A reflow soldering air duct

Abstract

The utility model relates to a wind channel structure technical field, concretely relates to a reflow soldering air channel, including two opposite placement and located in reflow soldering stove's air channel subassembly, the air channel subassembly includes shell body, air supply device and rectifier device, the rectifier device includes rectifier box and first rectifier board, the rectifier box is located in the shell body bottom end, the air supply device is located on the rectifier box, the rectifier box top surface has the air inlet that communicates with the air supply device output end, the first rectifier board is located in the rectifier box and is located the air inlet directly below, adopts the structure layout of double -deck pair of blowing up and down, and the wind force is guided rectification through the cooperation of rectifier box and first rectifier board increase, makes the hot air more evenly, and the four sides air return in the shell interior forms circulation, avoids the problem that the circuit board (PCB) is easy to produce the false soldering after welding, improves the welding quality of circuit board (PCB).

Description

Technical Field

[0001] This utility model relates to the field of air duct structure technology, specifically to a reflow soldering air duct. Background Technology

[0002] Currently, reflow ovens are commonly used for surface soldering processes on printed circuit boards (PCBs). During the soldering process of PCBs, some areas inside the reflow oven need to maintain a high temperature. However, the air duct structure used in existing reflow ovens is directly blown downwards by a hot air motor. The hot air delivered is uneven and cannot achieve internal circulation, which makes it easy for cold solder joints to occur after the PCB is soldered, thus reducing the soldering quality of the PCB.

[0003] Therefore, the applicant hereby proposes a reflow soldering air duct to solve the aforementioned problems. Utility Model Content

[0004] To address the shortcomings of existing technologies, this utility model provides a reflow soldering air duct.

[0005] The technical solution of this utility model is as follows:

[0006] This utility model provides a reflow soldering air duct, including two air duct assemblies placed opposite each other and located inside a reflow oven. Each air duct assembly includes a housing, an air supply device, and a rectifier. The rectifier includes a rectifier box and a first rectifier plate. The rectifier box is located inside the bottom of the housing, and the air supply device is located on the rectifier box. The top surface of the rectifier box has an air inlet that communicates with the output end of the air supply device. The first rectifier plate is located inside the rectifier box and directly below the air inlet.

[0007] Furthermore, the air supply device includes an air supply box with air supply pipes connected to both ends, an air supply impeller, a heating wire, and an air supply motor; the air supply box is located on the top of the rectifier box, the air supply pipe is connected to the air inlet, the air supply impeller is rotatably located inside the air supply box, the heating wire is fixedly arranged around the outer periphery of the air supply impeller, and the air supply motor is located on the outer casing and its output end is connected to the air supply impeller for transmission.

[0008] Furthermore, the rectifier also includes a second rectifier plate located at the bottom of the rectifier box, wherein rectifier holes and return holes are rectangularly and equidistantly distributed on the middle and both ends of the second rectifier plate.

[0009] The beneficial effects achieved by this utility model are as follows:

[0010] The reflow soldering air duct provided by this utility model adopts a double-layer counter-blowing structure. The airflow is guided and rectified by the addition of a rectifier box and a first rectifier plate, making the blown hot air more uniform. The airflow is also circulated in four directions inside the shell. This avoids the problem of cold solder joints that are easy to occur after the circuit board (PCB) is soldered, and improves the soldering quality of the circuit board (PCB). Attached Figure Description

[0011] Figure 1 This is a schematic diagram of the overall structure of this utility model.

[0012] Figure 2 yes Figure 1 Enlarged view of point A.

[0013] Figure 3 This is a schematic internal cross-sectional view of the present invention.

[0014] Figure 4 yes Figure 3 Enlarged view of point B.

[0015] Figure 5 This is a 3D schematic diagram of the air supply box.

[0016] Figure 6 This is a schematic diagram of the hot air rectification and guidance path. Detailed Implementation

[0017] To facilitate understanding of this utility model by those skilled in the art, the specific embodiments of this utility model are clearly described below with reference to the accompanying drawings. Obviously, the specific embodiments described are merely preferred embodiments of this utility model, and not all embodiments.

