Laser device and laser processing apparatus

Abstract

The utility model discloses a kind of laser device and laser processing equipment, it is related to laser processing technical field, wherein, laser device includes shell structure and laser light source module, the shell structure includes installation cavity shell body, the installation cavity shell body is surrounded into first installation cavity, the laser light source module is set in the first installation cavity and with the inner surface of the installation cavity shell body contact, the installation cavity shell body is equipped with cooling liquid passage, at least a portion of the cooling liquid passage is set to the outer surface of the installation cavity shell body, the cooling liquid passage is used to heat dissipation to the laser light source module;The shell structure is equipped with liquid inlet and liquid outlet, the liquid inlet with the liquid inlet end of the cooling liquid passage communication, the liquid outlet with the liquid outlet end of the cooling liquid passage communication, the liquid inlet and the liquid outlet adjacent arrangement.This application technical scheme can improve the heat dissipation performance of laser device.

Description

Technical Field

[0001] This utility model relates to the field of laser processing technology, and in particular to a laser device and laser processing equipment. Background Technology

[0002] Currently, laser processing equipment using lasers is becoming increasingly popular. During laser processing, the laser device usually generates a lot of heat. The higher the power of the laser device, the more heat is generated. When the power of the laser device is high, if the heat dissipation performance of the laser device is poor and cannot dissipate heat in time, it will affect the performance of the laser device and thus affect the processing effect of the laser processing equipment. Utility Model Content

[0003] The main purpose of this invention is to propose a laser device and laser processing equipment, which aims to improve the heat dissipation performance of the laser device.

[0004] To achieve the above objectives, the present invention proposes a laser device comprising a housing structure and a laser source module. The housing structure includes a mounting cavity housing, which encloses a first mounting cavity. The laser source module is disposed within the first mounting cavity and contacts the inner surface of the mounting cavity housing. The mounting cavity housing is provided with a coolant passage, at least a portion of which is disposed on the outer surface of the mounting cavity housing. The coolant passage is used to dissipate heat from the laser source module.

[0005] The housing structure is provided with a liquid inlet and a liquid outlet. The liquid inlet is connected to the liquid inlet end of the coolant passage, and the liquid outlet is connected to the liquid outlet end of the coolant passage. The liquid inlet and the liquid outlet are arranged adjacent to each other.

[0006] In one embodiment, the mounting cavity housing includes two first sidewalls spaced apart, the space between the two first sidewalls is the first mounting cavity, and the coolant passage includes two first flow paths, which are respectively disposed on the outer surfaces of the two first sidewalls and are interconnected.

[0007] Wherein, the liquid inlet is connected to one of the first flow paths, and the liquid outlet is connected to the other of the first flow paths; or, both the liquid inlet and the liquid outlet are connected to one of the first flow paths.

[0008] In one embodiment, the mounting cavity housing further includes a first connecting wall, which is located between the two first side walls and is connected to the two first side walls respectively;

[0009] The coolant passage further includes a second flow path that connects the two first flow paths, and the second flow path is disposed within the first connecting wall;

[0010] And / or, the first connecting wall is disposed in the first mounting cavity and divides the first mounting cavity into a first chamber and a second chamber.

[0011] In one embodiment, the first flow path includes a main flow path and a groove formed on the inner wall of the main flow path, wherein both the main flow path and the groove extend along the extension direction of the first flow path;

[0012] And / or, the first sidewall is provided with a mounting hole, and at least a portion of the structure of the laser light source module is mounted in the mounting hole.

[0013] In one embodiment, the housing structure further includes a sealing element, and the outer surface of the first sidewall is provided with a sealing groove. The sealing groove is parallel to the first flow path and is disposed around the outer peripheral edge of the first flow path. The sealing element is snapped into the sealing groove to seal the first flow path.

[0014] In one embodiment, the housing structure further includes a first housing, the first sidewall being connected to the first housing to form a cooling chamber, and the first flow path, the seal and the sealing groove being located within the cooling chamber.

[0015] In one embodiment, the housing structure further includes a second connecting wall located below the first connecting wall; the coolant passage further includes a third flow path located below the second connecting wall, one end of the third flow path being connected to the first flow path, and the other end of the third flow path being connected to the outlet or the inlet.

[0016] In one embodiment, the housing structure further includes a second housing, the second connecting wall and the second housing forming a second mounting cavity, the second mounting cavity being used to mount electronic devices electrically connected to the laser light source module.

[0017] In one embodiment, the first flow path extends and bends along the outer surface of the first sidewall, and the first flow path includes:

[0018] A first sub-flow path is provided, extending along the edge of the first sidewall; and

[0019] The second sub-flow path is located in the middle region of the first sidewall and is connected to the first sub-flow path.

[0020] In one embodiment, the housing structure is further provided with a laser channel, which is connected to the first mounting cavity. An optical device is provided in the laser channel, which is used to allow the laser emitted by the laser source module to be emitted to the outside of the housing structure.

[0021] The mounting cavity housing has a light-transmitting opening, which connects the first mounting cavity and the laser channel;

[0022] And / or, the laser channel's light outlet, the liquid inlet, and the liquid outlet face the same side of the housing structure.

[0023] This application also proposes a laser processing device, comprising:

[0024] The laser device as described in any of the foregoing embodiments; and

[0025] The cooling module includes a water-cooled radiator, a water pump, and water-cooled piping. The water-cooled piping is connected to the water-cooled radiator and the water pump in sequence, and is interconnected with the coolant passage of the laser device.

[0026] In one embodiment, the cooling module further includes a cooling fan, the cooling fan being disposed toward the water cooling radiator, and the water cooling radiator being disposed on the air outlet side of the cooling fan;

[0027] The cooling fan is configured as an axial fan, and the cooling module also includes an air guide shroud. The air guide shroud is located on the side of the cooling fan facing away from the water cooling radiator. The air guide shroud has an air guide cavity and a vent communicating with the air guide cavity.

[0028] In one embodiment, the cooling module further includes a flow meter disposed in the water-cooling pipeline, the flow meter being configured to detect the flow rate of coolant in the water-cooling pipeline;

[0029] And / or, the cooling module further includes a thermometer configured to detect the temperature of the coolant in the cooling module;

[0030] And / or, the cooling module further includes a water tank, the water cooling pipeline includes a first pipeline, a second pipeline and a third pipeline, the first pipeline connects the outlet of the water cooling radiator and the inlet of the coolant passage, the second pipeline connects the outlet of the coolant passage and the inlet of the water tank, the outlet of the water tank connects to the inlet of the water pump, and the third pipeline connects the outlet of the water pump and the inlet of the water cooling radiator;

[0031] And / or, the laser processing equipment further includes a control module, which is communicatively connected to the electrical components of the cooling module;

[0032] And / or, the laser processing equipment further includes a frame and a moving component, the frame having a processing platform located below the laser device, the moving component being mounted on the frame and connected to the laser device for driving the laser device to move.

