A double-sided synchronous purging device

Abstract

The utility model provides a kind of double-sided synchronous purging device, including wafer bearing device, liftable wafer clamping device, first purging device and second purging device, liftable wafer clamping device can be liftable and is set on wafer bearing device upside, liftable wafer clamping device upside is equipped with first purging device, liftable wafer clamping device downside is equipped with second purging device, first purging device sends clean air to the surface of liftable wafer clamping device, and second purging device sends clean air to the bottom surface of liftable wafer clamping device.The utility model realizes double-sided synchronous purging, avoids the damage risk caused by artificial turnover, shortens purging time, substantially improves production efficiency, significantly improves wafer thin film deposition uniformity and device yield.

Description

Technical Field

[0001] This utility model belongs to the field of semiconductor manufacturing technology, specifically relating to a double-sided synchronous purging device. Background Technology

[0002] In semiconductor chemical vapor deposition (CVD) equipment, the gas diffuser is a key gas distribution component, and its performance directly affects the uniformity of wafer thin film deposition and device yield. Current purging technology uses a single-sided purging process, resulting in a residue thickness of 80-150 μm on the back side after single-sided purging, leading to incomplete cleaning; manual flipping is required, with a single-piece processing time of 45-60 minutes, impacting production efficiency; and manual flipping carries a high risk of damage.

[0003] Therefore, the above problems urgently need to be solved. Utility Model Content

[0004] Purpose of the utility model: In order to overcome the above shortcomings, this utility model provides a double-sided synchronous blowing device to achieve double-sided synchronous blowing, avoid the risk of damage caused by manual flipping, shorten the blowing time, greatly improve production efficiency, and significantly improve the uniformity of wafer thin film deposition and device yield.

[0005] Technical Solution: To achieve the above objectives, this utility model provides a double-sided synchronous blowing device, including a wafer carrier, a liftable wafer clamping device, a first blowing device, and a second blowing device. The liftable wafer clamping device is liftably mounted on the upper side of the wafer carrier. The first blowing device is located on the upper side of the liftable wafer clamping device, and the second blowing device is located on the lower side of the liftable wafer clamping device. The first blowing device blows clean air onto the surface of the liftable wafer clamping device, and the second blowing device blows clean air onto the bottom surface of the liftable wafer clamping device. This utility model is used for wafer blowing. A robotic arm grips the wafer and places it on the wafer carrier. The liftable wafer clamping device lowers to the wafer position, clamping the wafer edge. The liftable wafer clamping device then rises to the working position. The first and second blowing devices simultaneously blow and clean the upper and lower surfaces of the wafer, effectively removing surface particles and residues and improving cleanliness. This invention enables simultaneous double-sided blowing, avoiding the risk of damage caused by manual flipping, shortening the blowing time, significantly improving production efficiency, and substantially enhancing the uniformity of wafer thin film deposition and device yield.

[0006] Furthermore, in the aforementioned dual-sided synchronous blowing device, the liftable wafer clamping device includes a lifting drive device, a lifting plate, and a gripper mechanism. The lifting drive device and the lifting plate are driven together, and the lifting drive device drives the lifting plate to move closer to or away from the wafer carrier. The gripper mechanism is connected to the top surface of the lifting plate, and two or more gripper mechanisms are arranged around the wafer carrier array. The two or more gripper mechanisms are used to clamp the wafer.

[0007] Furthermore, in the aforementioned dual-sided synchronous purging device, the gripper mechanism includes a slide rail connected to the lifting plate, a clamping plate, and a linear drive module. The slide rail is connected to the lifting plate, and the clamping plate is slidably connected to the slide rail via a slider. The linear drive module is connected to the lifting plate, and its drive unit is connected to the clamping plate, driving the clamping plate to slide along the slide rail. The linear drive module is a linear motor module that uses electromagnetic force to drive the clamping plate in linear motion, achieving high speed and precision. The linear drive module drives the clamping plate to move along the slide rail, enabling the gripper mechanism to adapt to various wafer sizes and improving the device's versatility. The slide rail is designed as a high-precision linear guide, ensuring smooth operation of the clamping plate and uniform force on the wafer edges during clamping, preventing wafer breakage or micro-deformation due to improper clamping. This structure improves the stability and adaptability of clamping, ensuring the safety and cleanliness of the wafer during the purging process.

