Silicon wafer carrier cleaning apparatus and silicon wafer carrier cleaning apparatus

Abstract

The utility model provides a kind of silicon wafer carrier cleaning device and silicon wafer carrier cleaning equipment, it is related to the field of semiconductor technology, the silicon wafer carrier cleaning device, comprising: cleaning box body, at least one bearing platform is provided in cleaning box body, bearing platform is in vertical direction and is divided into at least two containing space by cleaning box body, bearing platform is used to clamping and fixing at least two types of silicon wafer carrier, the first side of cleaning box body is formed as opening, silicon wafer carrier enters containing space by the opening or silicon wafer carrier is taken out from containing space by opening;Spray device is set to one side of cleaning box body, and spray device is used to spray cleaning fluid towards first side, and cleaning fluid is washed to the silicon wafer carrier in containing space by opening.The utility model can support the cleaning of at least two types of silicon wafer carrier when the silicon wafer carrier is cleaned, and when the two or more types of silicon wafer carrier is cleaned, it can be cleaned simultaneously.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor technology, and in particular to a silicon wafer carrier cleaning device and silicon wafer carrier cleaning equipment. Background Technology

[0002] In the silicon wafer production process, the cleanliness of the silicon wafer carrier used to support the silicon wafer directly affects the metal ion content, particle content, and other indicators of the silicon wafer. Therefore, it is necessary to clean the silicon wafer carrier regularly.

[0003] In the existing technology, semi-automatic wafer cassette cleaning equipment is generally used to clean silicon wafer carriers. However, existing semi-automatic wafer cassette cleaning equipment only supports one type of silicon wafer carrier when cleaning silicon wafer carriers. That is, at least one silicon wafer carrier of the same type needs to be placed into the semi-automatic wafer cassette cleaning equipment for cleaning first. After that type of silicon wafer carrier is removed, at least one silicon wafer carrier of another type is placed into the semi-automatic wafer cassette cleaning equipment for cleaning. This operation process is cumbersome, labor-intensive, and can easily cause wear and tear on the silicon wafer carriers. Utility Model Content

[0004] This utility model provides a silicon wafer carrier cleaning device and a silicon wafer carrier cleaning equipment to solve the problem that existing semi-automatic wafer cassette cleaning equipment can only support one type of silicon wafer carrier when cleaning silicon wafer carriers.

[0005] To solve the above-mentioned technical problems, the embodiments of this utility model provide the following technical solutions:

[0006] In a first aspect, embodiments of the present invention provide a silicon wafer carrier cleaning device, comprising:

[0007] A cleaning chamber is provided inside the cleaning chamber, and the cleaning chamber is divided into at least one receiving space in the vertical direction by the supporting platform. The supporting platform is used to secure at least two types of silicon wafer carriers. The first side of the cleaning chamber is formed as an opening, through which the silicon wafer carrier enters the receiving space or is taken out of the receiving space.

[0008] A spraying device is provided on one side of the cleaning chamber. The spraying device is used to spray cleaning liquid toward the first side, and the cleaning liquid cleans the silicon wafer carrier in the accommodating space through the opening.

[0009] In some embodiments, the silicon wafer carrier includes at least one of the following:

[0010] Open wafer cassette;

[0011] Front-opening FOSB shipping box;

[0012] Front-opening wafer transport box (FOUP);

[0013] Non-contact horizontal wafer transport box.

[0014] In some embodiments, the support platform includes a partition plate and a clamping block located above the partition plate;

[0015] The number of clamping blocks is two, the two clamping blocks are arranged opposite to each other, and the clamping blocks have a stepped structure;

[0016] Different types of silicon wafer carriers are secured by the stepped sides of the different layers of the clamping block.

[0017] In some embodiments, a sliding track is provided above the partition plate, and a slider capable of moving along the sliding track is provided on the sliding track, with the clamping block fixed on the slider.

[0018] In some embodiments, the first support platform of the at least one support platform divides the accommodating space into a first accommodating space and a second accommodating space, wherein the first accommodating space is the accommodating space located above the first support platform, and the second accommodating space is the accommodating space located below the first support platform;

[0019] The first accommodating space is used to accommodate at least two types of silicon wafer carriers;

[0020] The second accommodating space is used to accommodate the cover plate corresponding to the silicon wafer carrier.