[0033] The technical solution of this utility model includes a coolant passage within the housing structure of the laser device. This coolant passage serves as a flow path for the coolant, employing liquid cooling to dissipate heat from the laser device, resulting in high heat dissipation performance. Furthermore, the laser source module is in contact with the mounting cavity housing containing the coolant passage, ensuring its proximity to the laser source module and allowing for efficient heat dissipation. This high heat dissipation efficiency contributes to the laser device's stable performance during processing. The improved heat dissipation also allows for the use of higher-power laser source modules, enhancing laser processing efficiency and quality. It also enables the processing of harder and thicker materials, broadening the applicability of laser processing. The inlet and outlet are located on the same side of the housing structure and adjacent to each other, facilitating the installation and removal of water-cooled pipes connected to the two coolant outlets on the same side of the housing structure, thus improving ease of installation and removal. Attached Figure Description

[0034] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0035] Figure 1 A structural diagram of the laser device and cooling module in one embodiment of the laser processing equipment provided in this application;

[0036] Figure 2 for Figure 1 An exploded view of a laser processing equipment where the cooling module's water-cooling radiator, cooling fan, and air guide cover are separated.

[0037] Figure 3 A structural diagram showing the removal of a portion of the structure to expose the first flow path in one embodiment of the shell structure provided in this application;

[0038] Figure 4 A structural diagram of the shell structure provided in this application from another perspective;

[0039] Figure 5 for Figure 3 Another structural diagram of the middle shell structure;

[0040] Figure 6 for Figure 3 A cross-sectional view of the middle shell structure at the location of the second flow path;

[0041] Figure 7 for Figure 6 Enlarged view of point A in the middle;

[0042] Figure 8 for Figure 3 Cross-sectional view of the middle shell structure at the location of the third flow path;

[0043] Figure 9 for Figure 3 Cross-sectional view of the middle shell structure at the laser channel location.

[0044] Explanation of icon numbers:

[0045] 1000. Laser processing equipment; 100. Laser device; 10. Housing structure; 11. First housing; 111. First sidewall; 112. Second sidewall; 113. First connecting wall; 114. First mounting cavity; 1141. First chamber; 1142. Second chamber; 115. Mounting hole; 116. Sealing groove; 117. Light transmission port; 118. Cooling chamber; 12. Second housing; 121. Second mounting cavity;

[0046] 20. Coolant passage; 21. First flow path; 211. Main flow path; 212. Groove; 213. First sub-flow path; 214. Second sub-flow path; 22. Second flow path; 23. Third flow path; 30. Coolant inlet; 40. Laser channel; 41. Light outlet;

[0047] 200. Cooling module; 201. Water radiator; 202. Water pump; 203. Water cooling piping; 2031. First piping; 2032. Second piping; 2033. Third piping; 204. Cooling fan; 205. Air guide shroud; 2051. Air guide cavity; 2052. Vent; 206. Flow meter; 207. Thermometer; 208. Water tank; 300. Control module.

[0048] The realization of the purpose, functional features and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0049] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present utility model.

[0050] It should be noted that if the embodiments of this utility model involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a specific posture. If the specific posture changes, the directional indicators will also change accordingly.

[0051] Furthermore, if the embodiments of this utility model involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the use of "and / or" or "and / or" throughout the text includes three parallel solutions. For example, "A and / or B" includes solution A, solution B, or a solution where both A and B are satisfied simultaneously. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.

[0052] This invention proposes a housing structure 10 for use in a laser device 100, which can improve the heat dissipation performance of the laser device 100.

[0053] See also Figure 1 and Figure 3 In one embodiment of this utility model, the laser device 100 includes a housing structure 10 and a laser source module. The housing structure 10 includes a mounting cavity housing, which surrounds a first mounting cavity 114. The laser source module is disposed in the first mounting cavity 114 and contacts the inner surface of the mounting cavity housing. The mounting cavity housing is provided with a coolant passage 20, at least a portion of which is disposed on the outer surface of the mounting cavity housing. The coolant passage 20 is used to dissipate heat from the laser source module. The housing structure 10 is provided with an inlet and an outlet. The inlet is connected to the inlet end of the coolant passage 20, and the outlet is connected to the outlet end of the coolant passage 20. The inlet and outlet are arranged adjacent to each other.

[0054] The adjacent arrangement of the inlet and outlet can be understood as follows: the inlet and outlet are located on the same side of the housing structure 10; or, the inlet and outlet are located on the same outer surface of the housing structure 10, with the distance between the edges of the inlet and outlet being less than the radius of the inlet or outlet; or, the inlet and outlet are located on the same outer surface of the housing structure 10, with the distance between the edges of the inlet and outlet being less than 1 cm. Because the inlet and outlet are adjacent, it facilitates the installation of external water pipes and avoids the interference laser device 100 from moving on the guide rail due to excessive dispersion of external water pipes.

[0055] In practical applications, both the inlet and outlet are connected to cooling water pipes. Coolant flows through the cooling water pipes into the cooling water passage 20. Since the laser source module is in contact with the inner surface of the mounting cavity housing, and the coolant is in contact with the outer surface of the mounting cavity housing via the cooling water passage 20, the coolant and laser source module are in contact with opposite surfaces of the mounting cavity housing. Therefore, the coolant can exchange heat with the laser source module in the first mounting cavity 114 by contacting the outer surface of the mounting cavity housing. This arrangement, with the cooling water passage adjacent to the first mounting cavity 114, allows the coolant to efficiently remove heat from the laser source module, resulting in high heat dissipation efficiency. This gives the laser device 100 better heat dissipation performance, ensuring stable performance during processing. The improved heat dissipation performance allows the laser device 100 to use a laser source module with higher laser power, improving laser processing efficiency and quality. It also enables the processing of harder and thicker materials, enhancing the applicability of laser processing.