[0008] Furthermore, in the aforementioned double-sided synchronous purging device, the clamping plate includes a clamping part and a connecting part, which are integrated in an L-shape. The connecting part is slidably connected by a slider and a slide rail. The driving part of the linear drive module is connected to the connecting part, and the clamping part is located at the end of the connecting part near the wafer carrier. A flexible pad is connected to the side of the clamping part away from the connecting part. A pressure sensor is connected to the end of the connecting part near the clamping part. The sensing head of the pressure sensor passes through the clamping part and is located in a through hole in the flexible pad. The sensing surface is slightly flush with or slightly lower than the working surface of the flexible pad. The pressure sensor monitors the contact pressure between the flexible pad and the wafer in real time during clamping and feeds the data back to the control system to ensure that the clamping force is always maintained within the set range, preventing wafer deformation or breakage due to excessive or uneven clamping force. Through the synergistic effect of the flexible pad and the pressure sensor, the gripper mechanism achieves precise clamping while improving the safety and reliability of wafer clamping.

[0009] Furthermore, in the aforementioned dual-sided synchronous purging device, the first purging device includes a first driving device, a second driving device, and a first air blowing device. The driving end of the first driving device is connected to the base of the second driving device, and the driving end of the second driving device is drivenly connected to the first air blowing device. The driving direction of the first driving device and the direction of the second driving device are perpendicular to each other. The second driving device drives the first air blowing device to move closer to or away from the wafer carrier. The second driving device drives the first air blowing device to move closer to or away from the wafer carrier in a horizontal direction. The first air blowing device is adjusted in a direction perpendicular to the movement direction of the second driving device to accurately align with the purging area of ​​the wafer edge, thereby achieving efficient and uniform purging of the wafer surface.

[0010] Furthermore, in the aforementioned dual-sided synchronous purging device, the first air blowing device includes an air pipe, an air nozzle, and a connector. The connector is connected to the air inlet of the air pipe, and the air nozzle is connected to the side of the air pipe facing the wafer carrier. The air nozzles are arranged along the air pipe array. The air nozzles are distributed along the air pipe array to ensure that the airflow covers the edge area of ​​the wafer, thereby improving purging efficiency.

[0011] Furthermore, in the aforementioned dual-sided synchronous purging device, the second purging device is connected to the bottom surface of the lifting plate. The second purging device includes a third driving device, a fourth driving device, and a second air blowing device. The driving end of the third driving device is connected to the base of the fourth driving device, and the driving end of the fourth driving device is driven by the second air blowing device. The driving direction of the third driving device and the direction of the fourth driving device are perpendicular to each other. The fourth driving device drives the second air blowing device to move closer to or away from the wafer carrier.

[0012] Furthermore, in the aforementioned dual-sided synchronous purging device, the wafer carrier is connected to the top surface of the base plate, and a top plate is provided on the upper side of the base plate. The base plate and the top plate are supported and connected by guide pillars, and the lifting plate is slidably connected to the guide pillars via a sliding sleeve. The lifting drive device is set in a driving direction parallel to the axis of the guide pillars, and the lifting drive device drives the lifting plate to slide along the guide pillars. The lifting drive device includes a first lead screw with its two ends connected to the base plate and the top plate respectively. The first lead screw is driven and connected to the lifting plate via a bushing, and one end of the first lead screw is driven and connected to a servo motor.

[0013] Furthermore, in the aforementioned double-sided synchronous purging device, the first driving device includes a slide, a second lead screw, and a driving block. The second lead screw is rotatably mounted along the slide, and a servo motor is driven to one end of the second lead screw. The second lead screw and the driving block are threadedly connected, and the driving block is slidably connected within the slide. A support plate is connected to the top surface of the driving block. The second driving device is connected to the top surface of the support plate.

[0014] Furthermore, in the aforementioned dual-sided synchronous purging device, the second driving device includes a housing, within which a driving screw is movably connected. A driving motor is connected to the end of the housing furthest from the wafer carrier. The driving motor is connected to the driving screw via a threaded sleeve, and the driving motor drives the driving screw to move closer to or away from the wafer carrier via the threaded sleeve. The driving motor is configured as a servo motor.

