Single crystal silicon wafer grinding device

Abstract

The utility model relates to the field of semiconductor manufacturing equipment especially monocrystalline silicon wafer grinding processing device, including base, connecting block and air pipe etc., the polishing assembly is installed to the base rear end, the controller is installed to the base front end, the sucking disc is connected to the base top, the fixed frame is slidably connected to the left and right ends of the base top, the second electric slide rail is installed to the side of fixed frame towards sucking disc, the base is installed for driving the first electric slide rail of fixed frame forward and backward sliding, the connecting block is slidably connected in the second electric slide rail, the air cavity is rotatably connected between two connecting blocks, the connecting block is provided with the rotation subassembly for driving air cavity rotation, the air cavity is installed with a plurality of suction nozzles, the sucking disc middle part is provided with the flush component of supporting wafer. Through the coordinated action of air cavity bottom suction nozzle and auxiliary rod, avoid stress concentration, cooperate the adsorption force of suction nozzle, the local pressure when turning over wafer is converted into surface contact pressure, prevent the deformation or fracture caused by single point stress.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor manufacturing equipment, and in particular to a single-crystal silicon wafer grinding processing device. Background Technology

[0002] As a core material in semiconductor devices, solar cells, and other fields, the processing precision of monocrystalline silicon wafers directly affects the performance and reliability of end products. The production of monocrystalline silicon wafers involves multiple processes, including monocrystalline growth, slicing, grinding, and polishing. Among these, grinding is a crucial step in achieving surface flatness of ultra-thin wafers. With the increasing integration of integrated circuits, the thickness of silicon wafers has decreased to below 100μm, placing higher demands on the precision and stability of grinding equipment.

[0003] Among existing monocrystalline silicon wafer grinding equipment, an automatic flipping grinding machine for monocrystalline silicon wafers, with announcement number CN115476237B, is mentioned. This equipment uses a fixing component to stably clamp the wafer and combines it with an automatic flipping mechanism to achieve double-sided grinding, significantly improving processing efficiency. Its core structure uses a long strip clamping plate to hold the wafer at both ends, fixing the wafer position through mechanical force, and flipping it by rotation during the grinding process, reducing manual intervention.

[0004] However, because the clamping plates are long and narrow and only apply clamping force at both ends, the stress distribution on the wafer is uneven during high-speed rotation or flipping. For ultra-thin wafers with small thickness, this clamping method easily leads to local stress concentration, especially under grinding forces, causing the wafer edges to fracture due to insufficient bending strength. In addition, the fixed mode of clamping at both ends limits the equipment's adaptability to wafers of different sizes, further reducing processing reliability. Utility Model Content

[0005] To overcome the risk of breakage due to clamping and flipping, this invention provides a single-crystal silicon wafer grinding device, which aims to solve the above-mentioned shortcomings.

[0006] A single-crystal silicon wafer grinding processing device includes a base, connecting blocks, and air pipes. A grinding assembly is installed at the rear end of the base, a controller is installed at the front end of the base, a suction cup is connected to the top of the base, and fixed frames are slidably connected to the left and right ends of the top of the base. A second electric slide rail is installed on the side of the fixed frame facing the suction cup, and a first electric slide rail is installed on the base for driving the fixed frame to slide back and forth. The connecting blocks are slidably connected within the second electric slide rails, and an air chamber is rotatably connected between the two connecting blocks. The connecting blocks are provided with a rotating assembly for driving the air chamber to rotate, and several suction nozzles are installed in the air chamber. Several suction nozzles are provided on the top surface of the suction cup. An air pump is installed inside the base, and the air pump is connected to the end of the air chamber through the air pipe. A telescopic tube is provided in the middle of the air pipe, and a slip ring is provided at the connection between the air pipe and the air chamber. The slip ring is rotatably connected to the connecting blocks and fixedly connected to the air pipe. A wafer-supporting flushing assembly is provided in the middle of the suction cup.

[0007] Optionally, the rotating assembly includes a motor, the motor is mounted on the side of the connecting block, the output shaft of the motor is connected to a gear, and a gear ring is connected to the end of the air chamber, with the gear meshing with the gear ring.

[0008] Optionally, the flushing assembly includes a contact plate, the grinding assembly has a mounting bracket connected in the middle, the contact plate is slidably connected to the mounting bracket, and the bottom of the contact plate is slidably connected to the base. A return spring is sleeved on the contact plate, one end of the return spring is connected to the mounting bracket, and the other end is connected to the contact plate.

