Semiconductor package adhesive curing apparatus

Abstract

The utility model relates to the technical field of semiconductor manufacturing equipment discloses a kind of semiconductor encapsulation colloid solidification device, including solidification box and controller, solidification box outside is connected with heat dissipation component, and solidification box outer wall is equipped with heat dissipation window, and dust screen is connected in heat dissipation window, and detachable assembly is connected between dust screen and heat dissipation window.The utility model has the advantages compared with prior art: using detachable assembly can easily take down dust screen to clean or replace, avoid dust accumulation to block mesh hole to influence heat dissipation and dustproof effect, ensure that device inside is clean;Using heat dissipation component is convenient for quickly reducing temperature in solidification box after use, avoid heat accumulation for too long to influence subsequent use.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor manufacturing equipment technology, and in particular to a semiconductor packaging colloid curing device. Background Technology

[0002] In the semiconductor packaging process, the encapsulating colloid needs to be cured to harden and shape, thus protecting the internal chip.

[0003] Existing semiconductor encapsulation colloid curing devices generate a large amount of dust during long-term use, requiring the use of dustproof nets for dust prevention. However, dustproof nets are inconvenient to disassemble, clean, or replace, and are prone to accumulating and clogging the mesh, affecting heat dissipation and dust prevention. Furthermore, the curing chamber generates a large amount of heat after use, with low heat dissipation efficiency, affecting subsequent use and the removal of semiconductor packages, thus making the device somewhat inadequate. Utility Model Content

[0004] The purpose of this invention is to address the shortcomings of existing technologies by proposing a semiconductor encapsulation colloid curing device.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: a semiconductor encapsulation colloid curing device, comprising a curing chamber and a controller, wherein a heat dissipation component is connected to the outside of the curing chamber, a heat dissipation window is opened on the outer wall of the curing chamber, a dustproof net is connected inside the heat dissipation window, and a detachable component is connected between the dustproof net and the heat dissipation window;

[0006] The detachable component includes a card plate, which is fixedly connected to the side of the dustproof net. A card slot is provided inside the curing box, and both the card plate and the dustproof net are slidably connected in the card slot. A fixing plate is fixedly connected to the side of the curing box, and a fixing rod is slidably connected inside the fixing plate. A pull plate is fixedly connected to one end of the fixing rod, and a spring is fixedly connected between the pull plate and the fixing plate. A limit hole is provided on the side of the card plate, and one end of the fixing rod is slidably connected in the limit hole.

[0007] As a further description of the above technical solution:

[0008] The heat dissipation assembly includes an electric telescopic rod, which is fixedly connected to the outer wall of the curing chamber. A connecting plate is fixedly connected to the top of the electric telescopic rod, and baffles are fixedly connected to both ends of the connecting plate. Heat dissipation fins are fixedly connected to the bottom of the baffles, and a mounting base is fixedly connected to the side of the heat dissipation fins. A heat dissipation fan is fixedly connected to the side of the mounting base by bolts. The controller is fixedly connected to the top of the curing chamber, and both the electric telescopic rod and the heat dissipation fan are electrically connected to the controller.

[0009] As a further description of the above technical solution:

[0010] The curing chamber has a door hinged to its front side, and a handle is fixedly connected to the side of the door.

[0011] As a further description of the above technical solution:

[0012] A cushioning pad is fixedly connected to the bottom of the curing box.

[0013] As a further description of the above technical solution:

[0014] The baffle slides on the outer wall of the curing chamber.

[0015] As a further description of the above technical solution:

[0016] The spring is sleeved on the outside of the fixed rod.

[0017] As a further description of the above technical solution:

[0018] The heat dissipation fins slide on the outer wall of the heat dissipation window.

[0019] This utility model has the following beneficial effects:

[0020] 1. In this utility model, in the semiconductor packaging colloid curing device, a detachable component is used to easily remove the dustproof screen for cleaning or replacement, avoiding dust accumulation that clogs the mesh and affects heat dissipation and dustproof effect, and ensuring the cleanliness of the device's interior.

