments, the elastic coefficient of elastic element 3 is greater than that of elastic element 4.

[0061] Specifically, the diameter of elastic element 2 4 is smaller than the diameter of elastic element 1 3.

[0062] In some embodiments, there are multiple elastic elements 3, and the multiple elastic elements 3 are arranged at intervals along the top surface of the mold 2.

[0063] Multiple elastic elements 3 are arranged circumferentially along the top surface of mold 2, which can further improve the stability of elastic support and hot pressing pressure.

[0064] Specifically, mold 1 and mold 2 are rectangular flat plate structures. Fixing groove 1 21 is provided at each of the four corners of the top surface of mold 2; fixing groove 3 13 is provided at each of the four corners of the bottom surface of mold 1; fixing groove 1 21 and fixing groove 3 13 are arranged in a one-to-one correspondence.

[0065] In some embodiments, when mold 1 and mold 2 are close to each other, the other end of elastic member 4 can be movably inserted into the Luer joint clearance through hole 12.

[0066] The through hole 12 of the Luer connector can guide and stabilize the other end of the elastic element 4, thereby making the pressure of the elastic element 4 on the Luer connector of the chip to be heat-pressed more stable.

[0067] In some embodiments, both mold 1 and mold 2 are metal molds.

[0068] Specifically, mold 1 and mold 2 can be made of stainless steel.

[0069] In some embodiments, mold three is a mirror panel.

[0070] Specifically, the top surface of mold 1 is flat, while mold 3 can be made of mirror-finished steel plate, which can improve the uniformity of the pressure applied. The specific dimensions of molds 1, 2, and 3 can be flexibly set according to the size of the chip to be hot-pressed, and will not be elaborated here.

[0071] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. In addition, those skilled in the art can combine and integrate the different embodiments or examples described in this specification.

[0072] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of the present invention.

Claims

1. A mold for hot-press bonding of chips containing Luer junction structures, characterized in that, include: Mold 1 (1), the top surface of the mold 1 (1) has a chip groove (11) and a Luer connector clearance through hole (12) opened on the bottom surface of the chip groove (11); Mold 2 (2), the top surface of which is arranged corresponding to the bottom surface of mold 1 (1); Elastic element 1 (3), one end of which is connected to mold 2 (2) and the other end of which is connected to mold 1 (1), so as to provide a reverse elastic force when mold 1 (1) and mold 2 (2) approach each other; Elastic element two (4), one end of the elastic element two (4) is connected to the mold two (2), and the other end is arranged corresponding to the Luer joint avoidance through hole (12) to form the Luer joint abutment end; Mold 3, which can press against the top surface of mold 1 (1) to perform thermo-press bonding on the chip to be thermo-pressed placed in the chip slot (11).

2. The mold for hot-press bonding of chips with Luer connector structures according to claim 1, characterized in that, The bottom surface of the mold is a plane that can be adapted to fit the top surface of the mold (1).

3. The mold for hot-press bonding of chips with Luer connector structures according to claim 1, characterized in that, The top surface of the mold 2 (2) is provided with a fixing groove 1 (21) and a fixing groove 2 (22) corresponding to the side of the fixing groove 1 (21); the bottom surface of the mold 1 (1) is provided with a fixing groove 3 (13) corresponding to the fixing groove 1 (21); one end of the elastic element 1 (3) is embedded in the fixing groove 1 (21) and the other end is embedded in the fixing groove 3 (13); one end of the elastic element 2 (4) is embedded in the fixing groove 2 (22).

4. The mold for hot-press bonding of chips with Luer connector structures according to claim 3, characterized in that, Both the first elastic element (3) and the second elastic element (4) are springs.

5. The mold for hot-press bonding of chips with Luer connector structures according to claim 4, characterized in that, The elastic coefficient of the first elastic element (3) is greater than that of the second elastic element (4).

6. The mold for hot-press bonding of chips with Luer connector structures according to claim 1, characterized in that, There are multiple elastic elements (3), and the multiple elastic elements (3) are arranged at intervals along the top surface of the mold (2).

7. The mold for hot-press bonding of chips with Luer connector structures according to claim 1, characterized in that, When the first mold (1) and the second mold (2) approach each other, the other end of the second elastic element (4) can be movably inserted into the Luer joint clearance through hole (12).

8. The mold for hot-press bonding of chips with Luer connector structures according to claim 1, characterized in that, Both mold one (1) and mold two (2) are metal molds.

9. The mold for hot-press bonding of chips with Luer connector structures according to claim 1, characterized in that, The mold three is a mirror panel.

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