[0009] Optionally, a rubber pad is connected to the top surface of the contact plate.

[0010] Optionally, auxiliary rods are connected to both the front and rear sides of the air chamber.

[0011] Optionally, a protective cover is attached to the top of the base.

[0012] Optionally, bearings are provided at both ends of the air cavity, the bearings are located inside the connecting block, and the inner and outer rings of the bearings are respectively connected to the air cavity and the connecting block.

[0013] Compared with the prior art, the present invention has the following advantages:

[0014] 1. By working together with the suction nozzle at the bottom of the air chamber and the auxiliary rod, stress concentration is avoided. The suction force of the nozzle is used to convert the local pressure during wafer flipping into surface contact pressure, preventing deformation or breakage caused by single-point force.

[0015] 2. Through the contact plate and the reset spring, the dynamic balance between the elastic force and the grinding force is achieved during grinding, absorbing the impact force of the grinding head pressing down. At the same time, the spring compression is embedded in the air cavity to ensure the feasibility of the wafer flipping process. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the overall structure of this utility model.

[0017] Figure 2 This is a cross-sectional view of the mounting structure of the gear ring and air chamber of this utility model.

[0018] Figure 3 This is a schematic diagram of the installation structure of the air tube and telescopic tube of this utility model.

[0019] Figure 4 This is a schematic diagram of the installation structure of the contact plate and the return spring of this utility model.

[0020] The markings in the attached diagram are as follows: 1: Base, 101: Grinding assembly, 102: Controller, 103: Suction cup, 2: Fixing frame, 201: First electric slide rail, 3: Second electric slide rail, 4: Connecting block, 5: Air chamber, 501: Slip ring, 6: Suction nozzle, 7: Motor, 8: Gear, 9: Gear ring, 10: Air pump, 11: Air pipe, 12: Telescopic pipe, 13: Flush assembly, 1301: Mounting bracket, 1302: Contact plate, 1303: Return spring, 14: Rubber pad, 15: Auxiliary rod, 16: Protective cover, 17: Bearing. Detailed Implementation

[0021] The present invention will be further described below with reference to specific embodiments. The illustrative embodiments and descriptions of the present invention are used to explain the present invention, but are not intended to limit the present invention.

[0022] Example: Single-crystal silicon wafer grinding apparatus, such as Figures 1-4As shown, the assembly includes a base 1, a grinding component 101, a controller 102, a suction cup 103, a mounting bracket 2, a first electric slide rail 201, a second electric slide rail 3, a connecting block 4, an air chamber 5, a slip ring 501, a suction nozzle 6, a rotating component, an air pump 10, an air pipe 11, a telescopic pipe 12, and a flushing component 13. The grinding component 101 is mounted at the rear end of the base 1, the controller 102 is mounted at the front end of the base 1, and the suction cup 103 is connected to the top of the base 1. The mounting bracket 2 is slidably connected to the left and right ends of the top of the base 1. The second electric slide rail 3 is mounted on the side of the mounting bracket 2 facing the suction cup 103. The base 1 is equipped with a first electric slide rail 201 for driving the mounting bracket 2 to slide back and forth. The stroke of the first electric slide rail 201 is designed to be 1.2 times the radius of the suction cup 103, ensuring that the mounting bracket 2 will not interfere with the grinding head when it moves to the front end, effectively guaranteeing the operating space. The connecting block 4 slides... The suction cup 103 is rotatably connected to the second electric slide rail 3. An air chamber 5 is rotatably connected between the two connecting blocks 4. The connecting blocks 4 are equipped with a rotating component for driving the air chamber 5 to rotate. The air chamber 5 is equipped with several suction nozzles 6. Several suction nozzles 6 are also provided on the top surface of the suction cup 103. The second electric slide rail 3 achieves precise lifting and lowering of the connecting blocks 4 through a double guide rail design. The suction nozzles 6 are arranged in a ring array on the surface of the air chamber 5, which effectively improves the reliability of wafer fixation. An air pump 10 is installed in the base 1. The air pump 10 is connected to the end of the air chamber 5 through an air pipe 11. A telescopic tube 12 is provided in the middle of the air pipe 11. The two ends of the telescopic tube 12 are sealed to the air pipe 11 to adapt to the position change of the air chamber 5. A slip ring 501 is provided at the connection between the air pipe 11 and the air chamber 5. The slip ring 501 is rotatably connected to the connecting blocks 4 and fixedly connected to the air pipe 11. A flush component 13 for supporting the wafer is provided in the middle of the suction cup 103.

