Dustproof structure for die bonder's adhesive disc

Abstract

The utility model discloses a kind of dustproof structures for die bonder rubber disc, it is related to die bonder technical field, a kind of dustproof structures for die bonder rubber disc includes rubber disc mechanism, the rubber disc mechanism includes rubber disc support plate, rubber disc card seat and rubber disc guide column, rubber disc card seat is provided on the rubber disc support plate upper end, rubber disc guide column is provided on the rubber disc card seat upper end, driving module is provided in the rubber disc mechanism, the driving module includes gear and rotating rod, the gear is set on rubber disc mechanism upper end, the rotating rod is set in rubber disc mechanism inside, and is rotatably connected with rubber disc mechanism, dustproof module is provided on the rubber disc mechanism upper end, the lower side of dustproof module rear end is provided with clamping module, the lower end of dustproof module front end is provided with fixed module, the present scheme provides to solve the problem of dust and sundries pollution, the problem of die bonder maintenance cost.

Description

Technical Field

[0001] This utility model relates to the field of die bonder technology, specifically to a dustproof structure for die bonder trays. Background Technology

[0002] In the LED packaging industry, die bonders are key equipment for fixing LED chips onto substrates. Currently, common die bonders mainly consist of a feeding mechanism, a pushing mechanism, a dispensing mechanism, a dispensing platform, a swing arm mechanism, a die bonder platform, a die finding platform, fixtures, and an unloading mechanism. In actual production, die bonders can complete the die bonding of dozens or even hundreds of chips per minute with micron-level precision, greatly meeting the needs of large-scale LED production.

[0003] A die bonder, as disclosed in publication number CN221262309U, includes a frame, a feeding mechanism, a discharging mechanism, and a picking mechanism. The feeding, discharging, and picking mechanisms are mounted on the frame. The feeding mechanism includes a first sliding rail and a vibratory feeder mounted on the first sliding rail, with the vibratory feeder having a discharge channel. The discharging mechanism is mounted on the frame and includes a second sliding rail and a support platform mounted on the second sliding rail. The picking mechanism is mounted on the frame and includes a robotic arm and a die picker. The die picker is mounted on the robotic arm. The picking mechanism moves the die bonder material from the discharge channel to the support platform for arrangement. The vibratory feeder reduces the steps involved in arranging the die bonder material and enables continuous feeding without stopping the machine, thus improving production efficiency.

[0004] The aforementioned devices suffer from dust and debris contamination during use, resulting in high maintenance costs for the die bonder. Therefore, we propose a dustproof structure for the die bonder tray to address these issues. Utility Model Content

[0005] The purpose of this invention is to provide a dustproof structure for die bonder trays, in order to solve the problems of dust and debris contamination and high maintenance costs of existing die bonders mentioned in the background art.

[0006] To achieve the above objectives, this utility model provides the following technical solution: a dustproof structure for a die bonder tray, comprising a tray mechanism, the tray mechanism including a tray support plate, a tray holder, and a tray guide post. The tray support plate has a tray holder at its upper end, and the tray holder has a tray guide post at its upper end. A drive module is provided within the tray mechanism, the drive module including a gear and a rotating rod. The gear is located at the upper end of the tray mechanism, and the rotating rod is located inside the tray mechanism and rotatably connected to it. A dustproof module is located at the upper end of the tray mechanism, a snap-fit ​​module is located at the lower rear end of the dustproof module, and a fixing module is located at the lower front end of the dustproof module.

[0007] Preferably, the dustproof module includes a baffle plate, which is disposed at the upper end of the rubber disc guide post.

[0008] Preferably, the baffle has a snap-fit ​​groove at its rear end and an assembly groove in its middle, and the baffle is assembled and connected to the rubber disc mechanism through the assembly groove.

[0009] Preferably, the snap-fit ​​module includes a fixed base, a connecting block, and a snap-fit ​​block. The fixed base has a snap-fit ​​block at its lower end, which snaps into connection with the baffle. The fixed base has a connecting block on one side.

[0010] Preferably, the fixing module includes a guide seat, a top plate, and a mounting base. The guide seat is disposed inside the mounting base, and the guide seat and the mounting base are assembled and connected. The top plate is disposed inside the guide seat.

[0011] Preferably, guide grooves are provided on the left and right sides of the guide seat, the top plate is guided and connected to the guide seat through the guide grooves, and the top of the top plate is fitted and connected to the baffle.