[0015] As can be seen from the above technical solution, this utility model has the following beneficial effects: The double-sided synchronous blowing device of this utility model, with a first blowing device and a second blowing device simultaneously blowing and cleaning the upper and lower surfaces of the wafer, effectively removes surface particles and residues, improves cleanliness, avoids the risk of damage caused by manual flipping, shortens blowing time, significantly improves production efficiency, and significantly improves the uniformity of wafer thin film deposition and device yield. This utility model is applicable to the blowing needs of wafers of various specifications, possessing good versatility and adaptability. By precisely controlling the operating parameters of each driving component, precise control of the entire blowing process is achieved, further ensuring the consistency and stability of wafer processing. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the structure of the double-sided synchronous purging device of this utility model; Figure 2 This is a schematic diagram of the structure of the liftable wafer clamping device; Figure 3 As shown Figure 2 A magnified view of a portion of the image; Figure 4 This is a schematic diagram of the structure of the first purging device; Figure 5 As shown Figure 4 A magnified view of a portion of the image; Figure 6 This is a schematic diagram of the second purging device.

[0017] In the diagram: 1. Wafer carrier; 2. Liftable wafer clamping device; 21. Lifting drive device; 211. First lead screw; 22. Lifting plate; 23. Gripper mechanism; 231. Slide rail; 232. Clamping plate; 2321. Clamping part; 2322. Connecting part; 2323. Flexible pad; 233. Linear drive module; 234. Pressure sensor; 3. First purging device; 31. First drive device; 311. Slide base. 312. Second lead screw; 313. Drive block; 314. Support plate; 32. Second drive device; 321. Housing; 322. Drive screw; 323. Drive motor; 33. First air blowing device; 331. Air pipe; 332. Air nozzle; 333. Connector; 4. Second purging device; 41. Third drive device; 42. Fourth drive device; 43. Second air blowing device; 5. Base plate; 6. Top plate; 7. Guide column. Detailed Implementation

[0018] Example 1 like Figure 1The illustrated dual-sided synchronous purging device includes a wafer carrier 1, a liftable wafer clamping device 2, a first purging device 3, and a second purging device 4. The liftable wafer clamping device 2 is purgably mounted on the upper side of the wafer carrier 1. The first purging device 3 is located on the upper side of the liftable wafer clamping device 2, and the second purging device 4 is located on the lower side of the liftable wafer clamping device 2. The first purging device 3 blows clean air onto the surface of the liftable wafer clamping device 2, and the second purging device 4 blows clean air onto the bottom surface of the liftable wafer clamping device 2.

[0019] In this implementation, a wafer carrier 1 is connected to the top surface of a base plate 5. A top plate 6 is located on the upper side of the base plate 5. The base plate 5 and the top plate 6 are supported and connected by guide posts 7. A lifting plate 22 is slidably connected to the guide posts 7 via a sliding sleeve. The lifting drive device 21 is set in a driving direction parallel to the axis of the guide posts 7, and the lifting drive device 21 drives the lifting plate 22 to slide along the guide posts 7. The lifting drive device 21 includes a first lead screw 211 with its two ends connected to the base plate 5 and the top plate 6 respectively. The first lead screw 211 is driven and connected to the lifting plate 22 via a bushing, and one end of the first lead screw 211 is driven and connected to a servo motor.

[0020] like Figure 2 The illustrated double-sided synchronous blowing device includes a liftable wafer clamping device 2 comprising a lifting drive device 21, a lifting plate 22, and a gripper mechanism 23. The lifting drive device 21 and the lifting plate 22 are driven together, and the lifting drive device 21 drives the lifting plate 22 to move closer to or away from the wafer carrier device 1. The gripper mechanism 23 is connected to the top surface of the lifting plate 22, and two or more gripper mechanisms 23 are arranged in an array around the wafer carrier device 1 (preferably three). The two or more gripper mechanisms 23 are used to clamp the wafer.

[0021] In this embodiment, the gripper mechanism 23 includes a slide rail 231 connected to the lifting plate 22, a clamping plate 232, and a linear drive module 233. The slide rail 231 is connected to the lifting plate 22, and the clamping plate 232 is slidably connected to the slide rail 231 via a slider. The linear drive module 233 is connected to the lifting plate 22, and its drive unit is driven to drive the clamping plate 232, driving the clamping plate 232 to slide along the slide rail 231. The linear drive module 233 is a linear motor module that uses electromagnetic force to drive the clamping plate 232 to perform linear motion, resulting in high speed and high precision. The linear drive module 233 drives the clamping plate 232 to move along the slide rail 231, enabling the gripper mechanism to adapt to various wafer specifications and improving the device's versatility. The slide rail 231 is designed as a high-precision linear guide rail to ensure smooth operation of the clamping plate 232 and uniform force on the wafer edge during clamping, avoiding wafer breakage or micro-deformation caused by improper clamping. This structure improves the stability and adaptability of the clamping, ensuring the safety and cleanliness of the wafer during the purging process.