[0023] like Figure 1 and Figure 2 As shown, the rotating assembly includes a motor 7, a gear 8, and a gear ring 9. The motor 7 is mounted on the side of the connecting block 4. The output shaft of the motor 7 is connected to the gear 8. The end of the air chamber 5 is connected to the gear ring 9. The gear 8 meshes with the gear ring 9. The motor 7 adopts a stepper design. With the reduction ratio design of the gear 8 and the gear ring 9, the rotation angle of the air chamber 5 can be precisely controlled.

[0024] like Figure 3 and Figure 4 As shown, the flushing assembly 13 includes a mounting bracket 1301, a contact plate 1302, and a return spring 1303. The mounting bracket 1301 is connected to the middle of the grinding assembly 101. The contact plate 1302 is slidably connected to the mounting bracket 1301, and the bottom of the contact plate 1302 is slidably connected to the base 1. The return spring 1303 is sleeved on the contact plate 1302. One end of the return spring 1303 is connected to the mounting bracket 1301, and the other end is connected to the contact plate 1302. The contact plate 1302 is made of a high wear-resistant material.

[0025] like Figure 4As shown, it also includes a rubber pad 14. The top surface of the contact plate 1302 is connected to the rubber pad 14, which is made of silicone to ensure sufficient elastic deformation capacity.

[0026] like Figure 2 and Figure 3 As shown, it also includes auxiliary rods 15. Auxiliary rods 15 are connected to both the front and rear sides of the air cavity 5. The auxiliary rods 15 are made of lightweight aluminum alloy and form a ring support area during the flipping process, so that the force on the wafer is evenly distributed.

[0027] like Figure 1 As shown, it also includes a protective cover 16. The protective cover 16 is connected to the top of the base 1. The protective cover 16 is made of transparent PC material, which can ensure a clear operating view and prevent cutting fluid from splashing.

[0028] like Figure 2 As shown, it also includes bearings 17. Bearings 17 are provided at both ends of the air chamber 5. The bearings 17 are located inside the connecting block 4. The inner and outer rings of the bearings 17 are connected to the air chamber 5 and the connecting block 4, respectively.

[0029] In the initial state, the first electric slide rail 201 drives the fixing frame 2 to move to the rear limit position of the base 1. At this time, the fixing frame 2 is aligned with the rear edge of the suction cup 103, leaving sufficient operating space for subsequent polishing. The operator places the single crystal silicon wafer to be processed flat on the designated position on the top surface of the suction cup 103, starts the air pump 10 through the control panel, and the air pipe 11 generates negative pressure on the suction nozzle 6 on the top surface of the suction cup 103. The suction nozzle 6 of the suction cup 103 fixes the wafer and ensures the stability of the wafer during polishing.

[0030] During the first grinding, the grinding assembly 101 drives the grinding head to move vertically downward. The contact plate 1302 keeps its top surface flush with the top surface of the suction cup 103 under the action of the return spring 1303. When the grinding head contacts the wafer surface, the rubber pad 14 absorbs the impact force of the grinding head pressing down through elastic deformation. At the same time, the contact plate 1302 slides downward after being pressed. The compression of the return spring 1303 and the grinding pressure form a dynamic balance, which ensures that the wafer is reliably supported and avoids wafer breakage due to rigid contact.

[0031] After the flipping process is started, the polishing component 101 is first raised to a safe height. Then, the first electric slide rail 201 drives the fixing frame 2 to move forward to directly above the suction cup 103. The second electric slide rail 3 simultaneously drives the connecting block 4 to move downward, causing the air chamber 5 to gradually approach the wafer. When the suction nozzle 6 at the bottom of the air chamber 5 contacts the wafer surface, the suction nozzle 6 of the suction cup 103 stops the negative pressure and releases gas. The suction nozzle 6 of the air chamber 5 immediately increases the suction force. At this time, the auxiliary rod 15 moves down with the air chamber 5 and first contacts the top surface of the suction cup 103, extending the support area and preventing the wafer from deforming due to excessive local suction force. After the connecting block 4 continues to move up to the top of the second electric slide rail 3, the motor 7 drives the gear ring 9 to rotate through the gear 8. The bearing 17 ensures the concentricity of the air chamber 5 when it rotates. The air chamber 5 drives the wafer to complete a 180° flip. During the flipping process, the auxiliary rod 15 expands the support range, so that the wafer is evenly stressed.