[0012] Preferably, the front end of the card seat is provided with a first bolt, and there are two sets of the first bolts, which are symmetrically arranged on the left and right sides of the card seat. The top plate inside the guide seat is fixedly connected to the card seat by the first bolts.

[0013] Preferably, a connector is provided at the lower end of the connecting block, and a second bolt is provided at the upper end of the connecting block.

[0014] Preferably, there are two sets of the second bolts, which are symmetrically arranged on the upper end of the connecting block, and the connecting block is bolted to the connecting member by the two sets of second bolts.

[0015] Preferably, the connector is provided with a connecting post.

[0016] Compared with the prior art, the beneficial effects of this utility model are:

[0017] This invention designs a baffle adapted to the size and layout of the die bonder. The baffle is C-shaped, with its middle section covering the top of the bonding tray and both ends extending along the sides of the die bonder. This effectively blocks dust and debris from all directions and provides a secure hold. The horizontal section is slightly longer and wider than the bonding tray to ensure complete coverage. The vertical section is adjusted to the height of the bonding tray to ensure a tight connection between the mounting structure and the baffle. A dedicated slotted bracket is provided for the bonding tray. The baffle is embedded into the bonding tray, facilitating easy removal and installation for cleaning or maintenance. This solves the problems of dust and debris contamination and high maintenance costs associated with die bonders. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0019] Figure 2 This is a side view of the present invention;

[0020] Figure 3 This is a top view of the present invention;

[0021] Figure 4 This is an enlarged view of the connection between the fixing module and the baffle of this utility model;

[0022] In the diagram: 1. Glue tray mechanism; 2. Baffle; 3. Card holder; 4. Guide seat; 5. Drive module; 51. Gear; 52. Rotating rod; 6. Top plate; 7. First bolt; 8. Second bolt; 9. Fixed seat; 10. Connecting block; 11. Glue tray support plate; 12. Glue tray card holder; 13. Glue tray guide post; 14. Connecting piece; 15. Card block; 16. Guide groove. Detailed Implementation

[0023] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0024] Please see Figure 1-4 This utility model provides an embodiment of a dustproof structure for a die bonder tray, comprising a tray mechanism 1, which includes a tray support plate 11, a tray holder 12, and a tray guide post 13. The tray support plate 11 has a tray holder 12 at its upper end, and the tray holder 12 has a tray guide post 13 at its upper end. A drive module 5 is provided inside the tray mechanism 1, which includes a gear 51 and a rotating rod 52. The gear 51 is located at the upper end of the tray mechanism 1, and the rotating rod 52 is located inside the tray mechanism 1 and is rotatably connected to it. A dustproof module is provided at the upper end of the tray mechanism 1, a snap-fit ​​module is provided at the lower rear end of the dustproof module, and a fixing module is provided at the lower front end of the dustproof module. A baffle 2 is designed to match the size and layout of the die bonder. The baffle 2 is C-shaped, with its middle section covering the entire surface of the adhesive tray and its two ends extending along the sides of the die bonder. This effectively blocks dust and debris from all directions and provides a secure hold. The horizontal section is slightly longer and wider than the adhesive tray to ensure complete coverage. The vertical section's height is adjusted to match the tray's height, ensuring a tight connection between the mounting structure and the baffle 2. A dedicated slotted bracket is provided for the adhesive tray. The baffle 2 is embedded into the tray, facilitating easy removal and installation for cleaning or maintenance. This solves the problems of dust and debris contamination and high maintenance costs associated with the die bonder.

[0025] Please see Figure 1 The dustproof module includes a baffle 2, which is located on the upper end of the rubber disc guide post 13.

[0026] Please see Figure 4 The baffle 2 has a snap-fit ​​groove at its rear end and an assembly groove in its middle. The baffle 2 is assembled and connected to the adhesive tray mechanism 1 through the assembly groove. The baffle 2 is designed to fit the size and layout of the die bonding machine. The baffle 2 is generally C-shaped, with the middle part covering the adhesive tray and the two ends extending along the sides of the die bonding machine. It can effectively block dust and debris from all directions and play a fixing role.

[0027] Please see Figure 3 The snap-fit ​​module includes a fixed base 9, a connecting block 10, and a snap-fit ​​block 15. The fixed base 9 has a snap-fit ​​block 15 at its lower end, which snaps into the baffle 2. The fixed base 9 has a connecting block 10 on one side, which serves to dock with and fix the baffle 2.