[0056] The housing structure 10 in this embodiment is used to install the laser source module, optical module, and other structures, and can also be used to install circuit boards and other devices. The laser source module can be, but is not limited to, a semiconductor laser, a gas laser, etc. The laser generated by the laser source module is directed towards the optical module and then emitted outwards from the housing structure 10, and can be used for processing operations such as laser cutting, laser welding, laser marking, laser engraving, and laser cleaning. The optical module can be used to guide the propagation path of the laser beam, and to perform at least one operation such as shaping, focusing, and beam combining of the laser. For example, the optical module can include at least one optical device such as a reflector, collimating lens, focusing lens, and beam combiner. For example, a reflector is used to change the propagation direction of the laser beam emitted from the laser source; a shaping lens can be used to adjust the divergence angle of the laser beam in at least one direction, namely the fast axis direction and the slow axis direction; in addition, when the laser source module is provided with two or more laser sources, a beam combiner can be used to combine the laser beams emitted from the two sets of laser sources into one beam, thereby increasing the laser energy. Optionally, the laser device 100 may be equipped with two sets of laser source modules, and a beam combining module may be provided in the laser device 100 to combine the beams of the two sets of laser source modules into one beam; wherein, the arrangement of the two sets of laser source modules may be the same or different, and is not limited here.

[0057] In one possible embodiment of this application, the mounting cavity housing includes two first sidewalls 111 spaced apart along a first direction, the gap between the two first sidewalls 111 forming at least a portion of the first mounting cavity 114, and two second sidewalls 112 spaced apart along a second direction, the first and second directions intersecting each other. The two first sidewalls 111 and the two second sidewalls 112 enclose a first mounting cavity 114 for mounting a laser source module. In some embodiments, the mounting cavity housing also includes a top wall and a bottom wall spaced apart along a third direction to improve the stability of the laser source module mounted in the first mounting cavity 114. The first direction, the second direction, and the third direction intersect each other.

[0058] The coolant passage 30 is connected to the external cooling module 200 through the inlet and outlet to form a coolant circuit. The cooling module 200 can introduce coolant with a lower temperature into the coolant passage 20 through the inlet. The coolant flows along the coolant passage 20 and exchanges heat with the laser device 100 before flowing out through the outlet back into the cooling module 200. This can remove the heat from the laser device 100 and achieve heat dissipation and cooling of the laser device 100.

[0059] At least a portion of the coolant passage 20 is disposed on the outer surface of the first sidewall 111 of the mounting cavity housing. The coolant passage 20 includes at least a first flow path 21 disposed on the outer surface of the first sidewall 111. In practical applications, since the laser source module is in contact with the inner surface of the first sidewall 111, the coolant can flow in the first flow path 21. Therefore, the coolant can exchange heat with the laser source module in the first mounting cavity 114 through contact with the first sidewall 111. With this arrangement, the coolant passage is located adjacent to the first mounting cavity 114, allowing the coolant to efficiently remove heat from the laser source module, resulting in high heat dissipation efficiency. This gives the laser device 100 better heat dissipation performance, ensuring stable performance of the laser device 100 during processing. The improved heat dissipation performance allows the laser device 100 to use a laser source module with higher laser power, thereby improving laser processing efficiency and quality. It can also be applied to the processing of harder and thicker materials, improving the applicability of laser processing.

[0060] In this embodiment, the liquid inlet and liquid outlet are located on the same side of the housing structure 10 and are adjacent to each other, which facilitates the installation and removal of the water cooling pipe 203 connected to the liquid inlet and liquid outlet on the same side of the housing structure 10, thereby improving the ease of installation and removal.

[0061] Optionally, in this embodiment, the first flow path 21 may be provided in only one of the first sidewalls 111, or a first flow path 21 may be provided in each of the first sidewalls 111. Optionally, a coolant passage 20 may be provided in at least one of the second sidewalls 112. In some embodiments, the coolant passage 20 may be provided on at least one of the top wall and the bottom wall, which can increase the heat exchange area between the coolant and the laser device 100 and improve the heat exchange efficiency.

[0062] The technical solution of this utility model includes a coolant passage 20 provided in the housing structure 10 of the laser device 100. The coolant passage 20 allows coolant flow, and in practical applications, a relatively coolant enters the coolant passage 20. After heat exchange with the laser device 100, the coolant flows out, carrying away the heat from the laser device 100. This liquid cooling method provides the laser with high heat dissipation performance. Furthermore, the coolant passage 20 is located on the first sidewall 111 of the first mounting cavity 114 used to install the laser source module. Its proximity to the laser source module allows for efficient heat removal, resulting in high heat dissipation efficiency and ensuring good heat dissipation performance of the laser device 100, thus maintaining stable performance during processing. This improved heat dissipation also allows for the use of a higher-power laser source module in the laser device 100, improving laser processing efficiency and quality. It also enables the processing of harder and thicker materials, enhancing the applicability of laser processing.

[0063] Please refer to the following: Figure 3 , Figure 4 as well as Figure 6 In one embodiment, the mounting cavity housing includes two first sidewalls 111 spaced apart, the spaced area between the two first sidewalls 111 is the first mounting cavity 114, and the coolant passage 20 includes two first flow paths 21, which are respectively disposed on the outer surfaces of the two first sidewalls 111. The two first flow paths 21 are interconnected, the inlet is connected to one of the first flow paths 21, and the outlet is connected to the other first flow path 21.

[0064] In this embodiment, each first sidewall 111 is provided with a first flow path 21. The two first flow paths 21 can be connected by an external water pipe, or a second flow path 22 can be provided in the shell structure 10 to connect the two first flow paths 21. By connecting the two first flow paths 21 to each other, the shell structure 10 can be provided with only two coolant inlets 30, one of which is used as an inlet and the other as an outlet. That is, the two first flow paths 21 share a set of inlet and outlet, reducing the number of coolant inlets 30 on the shell structure 10, and also facilitating the connection between the coolant passage 20 of the shell structure 10 and the cooling module 200, thus improving the ease of disassembly and assembly.

[0065] In some embodiments, two coolant inlets 30 correspond one-to-one with two first flow paths 21, and one coolant inlet 30 is connected to one first flow path 21. In specific applications, one coolant inlet 30 serves as an inlet and the other coolant inlet 30 serves as an outlet. Coolant flows into the corresponding first flow path 21 from the inlet, then flows to the other first flow path 21, and finally flows out from the outlet.

[0066] Alternatively, both the inlet and outlet are connected to one of the first flow paths 21. The first flow path 21 connected to the inlet and outlet includes an inlet section and an outlet section. The inlet is connected to the inlet section, and the outlet is connected to the outlet section. The inlet section and the outlet section are respectively connected to another first flow path 21. In this configuration, the coolant flows from the inlet into the inlet section, then flows to another first flow path 21, and then flows into the outlet section to exit the shell structure 10 from the outlet.