[0032] Before the second grinding, the second electric slide rail 3 drives the connecting block 4 to move downwards, and the bottom of the air cavity 5 gradually squeezes the contact plate 1302. The rubber pad 14 undergoes elastic deformation, and the contact plate 1302 slides to compress the reset spring 1303 until the air cavity 5 is completely embedded in the suction cup 103. At this time, the bottom surface of the wafer is completely in contact with the top surface of the suction cup 103. The contact plate 1302 provides uniform support force through the elastic force of the reset spring 1303. The grinding head presses down again to process. Throughout the process, the telescopic tube 12 automatically extends and retracts with the position change of the air cavity 5 to keep the air pressure in the air tube 11 stable.

[0033] After polishing, the second electric slide rail 3 drives the connecting block 4 to move upward. The air chamber 5 lifts the wafer to a position 5-8mm above the top surface of the suction cup 103 via the auxiliary rod 15. At the same time, the air pump 10 stops working and releases positive pressure gas, releasing the suction nozzle 6 from the wafer. The operator can easily remove the wafer from the support area of ​​the auxiliary rod 15. Finally, the second electric slide rail 3 drives the connecting block 4 to return to the initial height, and the first electric slide rail 201 drives the fixing frame 2 back to the rear end of the base 1. All components return to standby state.

[0034] It should be understood that the above description is for illustrative purposes only and is not intended to limit the present invention. Those skilled in the art will understand that variations of the present invention will be included within the scope of the claims herein.

Claims

1. A grinding and processing apparatus for single-crystal silicon wafers, characterized in that: The system includes a base (1), a connecting block (4), and an air pipe (11). A grinding assembly (101) is installed at the rear end of the base (1), a controller (102) is installed at the front end of the base (1), a suction cup (103) is connected to the top of the base (1), and a fixing frame (2) is slidably connected to the left and right ends of the top of the base (1). A second electric slide rail (3) is installed on the side of the fixing frame (2) facing the suction cup (103). A first electric slide rail (201) for driving the fixing frame (2) to slide back and forth is installed on the base (1). The connecting block (4) is slidably connected in the second electric slide rail (3). An air chamber (5) is rotatably connected between the two connecting blocks (4). A rotating assembly for driving the air chamber (5) to rotate is provided. The air chamber (5) is equipped with a plurality of suction nozzles (6). A plurality of suction nozzles (6) are provided on the top surface of the suction cup (103). An air pump (10) is installed in the base (1). The air pump (10) is connected to the end of the air chamber (5) through the air pipe (11). A telescopic tube (12) is provided in the middle of the air pipe (11). A slip ring (501) is provided at the connection between the air pipe (11) and the air chamber (5). The slip ring (501) is rotatably connected to the connecting block (4). The slip ring (501) is fixedly connected to the air pipe (11). A flush assembly (13) for supporting the wafer is provided in the middle of the suction cup (103).

2. The single-crystal silicon wafer grinding apparatus according to claim 1, characterized in that: The rotating assembly includes a motor (7), the motor (7) is mounted on the side of the connecting block (4), the output shaft of the motor (7) is connected to a gear (8), the end of the air chamber (5) is connected to a gear ring (9), and the gear (8) meshes with the gear ring (9).

3. The single-crystal silicon wafer grinding apparatus according to claim 2, characterized in that: The flushing assembly (13) includes a contact plate (1302). The grinding assembly (101) is connected to a mounting bracket (1301) in the middle. The contact plate (1302) is slidably connected to the mounting bracket (1301), and the bottom of the contact plate (1302) is slidably connected to the base (1). A return spring (1303) is sleeved on the contact plate (1302). One end of the return spring (1303) is connected to the mounting bracket (1301), and the other end is connected to the contact plate (1302).

4. The single-crystal silicon wafer grinding apparatus according to claim 3, characterized in that: A rubber pad (14) is connected to the top surface of the contact plate (1302).

5. The single-crystal silicon wafer grinding apparatus according to claim 4, characterized in that: The air chamber (5) is connected to auxiliary rods (15) on both the front and rear sides.

6. The single-crystal silicon wafer grinding apparatus according to claim 5, characterized in that: The base (1) is connected to a protective cover (16) on top.

7. The single-crystal silicon wafer grinding apparatus according to claim 6, characterized in that: Bearings (17) are provided at both ends of the air cavity (5). The bearings (17) are located inside the connecting block (4). The inner and outer rings of the bearings (17) are connected to the air cavity (5) and the connecting block (4) respectively.

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