A clamp apparatus for ultrasonic welding of semiconductor DBC and lead frame

Abstract

The utility model discloses a semiconductor DBC and lead frame ultrasonic welding's clamp device, include: base, install the pressure hold subassembly, vacuum adsorption subassembly on the base, the top of vacuum adsorption subassembly forms an adsorption platform, still include: tray, the tray places in the adsorption platform, and the tray has at least one for placing the positioning slot of lead frame, when the tray places in the adsorption platform, the pressure hold subassembly can press down the lead frame positioned in the positioning slot, the vacuum adsorption subassembly can adsorb the semiconductor DBC placed under the lead frame. The utility model effectively reduced the manual participation in the operation of clamping, significantly improved the processing efficiency, reduced the manual cost simultaneously.

Description

Technical Field

[0001] This utility model relates to the technical field of semiconductors, and in particular to a fixture device for ultrasonic welding of semiconductor DBCs and lead frames. Background Technology

[0002] A power module is a module composed of power electronic devices combined with certain functions and then encapsulated. It is an advanced hybrid integrated power component with IGBT (Insulated Gate Bipolar Transistor) as its core, consisting of a high-speed, low-power die (IGBT), an optimized gate drive circuit, and a fast protection circuit.

[0003] In the encapsulation process of power modules, soldering the semiconductor DBC and leadframe is a crucial step. Current technology involves fabricating single-station fixtures for specific DBC and leadframe models and fixing these fixtures onto the welding platform of an ultrasonic soldering machine. During production, the single-station fixtures are manually operated to position and clamp the semiconductor DBC and leadframe before the ultrasonic soldering machine completes the soldering. This process suffers from slow production speed and high labor costs. Utility Model Content

[0004] In view of the aforementioned problems in existing semiconductor DBC and lead frame soldering, the aim is to provide a fixture device for ultrasonic soldering of semiconductor DBC and lead frame.

[0005] The specific technical solution is as follows:

[0006] A fixture device for ultrasonic welding of semiconductor DBC and lead frame includes: a base on which a holding component and a vacuum adsorption component are mounted, and an adsorption platform is formed on the top of the vacuum adsorption component.

[0007] It also includes: a tray, which is placed on the adsorption platform and has at least one positioning groove for placing a lead frame. When the tray is placed on the adsorption platform, the pressing component can press down to position the lead frame located in the positioning groove, and the vacuum adsorption component can adsorb the semiconductor DBC placed under the lead frame.

[0008] As a further improvement and optimization of this solution, the pressure-holding component includes:

[0009] At least two pressure blocks, the two pressure blocks being located on opposite sides of the vacuum adsorption assembly;

[0010] A first driving mechanism is used to drive the two pressure blocks to move closer or further apart from each other.

[0011] The second driving mechanism is used to drive the two pressure blocks to move up and down. When the lead frame is placed on the tray, the first driving mechanism drives the two pressure blocks to move closer to each other and move to directly above the two sides of the lead frame. The second driving mechanism drives the two pressure blocks to descend and press down on the two sides of the lead frame to position them.

[0012] As a further improvement and optimization of this solution, the second drive mechanism includes:

[0013] At least two pressure plates, and the two pressure blocks are respectively mounted on the two pressure plates;

[0014] At least two lifting cylinders are provided, and the two lifting cylinders are respectively connected to the two pressure plates for driving the two pressure plates to lift and lower, so as to lift and lower the two pressure blocks.

[0015] Two mounting plates are respectively mounted on the two mounting plates, and the first driving mechanism is connected to the two mounting plates for driving the two mounting plates to move closer or further away from each other, thereby driving the two pressure blocks to move closer or further away from each other.

[0016] As a further improvement and optimization of this solution, the first driving mechanism includes two translation cylinders, which are mounted on the base and respectively connected to the two mounting plates.

[0017] As a further improvement and optimization of this solution, a positioning component is provided between the adsorption platform and the tray for positioning the tray.

[0018] As a further improvement and optimization of this solution, the positioning component includes at least two positioning posts disposed on the adsorption platform, and the tray has at least two positioning holes, with the two positioning posts respectively positioning and cooperating with the two positioning holes.

