A gas cleaning device for a wafer polishing machine

Abstract

The utility model discloses a kind of wafer polishing machine gas cleaning devices, it is related to the field of semiconductor technology.It includes: work platform;Protective cover, protective cover is fixed above work platform, protective cover and work platform are enclosed to form enclosed work area, the side wall of protective cover is provided with the opening for putting into wafer, opening is provided with sliding door, and sliding door is connected with the side wall of protective cover;Exhaust part, exhaust part is set on protective cover, one end of exhaust part is communicated with work area, and the other end of exhaust part is communicated with the gas collection device of outside;Filter part, filter part is set on protective cover, one end of filter part is communicated with work area, and the other end of filter part is used to absorb outside air.The wafer polishing machine gas cleaning device provided in the utility model ensures the cleanliness of polishing machine internal gas.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor technology, and more specifically to a gas cleaning device for a wafer polishing machine. Background Technology

[0002] In the semiconductor wafer processing, wafer polishing is a very important step.

[0003] Wafer polishing involves placing the wafer between two highly flat polishing pads, applying pressure, and using a specific polishing fluid to thin the wafer surface, removing mechanical damage and chemical corrosion defects, maintaining high flatness, and ensuring a defect-free wafer surface.

[0004] The quality of wafer polishing directly affects the final wafer quality and processing yield, making it a crucial aspect that any semiconductor wafer manufacturing and processing company highly values.

[0005] During wafer polishing, the cleanliness of the polishing machine's interior directly affects the polishing quality. If dust and impurities enter the polishing machine's internal environment, they will adhere to the surface of the polishing pad, causing mechanical damage to the wafer surface during polishing. Therefore, maintaining the cleanliness of the polishing machine's interior is essential.

[0006] Polishing fluid is essential in wafer polishing. Most polishing fluids contain chlorine, which releases corrosive chlorine gas during use. To prevent this gas from entering the workshop, polishing machines are typically equipped with exhaust fans to remove it. This creates a negative pressure inside the polishing machine, necessitating the introduction of external gas. However, ensuring the cleanliness of the external gas entering the polishing machine is challenging. Utility Model Content

[0007] In view of this, the present invention provides a gas cleaning device for a wafer polishing machine to ensure the cleanliness of the gas inside the polishing machine. To achieve the above objective, the present invention adopts the following technical solution: This utility model provides a gas cleaning device for a wafer polishing machine, comprising: Work platform; A protective cover is fixed above the work platform, and the protective cover and the work platform enclose a closed work area. An opening for placing a wafer is provided on the side wall of the protective cover, and a sliding door is provided at the opening, which is connected to the side wall of the protective cover. An exhaust fan is provided on the protective cover. One end of the exhaust fan is connected to the working area, and the other end of the exhaust fan is connected to an external gas collection device. A filter section is disposed on the protective cover. One end of the filter section is connected to the working area, and the other end of the filter section is used to absorb outside air.

[0008] Furthermore, the protective cover includes a surrounding panel and a top panel, the top panel being spaced apart from the work platform, the surrounding panel being connected between the top panel and the work platform, the surrounding panel, the top panel, and the work platform enclosing a sealed working area, the exhaust fan being connected to the top panel, and the opening being located on the side wall of the surrounding panel.

[0009] Furthermore, the enclosure includes an inner enclosure and an outer enclosure. The two ends of the outer enclosure are connected to the top plate and the work platform respectively to form a working area. The inner enclosure is disposed inside the working area and is connected to the top plate. A channel for gas inflow is provided between the inner enclosure and the work platform. Both the outer enclosure and the inner enclosure are provided with openings, and an outer sliding door and an inner sliding door are respectively provided at the openings. The exhaust fan is disposed above the inner enclosure, and the filter is disposed between the inner enclosure and the outer enclosure. The exhaust fan discharges the gas inside the inner enclosure and the filter blows clean air into the space between the inner enclosure and the outer enclosure through the filter.

[0010] Furthermore, the inner sliding door is slidably connected to the inner panel, and the outer sliding door is slidably connected to the outer panel.

[0011] Furthermore, the filter section is connected to the top plate.

[0012] Furthermore, position sensors are provided on the inner sliding door and the outer sliding door, and the position sensors are electrically connected to the filter section.