[0021] 2. In this utility model, a heat dissipation component is used in the semiconductor packaging colloid curing device to facilitate the rapid reduction of the temperature inside the curing chamber after use, and to avoid heat accumulation for too long affecting subsequent use. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of the overall structure of a semiconductor encapsulation colloid curing device proposed in this utility model. Figure 1 ;

[0023] Figure 2 This is a schematic diagram of the overall structure of a semiconductor encapsulation colloid curing device proposed in this utility model. Figure 2 ;

[0024] Figure 3 This is a partial structural diagram of a semiconductor encapsulation colloid curing device proposed in this utility model. Figure 1 ;

[0025] Figure 4 This is a partial structural diagram of a semiconductor encapsulation colloid curing device proposed in this utility model. Figure 2 ;

[0026] Figure 5 This utility model proposes a semiconductor encapsulation colloid curing device. Figure 3Enlarged view of point A in the middle.

[0027] Legend:

[0028] 1. Curing box; 2. Box door; 3. Card slot; 4. Card plate; 5. Limiting hole; 6. Fixing plate; 7. Fixing rod; 8. Pull plate; 9. Spring; 10. Heat dissipation window; 11. Dustproof net; 12. Controller; 13. Electric telescopic rod; 14. Connecting plate; 15. Baffle; 16. Heat dissipation fins; 17. Fixing base; 18. Cooling fan; 19. Handle; 20. Buffer pad. Detailed Implementation

[0029] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0030] Reference Figures 1-5 The present invention provides an embodiment of a semiconductor encapsulation colloid curing device, comprising a curing chamber 1 and a controller 12. A heat dissipation component is connected to the outside of the curing chamber 1, and a heat dissipation window 10 is opened on the outer wall of the curing chamber 1. A dustproof net 11 is connected inside the heat dissipation window 10, and a detachable component is connected between the dustproof net 11 and the heat dissipation window 10.

[0031] The detachable components include a card plate 4, which is fixedly connected to the side of the dustproof net 11. A card slot 3 is provided inside the curing box 1. Both the card plate 4 and the dustproof net 11 are slidably connected in the card slot 3. A fixing plate 6 is fixedly connected to the side of the curing box 1. A fixing rod 7 is slidably connected inside the fixing plate 6. A pull plate 8 is fixedly connected to one end of the fixing rod 7. A spring 9 is fixedly connected between the pull plate 8 and the fixing plate 6. A limit hole 5 is provided on the side of the card plate 4. One end of the fixing rod 7 is slidably connected in the limit hole 5 to facilitate fixing the card plate 4.

[0032] The heat dissipation assembly includes an electric telescopic rod 13, which is fixedly connected to the outer wall of the curing chamber 1. A connecting plate 14 is fixedly connected to the top of the electric telescopic rod 13. Baffles 15 are fixedly connected to both ends of the connecting plate 14. Heat dissipation fins 16 are fixedly connected to the bottom of the baffles 15. A fixing seat 17 is fixedly connected to the side of the heat dissipation fins 16. A cooling fan 18 is fixedly connected to the side of the fixing seat 17 by bolts. A controller 12 is fixedly connected to the top of the curing chamber 1. The electric telescopic rod 13 and the cooling fan 18 are electrically connected to the controller 12. A door 2 is hinged to the front side of the curing chamber 1. A handle 19 is fixedly connected to the side of the door 2. A buffer pad 20 is fixedly connected to the bottom of the curing chamber 1. The baffles 15 slide on the outer wall of the curing chamber 1. A spring 9 is sleeved on the outside of the fixing rod 7. The heat dissipation fins 16 slide on the outer wall of the heat dissipation window 10 to facilitate the dissipation of internal heat after aligning with the outside of the heat dissipation window 10.

[0033] Working principle: In the semiconductor encapsulation colloid curing device, pulling the pull plate 8 outward causes one end of the fixing rod 7 to slide out of the limiting hole 5, while simultaneously stretching the spring 9. This allows the card plate 4 and dustproof net 11 to slide out along the slot 3, making it easy to remove the dustproof net 11 for cleaning or replacement. This prevents dust accumulation from clogging the mesh and affecting heat dissipation and dustproofing, ensuring the cleanliness of the device's interior. During installation, pulling the pull plate 8 outward stretches the spring 9, sliding the card plate 4 into the slot 3. Releasing the pull plate 8 allows the spring 9 to cause one end of the fixing rod 7 to slide into the limiting hole 5, thus fixing the card plate 4 and completing the installation. After curing, controlling the start of the electric telescopic rod 13 raises the baffle 15, causing the heat dissipation fins 16 to slide to the outside of the heat dissipation window 10. This activates the cooling fan 18, assisting the heat dissipation fins 16 in dissipating the temperature inside the curing chamber 1, facilitating rapid temperature reduction after use and preventing prolonged heat buildup from affecting subsequent use.

