Sensor chip encapsulation device

Abstract

The utility model relates to a sensor chip glue sealing device, and the inside middle end movable inlay of installation base is provided with the bearing base, the surface of four corners of bearing base top is all fixed and installed with the hollow pipe in the vertical direction, the both sides of each hollow pipe outside are all movable inlay installation and are close to the arc plate, the inside of each hollow pipe is provided with the bidirectional push mechanism, the bottom of bearing base is provided with the synchronous drive mechanism, and synchronous drive mechanism and bidirectional push mechanism transmission connection, the utility model discloses when needing to carry out the glue sealing processing to the circuit board and its surface sensor chip, the operator only needs to drive the rotary disc and makes it rotate in the fixed frame inner wall, makes a plurality of groups of close to the arc plate can be synchronized from the relative removal of hollow pipe outer wall both sides, can carry out the synchronous fixing and limiting treatment to the four side of sensor chip, under the action of the resistance of close to the arc plate and carries out the limiting treatment to the vertical position of sensor chip, improves the stability of sensor chip when the glue sealing processing.

Description

Technical Field

[0001] This utility model relates to the field of encapsulation technology, specifically to a sensor chip encapsulation device. Background Technology

[0002] As the core sensing element of the Internet of Things and intelligent systems, sensor chips integrate microelectronics and photoelectric conversion technologies. They can accurately capture physical or chemical quantities such as temperature, pressure, light intensity, and biological signals, and convert them into processable electrical signals. Their nanoscale manufacturing process ensures high sensitivity and low power consumption characteristics, and they are widely used in consumer electronics, industrial control, and medical monitoring. To ensure the stability of the chip in complex environments, the encapsulation process uses polymer materials such as epoxy resin and silicone. A dense protective layer is formed through dispensing, molding, or vacuum potting techniques, which effectively isolates moisture, dust, and mechanical impact, while optimizing thermal conductivity and extending the life of the device. This is a key technical link for achieving high reliability in sensors.

[0003] Traditional encapsulation mechanisms, when encapsulating sensor chips on circuit boards, use a dispensing tube to deliver sealant to the outside of the sensor chip. To ensure sufficient encapsulation, multiple sets of sliding rails operate synchronously, moving the dispensing tube in multiple directions and changing the dispensing position. During this process, the entire processing table vibrates due to the movement of the electric sliding rails, causing the sensor chip to wobble. Furthermore, when fixing the sensor chip at its four corners, the relatively simple fixing mechanism, especially for circuit boards with connecting slots at the corners, can only fix it from one direction, failing to guarantee the vertical stability of the sensor chip. The operator also cannot simultaneously adjust and fix multiple positions of the sensor chip, thus affecting the efficiency of the sensor chip encapsulation process. Therefore, a new technical solution is needed to address this issue. Utility Model Content

[0004] The purpose of this invention is to overcome the shortcomings of the existing technology, adapt to practical needs, and provide a sensor chip encapsulation device. This addresses the problem that current encapsulation mechanisms, when encapsulating sensor chips on the surface of circuit boards, require multiple sets of sliding rails to move the injection tube in multiple directions to ensure sufficient encapsulation. During this process, the entire processing table vibrates due to the movement of the electric sliding rails, causing the sensor chip to shake. Furthermore, when fixing the sensor chip at its four corners, the relatively simple fixing mechanism can only fix it from one direction, failing to guarantee the vertical stability of the sensor chip. Additionally, the operator cannot simultaneously adjust and fix multiple positions of the sensor chip, thus affecting the efficiency of the sensor chip encapsulation process.

[0005] To achieve the purpose of this utility model, the technical solution adopted by this utility model is as follows: a sensor chip encapsulation device is designed, including a mounting base, a mounting bracket is slidably mounted on the top of the mounting base, and an injection tube is movably mounted on the inner side of the mounting bracket;

[0006] A bearing base is movably embedded in the middle of the inner side of the mounting base. Hollow tubes are vertically fixed on the four corner surfaces of the top of the bearing base. A retaining arc plate is movably embedded in both sides of the outer side of each hollow tube.

[0007] Each hollow tube is equipped with a bidirectional pushing mechanism inside, and the bottom of the support base is equipped with a synchronous driving mechanism, and the synchronous driving mechanism and the bidirectional pushing mechanism are connected in transmission.

[0008] Preferably, a first electric slide rail is fixedly installed at both ends of the side of the mounting base, and the bottom end of the mounting frame is drivenly connected to the first electric slide rail. A second electric slide rail is vertically fixedly installed at both ends of the top inner side of the mounting frame. A mounting plate is drivenly connected between the outer sides of the two sets of second electric slide rails. A third electric slide rail is fixedly installed on the bottom surface of the mounting plate, and the bottom of the third electric slide rail is drivenly connected to the glue injection tube.

