A kind of air cooling device after edge band gluing

Abstract

The utility model discloses an edge band after the glue spreading air -cooled device, include: the support frame of top is equipped with a plurality of conveying roller, the protective cover, the protective cover is located the top of support frame, the cold air channel, the cold air channel is located the inside of protective cover, one fan is fixedly connected to the end of cold air channel, the bottom of cold air channel is equipped with a plurality of cold air hole, the top of cold air channel is fixedly connected with the heat exchange air channel, the utility model has the beneficial effects that: through the combination of semiconductor refrigeration sheet and cold conduction fin, can rapidly reduce the temperature in the cold air channel, and the cold air is blown to the edge band from the cold air hole by the fan no.

Description

Technical Field

[0001] This utility model relates to the field of edge banding processing technology, specifically to an air-cooling device for edge banding after adhesive application. Background Technology

[0002] After the edge banding is applied, the adhesive is usually in a liquid or semi-solid state and requires a certain amount of time to cure. Air cooling can lower the adhesive temperature, thereby accelerating the curing process and shortening the production cycle.

[0003] Existing air cooling methods mostly rely on natural air cooling or use equipment such as fans or blowers to generate forced airflow that blows directly onto the edge banding strip after the adhesive has been applied. The air cooling temperatures of these methods are relatively low, and they cannot achieve rapid cooling and curing, thus failing to effectively improve processing efficiency. Utility Model Content

[0004] The purpose of this invention is to provide an air-cooling device for edge banding strips after gluing, so as to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a wind-cooling device for edge banding strips after adhesive application, comprising:

[0006] A support frame with multiple conveyor rollers at the top;

[0007] A protective cover is placed on top of the support frame;

[0008] A cold air duct is placed inside the protective cover. A fan is fixed to the end of the cold air duct. Multiple cold air holes are opened at the bottom of the cold air duct. A heat exchange air duct is fixed to the top of the cold air duct. A base plate is fixed to the bottom of the heat exchange air duct. A semiconductor refrigeration chip is embedded in the top of the base plate. Multiple cold conduction fins extending into the interior of the cold air duct are fixed to the cooling end of the semiconductor refrigeration chip.

[0009] Preferably, air guide plates are installed at an angle on both sides of the cold air duct.

[0010] Preferably, a heat dissipation duct is provided on one side of the heat exchange duct, and multiple heat dissipation ports are opened on the side of the heat exchange duct. A second fan is installed in the middle of the heat dissipation port, and the air outlet of the second fan is connected to the heat dissipation duct.

[0011] Preferably, the heating end of the semiconductor cooling chip is fixed with multiple heat conduction fins, which extend into the heat exchange duct.

[0012] Preferably, a pressure roller is installed on the top of the inner wall of the protective cover. The pressure roller is located above the conveying roller at the end of the support frame, and a drive unit is provided on one side of the pressure roller to drive its rotation.

[0013] Preferably, the protective cover is provided with sealing plates at both ends, and the sealing plates are provided with material conveying holes in the middle.

[0014] Compared with the prior art, the beneficial effects of this utility model are as follows: By combining the semiconductor cooling chip with the cold conduction fins, the temperature inside the cold air duct can be rapidly reduced. The No. 1 fan blows cold air from the cold air hole to the edge sealing strip, achieving a rapid and uniform cooling effect, which helps the adhesive to set quickly. The design of the air guide plate can be adjusted according to the width of the edge sealing strip, and its tilt angle can effectively concentrate the air force, forming a funnel-like airflow that directly targets the edge sealing strip, improving cooling efficiency and accuracy. The setting of the heat exchange air duct and the heat dissipation air duct, as well as the use of the No. 2 fan, ensure that the heat generated by the heating end of the semiconductor cooling chip is discharged from the system in a timely manner, preventing heat backflow from affecting the cooling effect and maintaining the stability and continuous high-efficiency operation of the system. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the structure of this utility model;

[0016] Figure 2 This is a schematic diagram of the structure of the pressure roller of this utility model;

[0017] Figure 3 This is a schematic diagram of the structure of the conveyor roller of this utility model;

[0018] Figure 4 This is a schematic diagram of the structure of the cooling air vent of this utility model;

[0019] Figure 5 This is a schematic diagram of the structure of the No. 2 fan of this utility model;

[0020] Figure 6 This is a schematic diagram of the structure of the heat conduction fins of this utility model.

[0021] In the diagram: 1. Support frame; 2. Protective cover; 3. Fan No. 1; 4. Heat exchange air duct; 5. Heat dissipation air duct; 6. Conveyor roller; 7. Pressure roller; 8. Cold air duct; 9. Cold air hole; 10. Air guide plate; 11. Semiconductor cooling chip; 12. Cold conduction fins; 13. Heat conduction fins; 14. Fan No. 2; 15. Base plate. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0023] Please see Figure 1, 2 As shown in Figures 3, 4, 5, and 6, this utility model provides a technical solution: a wind-cooling device for edge-sealing strips after adhesive application, comprising: a support frame 1 with multiple conveying rollers 6 rotatably mounted on the top; a protective cover 2 fixedly connected to the top of the support frame 1; a cold air duct 8 fixedly connected to the inside of the protective cover 2, a No. 1 fan 3 fixedly connected to the end of the cold air duct 8, multiple cold air holes 9 opened at the bottom of the cold air duct 8, a heat exchange air duct 4 fixedly connected to the top of the cold air duct 8, a base plate 15 fixedly connected to the bottom of the heat exchange air duct 4, a semiconductor refrigeration chip 11 embedded in the top of the base plate 15, and multiple cold conduction fins 12 extending into the inside of the cold air duct 8 fixedly connected to the cooling end of the semiconductor refrigeration chip 11.