[0019] As a further improvement and optimization of this solution, the vacuum adsorption assembly includes: a vacuum suction plate and a vacuum suction plate. The vacuum suction plate is mounted on the base, and the vacuum suction plate is mounted on top of the vacuum suction plate, with the top of the vacuum suction plate forming the adsorption platform.

[0020] As a further improvement and optimization of this solution, two guide shafts are installed on the base. The two guide shafts are parallel to each other and are located on both sides of the base respectively. The two ends of each mounting plate are slidably engaged with the two guide shafts respectively.

[0021] As a further improvement and optimization of this solution, each of the mounting plates is provided with linear bearings at both ends, and the two linear bearings are slidably sleeved on the outside of the two guide shafts.

[0022] As a further improvement and optimization of this solution, the base is also equipped with a photoelectric sensor for detecting whether there is a tray on the adsorption platform and a pressure gauge for displaying the negative pressure value provided by the vacuum adsorption component.

[0023] The positive effects of the above technical solution compared with the existing technology are:

[0024] (1) This utility model effectively reduces the degree of manual intervention in the clamping operation during processing, significantly improves processing efficiency, and reduces labor costs.

[0025] (2) In the welding process, the lead frame is pressed by the cylinder-driven pressure block, and the semiconductor DBC is adsorbed by the vacuum adsorption component under negative pressure to ensure that it will not move randomly or be lifted by the welding head during welding, thereby improving the stability and accuracy of welding. Attached Figure Description

[0026] Figure 1 This is a schematic diagram of the structure of a fixture device for ultrasonic welding of a semiconductor DBC and a lead frame according to the present invention;

[0027] Figure 2 This is a schematic diagram of the vacuum adsorption component of a fixture device for ultrasonic welding of semiconductor DBC and lead frame according to this utility model.

[0028] Figure 3 This is a schematic diagram showing the installation between the tray, the lead frame, and the semiconductor DBC in a fixture device for ultrasonic welding of semiconductor DBC and lead frame according to this utility model.

[0029] Figure 4 This is a schematic diagram showing the connection between the pressure block, lifting cylinder, pressure plate, and mounting plate of a fixture device for ultrasonic welding of semiconductor DBC and lead frame according to this utility model.

[0030] Figure 5 This is a schematic diagram of the translation cylinder of a fixture device for ultrasonic welding of semiconductor DBC and lead frame according to this utility model.

[0031] In the attached diagram: 1. Base; 2. Vacuum adsorption assembly; 3. Holding assembly; 4. Lead frame; 5. Semiconductor DBC; 6. Tray; 7. Photoelectric sensor; 8. Pressure gauge; 9. Guide shaft; 10. Linear bearing; 21. Vacuum suction plate; 22. Vacuum suction plate; 23. Positioning column; 31. Pressure block; 32. Pressure plate; 33. Lifting cylinder; 34. Mounting plate; 35. Translation cylinder; 61. Positioning groove; 221. Adsorption platform. Detailed Implementation

[0032] The technical solution of this utility model will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.

[0033] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0034] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0035] Figure 1 This is a schematic diagram of the fixture device for ultrasonic welding of semiconductor DBC and lead frame according to the present invention. Figure 2 This is a schematic diagram of the vacuum adsorption assembly of a fixture device for ultrasonic welding of semiconductor DBC and lead frame according to this utility model. Figure 3 This is a schematic diagram showing the installation of the tray, lead frame, and semiconductor DBC in a fixture device for ultrasonic welding of a semiconductor DBC and lead frame according to this utility model. Figure 4 This diagram illustrates the connection between the clamping block, lifting cylinder, pressure plate, and mounting plate of a fixture device for ultrasonic welding of semiconductor DBC and lead frame according to this utility model. Figure 5 This is a schematic diagram of the translation cylinder of a fixture device for ultrasonic welding of semiconductor DBC and lead frame according to this utility model. Figure 1-5The image shows a preferred embodiment of a fixture device for ultrasonic welding of a semiconductor DBC5 and a lead frame 4, comprising: a base 1, on which a holding component 3 and a vacuum adsorption component 2 are mounted, the top of the vacuum adsorption component 2 forming an adsorption platform 221; and a tray 6, which is placed on the adsorption platform 221 and has at least one positioning groove 61 for placing the lead frame 4. When the tray 6 is placed on the adsorption platform 221, the holding component 3 can press down to position the lead frame 4 located in the positioning groove 61, and the vacuum adsorption component 2 can adsorb the semiconductor DBC5 placed under the lead frame 4.