[0021] In some embodiments, grooves are respectively formed on two opposite sides inside the second accommodating space, and the opposite ends of the cover plate corresponding to the silicon wafer carrier extend into the grooves to support the cover plate through the grooves.

[0022] In some embodiments, the groove is inclined toward a first direction;

[0023] Wherein, the first direction is the direction from the side closest to the first side toward the side furthest from the first side.

[0024] In some embodiments, the inner wall of the cleaning tank is provided with multiple locking structures of different heights in the vertical direction, and the support platform is detachably connected to the locking structures;

[0025] The support platform is detachably connected to the locking structure, and the height of the support platform in the vertical direction can be adjusted.

[0026] In some embodiments, a drying device is provided on the inner wall of the cleaning chamber, the drying device being used to dry the cleaned silicon wafer carrier.

[0027] In a second aspect, the present invention also provides a silicon wafer carrier cleaning device, including at least one silicon wafer carrier cleaning device as described in any one of the first aspects;

[0028] The silicon wafer carrier cleaning equipment also includes a rotating frame and a water spray shaft. The cleaning tank in the silicon wafer carrier cleaning device is mounted on the rotating frame, and the spray device in the silicon wafer carrier cleaning device is mounted on the water spray shaft.

[0029] The rotating frame is used to drive the cleaning tank to rotate around the water spray shaft as the rotation axis.

[0030] The embodiments of this utility model have the following beneficial effects:

[0031] The silicon wafer carrier cleaning device provided in this embodiment includes a cleaning chamber for carrying silicon wafer carriers. At least one support platform is provided inside the cleaning chamber, which vertically divides the cleaning chamber into at least one receiving space. At least two types of silicon wafer carriers are secured within the receiving space by the support platform. Then, a cleaning liquid is sprayed towards a first side of the cleaning chamber through a spray device. The cleaning liquid cleans the silicon wafer carriers within the receiving space through an opening on the first side. This device supports cleaning at least two types of silicon wafer carriers simultaneously, eliminating the need to disassemble and clean different types of silicon wafer carriers separately. The device is simple to operate, saves manpower, and reduces wear on the silicon wafer carriers. Attached Figure Description

[0032] Figure 1 This is one of the structural schematic diagrams of the silicon wafer carrier cleaning device provided in this embodiment of the present invention;

[0033] Figure 2 This is the second schematic diagram showing the structure of the silicon wafer carrier cleaning device provided in this embodiment of the present invention;

[0034] Figure 3 This is a schematic diagram of the structure of the support platform provided in an embodiment of the present utility model;

[0035] Figure 4 This is a schematic diagram showing the structure of the groove provided in an embodiment of the present invention;

[0036] Figure 5 This is a schematic diagram showing the structure of the fastening structure provided in the embodiment of this utility model.

[0037] Explanation of reference numerals in the attached figures:

[0038] 1-Cleaning chamber; 2-Supporting platform; 21-Divider plate; 22-Clamping block; 23-Sliding track; 3-Silicon wafer carrier; 4-Groove; 5-Cover plate; 6-Securing structure; 7-Fixing rod. Detailed Implementation

[0039] To make the technical problems, technical solutions and advantages of the embodiments of this utility model clearer, a detailed description will be given below in conjunction with the accompanying drawings and specific embodiments.

[0040] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. All other embodiments obtained by those skilled in the art based on the described embodiments of this utility model are within the protection scope of this utility model.

[0041] To address the issue that existing semi-automatic wafer cassette cleaning equipment can only support one type of silicon wafer carrier when cleaning silicon wafer carriers, this utility model provides a silicon wafer carrier cleaning device and a silicon wafer carrier cleaning equipment.

[0042] like Figure 1 As shown, this embodiment of the present invention provides a silicon wafer carrier cleaning device, comprising:

[0043] A cleaning chamber 1 is provided inside the cleaning chamber 1, and at least one support platform 2 is provided inside the cleaning chamber 1. The support platform 2 divides the cleaning chamber 1 into at least one receiving space in the vertical direction. The support platform 2 is used to secure at least two types of silicon wafer carriers 3. The first side of the cleaning chamber 1 is formed as an opening, through which the silicon wafer carrier 3 enters the receiving space or is removed from the receiving space.