[0067] Please see Figure 6 In one embodiment, the mounting cavity housing further includes a first connecting wall 113, which is located between two first side walls 111 and is connected to the two first side walls 111 respectively.

[0068] In this embodiment, the first connecting wall 113 can be disposed on the periphery of the first mounting cavity 114. For example, the connecting wall 113 can be disposed as one of the two second side walls 112 of the shell structure 10 in the previous embodiment; or, in some embodiments, the first connecting wall 113 can be disposed as a top wall covering the first mounting cavity 114, or it can be disposed as a bottom wall located below the first mounting cavity 114; in addition, the first connecting wall 113 can also be disposed in the first mounting cavity 114, which is not limited here.

[0069] The coolant passage 20 also includes a second flow path 22 connecting the two first flow paths 21, and the second flow path 22 is disposed within the first connecting wall 113. It can be understood that the first connecting wall 113 has a certain thickness, and the second flow path 22 is formed by hollowing out the first connecting wall 113.

[0070] In this embodiment, the coolant passage 20 includes a second flow path 22 disposed in the first connecting wall 113. Both ends of the second flow path 22 are connected to two first flow paths 21, respectively. This eliminates the need for external water pipes connecting the two first flow paths 21. The coolant passage 20 is entirely concealed within the housing structure 10, avoiding the problem of water pipes connecting the two first flow paths 21 easily becoming detached, ensuring stable conduction of the two first flow paths 21. Furthermore, it also makes the overall structure of the housing structure 10 appear neat and uniform. Additionally, when the coolant flows in the second flow path 22, it can also exchange heat with the components in the first mounting cavity 114 through the first connecting wall 113, increasing the heat exchange area and improving heat dissipation efficiency.

[0071] Please see Figure 6 In one embodiment, the connecting wall 113 is disposed in the first mounting cavity 114, and divides the first mounting cavity 114 into a first chamber 1141 and a second chamber 1142.

[0072] In this embodiment, the first connecting wall 113 is disposed in the first mounting cavity 114, which can divide the first mounting cavity 114 into a first chamber 1141 and a second chamber 1142. Optionally, the first chamber 1141 and the second chamber 1142 can be used to install laser source modules, that is, two sets of laser source modules are provided in the laser device 100. The laser beams emitted by the two sets of laser source modules can be combined into a single laser beam by setting a beam combining module. This arrangement is beneficial to improving the energy of the laser beam emitted by the laser device 100, improving processing efficiency and processing quality, and can be used for processing thicker and harder materials. Alternatively, one of the first chamber 1141 and the second chamber 1142 can be used to install the laser source module, and the other can be used to install the circuit board or other components in the laser device 100, so that the laser source module is isolated from other components and the heat of the laser source module during operation is prevented from affecting other components. When the coolant flows in the second flow path 22, it can also absorb the heat in the first chamber 1141 and the second chamber 1142 at the same time, so that the devices in the first chamber 1141 and the second chamber 1142 can dissipate heat and cool down better.

[0073] Please see Figure 7 In one embodiment, the first flow path 21 includes a main flow path 211 and a groove 212 formed on the inner wall of the main flow path 211. Both the main flow path 211 and the groove 212 extend along the extension direction of the first flow path 21.

[0074] In this embodiment, the first flow path 21 includes a main flow path 211 and a groove 212 disposed on the inner wall of the main flow path 211. The inner wall of the main flow path 211 includes two opposing inner sidewalls and an inner bottom wall connecting the two inner sidewalls. A groove 212 is disposed on at least one inner sidewall and / or the inner bottom wall. Both the groove 212 and the main flow path 211 extend along the extension direction of the first flow path 21. This arrangement can increase the wall area used to enclose and form the first flow path 21, thereby increasing the contact area between the coolant and the first sidewall 111 and the heat exchange area between the coolant and the shell structure 10, which is beneficial to improving heat dissipation efficiency. Optionally, the cross-sectional shape of the groove 212 can be, but is not limited to, square, triangular, semi-circular, and other shapes; one, two, or more grooves 212 can be disposed on the same sidewall of the main flow path 211, which is not limited here.

[0075] Please see Figure 3 and Figure 4In one embodiment, the housing structure 10 further includes a sealing element (not shown). The outer surface of the first sidewall 111 is provided with a sealing groove 116, which is parallel to the first flow path 21 and surrounds the outer peripheral edge of the first flow path 21. The sealing element is snapped into the sealing groove 116 to seal the first flow path 21 and prevent coolant from flowing into the first mounting cavity 114 and damaging the laser source module.

[0076] In this embodiment, to facilitate processing or cleaning of the first flow path 21, it is typically formed on the outer surface of the first sidewall 111. The seal can be a gasket covering the first flow path 21, with a protrusion on the surface facing the sealing groove 116. This protrusion engages within the sealing groove 116, improving the positional stability and connection strength of the gasket on the first sidewall. Optionally, the seal can be a sealing ring, sealant, or similar structure. The seal is embedded in the sealing groove 116 and partially protrudes from it. A cover can be provided to cover the first sidewall 111, concealing the first flow path 21, with the seal sandwiched between the first sidewall 111 and the cover. The seal prevents coolant in the first flow path 21 from overflowing and flowing to other locations, thus avoiding interference with other components in the laser device 100. For example, it prevents coolant from flowing into the mounting hole 115 and affecting the laser source module. This also prevents coolant from leaking out of the laser device 100 and flowing onto other parts of the laser processing equipment 1000.

[0077] The sealing groove 116 on the first sidewall 111 can limit the position of the sealing gasket and sealing ring when using sealing gasket and sealing ring as sealing elements, so as to avoid the sealing elements from being misaligned; when using sealant as sealing element, it can increase the amount of sealant dispensed and reduce the risk of sealant flowing into the first flow path 21 or other locations.

[0078] Please see Figure 3 and Figure 8 In one embodiment, the housing structure 10 includes a first housing 11, and a first sidewall 111 and the first housing 11 enclose a cooling chamber 118. The first flow path 21, the seal, and the sealing groove 116 are all located within the cooling chamber 118. It is understood that the first housing 11 can be an outer shell surrounding the mounting cavity housing, that is, the first housing 11 can be an outer shell surrounding the first sidewall 111, the second sidewall 112, the top wall, and the bottom wall, and the housing structure 10 is configured as a double-layered housing; or, at least one of the second sidewall, the top wall, and the bottom wall can be used as part of the first housing 11. In this case, the housing structure 10 can form a double-layered sidewall structure only on the side where the first sidewall 111 is located.