[0018] like Figure 1-6 As shown, the present invention provides a reflow soldering air duct, which is used in a reflow soldering furnace to achieve uniform hot air delivery and form an internal circulation; it includes two air duct components 1 placed opposite each other and located in the reflow soldering furnace, with a feeding channel formed between the two air duct components 1. Each air duct component 1 includes an outer shell 11, an air supply device 12 for providing hot air, and a rectifier device 13 for rectifying and guiding the hot air; the rectifier device 13 includes a rectifier box 131 and a first rectifier plate 132; the rectifier box 131 is located inside the bottom of the outer shell 11, the air supply device 12 is located inside the outer shell 11 and on the rectifier box 131, the top surface of the rectifier box 131 has an air inlet 131A that communicates with the output end of the air supply device 12, and the first rectifier plate 132 is fixed inside the rectifier box 131 by a support rod and located directly below the air inlet 131A;

[0019] The air supply device 12 includes an air supply box 121 for guiding the direction of airflow, with air supply pipes 121A connected to both ends; an air supply impeller 122 for rotating to provide airflow; a heating wire 123 for heating the airflow; and an air supply motor 124 for driving the air supply impeller to rotate. The air supply box 121 is located on the top of the rectifier box 131. The air supply pipes 121A are connected to the air inlets 131A. In this embodiment, the air supply box 121 uses two air supply pipes 121A, but it can also have three, four, etc. At the same time, the rectifier box 131 is provided with several air inlets 131A that are correspondingly connected to the air supply pipes 121A. The air supply impeller 122 is rotatably located inside the air supply box 121. The heating wire 123 is fixed around the outer periphery of the air supply impeller 122 by a bracket. The air supply motor 124 is located on the outer casing 11 and its output end is connected to the air supply impeller 122.

[0020] The rectifier 13 also includes a second rectifier plate 133 located at the bottom of the rectifier box 131. The second rectifier plate 133 has multiple rectifier holes 133A and return holes 133B for hot air to pass through, which are rectangularly and equidistantly distributed in the middle and at both ends, making the hot air blown out more uniform.

[0021] The reflow soldering air duct provided by this utility model adopts a double-layer counter-blowing structure. The airflow is guided and rectified by the addition of a rectifier box and a first rectifier plate, making the blown hot air more uniform. The airflow is also circulated in four directions inside the shell. This avoids the problem of cold solder joints that are easy to occur after the circuit board (PCB) is soldered, and improves the soldering quality of the circuit board (PCB).

[0022] The embodiments of this utility model described above do not constitute a limitation on the scope of protection of this utility model. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this utility model should be included within the scope of protection of the claims of this utility model.

Claims

1. A reflow soldering air duct, characterized in that: The device includes two air duct assemblies (1) placed opposite each other and located inside a reflow oven. Each air duct assembly (1) includes an outer shell (11), an air supply device (12), and a rectifier (13). The rectifier (13) includes a rectifier box (131) and a first rectifier plate (132). The rectifier box (131) is located inside the bottom of the outer shell (11), and the air supply device (12) is located on the rectifier box (131). The top surface of the rectifier box (131) has an air inlet (131A) that communicates with the output end of the air supply device (12). The first rectifier plate (132) is located inside the rectifier box (131) and directly below the air inlet (131A).

2. The reflow oven ventilation duct according to claim 1, characterized in that: The air supply device (12) includes an air supply box (121) with air supply pipes (121A) connected to both ends, an air supply impeller (122), a heating wire (123), and an air supply motor (124); the air supply box (121) is located on the top of the rectifier box (131), the air supply pipe (121A) is connected to the air inlet (131A), the air supply impeller (122) is rotatably located inside the air supply box (121), the heating wire (123) is fixed around the outer periphery of the air supply impeller (122), and the air supply motor (124) is located on the outer shell (11) and its output end is connected to the air supply impeller (122) for transmission.

3. A reflow soldering duct according to claim 1 or 2, characterized in that: The rectifier (13) further includes a second rectifier plate (133) located at the bottom of the rectifier box (131). The second rectifier plate (133) has rectifier holes (133A) and return holes (133B) distributed rectangularly at equal intervals in the middle and at both ends.

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