[0022] like Figure 3The double-sided synchronous purging device shown includes a clamping plate 232 comprising a clamping part 2321 and a connecting part 2322. The clamping part 2321 and the connecting part 2322 are integrally L-shaped. The connecting part 2322 is slidably connected via a slider and a slide rail 231. The driving part of the linear drive module 233 is connected to the connecting part 2322. The clamping part 2321 is located at the end of the connecting part 2322 near the wafer carrier 1. A flexible pad 2323 is connected to the side of the clamping part 2321 away from the connecting part 2322. A pressure sensor 234 is connected to the end of the connecting part 2322 near the clamping part 2321. The sensing head of the pressure sensor 234 passes through the clamping part 2321 and is located within a through hole in the flexible pad 2323. The sensing surface is slightly flush with or slightly lower than the working surface of the flexible pad 2323. The flexible pad 2323 uses a carbon fiber reinforced liner, which has good cushioning performance and wear resistance. It can effectively absorb vibration during clamping and protect the wafer edge from damage.

[0023] like Figure 4 The illustrated dual-sided synchronous purging device includes a first purging device 3 comprising a first driving device 31, a second driving device 32, and a first air blowing device 33. The driving end of the first driving device 31 is connected to the base of the second driving device 32, and the driving end of the second driving device 32 is driven to the first air blowing device 33. The driving direction of the first driving device 31 and the direction of the second driving device 32 are perpendicular to each other. The second driving device 32 drives the first air blowing device 33 to move closer to or away from the wafer carrier 1. The second driving device 32 drives the first air blowing device 33 to move closer to or away from the wafer carrier 1 in a horizontal direction. The first air blowing device 33 is adjusted in a direction perpendicular to the movement direction of the second driving device 32 to precisely align with the purging area at the edge of the wafer, thereby achieving efficient and uniform purging of the wafer surface.

[0024] In this embodiment, the first driving device 31 includes a slide 311, a second lead screw 312, and a driving block 313. The second lead screw 312 is rotatably mounted along the slide 311, and a servo motor is driven to one end of the second lead screw 312. The second lead screw 312 and the driving block 313 are threadedly connected, and the driving block 313 is slidably connected within the slide 311. A support plate 314 is connected to the top surface of the driving block 313. The second driving device 32 is connected to the top surface of the support plate 314.

[0025] In this embodiment, the second driving device 32 includes a housing 321, within which a driving screw 322 is movably connected. A driving motor 323 is connected to the end of the housing 321 furthest from the wafer carrier 1. The driving motor 323 is connected to the driving screw 322 via a threaded sleeve, and the driving motor 323 drives the driving screw 322 to move closer to or away from the wafer carrier 1 via the threaded sleeve. The driving motor 323 is configured as a servo motor.

[0026] like Figure 5 The illustrated dual-sided synchronous purging device includes a first air-blowing device 33 comprising an air pipe 331, an air nozzle 332, and a connector 333. The connector 333 is connected to the air inlet of the air pipe 331. The air nozzle 332 is connected to the side of the air pipe 331 facing the wafer carrier 1 and is arranged in an array along the air pipe 331. The distribution of the air nozzles 332 along the air pipe 331 array ensures that the airflow covers the wafer edge area, improving purging efficiency. The air nozzles 332 are Venturi nozzles, which effectively enhance airflow velocity and reduce airflow diffusion, making purging more concentrated and efficient.

[0027] like Figure 6 The double-sided synchronous purging device shown has a second purging device 4 connected to the bottom surface of the lifting plate 22. The second purging device 4 includes a third drive device 41, a fourth drive device 42, and a second air blowing device 43. The drive end of the third drive device 41 is connected to the base of the fourth drive device 42, and the drive end of the fourth drive device 42 is driven by the second air blowing device 43. The drive direction of the third drive device 41 and the direction of the fourth drive device 42 are perpendicular. The fourth drive device 42 drives the second air blowing device 43 to move closer to or away from the wafer carrier 1. The third drive device 41 and the first drive device 31 have the same structure, and the fourth drive device 42 and the second drive device 31 have the same structure.