[0009] Preferably, the bidirectional pushing mechanism includes a bidirectional lead screw and a pushing rod. The bidirectional lead screw is vertically rotatably mounted inside each hollow tube via a bearing. Lifting sleeves are threadedly connected to both sides of the outer side of each bidirectional lead screw.

[0010] Preferably, each of the lifting sleeves has connecting blocks fixedly installed at both ends of its outer side and at both ends of the outer wall of the abutting arc plate. A push rod is inclinedly hinged between the outer sides of every two sets of connecting blocks via a rotating shaft. Limiting grooves are vertically opened on both sides of the hollow tube, and the push rod is slidably installed inside the limiting groove.

[0011] Preferably, the synchronous drive mechanism includes a follower gear, a transmission gear ring, a transmission bevel gear, and a follower bevel gear. A fixed frame is fixedly installed at the bottom of the bearing base. A rotating circular plate is rotatably installed inside the fixed frame. A transmission gear ring is fixedly installed on the top surface of the rotating circular plate. A rotating rod is fixedly installed at the bottom of each bidirectional lead screw, and the rotating rod is rotatably installed inside the fixed frame through a bearing. A follower gear is fixedly sleeved on the outside of each rotating rod, and the outer wall of the follower gear meshes with the inner side of the transmission gear ring.

[0012] Preferably, a transmission frame is horizontally fixedly installed at the bottom center of the fixed frame, and a rotating tube is rotatably installed through a bearing at the side center of the transmission frame. A connecting rod is horizontally fixedly installed at the side center of the rotating tube, and a transmission bevel gear is fixedly sleeved on the outer side of the end of the connecting rod away from the rotating tube. A transmission rod is fixedly installed at the bottom center of the rotating circular plate, and a follower bevel gear is fixedly sleeved on the outer side of the bottom of the transmission rod, with the transmission bevel gear and the follower bevel gear meshing on their outer sides.

[0013] Preferably, a connector rod is slidably inserted inside the rotating tube, and a screwing plate is fixedly installed on the top side of the connector rod.

[0014] Preferably, both ends of the plug rod away from the rotating plate are fixedly installed with abutting blocks, and abutting grooves are opened on both sides inside the rotating tube, and the abutting blocks are slidably inserted into the abutting grooves.

[0015] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0016] 1. This utility model features hollow tubes vertically positioned at the four corners of the mounting base, with bidirectional lead screws inside each tube. A rotating rod connects the follower gears and the bidirectional lead screws, allowing for easy assembly of the circuit board and its sensor chips. When the circuit board and its surface sensor chips are being encapsulated by fitting the slots at the four corners of the hollow tubes, the operator simply drives a rotating disc to rotate within the fixed frame. This rotation causes the transmission gear ring on the disc to rotate. The meshing of the transmission gear ring and the four sets of follower gears synchronously drives these gears to rotate within the fixed frame. The rotating rod then connects the bidirectional lead screws inside the hollow tubes. The rod rotates synchronously and in the same direction. Combined with the rotational transmission of the lifting sleeve by the double-acting screw, the lifting sleeves sleeved on both sides of the double-acting screw can move vertically in opposite directions inside the hollow tube. Then, with the hinge action of the rotating shaft, the push rod can convert the vertical movement force of the lifting sleeve into an outward pushing force on the pressing arc plate. This allows the pressing arc plate to move outward from both sides of the outer wall of the hollow tube until it can fit against the inner wall of the circuit board slot. This allows the sensor chip to be fixed and limited on all four sides simultaneously. At the same time, the vertical position of the sensor chip is limited by the resisting force of the pressing arc plate, improving the stability of the sensor chip during the encapsulation process.

[0017] 2. This utility model features a transmission frame at the bottom of the fixed frame, and transmission bevel teeth and follower bevel teeth inside the transmission frame. The rotating circular plate and follower bevel teeth are connected by a transmission rod. This allows the operator to adjust the position of multiple sets of clamping arc plates by turning the rotating tube located at the center of the bottom of the mounting base. The meshing transmission of the transmission bevel teeth and follower bevel teeth provides the driving force required for the rotation of the rotating circular plate and the transmission gear ring, thereby simultaneously providing the driving force required for the fixed limit adjustment of multiple sets of clamping arc plates. This facilitates the operator to quickly fix and remove the sensor chip to be sealed. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0019] Figure 2 This is a schematic diagram of the overall bottom structure of this utility model;

[0020] Figure 3 This is a schematic diagram of the internal structure of the fixed frame of this utility model;

[0021] Figure 4 This is a side sectional view of the transmission frame of this utility model.