[0079] In this embodiment, two first sidewalls 111 are spaced apart within and connected to the first housing 11. The inner surfaces of the two first sidewalls 111 and the first housing 11 enclose a first mounting cavity 114. The outer surface of at least one first sidewall 11 and the first housing 11 enclose a cooling chamber 118. The first flow path 21, the seal, and the sealing groove 116 are all located within the cooling chamber 118. Optionally, if the outer surface of at least one of the second sidewall 112, the top wall, and the bottom wall is also provided with a first flow path 21, then the outer surface of at least one of the second sidewall 112, the top wall, and the bottom wall and the first housing 11 can also enclose a cooling chamber. Optionally, the cooling chamber 118 has an opening on the side away from the first sidewall 111, and the portion of the first housing 11 opposite to the first sidewall can be configured as an openable cover, which is used to close the opening. Optionally, the cover is rotatably disposed on the side of the first sidewall 111 opposite to the first mounting cavity 114, so that the first flow path 21 is exposed by rotating the cover; or the cover is configured to be detachably connected to other parts of the first housing 11, so that the first flow path 21 is exposed by removing the cover. This configuration facilitates cleaning of the first flow path 21; and also facilitates the forming of the first flow path 21 on the first sidewall 111, improving processing convenience.

[0080] In one embodiment, the housing structure 10 further includes a second connecting wall located below the first connecting wall 113; the coolant passage 20 further includes a third flow path 23 located below the second connecting wall, one end of the third flow path 23 being connected to the first flow path 21, and the other end of the third flow path 23 being connected to an outlet or an inlet.

[0081] In this embodiment, the second connecting wall serves as the bottom support structure of the first mounting cavity 114, preventing light leakage at the bottom of the first mounting cavity 114 and providing a support base for the devices installed in the first mounting cavity 114. The third flow path located below the second connecting wall increases the distribution area of ​​the water-cooling pipes 203 within the housing structure 10, thereby increasing the flow area of ​​the coolant and the contact area between the coolant and the housing structure 10. This increases the heat exchange area between the coolant and the laser device 100, improving heat dissipation efficiency. Furthermore, the design of the third flow path 23 allows for more flexible placement of the inlet and outlet, enabling them to be positioned adjacent to each other for easy connection to the cooling module 200.

[0082] In practical applications, taking the coolant inlet 30 connected to the third flow path 23 as an example, the coolant flows into the third flow path 23 from the inlet, then flows into the first flow path 21 connected to the third flow path 23, flows out from the first flow path 21, passes through the second flow path 22, flows to another first flow path 21 set on the first side wall 111, and then exits from the outlet. With this configuration, the coolant can flow through the two first side walls 111 on both sides of the first mounting cavity 114 below the first mounting cavity 114, as well as the first connecting wall 113 separated in the first mounting cavity 114, thereby exchanging heat with the shell structure 10 in more areas, which can better absorb the heat in the first mounting cavity 114 and improve the heat dissipation efficiency.

[0083] Please refer to Figure 9 In one embodiment, the housing structure 10 further includes a second housing 12, and the second connecting wall and the second housing 12 surround a second mounting cavity 121, which is used to mount electronic devices electrically connected to the laser light source module.

[0084] In this embodiment, the second mounting cavity 121 can be used to mount, but is not limited to, circuit boards or other devices of the laser device 100, so that the devices mounted in the second mounting cavity 121 are separated from the laser source module mounted in the first mounting cavity 114, thereby reducing the impact of heat generated by the laser source module on other devices and also reducing the impact of heat from other devices on the laser source module, which is beneficial to improving the performance stability of the laser device 100.

[0085] Please refer to Figure 8 The third flow path 23, the inlet, and the outlet are located in the second housing 12. The water pipe connecting the inlet and outlet can be connected in the bottom area of ​​the housing structure 10 without extending the water pipe to an excessively high area. It is understood that a clearance area is provided on one side of the second housing 12, and the other side is a housing wall with a certain thickness. The clearance area and the second connecting wall enclose the second mounting cavity 121, and the third flow path 23 is provided inside the housing wall.

[0086] Please see Figure 3 and Figure 4 In one embodiment, the first flow path 21 is bent and extended in the first sidewall 111.

[0087] In this embodiment, the first flow path 21 is coiled and can be configured as, but is not limited to, a serpentine channel structure with reciprocating bends, a spiral flow channel structure, or, as in the following embodiments, the first flow path 21 includes a first sub-flow path 213 and a second sub-flow path 214, which is not limited here. Using the above method, the first flow path 21 has a large distribution area on the first sidewall 111, which can increase the heat exchange area between the coolant and the shell structure 10, thus improving heat dissipation efficiency.

[0088] Please see Figure 3 and Figure 4 In one embodiment, the first flow path 21 includes a first sub-flow path 213 and a second sub-flow path 214. The first sub-flow path 213 extends along the edge of the first sidewall 111 and is arranged around the wall surface of the first sidewall 111. The second sub-flow path 214 is located in the middle region of the first sidewall 111, and both ends of the second sub-flow path 214 extend toward the edge of the first sidewall 111 and are respectively connected to the first sub-flow path 213.

[0089] In this embodiment, the first flow path 21 includes a first sub-flow path 213 extending along the edge region of the first sidewall 111. The first sub-flow path 213 forms an annular flow channel to cover most of the edge region of the first sidewall 111. The second sub-flow path 214 is located in the middle region of the first sidewall 111, with both ends extending towards the edge of the first sidewall 111 and communicating with the first sub-flow path 213 respectively. This arrangement allows the first flow path 21 to have a large distribution area on the first sidewall 111, enabling the coolant to flow through both the edge and middle regions of the first sidewall 111 for heat absorption, preventing excessive heat in localized areas and improving the heat dissipation efficiency of the laser device 100.

[0090] Please see Figure 9 In one embodiment, the housing structure 10 is further provided with a laser channel 40, which communicates with the first mounting cavity 114. Optical devices are disposed within the laser channel 40, and these devices are used to direct the laser emitted from the laser source module outwards from the housing structure 10. The mounting cavity housing has a light-transmitting opening 117, which connects the first mounting cavity 114 and the laser channel 40. The second sidewall 112 and the first outer shell 11 can be configured to form the laser channel 40, with the light-transmitting opening 117 on the second sidewall 112 to allow communication between the laser channel 40 and the first mounting cavity 114.