[0044] like Figure 1 As shown, the cleaning chamber is formed into a vertical cuboid structure. When dividing the cleaning chamber 1, one support platform 2 divides the cleaning chamber 1 into one receiving space. This support platform is located at the bottom of the cleaning chamber 1. Two support platforms 2 divide the cleaning chamber 1 into two receiving spaces. One support platform 2 is located at the bottom of the cleaning chamber 1, and the other is located in the middle of the cleaning chamber 1, and so on. That is, N support platforms 2 divide the cleaning chamber 1 into N receiving spaces, where N is a positive integer.

[0045] The support platform 2 can secure at least two types of silicon wafer carriers 3. This can be understood as one support platform 2 being able to secure at least two types of silicon wafer carriers 3; or, one support platform 2 carries one type of silicon wafer carrier 3, different support platforms 2 carry different types of silicon wafer carriers 3, and the cleaning chamber 1 includes at least two support platforms 2, thereby securing at least two types of silicon wafer carriers 3 through at least two support platforms 2.

[0046] The support platform 2 secures the silicon wafer carrier 3 within the receiving space, thereby facilitating subsequent cleaning of the silicon wafer carrier 3.

[0047] The first side of the cleaning chamber 1 being formed as an opening can be understood as setting the first side as a completely open opening, or setting an opening on the first side corresponding to the position of each accommodating space. The size of the opening should ensure that different types of silicon wafer carriers 3 can freely enter and exit the accommodating space.

[0048] Alternatively, the silicon wafer carrier can be placed into the receiving space through the opening by means of manual means or by means of a robotic arm, and then the silicon wafer carrier can be secured by a support platform. Alternatively, the silicon wafer carrier located in the receiving space can be removed from the receiving space by means of manual means or by means of a robotic arm.

[0049] A spray device (not shown in the figure) is provided on one side of the cleaning chamber 1. The spray device is used to spray cleaning liquid toward the first side, and the cleaning liquid cleans the silicon wafer carrier 3 in the accommodating space through the opening.

[0050] That is, the silicon wafer carrier is placed in the receiving space through the opening, and then the silicon wafer carrier is secured by the support platform. The spraying device is controlled to spray cleaning liquid towards the first side. The cleaning liquid cleans the silicon wafer carrier in the receiving space through the opening. After cleaning, the silicon wafer carrier located in the receiving space is taken out of the receiving space through the opening.

[0051] The cleaning solution can be water or a liquid containing chemical substances.

[0052] The silicon wafer carrier cleaning device provided in this embodiment of the invention can support cleaning at least two types of silicon wafer carriers, and can clean two or more types of silicon wafer carriers simultaneously without disassembling and cleaning different types of silicon wafer carriers separately. It is simple to operate, saves manpower, and reduces wear and tear on the silicon wafer carriers.

[0053] Optionally, the cleaning tank 1 is a closed structure except for the opening, to avoid the cleaning liquid from polluting the environment.

[0054] Optionally, a drain pipe can be provided at the bottom of the cleaning tank 1 to facilitate the real-time discharge of cleaning solution after use.

[0055] Optionally, a cleaning fluid collection device and a liquid particle counter can be installed below the cleaning chamber 1. The cleaning fluid collection device is used to collect the cleaning fluid after cleaning the silicon wafer carrier 3, and the liquid particle counter is used to detect the particle content in the collected liquid. The particle content can be used to determine whether the silicon wafer carrier 3 has been cleaned completely or whether it is clean. This avoids incomplete cleaning of the silicon wafer carrier and prevents the quality of the silicon wafers from being affected during subsequent transportation.

[0056] Preferably, in order to ensure that the cleaning chamber 1 can support more silicon wafer carriers, at least two support platforms 2 are provided to divide the cleaning chamber into at least two accommodating spaces.

[0057] The silicon wafer carrier includes at least one of the following:

[0058] Open Cassette (CST);

[0059] Front-opening shipping box (FOSB);

[0060] Front Opening Unified Pod (FOUP);

[0061] Contactless Horizontal Wafer Shippers.

[0062] It should be noted that the open wafer cassette (CST) is used to load silicon wafers after wire dicing and before cleaning. The interior is open and exposed to the clean room, which facilitates personnel to pick up and place the wafers and observe their condition after processing. FOUP and FOSB are used to load silicon wafers after cleaning and then shipping. The interior is closed and has a front-opening cover. The non-contact horizontal wafer transport box uses support rings to ensure that the silicon wafers do not come into contact during storage and transportation.