[0036] The processing steps are as follows:

[0037] S1: Outside the device, at the tray placement station, place the semiconductor DBC5 and lead frame 4 into the tray 6;

[0038] S2: Place the tray 6 containing the semiconductor DBC5 and lead frame 4 onto the adsorption platform 221;

[0039] S3: Use the vacuum adsorption component 2 to provide negative pressure adsorption force to hold the semiconductor DBC5, and use the pressing component to press the lead frame 4 for ultrasonic welding.

[0040] S4: After the welding is completed, the welded semiconductor DBC5, lead frame 4 and tray 6 are removed from the adsorption platform 221 together (at this time, the next tray 6 with unwelded semiconductor DBC5 and lead frame 4 is waiting to be placed into the adsorption platform 221, and the removed tray 6 is sent to the splitting station).

[0041] S5: The splitting station removes the soldered semiconductor DBC 5 and lead frame 4 from the tray 6, and the empty tray 6 is transferred back to the plating station.

[0042] This application effectively reduces the degree of manual intervention in the clamping operation during processing, significantly improves processing efficiency, and reduces labor costs.

[0043] More preferably, the semiconductor DBC5 and lead frame 4 in this embodiment can be used in power modules, but are not limited to power modules. Of course, the semiconductor DBC5 and lead frame 4 to be soldered can be applied to other similar structures besides those described above.

[0044] Furthermore, as a preferred embodiment, the holding assembly 3 includes at least two pressing blocks 31, a first driving mechanism, and a second driving mechanism. The two pressing blocks 31 are respectively located on both sides of the vacuum adsorption assembly 2. The first driving mechanism is used to drive the two pressing blocks 31 to move closer or further away from each other, and the second driving mechanism is used to drive the two pressing blocks 31 to move up and down. When the tray 6 containing the semiconductor DBC5 and the lead frame 4 is placed on the adsorption platform 221, the first driving mechanism drives the two pressing blocks 31 to move closer to each other and move them to directly above the two sides of the lead frame 4, respectively. The second driving mechanism drives the two pressing blocks 31 to descend and press down on the two sides of the lead frame 4 for positioning.

[0045] Furthermore, in a preferred embodiment, the second driving mechanism includes at least two pressure plates 32, at least two lifting cylinders 33, and two mounting plates 34. The two pressure blocks 31 are respectively mounted on the two pressure plates 32, and the two lifting cylinders 33 are respectively driven to drive the two pressure plates 32 to rise and fall, so that the two pressure blocks 31 rise and fall. The two lifting cylinders 33 are respectively mounted on the two mounting plates 34, and the first driving mechanism is driven to drive the two mounting plates 34 to move closer or further away from each other, thereby driving the two pressure blocks 31 to move closer or further away from each other.

[0046] Furthermore, as a preferred embodiment, the first drive mechanism includes two translation cylinders 35, which are mounted on the base 1 and are respectively connected to two mounting plates 34 for transmission.

[0047] More preferably, in this embodiment, multiple positioning slots 61 are provided on the tray 6, and the bottom of each positioning slot 61 is provided with a positioning port for positioning DBC5. This allows for the simultaneous positioning of multiple sets of lead frames 4 and semiconductor DBC5. During the welding process, the lead frame 4 is pressed by the pressure block 31 driven by the cylinder, and the semiconductor DBC5 is adsorbed by the vacuum adsorption component 2 under negative pressure, ensuring that it will not move randomly or be lifted by the welding head during welding, thereby improving the stability and accuracy of welding.

[0048] Even better, each positioning port has a support step on its side wall to support the DBC5.

[0049] Specifically, when the number of positioning slots 61 of the tray 6 is N, the number of pressure blocks 31 is set to 2N, and the number of lifting cylinders 33 is set to 2N.