[0091] In this embodiment, a laser channel 40 is provided in the housing structure 10. The laser emitted from the laser source module can enter the laser channel 40 through the light-transmitting port 117 provided on the second side wall 112, and then be emitted outward along the laser channel 40 through the optical module provided in the laser channel 40. Optionally, the optical module includes at least one of optical devices such as a reflector, a focusing lens, a collimating lens, and a beam combining module. The reflector is used to change the direction of laser propagation, so that the propagation direction of the laser beam entering the laser channel 40 is adjusted to be parallel to the axis of the laser channel 40. The focusing lens is used to focus the laser beam, so that the laser energy is concentrated to achieve high power density processing. The collimating lens can convert the diverging laser beam into a parallel beam, reduce the divergence of the laser beam during propagation, and concentrate the laser beam energy. The collimating lens can be placed in front of the focusing lens. The laser beam passes through the collimating lens and the focusing lens in sequence. After the collimating lens collimates the laser beam, the focusing lens focuses it onto the processing point of the workpiece, which can precisely control the size and depth of focus of the laser spot on the workpiece.

[0092] In some embodiments, a first connecting wall 113 is provided in the first mounting cavity 114 to divide the first mounting cavity 114 into a first chamber 1141 and a second chamber 1142. A set of laser source modules are respectively provided in the first chamber 1141 and the second chamber 1142. The first chamber 1141 and the second chamber 1142 are respectively connected to the laser channel 40. Two sets of reflectors can be provided in the laser channel 40. The laser light emitted from the laser source module in the first chamber 1141 into the laser channel 40 is reflected by one set of reflectors so that the propagation direction of the laser light is parallel to the axial direction of the laser channel 40. The laser light emitted from the laser source module in the second chamber 1142 into the laser channel 40 is reflected by the other set of reflectors so that the propagation direction of the laser light is parallel to the axial direction of the laser channel 40. Then, the two laser beams are combined into a single laser beam by a beam combining module provided in the laser channel 40. The combined laser beam is emitted along the laser channel 40 for laser processing.

[0093] Please refer to Figure 5 In one embodiment, the light outlet 41, liquid inlet and liquid outlet 30 of the laser channel 40 face the same side of the housing structure 10.

[0094] In the laser processing equipment 1000, the light outlet 41 is usually set downwards, and the liquid inlet and outlet are set to face the same side as the light outlet 41. When the housing structure 10 is specifically applied to the laser processing equipment 1000, the water cooling pipe 203 connected to the liquid inlet and outlet can be connected to the housing structure 10 from below. This can avoid the water cooling pipe 203 occupying the side space of the laser device 100 and can prevent interference when the laser device 100 is translated.

[0095] Please see Figure 3 and Figure 4 In one embodiment, the first sidewall 111 is provided with a mounting hole 115, and at least a portion of the structure of the laser source module is mounted in the mounting hole 115. The mounting hole 115 can be used to mount the laser source in the laser source module, thereby improving the installation stability of the laser source. Furthermore, the mounting hole 115 can increase the contact area between the laser source and the housing structure 10, and bring the laser source closer to the first flow path 21, which is beneficial to improving the heat dissipation efficiency of the laser source.

[0096] In one embodiment, the laser source module includes a semiconductor laser source.

[0097] In this embodiment, a semiconductor laser source is provided in the laser source module to generate laser light. Due to its high directionality and coherence, the semiconductor laser can concentrate extremely high energy in a small spot area, and the laser beam has a small divergence angle, which can maintain a high energy density during long-distance transmission with little energy loss, which is beneficial to improving processing efficiency and processing quality.

[0098] In one embodiment, the laser device 100 is provided with a beam combining module and two sets of laser source modules. The beam combining module is configured to combine the lasers emitted from the two sets of laser source modules into a single laser beam.

[0099] In this embodiment, the laser device 100 may be equipped with two sets of laser source modules, and a beam combining module may be provided in the laser device 100 to combine the beams of the two sets of laser source modules into one beam. This is beneficial for increasing laser power and energy, improving processing efficiency and quality, and can be applied to the processing of thicker and harder materials. The arrangement of the two sets of laser source modules may be the same or different, and is not limited here.

[0100] Optionally, a first connecting wall 113 can be provided in the first mounting cavity 114, which divides the first mounting cavity 114 into a first chamber 1141 and a second chamber 1142. A laser channel 40 is provided in the housing structure 10, and a beam combining module is installed in the laser channel 40. One set of laser source modules is located in the first chamber 1141, and the other set of laser source modules is located in the second chamber 1142. Both sets of laser source modules emit lasers into the laser channel 40, and the beam combining module combines the two laser beams into one beam and emits it outward.

[0101] Please see Figure 1 and Figure 2This application also proposes a laser processing equipment 1000, including a laser device 100 and a cooling module 200. The specific structure of the laser device 100 is as described in the aforementioned embodiment. The cooling module 200 includes a water-cooled radiator 201, a water pump 202, and a water-cooled pipeline 203. The water-cooled pipeline 203 is connected to the water-cooled radiator 201 and the water pump 202 in sequence, and the water-cooled pipeline 203 is interconnected with the coolant passage 20 of the laser device 100.

[0102] The laser processing equipment 1000 in this embodiment includes a laser device 100 and a cooling module 200. The housing structure 10 of the laser device 100 is provided with a coolant passage 20. The cooling module 200 includes a water-cooled radiator 201, a water pump 202, and a water-cooled pipe 203. The water-cooled pipe 203 is connected to the coolant passage 20 to form a coolant circuit. The water pump 202 and the water-cooled radiator 201 are connected in series on the water-cooled pipe 203. The water pump 202 is used to provide the power for the flow of coolant so that the coolant with a lower temperature is introduced into the coolant passage 20 from the inlet. The coolant flows along the coolant passage 20 and exchanges heat with the laser device 100 before flowing back to the cooling module 200 from the outlet of the coolant passage 20. This can remove the heat from the laser device 100 and achieve heat dissipation and cooling of the laser device 100. The coolant flowing back from the coolant passage 20 to the water-cooling pipe 203 can flow to the water-cooling radiator 201. The water-cooling radiator 201 is provided with a coolant flow channel connected to the water-cooling pipe 203. The water-cooling radiator 201 is also provided with multiple heat dissipation fins. The heat dissipation fins can be flat sheet structures or corrugated structures. The heat dissipation fins give the water-cooling radiator 201 a large heat dissipation area, which makes the water-cooling radiator 201 have high heat dissipation efficiency. The coolant transfers heat to the water-cooling radiator 201, and the heat can be quickly dissipated into the environment through the water-cooling radiator 201 to cool the coolant. It can then flow back to the laser device 100 to absorb heat.