[0022] Figure 5 This is a front view cross-sectional structural diagram of the hollow tube of this utility model;

[0023] In the diagram: 1. Mounting base; 11. First electric slide rail; 12. Mounting bracket; 13. Second electric slide rail; 14. Mounting plate; 15. Third electric slide rail; 16. Glue injection tube; 2. Bearing base; 21. Hollow tube; 22. Two-way lead screw; 23. Lifting sleeve; 24. Abutting arc plate; 25. Connecting block; 26. Push rod; 27. Limiting groove; 28. Rotating rod; 29. ​​Follower gear; 3. Transmission rod; 31. Rotating circular plate; 32. Transmission gear ring; 33. Fixed frame; 4. Transmission frame; 41. Rotating tube; 42. Connecting rod; 43. Transmission bevel gear; 44. Follower bevel gear; 5. Insertion rod; 51. Abutting block; 52. Abutting groove; 53. Twisting plate. Detailed Implementation

[0024] The present invention will be further described below with reference to the accompanying drawings and embodiments:

[0025] Example 1: A sensor chip encapsulation device, see [link to example]. Figures 1 to 5The mounting base 1 has a support base 2 that is movably embedded in the middle of its inner side. Both ends of the support base 2 are connected to the inside of the mounting base 1 by bolts, allowing the support base 2 to be disassembled and replaced. The position of the hollow tube 21 on the surface of the support base 2 can be adjusted to ensure that it can be used for encapsulation of sensor chips of different specifications. Hollow tubes 21 are vertically fixedly installed on the four corners of the top surface of the support base 2, and a retaining arc plate 24 is movably embedded in both sides of the outside of each hollow tube 21.

[0026] A connecting rod 5 is slidably inserted inside the rotating tube 41. A rotating plate 53 is fixedly installed on the top side of the connecting rod 5. Abutting blocks 51 are fixedly installed at both ends on the side of the connecting rod 5 away from the rotating plate 53. Abutting grooves 52 are opened on both sides inside the rotating tube 41, and the abutting blocks 51 are slidably inserted into the abutting grooves 52.

[0027] When it is necessary to encapsulate the sensor chip, according to the size of the sensor chip, that is, the position of the mounting slots on the four sides of the circuit board on which the chip is mounted, select a support base 2 that matches the position. After using bolts to install it into the mounting base 1, the sensor chip to be encapsulated, together with the circuit board, is then fitted onto the outside of the four sets of hollow tubes 21. The abutment block 51 on the side of the plug rod 5 is aligned with the abutment groove 52 inside the rotating tube 41. The plug rod 5 is continuously pushed so that the side of the plug rod 5 moves into the rotating tube 41, connecting the plug rod 5 and the rotating tube 41. This allows the operator to adjust the position of the clamping arc plate 24 from the side of the mounting base 1.

[0028] For details, see Figures 1 to 5 A transmission frame 4 is horizontally fixedly installed at the bottom center of the fixed frame 33. A rotating tube 41 is rotatably installed through the middle of the side of the transmission frame 4 via a bearing. A connecting rod 42 is horizontally fixedly installed at the middle of the side of the rotating tube 41. A transmission bevel gear 43 is fixedly sleeved on the outer side of the end of the connecting rod 42 away from the rotating tube 41. A transmission rod 3 is fixedly installed at the bottom center of the rotating circular plate 31. The transmission rod 3 is rotatably installed inside the side of the transmission frame 4 via a bearing. A follower bevel gear 44 is fixedly sleeved on the outer side of the bottom of the transmission rod 3. The outer sides of the transmission bevel gear 43 and the follower bevel gear 44 mesh with each other.

[0029] After the insertion rod 5 and the rotating tube 41 are connected by transmission, the rotating plate 53 is pushed. Under the pushing action of the abutting block 51 on the abutting slide 52, the rotating tube 41 can be driven to rotate synchronously on the side of the transmission frame 4. Under the connecting transmission action of the connecting rod 42, the transmission bevel gear 43 can be driven to rotate inside the transmission frame 4. Under the meshing transmission action of the transmission bevel gear 43 and the follower bevel gear 44, the follower bevel gear 44 can be driven to rotate synchronously inside the transmission frame 4. Under the connecting transmission action of the transmission rod 3, the corresponding rotation driving force is provided to the rotating circular plate 31, which in turn can provide the driving force required for the movement and adjustment of multiple sets of abutting arc plates 24.