[0013] Furthermore, the width of the channel for gas inflow between the inner lining and the working platform is 5-10 cm.

[0014] As can be seen from the above technical solution, compared with the prior art, this utility model discloses a gas cleaning device for a wafer polishing machine. By cooperating with the protective cover and the working platform, the polishing work is carried out in a sealed environment, preventing unclean external gases from entering the working area. Clean air is delivered into the enclosed working space through the filter section, and the gas in the working area is discharged to the outside of the polishing machine through the exhaust section, so that the polishing work is carried out in a clean environment, ensuring the quality of the polishing work and the safety of the operators. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort.

[0016] Figure 1 A schematic diagram of the gas cleaning device for a wafer polishing machine provided by this utility model.

[0017] In the diagram: 1. Exhaust section; 2. Filter section; 3. Air inlet channel; 4. Inner sliding door; 5. Outer sliding door; 6. Work platform; 7. Polishing area. Detailed Implementation

[0018] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0019] See Figure 1 This utility model discloses a gas cleaning device for a wafer polishing machine, comprising: Work platform 6; A protective cover is fixed above the work platform 6. The protective cover and the work platform 6 enclose a closed work area. An opening for placing a wafer is provided on the side wall of the protective cover. A sliding door is provided at the opening and is connected to the side wall of the protective cover. Exhaust unit 1 is installed on the protective cover. One end of exhaust unit 1 is connected to the working area, and the other end of exhaust unit 1 is connected to the external gas collection device. The filter section 2 is mounted on the protective cover. One end of the filter section 2 is connected to the working area, and the other end of the filter section 2 is used to absorb outside air.

[0020] The protective cover and the work platform 6 work together to make the polishing work in a closed environment. Open the sliding door to open the opening and put the wafer to be polished into the work area through the opening. Close the sliding door to keep the wafer to be polished in a closed environment. The exhaust unit 1 exhausts the chlorine-containing gas in the work area from the polishing machine to ensure the health of the workers. The filter unit 2 introduces filtered clean gas into the work area to ensure that the gas entering the work area is clean and to ensure the polishing quality.

[0021] In some embodiments, the protective cover includes a surrounding panel and a top panel. The top panel is spaced apart from the work platform 6, and the surrounding panel is connected between the top panel and the work platform 6. The surrounding panel, the top panel, and the work platform 6 enclose a sealed working area. The exhaust fan 1 is connected to the top panel, and the opening is provided on the side wall of the surrounding panel.

[0022] The wafer to be polished is placed into the working area through the opening, and the chlorine-containing gas in the working area is discharged from the working area through the exhaust fan 1.

[0023] In some embodiments, the enclosure includes an inner enclosure and an outer enclosure. The two ends of the outer enclosure are connected to the top plate and the work platform 6 respectively to form a working area. The inner enclosure is disposed inside the working area and is connected to the top plate. A channel for gas to flow in is provided between the inner enclosure and the work platform 6. Both the outer enclosure and the inner enclosure are provided with openings, and an outer sliding door 5 and an inner sliding door 4 are respectively provided at the openings. An exhaust unit 1 is disposed above the inner enclosure, and a filter unit 2 is disposed between the inner enclosure and the outer enclosure. The exhaust unit 1 discharges the gas inside the inner enclosure, and the filter unit 2 blows clean air into the space between the inner enclosure and the outer enclosure.

[0024] Before wafer polishing, the inner sliding door 4 and the outer sliding door 5 are opened, and the wafer to be polished is placed into the working area through the openings of the outer and inner partition plates. After the wafer polishing begins, the filtered clean air is discharged into the air inlet channel 3 between the inner and outer partition plates through the filter section 2. The chlorine-containing gas in the working area is discharged to the outside of the polishing machine through the exhaust section 1. At this time, the clean gas in the air inlet channel 3 enters the working area under the action of negative pressure, ensuring that the air flowing into the working area under the action of negative pressure is clean air, avoiding unclean gas from outside the polishing machine from entering the working area, ensuring the cleanliness of the working area, and thus ensuring the polishing quality of the wafer.

[0025] In some embodiments, the inner sliding door 4 is slidably connected to the inner surrounding panel, and the outer sliding door 5 is slidably connected to the outer surrounding panel.