[0063] The aforementioned CST, FOSB, FOUP, and non-contact horizontal wafer transport boxes can all be used to carry 300mm silicon wafers.

[0064] A schematic diagram of the CST being carried within the accommodating space of the cleaning tank provided in this embodiment of the utility model is shown below. Figure 1 As shown in the diagram, the cleaning chamber's capacity accommodates a FOSB or FOUP. Figure 2 As shown.

[0065] In some embodiments, such as Figure 3 As shown, the support platform 2 includes a partition plate 21 and a clamping block 22 located above the partition plate 21.

[0066] The clamping block 22 is fixedly connected to the partition plate 21. Specifically, the clamping block 22 and the partition plate 21 can be fixedly connected by screws.

[0067] The number of clamping blocks 22 is two, the two clamping blocks 22 are arranged opposite to each other, and the clamping blocks 22 have a stepped structure.

[0068] By clamping the silicon wafer carrier 3 at both ends with two clamping blocks 22 that are positioned opposite each other, the stable locking of the silicon wafer carrier 3 can be ensured.

[0069] Different types of silicon wafer carriers 3 are secured by the stepped sides of the different layers of the clamping block 22.

[0070] Since the distance between the different steps of the two opposing clamping blocks 22 is different, and the different steps have different heights, and the different types of silicon wafer carriers 3 also have different sizes, the different types of silicon wafer carriers 3 are secured by the different steps.

[0071] For example, taking into account the size of CST, FOUP, and FOSB, CST is clamped between the lower step side of the two clamping blocks 22, and FOUP or FOSB is clamped between the upper step side of the two clamping blocks 22.

[0072] To ensure the cleanliness of the silicon wafer carrier and to prevent wear on the silicon wafer carrier by the clamping block 22, the clamping block 22 is made of polytetrafluoroethylene (PTFE).

[0073] The dimensions of the clamping block 22 and the dimensions of the sides and surfaces of the steps of different layers in the clamping block 22 can be determined according to the dimensions of the silicon wafer carrier to be clamped.

[0074] Furthermore, to ensure that the clamping block 22 can accommodate silicon wafer carriers of more sizes or types, such as Figure 3 As shown, a sliding track 23 is provided above the partition plate 21, and a slider that can move along the sliding track is provided on the sliding track 23. The clamping block 22 is fixed on the slider.

[0075] That is, the clamping block 22 is fixed on the sliding track 23 by the slider, and the clamping block 22 fixed on the slider can directly move closer or further away from each other. By adjusting the distance between the two opposing clamping blocks 22, the clamping block 22 can clamp more different types of silicon wafer carriers.

[0076] Optionally, in order to ensure the stable sliding of the clamping block 22, two or more sliding tracks 23 can be arranged in parallel, and the slider fixes the clamping block 22 on the two or more sliding tracks 23.

[0077] In some embodiments, for silicon wafer carriers with cover plates, in order to ensure the cleaning effect, the cover plates need to be removed for separate cleaning. In this case, the first carrier in the at least one carrier platform divides the accommodating space into a first accommodating space and a second accommodating space. The first accommodating space is the accommodating space located above the first carrier platform, and the second accommodating space is the accommodating space located below the first carrier platform.

[0078] The first accommodating space is used to accommodate at least two types of silicon wafer carriers;

[0079] The second accommodating space is used to accommodate the cover plate (or wafer cassette cover) corresponding to the silicon wafer carrier.

[0080] In this embodiment, the first support platform can be any one or more of at least one support platform, but the first support platform cannot be the support platform located at the bottom of the cleaning tank 1.

[0081] The first accommodating space, which is located above the first support platform, is understood as the accommodating space directly in contact with the first support platform and above it, and does not refer to all the accommodating spaces above the first support platform. The second accommodating space, which is located below the first support platform, is understood as the accommodating space directly in contact with the first support platform and below it, and does not refer to all the accommodating spaces below the first support platform.

[0082] The first accommodating space is used to accommodate or support a silicon wafer carrier, wherein the silicon wafer carrier refers to the silicon wafer carrier body without a cover plate, and the second accommodating space is used to accommodate or support the cover plate of the silicon wafer carrier, so as to achieve individual and targeted cleaning of the cover plate of the silicon wafer carrier.