[0028] Please see Figure 2 The fixed module includes a guide seat 4, a top plate 6, and a mounting base 3. The guide seat 4 is set inside the mounting base 3, and the guide seat 4 and the mounting base 3 are assembled and connected. The top plate 6 is set inside the guide seat 4.

[0029] Please see Figure 4 The guide seat 4 has guide grooves 16 on both sides. The top plate 6 is guided and connected to the guide seat 4 through the guide grooves 16. The top of the top plate 6 is attached to the baffle 2.

[0030] Please see Figure 1 The front end of the card seat 3 is provided with a first bolt 7. There are two sets of first bolts 7, which are symmetrically arranged on the left and right sides of the card seat 3. The top plate 6 inside the guide seat 4 is fixedly connected to the card seat 3 through the first bolts 7, which serves to support and limit the baffle 2.

[0031] Please see Figure 3 A connector 14 is provided at the lower end of the connecting block 10, and a second bolt 8 is provided at the upper end of the connecting block 10.

[0032] Please see Figure 3 Two sets of second bolts 8 are provided and are symmetrically arranged on the upper end of the connecting block 10. The connecting block 10 is bolted to the connecting piece 14 by the two sets of second bolts 8, which serves to fix the connecting block 10.

[0033] Please see Figure 2 A connecting post is provided inside the connector 14.

[0034] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. A dustproof structure for a die bonder tray, comprising a tray mechanism (1), characterized in that: The tray mechanism (1) includes a tray support plate (11), a tray holder (12), and a tray guide post (13). The tray support plate (11) is provided with a tray holder (12) at its upper end, and the tray holder (12) is provided with a tray guide post (13) at its upper end. The tray mechanism (1) is provided with a drive module (5). The drive module (5) includes a gear (51) and a rotating rod (52). The gear (51) is provided at the upper end of the tray mechanism (1), and the rotating rod (52) is provided inside the tray mechanism (1) and is rotatably connected to the tray mechanism (1). The tray mechanism (1) is provided with a dustproof module at its upper end, a snap-fit ​​module is provided at the lower rear end of the dustproof module, and a fixing module is provided at the lower front end of the dustproof module.

2. The dustproof structure for a die bonder tray according to claim 1, characterized in that: The dustproof module includes a baffle (2), which is disposed on the upper end of the rubber disc guide post (13).

3. The dustproof structure for a die bonder tray according to claim 2, characterized in that: The baffle (2) has a snap-fit ​​groove at its rear end and an assembly groove in the middle. The baffle (2) is assembled and connected to the rubber disc mechanism (1) through the assembly groove.

4. The dustproof structure for a die bonder tray according to claim 3, characterized in that: The snap-fit ​​module includes a fixed base (9), a connecting block (10) and a snap-fit ​​block (15). The fixed base (9) has a snap-fit ​​block (15) at its lower end. The snap-fit ​​block (15) is snap-fitted to the baffle (2). The fixed base (9) has a connecting block (10) on one side.

5. The dustproof structure for a die bonder tray according to claim 4, characterized in that: The fixing module includes a guide seat (4), a top plate (6) and a card holder (3). The guide seat (4) is disposed inside the card holder (3). The guide seat (4) and the card holder (3) are assembled and connected. The top plate (6) is disposed inside the guide seat (4).

6. The dustproof structure for a die bonder tray according to claim 5, characterized in that: The guide seat (4) has guide grooves (16) on both sides. The top plate (6) is guided and connected to the guide seat (4) through the guide grooves (16). The top of the top plate (6) is fitted and connected to the baffle (2).

7. The dustproof structure for a die bonder tray according to claim 6, characterized in that: The front end of the card holder (3) is provided with a first bolt (7). There are two sets of the first bolt (7), which are symmetrically arranged on the left and right sides of the card holder (3). The top plate (6) inside the guide seat (4) is fixedly connected to the card holder (3) by the first bolt (7).

8. The dustproof structure for a die bonder tray according to claim 7, characterized in that: The lower end of the connecting block (10) is provided with a connector (14), and the upper end of the connecting block (10) is provided with a second bolt (8).

9. A dustproof structure for a die bonder tray according to claim 8, characterized in that: The second bolt (8) is provided in two sets and is symmetrically arranged on the upper end of the connecting block (10). The connecting block (10) is bolted to the connecting piece (14) by the two sets of second bolts (8).

10. A dustproof structure for a die bonder tray according to claim 9, characterized in that: The connector (14) is provided with a connecting post.

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