[0026] During the insertion and removal of wafers, the inner sliding door 4 and the outer sliding door 5 are slid to open the openings on the inner and outer partitions. Workers can insert or remove wafers through these openings. After placing the wafers in the work area, the outer sliding door 5 and the inner sliding door 4 are closed, ensuring that the work area is enclosed. At the same time, clean gas in the air inlet channel 3 enters the polishing area 7 inside the inner partition through the lower end of the inner partition. Under the action of the exhaust fan, the clean gas passes through the polishing area 7, ensuring the cleanliness of the polishing area 7 and thus guaranteeing the quality of polishing.

[0027] In some embodiments, the filter section 2 is connected to the top plate.

[0028] In some embodiments, position sensors are provided on the inner sliding door 4 and the outer sliding door 5, and the position sensors are electrically connected to the filter section 2.

[0029] After the wafer is placed in the polishing area 7 inside the inner layer plate, the inner sliding door 4 and the outer sliding door 5 are closed. After the position sensor detects that the inner sliding door 4 and the outer sliding door 5 have reached the predetermined position, it sends an electrical signal to the filter unit 2. After receiving the electrical signal, the filter unit 2 starts to perform filtration, delivering clean gas between the inner and outer layers plate. Under the action of negative pressure, the clean gas enters the polishing area 7 inside the inner layer plate, ensuring the cleanliness of the polishing work area.

[0030] In some embodiments, the width of the channel for gas inflow between the inner shroud and the working platform 6 is 5-10 cm.

[0031] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on its differences from other embodiments. Similar or identical parts between embodiments can be referred to interchangeably. For the apparatus disclosed in the embodiments, since they correspond to the methods disclosed in the embodiments, the description is relatively simple; relevant parts can be referred to in the method section.

[0032] The above description of the disclosed embodiments enables those skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A gas cleaning device for a wafer polishing machine, characterized in that, include: Work platform; A protective cover is fixed above the work platform, and the protective cover and the work platform enclose a closed work area. An opening for placing a wafer is provided on the side wall of the protective cover, and a sliding door is provided at the opening, which is connected to the side wall of the protective cover. An exhaust fan is provided on the protective cover. One end of the exhaust fan is connected to the working area, and the other end of the exhaust fan is connected to an external gas collection device. A filter section is disposed on the protective cover. One end of the filter section is connected to the working area, and the other end of the filter section is used to absorb outside air.

2. The gas cleaning device for a wafer polishing machine according to claim 1, characterized in that, The protective cover includes a surrounding panel and a top panel. The top panel is spaced apart from the work platform. The surrounding panel is connected between the top panel and the work platform. The surrounding panel, the top panel, and the work platform enclose a sealed working area. The exhaust fan is connected to the top panel. The opening is located on the side wall of the surrounding panel.

3. The gas cleaning device for a wafer polishing machine according to claim 2, characterized in that, The enclosure includes an inner enclosure and an outer enclosure. The two ends of the outer enclosure are connected to the top plate and the work platform, respectively, to form a working area. The inner enclosure is located inside the working area and is connected to the top plate. A channel for gas to flow in is provided between the inner enclosure and the work platform. Both the outer enclosure and the inner enclosure have openings, and an outer sliding door and an inner sliding door are respectively provided at the openings. An exhaust fan is located above the inner enclosure, and a filter is located between the inner enclosure and the outer enclosure. The exhaust fan discharges the gas inside the inner enclosure, and the filter blows clean air into the space between the inner enclosure and the outer enclosure.

4. The gas cleaning device for a wafer polishing machine according to claim 3, characterized in that, The inner sliding door is slidably connected to the inner panel, and the outer sliding door is slidably connected to the outer panel.

5. The gas cleaning device for a wafer polishing machine according to claim 3, characterized in that, The filter section is connected to the top plate.

6. The gas cleaning device for a wafer polishing machine according to claim 5, characterized in that, Position sensors are installed on the inner and outer sliding doors, and the position sensors are electrically connected to the filter section.

7. The gas cleaning device for a wafer polishing machine according to claim 3, characterized in that, The width of the channel for gas flow between the inner lining and the working platform is 5-10cm.

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