[0028] This invention is used for wafer purging, and its working steps include: Preparation Phase: A robotic arm grips the wafer and places it on the wafer carrier 1. The lifting drive 21 drives the lifting plate 22 to the wafer position, and the linear drive module 233 drives the connecting part 2322 towards the wafer, causing the flexible pad 2323 connected to the clamping part 2321 to clamp the outer periphery of the wafer. A pressure sensor 234 monitors the contact pressure between the flexible pad 2323 and the wafer in real time during clamping and feeds the data back to the control system. When the pressure value reaches a set threshold, the linear drive module 233 stops working, ensuring that the clamping force is always maintained within the set range. The liftable wafer clamping device 2 rises to the working position. A servo motor drives the lifting plate 22 to rise to the working position via the first lead screw 211 (this working position is equidistant from the first blowing device 3 and the second blowing device 4, ensuring that the second blowing device 4 and the wafer carrier 1 do not interfere with each other).

[0029] During the purging phase: The first drive unit 31 and the second drive unit 32 are activated, pushing the first air blowing device 33 closer to the wafer edge area. The third drive unit 41 and the fourth drive unit 42 are activated, adjusting the second air blowing device 43 away from the wafer edge area of ​​the first air blowing device 33. The system control module simultaneously activates the air supply device, and the high-pressure airflow enters the air pipe 331 through the connector 333 and is ejected at high speed through the air nozzle 332 to simultaneously and efficiently purge the upper and lower surfaces of the wafer. The control system controls the first drive unit 31 and the second drive unit 32 to work together, so that the air nozzle 332 moves along the wafer surface in an S-shaped path, ensuring that the airflow evenly covers the entire wafer surface and avoids dead corners where particles remain. At the same time, the second air blowing device 43 operates synchronously, symmetrically purging the back of the wafer, achieving simultaneous cleaning of both sides and improving purging efficiency and cleanliness. Throughout the purging process, the pressure sensor 234 continuously monitors the changes in clamping force to ensure that the wafer is stably fixed during the purging process and to prevent displacement or damage caused by vibration or airflow impact.

[0030] After purging is completed, the first drive device 31, the second drive device 32, the third drive device 41 and the fourth drive device 42 are reset respectively. Then, the lifting drive device 21 drives the lifting plate 22 to descend to the initial position. Next, the linear drive module 233 drives the connecting part 2322 to reset, placing the wafer in the wafer carrier device 1. Finally, the robot arm takes out the wafer and puts it back into the wafer cassette, completing the entire wafer purging process.

[0031] The above embodiments are exemplary and are intended to illustrate the technical concept and features of this utility model, so that those skilled in the art can understand the content of this utility model and implement it accordingly. They should not be construed as limiting the scope of protection of this utility model. All equivalent changes or modifications made in accordance with the spirit and essence of this utility model should be covered within the scope of protection of this utility model.

Claims

1. A double-sided synchronous purging device, characterized in that: The device includes a wafer carrier (1), a liftable wafer clamping device (2), a first purging device (3), and a second purging device (4). The liftable wafer clamping device (2) is purgably mounted on the upper side of the wafer carrier (1). The first purging device (3) is mounted on the upper side of the liftable wafer clamping device (2), and the second purging device (4) is mounted on the lower side of the liftable wafer clamping device (2). The first purging device (3) blows clean air onto the surface of the liftable wafer clamping device (2), and the second purging device (4) blows clean air onto the bottom surface of the liftable wafer clamping device (2).

2. The double-sided synchronous purging device according to claim 1, characterized in that: The liftable wafer clamping device (2) includes a lifting drive device (21), a lifting plate (22), and a gripper mechanism (23). The lifting drive device (21) and the lifting plate (22) are driven to connect. The lifting drive device (21) drives the lifting plate (22) to move closer to or away from the wafer carrier device (1). The gripper mechanism (23) is connected to the top surface of the lifting plate (22). Two or more gripper mechanisms (23) are arranged around the wafer carrier device (1). The two or more gripper mechanisms (23) are used to clamp the wafer.