[0030] Further, see Figures 1 to 5 A fixed frame 33 is fixedly installed at the bottom of the support base 2. A rotating circular plate 31 is rotatably installed inside the fixed frame 33. A transmission gear ring 32 is fixedly installed on the top surface of the rotating circular plate 31. A rotating rod 28 is fixedly installed at the bottom of each bidirectional lead screw 22. The rotating rod 28 is rotatably installed inside the fixed frame 33 through a bearing. A follower gear 29 is fixedly sleeved on the outside of each rotating rod 28. The outer wall of the follower gear 29 meshes with the inner side of the transmission gear ring 32.

[0031] Further, see Figures 1 to 5 Each hollow tube 21 has a bidirectional lead screw 22 installed vertically via bearings. Each bidirectional lead screw 22 has a lifting sleeve 23 threadedly connected to both sides of its outer surface. The inner wall of the lifting sleeve 23 has a thread that matches the helical direction of the outer wall of the bidirectional lead screw 22. Each lifting sleeve 23 has a connecting block 25 fixedly installed at both ends of its outer surface and at both ends of the outer wall of the pressing arc plate 24. A push rod 26 is inclinedly hinged between the outer sides of every two sets of connecting blocks 25 via a rotating shaft. Each hollow tube 21 has a limiting groove 27 vertically opened on both sides of its inner surface, and the push rod 26 is slidably installed inside the limiting groove 27.

[0032] After the insertion rod 5 is turned, causing the follower bevel gear 44 to rotate synchronously, under the connecting transmission action of the transmission rod 3, the rotating circular plate 31 and the transmission gear ring 32 on its surface can be driven to rotate synchronously inside the fixed frame 33. Then, under the meshing transmission action of the transmission gear ring 32 on the follower gear 29, the four sets of follower gears 29, together with the rotating rod 28 inside them, can be driven to rotate synchronously and in the same direction. Then, under the connecting transmission action of the rotating rod 28, the corresponding rotation driving force of the four bidirectional screw rods 22 located at the bottom of the bearing can be driven synchronously, so that the four sets of bidirectional screw rods 22 rotate synchronously and in the same direction. Under the rotation transmission action of the bidirectional screw rods 22 on the lifting sleeve 23, and in the limiting slide groove 2 Under the guiding and limiting action of the push rods 26, the lifting sleeve 23 will not rotate axially with the rotation of the bidirectional screw 22. This allows the lifting sleeves 23 located on both sides inside the hollow tube 21 to move vertically in opposite directions synchronously. Combined with the hinge action of the rotating shaft, the two ends of the push rods 26 rotate relative to each other on the outer side of the lifting sleeve 23 and the outer wall of the pressing arc plate 24, respectively. The push rods 26 can convert the vertical movement force of the lifting sleeve 23 into an outward pushing force on the pressing arc plate 24, so that the pressing arc plate 24 can be moved out relative to each other from both sides of the outer wall of the hollow tube 21 until the pressing arc plate 24 can fit against the inner wall of the circuit board slot. Then, the four sides of the sensor chip can be synchronously fixed and limited.

[0033] It is worth noting that, see Figures 1 to 5 A mounting bracket 12 is slidably mounted on the top of the mounting base 1. An injection tube 16 is movably mounted on the inner side of the mounting bracket 12. A first electric slide rail 11 is fixedly mounted on both ends of the side of the mounting base 1, and the bottom end of the mounting bracket 12 is connected to the first electric slide rail 11. A second electric slide rail 13 is vertically fixedly mounted on both ends of the top inner side of the mounting bracket 12. A mounting plate 14 is connected between the outer sides of the two sets of second electric slide rails 13. A third electric slide rail 15 is fixedly mounted on the bottom surface of the mounting plate 14, and the bottom of the third electric slide rail 15 is connected to the injection tube 16.

[0034] After the sensor chip is fixed and limited, the first electric slide rail 11, the second electric slide rail 13 and the third electric slide rail 15 are opened by an external controller. During operation, the slide rail 15 moves from multiple directions, allowing the adhesive injection tube 16 to be evenly applied to the outside of the sensor chip, thus achieving the sealing process of the sensor chip.

[0035] In addition, all components designed in this utility model are general standard parts or components known to those skilled in the art. Their structure and principle can be learned by those skilled in the art through technical manuals or conventional experimental methods. Those skilled in the art can fully implement them, so there is no need to elaborate. The content protected by this utility model does not involve improvements to the internal structure and method.