[0083] It should be noted that, due to cleanliness requirements, the contact parts between the body and the cover of the FOUP or FOSB need to be made of PTFE material.

[0084] Preferably, such as Figure 4 As shown, grooves 4 are respectively provided on two opposite sides inside the second accommodating space, and the opposite ends of the cover plate 5 corresponding to the silicon wafer carrier extend into the grooves 4 to support the cover plate 5 through the grooves 4.

[0085] The number of grooves 4 can be determined based on the number of cover plates 5 that need to be accommodated or supported within the second accommodating space. The size of the grooves 4 can be determined based on the size of the cover plates 5 that need to be accommodated or supported within the second accommodating space, so as to ensure that the cover plates 5 can smoothly enter the grooves 4 and that the grooves 4 can stably support the cover plates 5.

[0086] Furthermore, the groove 4 is inclined toward the first direction;

[0087] Wherein, the first direction is the direction from the side closest to the first side toward the side furthest from the first side.

[0088] Since the cleaning of the silicon wafer carrier 3 and cover plate 5 in the accommodating space may be carried out during the translation or rotation of the cleaning chamber 1, in order to ensure that the cover plate 5 is thrown out, the groove 4 is designed to tilt downward in the direction away from the opening, that is, to ensure that the cover plate 5 is also tilted downward in the direction away from the opening in the accommodating space.

[0089] Preferably, the cover plate 5 has an inclination angle of 5°.

[0090] In some embodiments, the inner wall of the cleaning tank 1 is provided with multiple locking structures 6 at different heights in the vertical direction, and the support platform 2 is detachably connected to the locking structures 6.

[0091] The support platform 2 is detachably connected to the locking structure 6, allowing adjustment of the vertical height of the support platform 2.

[0092] Optionally, a schematic diagram of the locking structure 6 is shown below. Figure 5 As shown, a fixing rod 7 can be provided on the inner wall of the cleaning tank 1. The fixing rod 7 is fixedly connected to the inner wall of the cleaning tank 1. Multiple threaded holes or other types of holes are provided on the fixing rod 7 as a fastening structure 6. The support platform 2 and the fastening structure 6 are detachably connected by bolts.

[0093] Since the support platform 2 may require different heights of space to accommodate different types of silicon wafer carriers 3, the size of the space can be changed by adjusting the position of the locking structure 6, thereby ensuring that different types of silicon wafer carriers 3 can be accommodated without having to move the support platform 2 in and out as a whole, thus avoiding the risks caused by human factors. Moreover, this operation can be performed by a robotic arm, avoiding environmental pollution.

[0094] In some embodiments, a drying device is provided on the inner wall surface of the cleaning chamber 1, and the drying device is used to dry the cleaned silicon wafer carrier 3.

[0095] The drying device can be installed on the upper part of the inner wall of the cleaning chamber 1 to ensure the drying effect.

[0096] The drying device can also have a disinfection and sterilization function. While drying the silicon wafer carrier 3, the drying device can also perform real-time drying, disinfection and sterilization.

[0097] Optionally, the drying device is a drying tube or a heating tube.

[0098] For example, the heating element can be a duct capable of blowing out high-temperature nitrogen gas.

[0099] This utility model embodiment also provides a silicon wafer carrier cleaning device, including at least one silicon wafer carrier cleaning device as described in any one of the above;

[0100] The silicon wafer carrier cleaning equipment also includes a rotating frame and a water spray shaft. The cleaning tank in the silicon wafer carrier cleaning device is mounted on the rotating frame, and the spray device in the silicon wafer carrier cleaning device is mounted on the water spray shaft.

[0101] The rotating frame is used to drive the cleaning tank to rotate around the water spray shaft as the rotation axis.

[0102] The silicon wafer carrier cleaning equipment provided in this embodiment of the present invention can enable multiple silicon wafer carrier cleaning devices to clean silicon wafer carriers simultaneously, resulting in higher cleaning efficiency. Each silicon wafer carrier cleaning device can accommodate at least two types of silicon wafer carriers.

[0103] The silicon wafer carrier cleaning equipment includes a rotating frame and a water spray shaft. It can be understood that the rotating frame can rotate around the water spray shaft.