[0103] Since this laser device 100 adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be described in detail here.

[0104] Please see Figure 1 and Figure 2 In one embodiment, the cooling module 200 further includes a cooling fan 204, which is disposed toward the water cooling radiator 201.

[0105] In this embodiment, the water-cooling radiator 201 can be positioned on the air intake side of the cooling fan 204, with airflow passing through the radiator 201 before flowing into the cooling fan 204 and being blown out from there. Alternatively, the water-cooling radiator 201 can be positioned on the air outlet side of the cooling fan 204, with airflow flowing into the fan 204 before being blown towards the radiator 201. By utilizing the cooling fan 204, the airflow can remove heat from the water-cooling radiator 201, improving its heat dissipation efficiency. Optionally, the cooling fan 204 can be configured as an axial fan or a vortex fan.

[0106] Optionally, one, two, three or more cooling fans can be set; there is no limitation here.

[0107] Please see Figure 2 In one embodiment, the water-cooling radiator 201 is located on the exhaust side of the cooling fan 204. With this arrangement, the airflow first flows into the cooling fan 204 and is then blown by the cooling fan 204 towards the water-cooling radiator 201. This ensures that the airflow flowing towards both the cooling fan 204 and the water-cooling radiator 201 is relatively cool air, preventing the airflow that has heated up after flowing through the water-cooling radiator 201 from being blown towards the cooling fan 204, thereby preventing the cooling fan 204 from overheating and affecting its performance stability.

[0108] Please see Figure 2 In one embodiment, the cooling fan 204 is configured as an axial fan, and the cooling module 200 also includes an air guide shroud 205. The air guide shroud 205 covers the side of the cooling fan 204 that is away from the water cooling radiator 201. The air guide shroud 205 has an air guide cavity 2051 and a vent 2052 that communicates with the air guide cavity 2051.

[0109] In this embodiment, an air guide shroud 205 is provided on the side of the cooling fan 204 facing away from the water cooling radiator 201. The air guide shroud 205 can be used to guide the flow direction of the airflow. For example, the ventilation opening 2052 of the air guide shroud 205 can be oriented towards the side facing away from the laser device 100. In some embodiments, the laser processing equipment 1000 also includes a frame as a supporting base. The laser device 100 and the cooling module 200 are both mounted on the frame. In this case, the ventilation opening 2052 of the air guide shroud 205 can be oriented towards a direction that will not be blocked by the frame, thereby ensuring that the cooling fan 204 can drive more airflow and making the position design of the cooling module 200 more flexible.

[0110] Please see Figure 1 and Figure 2 In one embodiment, the cooling module 200 further includes a flow meter 206, which is disposed in the water cooling pipe 203 and is configured to detect the flow rate of coolant in the water cooling pipe 203.

[0111] In this embodiment, by setting a flow meter 206 to detect the coolant flow rate, it can be used to determine whether there is a problem of low flow rate, leakage, or no water flow. Under the condition of low flow rate, leakage, or no water flow, the flow meter 206 will send a signal to the control module 300 of the cooling module 200 to stop the laser light source module from emitting light, so as to avoid damage to the laser light source module due to failure to dissipate heat in time.

[0112] Please see Figure 1 and Figure 2 In one embodiment, the cooling module 200 further includes a thermometer 207, which is configured to detect the temperature of the coolant in the cooling module 200.

[0113] In this embodiment, a thermometer 207 is used to detect the temperature of the coolant in the cooling module 200. This allows for the determination of whether the coolant temperature is too high. If the coolant temperature is too high, problems such as abnormal heating of the laser device 100 or insufficient heat dissipation from the coolant by the cooling module 200 may occur, easily leading to overheating of the laser device 100 and affecting its performance. When the coolant temperature exceeds a preset value, the thermometer 207 sends a signal to the control module 300 of the cooling module 200 to stop the laser light source module from emitting light, preventing damage to the laser light source module due to insufficient heat dissipation.

[0114] Optionally, the thermometer 207 can be installed on the water-cooling pipe 203 to detect the temperature of the coolant in the water-cooling pipe 203, for example, at the inlet end, outlet end, or any position of the water-cooling pipe 203. In some embodiments, the cooling module 200 is provided with a water tank 208, and the thermometer 207 can also be installed on the water tank 208 to detect the temperature of the coolant in the water tank 208, or it can also be used to detect the temperature of the coolant in the water-cooling radiator 201, which is not limited here.

[0115] Please see Figure 1 and Figure 2 In one embodiment, the cooling module 200 further includes a water tank 208, and the water cooling pipeline 203 includes a first pipeline 2031, a second pipeline 2032, and a third pipeline 2033. The first pipeline 2031 connects the outlet of the water cooling radiator 201 and the inlet of the coolant passage 20. The second pipeline 2032 connects the outlet of the coolant passage 20 and the inlet of the water tank 208. The outlet of the water tank 208 is connected to the inlet of the water pump 202. The third pipeline 2033 connects the outlet of the water pump 202 and the inlet of the water cooling radiator 201.

[0116] In this embodiment, a water tank 208 is provided in the cooling module 200, so that more coolant can be stored in the cooling module 200 for circulation to dissipate heat from the laser device 100. In addition, in some embodiments, a thermometer 207 can be provided on the water tank 208 to detect the temperature of the coolant in the water tank 208. It is understood that the coolant flow rate in the water cooling pipe 203 is relatively high, while the coolant in the water tank 208 is relatively stable. Detecting the temperature of the coolant in the water tank 208 is more accurate than detecting the temperature of the coolant in the water cooling pipe 203.

[0117] Optionally, the outlet of the water tank 208 and the inlet of the water pump 202 can be directly connected by a male and female connector, or they can be interconnected by a water cooling pipe 203.

[0118] Please see Figure 1 and Figure 2 In one embodiment, the laser processing equipment 1000 further includes a control module 300, which is communicatively connected to the electrical components of the cooling module 200.

[0119] In this embodiment, the control module 300 is communicatively connected to the electrical components of the cooling module 200. The control module 300 can be used to receive detection signals from detection devices such as thermometer 207 and flow meter 206, and can also be used to control the operating status of devices such as water pump 202 and cooling fan 204. For example, it can control the input power of water pump 202 to control the coolant flow rate and flow, or control the speed of cooling fan 204 to control the airflow rate and air volume.