3. The double-sided synchronous purging device according to claim 2, characterized in that: The gripper mechanism (23) includes a slide rail (231), a clamping plate (232), and a linear drive module (233) connected to the lifting plate (22). The slide rail (231) is connected to the lifting plate (22), and the clamping plate (232) is slidably connected to the slide rail (231) via a slider. The linear drive module (233) is connected to the lifting plate (22), and the driving part of the linear drive module (233) is driven to connect with the clamping plate (232). The linear drive module (233) drives the clamping plate (232) to slide along the slide rail (231).

4. The double-sided synchronous purging device according to claim 3, characterized in that: The clamping plate (232) includes a clamping part (2321) and a connecting part (2322). The clamping part (2321) and the connecting part (2322) are integrally arranged in an L-shape. The connecting part (2322) is slidably connected by a slider and a slide rail (231). The linear drive module (233) has a drive part and a connecting part (2322) connected together. The clamping part (2321) is located near the wafer carrier device of the connecting part (2322). (1) One end; a flexible pad (2323) is connected to the side of the clamping part (2321) away from the connecting part (2322); a pressure sensor (234) is connected to the end of the connecting part (2322) near the clamping part (2321), and the sensing head of the pressure sensor (234) is provided through the clamping part (2321) and is provided in the through hole of the flexible pad (2323).

5. The double-sided synchronous purging device according to claim 1, characterized in that: The first purging device (3) includes a first driving device (31), a second driving device (32) and a first blowing device (33). The driving end of the first driving device (31) is connected to the base of the second driving device (32). The driving end of the second driving device (32) is driven to connect with the first blowing device (33). The driving direction of the first driving device (31) and the direction of the second driving device (32) are perpendicular to each other. The second driving device (32) drives the first blowing device (33) to move closer to or away from the wafer carrier device (1).

6. The double-sided synchronous purging device according to claim 5, characterized in that: The first air blowing device (33) includes an air pipe (331), an air nozzle (332) and a connector (333). The connector (333) is connected to the air inlet of the air pipe (331). The air nozzle (332) is connected to the side of the air pipe (331) facing the wafer carrier (1). The air nozzle (332) is arranged in an array along the air pipe (331).

7. The double-sided synchronous purging device according to claim 2, characterized in that: The second purging device (4) is connected to the bottom surface of the lifting plate (22); the second purging device (4) includes a third driving device (41), a fourth driving device (42) and a second air blowing device (43). The driving end of the third driving device (41) is connected to the base of the fourth driving device (42). The driving end of the fourth driving device (42) is driven to connect with the second air blowing device (43). The driving direction of the third driving device (41) and the direction of the fourth driving device (42) are set perpendicularly. The fourth driving device (42) drives the second air blowing device (43) to approach or move away from the wafer carrier device (1).

8. The double-sided synchronous purging device according to claim 2, characterized in that: The wafer carrier (1) is connected to the top surface of the base plate (5). The base plate (5) is provided with a top plate (6) on its upper side. The base plate (5) and the top plate (6) are supported and connected by a guide post (7). The lifting plate (22) is slidably connected to the guide post (7) through a sliding sleeve. The lifting drive device (21) is set in a driving direction parallel to the axis of the guide post (7). The lifting drive device (21) drives the lifting plate (22) to slide along the guide post (7). The lifting drive device (21) includes a first lead screw (211) with its two ends connected to the base plate (5) and the top plate (6) respectively. The first lead screw (211) is driven and connected to the lifting plate (22) through a bushing. One end of the first lead screw (211) is driven and connected to a servo motor.

9. The double-sided synchronous purging device according to claim 5, characterized in that: The first driving device (31) includes a slide (311), a second lead screw (312), and a driving block (313). The second lead screw (312) is rotatably arranged along the slide (311), and a servo motor is driven to one end of the second lead screw (312). The second lead screw (312) and the driving block (313) are threadedly connected. The driving block (313) is slidably connected in the slide (311), and a support plate (314) is connected to the top surface of the driving block (313). The second driving device (32) is connected to the top surface of the support plate (314).

10. The double-sided synchronous purging device according to claim 9, characterized in that: The second driving device (32) includes a housing (321), in which a driving screw (322) is movably connected. A driving motor (323) is connected to one end of the housing (321) away from the wafer carrier device (1). The driving motor (323) is driven by the driving screw (322) through a threaded sleeve. The driving motor (323) drives the driving screw (322) to move closer to or away from the wafer carrier device (1) through the threaded sleeve.

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