[0104] When there are two or more silicon wafer carrier cleaning devices, the cleaning chambers in the two or more silicon wafer carrier cleaning devices are evenly arranged on the rotating frame to ensure that the rotating frame can drive the cleaning chambers to rotate evenly.

[0105] When there are two or more silicon wafer carrier cleaning devices, the spray devices in the two or more silicon wafer carrier cleaning devices can be evenly arranged on the water spray shaft in the vertical direction to ensure uniform cleaning of the silicon wafer carriers in the cleaning box.

[0106] When cleaning silicon wafer carriers using a silicon wafer carrier cleaning device, it is not limited to rotating in only one direction. For example, it can first rotate clockwise and then counterclockwise. The time for clockwise rotation and the time for counterclockwise rotation can also be set separately to ensure the cleaning effect on the silicon wafer carrier.

[0107] The above description is the preferred embodiment of this utility model. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the principle of this utility model, and these improvements and modifications should also be considered within the protection scope of this utility model.

Claims

1. A silicon wafer carrier cleaning device, characterized in that, include: A cleaning chamber is provided inside the cleaning chamber, and the cleaning chamber is divided into at least one receiving space in the vertical direction by the supporting platform. The supporting platform is used to secure at least two types of silicon wafer carriers. The first side of the cleaning chamber is formed as an opening, through which the silicon wafer carrier enters the receiving space or is taken out of the receiving space. A spraying device is provided on one side of the cleaning chamber. The spraying device is used to spray cleaning liquid toward the first side, and the cleaning liquid cleans the silicon wafer carrier in the accommodating space through the opening.

2. The silicon wafer carrier cleaning apparatus according to claim 1, characterized in that, The silicon wafer carrier includes at least one of the following: Open wafer cassette; Front-opening FOSB shipping box; Front-opening wafer transport box (FOUP); Non-contact horizontal wafer transport box.

3. The silicon wafer carrier cleaning apparatus according to claim 1, characterized in that, The support platform includes a partition plate and a clamping block located above the partition plate; The number of clamping blocks is two, the two clamping blocks are arranged opposite to each other, and the clamping blocks have a stepped structure; Different types of silicon wafer carriers are secured by the stepped sides of the different layers of the clamping block.

4. The silicon wafer carrier cleaning apparatus according to claim 3, characterized in that, A sliding track is provided above the partition plate, and a slider that can move along the sliding track is provided on the sliding track. The clamping block is fixed on the slider.

5. The silicon wafer carrier cleaning apparatus according to claim 1, characterized in that, The first support platform in the at least one support platform divides the accommodating space into a first accommodating space and a second accommodating space. The first accommodating space is located above the first support platform, and the second accommodating space is located below the first support platform. The first accommodating space is used to accommodate at least two types of silicon wafer carriers; The second accommodating space is used to accommodate the cover plate corresponding to the silicon wafer carrier.

6. The silicon wafer carrier cleaning apparatus according to claim 5, characterized in that, The second accommodating space has grooves on two opposite sides, and the opposite ends of the cover plate corresponding to the silicon wafer carrier extend into the grooves to support the cover plate through the grooves.

7. The silicon wafer carrier cleaning apparatus according to claim 6, characterized in that, The groove is inclined toward the first direction; Wherein, the first direction is the direction from the side closest to the first side toward the side furthest from the first side.

8. The silicon wafer carrier cleaning apparatus according to claim 1, characterized in that, The inner wall of the cleaning tank is provided with multiple locking structures of different heights in the vertical direction, and the support platform is detachably connected to the locking structures. The support platform is detachably connected to the locking structure, and the height of the support platform in the vertical direction can be adjusted.

9. The silicon wafer carrier cleaning apparatus according to claim 1, characterized in that, A drying device is provided on the inner wall of the cleaning chamber, which is used to dry the cleaned silicon wafer carrier.

10. A silicon wafer carrier cleaning device, characterized in that, Includes at least one silicon wafer carrier cleaning device as described in any one of claims 1-9; The silicon wafer carrier cleaning equipment also includes a rotating frame and a water spray shaft. The cleaning tank in the silicon wafer carrier cleaning device is mounted on the rotating frame, and the spray device in the silicon wafer carrier cleaning device is mounted on the water spray shaft. The rotating frame is used to drive the cleaning tank to rotate around the water spray shaft as the rotation axis.

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