[0024] It should be noted that this utility model is equipped with a temperature sensor and a controller. The first fan 3 and the semiconductor cooling chip 11 are powered on by the switch. The cooling end of the semiconductor cooling chip 11 begins to cool. The cold conduction fins 12 transfer the low temperature at the end of the semiconductor cooling chip 11 to the cold air duct 8. The first fan 3 blows in from one end. The air blown in cools down after contacting the semiconductor cooling chip 11. Under the action of the first fan 3, the cold air blows downward from the cold air hole 9. After the edge sealing strip is coated with glue, it passes through the middle of the protective cover 2, so that the glued side corresponds to the cold air hole 9, thereby cooling it and allowing the glue to set quickly.

[0025] Please see Figure 4 , 5 As shown, air guide plates 10 are installed at an angle on both sides of the cold air duct 8.

[0026] It should be noted that the air guide plate 10 of this utility model is fixed to both sides of the cold air duct 8 by screws. The air guide plate 10 with different tilt angles can be replaced according to the width of the sealing strip. The air guide plate 10 is tilted and the two air guide plates 10 are funnel-shaped, so that the air is concentrated towards the sealing strip for cooling, thereby improving the efficiency of air cooling.

[0027] Please see Figure 4 , 5 As shown in Figure 6, a heat dissipation air duct 5 is provided on one side of the heat exchange air duct 4. Multiple heat dissipation ports are opened on the side of the heat exchange air duct 4. A second fan 14 is installed in the middle of the heat dissipation port. The air outlet of the second fan 14 is connected to the heat dissipation air duct 5. Multiple heat conduction fins 13 are fixed to the heating end of the semiconductor cooling chip 11. The heat conduction fins 13 extend into the heat exchange air duct 4.

[0028] It should be noted that the heat conduction fins 13 of this utility model transfer the heat from the heating end of the semiconductor cooling chip 11 to the heat exchange duct 4. The second fan 14 transports the heat inside the heat exchange duct 4 to the heat dissipation duct 5 and then discharges it from the end, preventing heat from entering the cold air duct 8 and affecting its cooling effect.

[0029] Please see Figure 2 , 3As shown, a pressure roller 7 is installed on the top of the inner wall of the protective cover 2. The pressure roller 7 is located above the conveying roller 6 at the end of the support frame 1. A motor is provided on one side of the pressure roller 7 to drive its rotation. Sealing plates are provided at both ends of the protective cover 2, and a material conveying hole is provided in the middle of the sealing plate.

[0030] It should be noted that the pressure roller 7 of this utility model is located on the outside of the sealing plate. The sealing strip passes through the middle of the sealing plate and then passes through the space between the conveying roller 6 and the pressure roller 7. The motor drives the pressure roller 7 to rotate. Under the action of friction, the pressure roller 7 and the conveying roller 6 convey the cooled sealing strip forward, and the sealing strip is pulled and cooled by air at the same time.

[0031] In the description of this utility model, it should be understood that the terms "coaxial", "bottom", "one end", "top", "middle", "other end", "upper", "side", "top", "inner", "front", "center", "both ends", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0032] Furthermore, the terms "first," "second," "third," and "fourth" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first," "second," "third," or "fourth" may explicitly or implicitly include at least one of those features.

[0033] In this utility model, unless otherwise explicitly specified and limited, the terms "installation", "setting", "connection", "fixing", "screw connection", etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal connection of two components or the interaction between two components. Unless otherwise explicitly limited, those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0034] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A wind-cooling device for edge-sealing strips after adhesive application, characterized in that: include: A support frame (1) with multiple conveying rollers (6) at the top; A protective cover (2) is placed on top of the support frame (1); A cold air duct (8) is placed inside the protective cover (2). A fan (3) is fixed to the end of the cold air duct (8). Multiple cold air holes (9) are opened at the bottom of the cold air duct (8). A heat exchange air duct (4) is fixed to the top of the cold air duct (8). A base plate (15) is fixed to the bottom of the heat exchange air duct (4). A semiconductor refrigeration chip (11) is embedded in the top of the base plate (15). Multiple cold conduction fins (12) extending into the interior of the cold air duct (8) are fixed to the cooling end of the semiconductor refrigeration chip (11).

2. The air-cooling device after applying adhesive to the edge banding strip according to claim 1, characterized in that: Both sides of the cold air duct (8) are equipped with air guide plates (10) at an angle.

3. The air-cooling device after applying adhesive to the edge banding strip according to claim 1, characterized in that: A heat dissipation duct (5) is provided on one side of the heat exchange duct (4). Multiple heat dissipation ports are opened on the side of the heat exchange duct (4). A second fan (14) is installed in the middle of the heat dissipation port. The air outlet of the second fan (14) is connected to the heat dissipation duct (5).

4. The air-cooling device after applying adhesive to the edge banding strip according to claim 3, characterized in that: The heating end of the semiconductor cooling chip (11) is fixed with a plurality of heat conduction fins (13), which extend into the heat exchange duct (4).

5. The air-cooling device after applying adhesive to the edge banding strip according to claim 1, characterized in that: A pressure roller (7) is installed on the top of the inner wall of the protective cover (2). The pressure roller (7) is located above the conveying roller (6) at the end of the support frame (1). A drive unit for driving the pressure roller (7) to rotate is provided on one side of the pressure roller (7).

6. The air-cooling device after applying adhesive to the edge banding strip according to claim 1, characterized in that: The protective cover (2) is provided with sealing plates at both ends, and the sealing plates are provided with material conveying holes in the middle.

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