[0050] Furthermore, as a preferred embodiment, a positioning component is provided between the adsorption platform 221 and the tray 6 to position the tray 6, thereby improving the accuracy of the holding component 3 in holding the lead frame 4 and the accuracy of the vacuum adsorption component 2 in adsorbing the semiconductor DBC5.

[0051] Furthermore, as a preferred embodiment, the positioning component includes at least two positioning posts 23 disposed on the adsorption platform 221, and the tray 6 has at least two positioning holes, with the two positioning posts 23 respectively engaging with the two positioning holes for positioning.

[0052] In a preferred embodiment, four positioning holes are provided, distributed in pairs on both sides of the tray 6, and four positioning posts 23 are provided accordingly.

[0053] Furthermore, as a preferred embodiment, the vacuum adsorption assembly 2 includes a vacuum suction plate 21 and a vacuum suction plate 22. The vacuum suction plate 21 is mounted on the base 1, and the vacuum suction plate 22 is mounted on top of the vacuum suction plate 21, with the top of the vacuum suction plate 22 forming an adsorption platform 221.

[0054] Both the vacuum suction plate 21 and the vacuum suction plate 22 are existing conventional accessories. Specifically, in some embodiments, the vacuum suction plate 21 contains a vacuum generating device (such as a vacuum pump or vacuum generator) and corresponding gas passages. The vacuum pump extracts the gas inside the vacuum suction plate 21 through mechanical movement (such as piston reciprocating, impeller rotation, etc.), reducing its internal gas pressure. The vacuum generator utilizes the jet effect of compressed air to form a high-speed airflow at the nozzle outlet, thereby generating negative pressure inside the vacuum suction plate 21. The vacuum suction plate 21 has a complex and orderly gas passage design. These passages connect the vacuum generating device and the vacuum suction plate 22, ensuring that the negative pressure can be uniformly and stably transmitted to the vacuum suction plate 22. The vacuum suction plate 22 is installed on top of the vacuum suction plate 21, and its top forms an adsorption platform 221 for directly adsorbing workpieces such as semiconductor DBCs. The adsorption surface of the vacuum suction plate 22 is usually specially treated and has multiple tiny adsorption holes or grooves. These adsorption holes or grooves are connected to the gas passages inside the vacuum suction plate 21. When the vacuum suction plate 21 generates negative pressure, a low-pressure area is formed at the suction holes or slots, creating a pressure difference with the external atmospheric pressure. When workpieces such as semiconductor DBCs are placed on the suction platform 221 of the vacuum suction plate 22, due to the tiny gaps between the workpiece and the suction platform 221, outside air will enter the suction holes or slots through these gaps. However, because the vacuum suction plate 21 is under negative pressure, the air is quickly extracted, further reducing the air pressure between the workpiece and the suction platform 221, thus creating a pressure difference between the upper and lower surfaces of the workpiece. According to the principle of pressure difference, the external atmospheric pressure will press the workpiece tightly onto the suction platform 221.

[0055] Furthermore, to ensure effective adsorption, the surface of the vacuum suction plate 22 that contacts the workpiece is typically made of a material with high flatness and high hardness, and the surface is finely machined to reduce the gap between the workpiece and the adsorption platform 221 and improve sealing. Additionally, in some cases, sealing strips or gaskets can be placed at the edges of the adsorption platform 221 to further enhance the sealing effect and prevent air leakage.

[0056] Furthermore, as a preferred embodiment, two guide shafts 9 are installed on the base 1. The two guide shafts 9 are parallel to each other and are located on both sides of the base 1 respectively. The two ends of each mounting plate 34 are slidably engaged with the two guide shafts 9 respectively.

[0057] Furthermore, as a preferred embodiment, each mounting plate 34 is provided with linear bearings 10 at both ends, and the two linear bearings 10 are slidably sleeved on the outside of the two guide shafts 9.

[0058] Furthermore, as a preferred embodiment, the base 1 is also equipped with a photoelectric sensor 7 for detecting whether the adsorption platform 221 has a tray 6 and a pressure gauge 8 for displaying the negative pressure value provided by the vacuum adsorption assembly 2. In one embodiment, the pressure gauge 8 is an electronic pressure gauge and is connected to the vacuum adsorption assembly 2 via a wire.