[0036] The embodiments disclosed herein are preferred embodiments, but are not limited thereto. Those skilled in the art can readily grasp the spirit of this utility model based on the above embodiments and make different extensions and variations. However, as long as they do not depart from the spirit of this utility model, they are all within the protection scope of this utility model.

Claims

1. A sensor chip encapsulation device, comprising a mounting base (1), characterized in that, The mounting base (1) is slidably mounted with a mounting bracket (12) on its top, and an injection tube (16) is movably mounted on the inner side of the mounting bracket (12); The mounting base (1) is movably embedded in the middle of the inner side of the support base (2). The four corner surfaces of the top of the support base (2) are vertically fixed with hollow tubes (21). Each hollow tube (21) is movably embedded in the outer two sides with a retaining arc plate (24). Each hollow tube (21) is provided with a bidirectional pushing mechanism inside, and the bottom of the bearing base (2) is provided with a synchronous driving mechanism, and the synchronous driving mechanism and the bidirectional pushing mechanism are connected in transmission.

2. The sensor chip encapsulation device as described in claim 1, characterized in that, The mounting base (1) has a first electric slide rail (11) fixedly installed at both ends of its side, and the bottom end of the mounting frame (12) is connected to the first electric slide rail (11) in a transmission connection. The top two ends of the inner side of the mounting frame (12) are vertically fixedly installed with a second electric slide rail (13). The two sets of second electric slide rails (13) are connected in a transmission connection between their outer sides with a mounting plate (14). The bottom surface of the mounting plate (14) is fixedly installed with a third electric slide rail (15), and the bottom of the third electric slide rail (15) is connected in a transmission connection with the glue injection tube (16).

3. The sensor chip encapsulation device as described in claim 1, characterized in that, The bidirectional pushing mechanism includes a bidirectional lead screw (22) and a pushing rod (26). The bidirectional lead screw (22) is installed vertically inside each hollow tube (21) via a bearing. Lifting sleeves (23) are threadedly connected to both sides of each bidirectional lead screw (22).

4. The sensor chip encapsulation apparatus as described in claim 3, characterized in that, Each of the lifting sleeves (23) has a connecting block (25) fixedly installed at both ends of the outer side and at both ends of the outer wall of the abutting arc plate (24). A push rod (26) is inclinedly hinged between the outer sides of each pair of connecting blocks (25) via a rotating shaft. Limiting grooves (27) are vertically opened on both sides of the hollow tube (21), and the push rod (26) is slidably installed inside the limiting groove (27).

5. The sensor chip encapsulation apparatus as described in claim 3, characterized in that, The synchronous drive mechanism includes a follower gear (29), a transmission gear ring (32), a transmission bevel gear (43), and a follower bevel gear (44). A fixed frame (33) is fixedly installed at the bottom of the bearing base (2). A rotating circular plate (31) is rotatably installed inside the fixed frame (33). The transmission gear ring (32) is fixedly installed on the top surface of the rotating circular plate (31). A rotating rod (28) is fixedly installed at the bottom of each bidirectional lead screw (22). The rotating rod (28) is rotatably installed inside the fixed frame (33) through a bearing. A follower gear (29) is fixedly sleeved on the outside of each rotating rod (28). The outer wall of the follower gear (29) meshes with the inner side of the transmission gear ring (32).

6. The sensor chip encapsulation apparatus as described in claim 5, characterized in that, A transmission frame (4) is horizontally fixedly installed at the bottom middle of the fixed frame (33). A rotating tube (41) is rotatably installed through a bearing at the middle of the side of the transmission frame (4). A connecting rod (42) is horizontally fixedly installed at the middle of the side of the rotating tube (41). A transmission bevel gear (43) is fixedly sleeved on the outer side of the end of the connecting rod (42) away from the rotating tube (41). A transmission rod (3) is fixedly installed at the bottom middle of the rotating circular plate (31). A follower bevel gear (44) is fixedly sleeved on the outer side of the bottom of the transmission rod (3), and the outer sides of the transmission bevel gear (43) and the follower bevel gear (44) mesh with each other.

7. The sensor chip encapsulation apparatus as described in claim 6, characterized in that, The rotating tube (41) has a sliding insertion rod (5) inside, and a rotating plate (53) is fixedly installed on the top side of the insertion rod (5).

8. The sensor chip encapsulation apparatus as described in claim 7, characterized in that, Both ends of the plug rod (5) away from the rotating plate (53) are fixedly installed with abutting blocks (51). Both sides of the rotating tube (41) are provided with abutting grooves (52), and the abutting blocks (51) are slidably inserted into the abutting grooves (52).

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