[0034] All electrical components mentioned in this article are electrically connected to an external main controller and 220V AC mains power. The main controller can be a conventional known device such as a computer for control. The detailed description of known functions and known components is omitted in the specific embodiments disclosed herein. To ensure the compatibility of the device, the operating methods used are consistent with the parameters of commercially available instruments.

[0035] This solution is only applicable to existing curing chambers, controllers, and cooling fans on the market. The structural technology of curing chambers, controllers, and cooling fans is already very mature and widely used. The technology of curing chambers, controllers, and cooling fans is common knowledge in the field and will not be described in detail here. At the same time, this application does not protect the specific structure of curing chambers, controllers, and cooling fans. Those skilled in the art can select curing chambers, controllers, and cooling fans based on practical experience and usage requirements.

[0036] In this utility model, unless otherwise explicitly specified and limited, the terms "installation", "setting", "connection", "fixing", "screw connection", etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal connection of two components or the interaction between two components. Unless otherwise explicitly limited, those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0037] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A semiconductor encapsulation colloid curing apparatus, comprising a curing chamber (1) and a controller (12), characterized in that: A heat dissipation assembly is connected to the outside of the curing box (1), and a heat dissipation window (10) is opened on the outer wall of the curing box (1). A dustproof net (11) is connected inside the heat dissipation window (10), and a detachable assembly is connected between the dustproof net (11) and the heat dissipation window (10). The detachable component includes a card plate (4), which is fixedly connected to the side of the dustproof net (11). A card slot (3) is provided in the curing box (1). The card plate (4) and the dustproof net (11) are slidably connected in the card slot (3). A fixing plate (6) is fixedly connected to the side of the curing box (1). A fixing rod (7) is slidably connected in the fixing plate (6). A pull plate (8) is fixedly connected to one end of the fixing rod (7). A spring (9) is fixedly connected between the pull plate (8) and the fixing plate (6). A limit hole (5) is provided on the side of the card plate (4). One end of the fixing rod (7) is slidably connected in the limit hole (5).

2. The semiconductor encapsulation colloid curing apparatus according to claim 1, characterized in that: The heat dissipation assembly includes an electric telescopic rod (13), which is fixedly connected to the outer wall of the curing chamber (1). A connecting plate (14) is fixedly connected to the top of the electric telescopic rod (13). Baffles (15) are fixedly connected to both ends of the connecting plate (14). Heat dissipation fins (16) are fixedly connected to the bottom of the baffles (15). A fixing seat (17) is fixedly connected to the side of the heat dissipation fins (16). A heat dissipation fan (18) is fixedly connected to the side of the fixing seat (17) by bolts. The controller (12) is fixedly connected to the top of the curing chamber (1). The electric telescopic rod (13) and the heat dissipation fan (18) are both electrically connected to the controller (12).

3. The semiconductor encapsulation colloid curing apparatus according to claim 1, characterized in that: The curing box (1) has a door (2) hinged to the front side, and a handle (19) is fixedly connected to the side of the door (2).

4. The semiconductor encapsulation colloid curing apparatus according to claim 1, characterized in that: A buffer pad (20) is fixedly connected to the bottom of the curing box (1).

5. The semiconductor encapsulation colloid curing apparatus according to claim 2, characterized in that: The baffle (15) slides on the outer wall of the curing chamber (1).

6. The semiconductor encapsulation colloid curing apparatus according to claim 1, characterized in that: The spring (9) is sleeved on the outside of the fixed rod (7).

7. The semiconductor encapsulation colloid curing apparatus according to claim 2, characterized in that: The heat dissipation fins (16) slide on the outer wall of the heat dissipation window (10).

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