[0059] Specifically, the photoelectric sensor 7 and the pressure gauge 8 are both connected to the controller in the ultrasonic welding equipment, which can transmit detection signals to the controller and enable the controller to perform corresponding actions on the holding component and the vacuum adsorption component 2.

[0060] The above description is only a preferred embodiment of the present utility model and does not limit the implementation method and protection scope of the present utility model. Those skilled in the art should realize that all solutions obtained by equivalent substitutions and obvious changes made based on the description and illustrations of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A fixture device for ultrasonic welding of a semiconductor DBC and a lead frame, characterized in that, include: A base on which a holding component and a vacuum adsorption component are mounted, and an adsorption platform is formed on the top of the vacuum adsorption component; It also includes: a tray, which is placed on the adsorption platform and has at least one positioning groove for placing a lead frame. When the tray is placed on the adsorption platform, the pressing component can press down to position the lead frame located in the positioning groove, and the vacuum adsorption component can adsorb the semiconductor DBC placed under the lead frame.

2. The fixture device for ultrasonic welding of semiconductor DBC and lead frame according to claim 1, characterized in that, The pressing component includes: At least two pressure blocks, the two pressure blocks being located on opposite sides of the vacuum adsorption assembly; A first driving mechanism is used to drive the two pressure blocks to move closer or further apart from each other. The second driving mechanism is used to drive the two pressure blocks to move up and down. When the lead frame is placed on the tray, the first driving mechanism drives the two pressure blocks to move closer to each other and move to directly above the two sides of the lead frame. The second driving mechanism drives the two pressure blocks to descend and press down on the two sides of the lead frame to position them.

3. The fixture device for ultrasonic welding of semiconductor DBC and lead frame according to claim 2, characterized in that, The second drive mechanism includes: At least two pressure plates, and the two pressure blocks are respectively mounted on the two pressure plates; At least two lifting cylinders are provided, and the two lifting cylinders are respectively connected to the two pressure plates for driving the two pressure plates to lift and lower, so as to lift and lower the two pressure blocks. Two mounting plates are respectively mounted on the two mounting plates, and the first driving mechanism is connected to the two mounting plates for driving the two mounting plates to move closer or further away from each other, thereby driving the two pressure blocks to move closer or further away from each other.

4. The fixture device for ultrasonic welding of semiconductor DBC and lead frame according to claim 3, characterized in that, The first driving mechanism includes two translation cylinders, which are mounted on the base and are respectively connected to the two mounting plates for transmission.

5. The fixture device for ultrasonic welding of semiconductor DBC and lead frame according to claim 1, characterized in that, A positioning component is provided between the adsorption platform and the tray for positioning the tray.

6. The fixture device for ultrasonic welding of semiconductor DBC and lead frame according to claim 5, characterized in that, The positioning component includes at least two positioning posts disposed on the adsorption platform, and the tray has at least two positioning holes, with the two positioning posts respectively positioning and engaging with the two positioning holes.

7. The fixture device for ultrasonic welding of semiconductor DBC and lead frame according to claim 1, characterized in that, The vacuum adsorption assembly includes a vacuum suction plate and a vacuum suction plate. The vacuum suction plate is mounted on the base, and the vacuum suction plate is mounted on top of the vacuum suction plate, with the top of the vacuum suction plate forming the adsorption platform.

8. The fixture device for ultrasonic welding of semiconductor DBC and lead frame according to claim 4, characterized in that, Two guide shafts are mounted on the base. The two guide shafts are parallel to each other and are located on both sides of the base. The two ends of each mounting plate are slidably engaged with the two guide shafts.

9. The fixture device for ultrasonic welding of semiconductor DBC and lead frame according to claim 8, characterized in that, Each of the mounting plates is provided with linear bearings at both ends, and the two linear bearings are slidably sleeved on the outside of the two guide shafts.

10. The fixture device for ultrasonic welding of semiconductor DBC and lead frame according to claim 1, characterized in that, The base is also equipped with a photoelectric sensor for detecting whether there is a tray on the adsorption platform and a pressure gauge for displaying the negative pressure value provided by the vacuum adsorption assembly.

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