[0120] In one embodiment, the laser processing equipment 1000 further includes a frame and a moving component. The frame is provided with a processing platform located below the laser device 100. The moving component is located on the frame and connected to the laser device 100 for driving the laser device 100 to move.

[0121] In this embodiment, the laser processing equipment 1000 further includes a frame with a processing platform and a moving component for driving the laser device 100 to move. Optionally, the moving component may include a slide rail extending along a first direction, with the laser device 100 slidably connected to the slide rail. The moving component may also include a first slide rail and a second slide rail intersecting in their extending directions, with the second slide rail slidably disposed on the first slide rail and the laser device 100 slidably disposed on the second slide rail, so that the laser device 100 can slide along the second slide rail or slide along the first slide rail with the second slide rail. In some embodiments, the moving component may also include a lifting mechanism for controlling the lifting and lowering of the laser device 100.

[0122] The above description is merely an exemplary embodiment of the present utility model and does not limit the patent scope of the present utility model. Any equivalent structural transformations made based on the technical concept of the present utility model and the contents of the present utility model specification and drawings, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present utility model.

Claims

1. A laser device, characterized in that, The device includes a housing structure and a laser source module. The housing structure includes a mounting cavity housing, which surrounds a first mounting cavity. The laser source module is disposed in the first mounting cavity and contacts the inner surface of the mounting cavity housing. The mounting cavity housing is provided with a coolant passage, at least a portion of which is disposed on the outer surface of the mounting cavity housing. The coolant passage is used to dissipate heat from the laser source module. The housing structure is provided with a liquid inlet and a liquid outlet. The liquid inlet is connected to the liquid inlet end of the coolant passage, and the liquid outlet is connected to the liquid outlet end of the coolant passage. The liquid inlet and the liquid outlet are arranged adjacent to each other.

2. The laser device as described in claim 1, characterized in that, The mounting cavity housing includes two first sidewalls spaced apart, the spaced area between the two first sidewalls is the first mounting cavity, and the coolant passage includes two first flow paths, which are respectively disposed on the outer surfaces of the two first sidewalls and are interconnected. Wherein, the liquid inlet is connected to one of the first flow paths, and the liquid outlet is connected to the other of the first flow paths; or, both the liquid inlet and the liquid outlet are connected to one of the first flow paths.

3. The laser device as described in claim 2, characterized in that, The mounting cavity housing further includes a first connecting wall, which is located between the two first side walls and is connected to the two first side walls respectively; The coolant passage further includes a second flow path that connects the two first flow paths, and the second flow path is disposed within the first connecting wall; And / or, the first connecting wall is disposed in the first mounting cavity and divides the first mounting cavity into a first chamber and a second chamber.

4. The laser device as described in claim 2, characterized in that, The first flow path includes a main flow path and a groove formed on the inner wall of the main flow path, and both the main flow path and the groove extend along the extension direction of the first flow path; And / or, the first sidewall is provided with a mounting hole, and at least a portion of the structure of the laser light source module is mounted in the mounting hole.

5. The laser device as described in claim 2, characterized in that, The housing structure also includes a sealing element, and the outer surface of the first sidewall is provided with a sealing groove. The sealing groove is parallel to the first flow path and is arranged around the outer peripheral edge of the first flow path. The sealing element is snapped into the sealing groove to seal the first flow path.

6. The laser device as described in claim 5, characterized in that, The housing structure further includes a first housing, and the first sidewall is connected to the first housing to form a cooling chamber. The first flow path, the sealing element and the sealing groove are all located in the cooling chamber.

7. The laser device as described in claim 3, characterized in that, The housing structure further includes a second connecting wall, which is located below the first connecting wall; the coolant passage further includes a third flow path, which is located below the second connecting wall, with one end of the third flow path connected to the first flow path and the other end of the third flow path connected to the outlet or the inlet.

8. The laser device as described in claim 7, characterized in that, The housing structure further includes a second housing, and the second connecting wall and the second housing form a second mounting cavity, which is used to install electronic devices that are electrically connected to the laser source module.

9. The laser device as described in claim 2, characterized in that, The first flow path extends and bends along the outer surface of the first sidewall, and the first flow path includes: A first sub-flow path is provided, extending along the edge of the first sidewall; and The second sub-flow path is located in the middle region of the first sidewall and is connected to the first sub-flow path.

10. The laser device according to any one of claims 1 to 9, characterized in that, The housing structure is also provided with a laser channel, which is connected to the first mounting cavity. Optical devices are provided in the laser channel, which are used to direct the laser emitted by the laser source module to the outside of the housing structure. The mounting cavity housing has a light-transmitting opening, which connects the first mounting cavity and the laser channel; And / or, the laser channel's light outlet, the liquid inlet, and the liquid outlet face the same side of the housing structure.

11. A laser processing device, characterized in that, include: The laser device as described in any one of claims 1 to 10; and The cooling module includes a water-cooled radiator, a water pump, and water-cooled piping. The water-cooled piping is connected to the water-cooled radiator and the water pump in sequence, and is interconnected with the coolant passage of the laser device.

12. The laser processing equipment as described in claim 11, characterized in that, The cooling module also includes a cooling fan, which is positioned toward the water cooling radiator, and the water cooling radiator is positioned on the exhaust side of the cooling fan. The cooling fan is configured as an axial fan, and the cooling module also includes an air guide shroud. The air guide shroud is located on the side of the cooling fan facing away from the water cooling radiator. The air guide shroud has an air guide cavity and a vent communicating with the air guide cavity.

13. The laser processing equipment as described in claim 11 or 12, characterized in that, The cooling module also includes a flow meter, which is installed in the water cooling pipeline and is configured to detect the flow rate of coolant in the water cooling pipeline. And / or, the cooling module further includes a thermometer configured to detect the temperature of the coolant in the cooling module; And / or, the cooling module further includes a water tank, the water cooling pipeline includes a first pipeline, a second pipeline and a third pipeline, the first pipeline connects the outlet of the water cooling radiator and the inlet of the coolant passage, the second pipeline connects the outlet of the coolant passage and the inlet of the water tank, the outlet of the water tank connects to the inlet of the water pump, and the third pipeline connects the outlet of the water pump and the inlet of the water cooling radiator; And / or, the laser processing equipment further includes a control module, which is communicatively connected to the electrical components of the cooling module; And / or, the laser processing equipment further includes a frame and a moving component, the frame having a processing platform located below the laser device, the moving component being mounted on the frame and connected to the laser device for driving the laser device to move.

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