Control device and humanoid robot

Abstract

The application relates to the field of robots, and provides a control device and a humanoid robot. The control device comprises a heat dissipation assembly, a first computing power board and a second computing power board. The heat dissipation assembly comprises a fan, and first and second heat dissipation members that are mutually covered. The first and second heat dissipation members form a heat dissipation space that penetrates in a first direction. The fan is arranged on the side of the heat dissipation space along the first direction. The first computing power board is arranged on the side of the first heat dissipation member away from the second heat dissipation member and is in insulating and heat-conducting connection with the first heat dissipation member. The second computing power board is arranged on the side of the second heat dissipation member away from the first heat dissipation member and is in insulating and heat-conducting connection with the second heat dissipation member. Therefore, the first and second computing power boards can share the heat dissipation assembly, the heat dissipation space and the fan for heat dissipation without needing to be respectively provided with heat sinks, so that the control device can be simplified in structure, the redundant components can be reduced, and the control device can be highly integrated, compact and simple, which is beneficial to the spatial layout, integration and miniaturization of the humanoid robot.

Description

Technical Field

[0001] This application belongs to the field of robotics technology, and in particular relates to a control device and a humanoid robot. Background Technology

[0002] In some cases, humanoid robots include multiple computing boards for functions such as visual control and motion control. To meet the demand for massive computing power, these computing boards need to perform a large number of high-speed calculations and rapid tasks such as instruction transmission and reception, which require high heat dissipation. This necessitates that each computing board be equipped with a heat sink, which is detrimental to the spatial layout, integration, and miniaturization of humanoid robots. Utility Model Content

[0003] This application provides a control device designed to address the problem that each computing board needs to be equipped with a heat sink for heat dissipation, which is detrimental to the spatial layout, integration, and miniaturization of humanoid robots.

[0004] To achieve the above objectives, the technical solution adopted in the embodiments of this application is as follows:

[0005] In a first aspect, a control device is provided, comprising:

[0006] A heat dissipation assembly includes a fan, and a first heat dissipation component and a second heat dissipation component that overlap each other, wherein the first heat dissipation component and the second heat dissipation component enclose a heat dissipation space that extends along a first direction, and the fan is disposed on the side of the heat dissipation space along the first direction.

[0007] The first computing board is located on the side of the first heat sink that faces away from the second heat sink, and is insulated and thermally connected to the first heat sink.

[0008] The second computing board is located on the side of the second heat sink that faces away from the first heat sink, and is insulated and thermally connected to the second heat sink.

[0009] In some embodiments, the heat dissipation assembly includes a fin structure connected between the first heat dissipation element and the second heat dissipation element and extending along the first direction, and the heat dissipation space is divided into at least two air ducts by the fin structure.

[0010] In some embodiments, the fin structure includes a plurality of first fins connected to the first heat sink and spaced apart along a second direction, and a plurality of second fins connected to the second heat sink and spaced apart along the second direction, wherein the second direction is perpendicular to the first direction.

[0011] Each of the first fins corresponds to one of the second fins, with the corresponding first fins and second fins extending toward each other and abutting against each other.

[0012] In some embodiments, the fan is provided in multiple ways, some of the fans are first fans and other fans are second fans, the first fans are provided on one side of the heat dissipation space along the first direction, and the second fans are provided on the other side of the heat dissipation space along the first direction;

[0013] The first fan and the second fan are alternately arranged along a second direction, which is perpendicular to the first direction.

[0014] In some embodiments, the control device includes an insulating isolation plate disposed between the first computing board and the first heat sink, the insulating isolation plate having a through hole;

[0015] The first heat sink includes a heat-conducting platform protruding toward the first computing board, the heat-conducting platform passing through the first hole and being insulated and thermally connected to the first computing board.

[0016] In some embodiments, an insulating thermally conductive adhesive layer is provided between the heat-conducting platform and the first computing board;

[0017] And / or, the first computing board has a first component that abuts against the heat-conducting platform, and the outer shell of the first component is an insulating shell.

[0018] In some embodiments, the control device includes a first housing, which covers the side of the first heat sink facing away from the second heat sink, and the first housing and the first heat sink together form a first space, wherein the first computing board and the insulating isolation plate are located within the first space;

[0019] The insulating isolation plate has a first connecting post protruding on the side facing the first computing board. The control device includes a first fastener corresponding to the first connecting post and a second fastener corresponding to the first fastener.

[0020] The nail portion of the first fastener passes through and connects the first computing board and the first connecting post, and the second fastener passes through and connects the first housing and the head of the first fastener.

[0021] In some embodiments, the second computing board has a second component that abuts against the second heat sink, and the control device includes an insulating heat-conducting sheet disposed between the second component and the second heat sink.

[0022] In some embodiments, the control device further includes an insulating fastener that passes through and connects the second heat sink, the insulating heat-conducting sheet, and the second component.

[0023] In some embodiments, the control device includes a second housing, which covers the side of the second heat sink facing away from the first heat sink, and the second housing and the second heat sink together form a second space, in which the second computing board and the insulating heat-conducting sheet are located;

[0024] The second heat sink further includes a second connecting post protruding toward the second computing board, and the control device includes a third fastener corresponding to the second connecting post, a fourth fastener corresponding to the third fastener, and a fifth fastener corresponding to the fourth fastener.

[0025] The nail portion of the third fastener is connected to the second connecting post, the head of the third fastener abuts against the second computing board, the nail portion of the fourth fastener passes through and connects the second computing board and the head of the third fastener, the head of the fourth fastener abuts against the second housing, and the fifth fastener passes through and connects the second housing and the head of the fourth fastener.

[0026] Secondly, a humanoid robot is provided, including the control device provided in the embodiments of this application.

[0027] The beneficial effects of the control device provided in this application are as follows:

[0028] The control device provided in this application embodiment can integrate multiple core functions into a single controller module through a first computing board and a second computing board. Based on this, the redundant structure of traditional split modules can be reduced, the overall volume can be reduced, and the space utilization rate can be improved. Based on this, the first heat sink can be insulated and thermally connected to the first computing board on the side facing away from the second heat sink, allowing the heat from the first computing board to be conducted to the first heat sink; similarly, the second heat sink can be insulated and thermally connected to the second computing board on the side facing away from the first heat sink, allowing the heat from the second computing board to be conducted to the second heat sink; the first and second heat sinks can be combined to form a heat dissipation space that runs through the first direction x, and a fan generates airflow along the heat dissipation space at one end, so that the airflow can carry away the heat from both the first and second heat sinks, and reliably carry away the heat from both the first and second computing boards; based on this, the first and second computing boards can share the heat dissipation components, their heat dissipation space, and the fan for effective heat dissipation to meet their own heat dissipation needs, and the first and second computing boards do not need to be equipped with their own heat sinks, thereby reducing the redundant configuration and space occupation of heat dissipation devices, compressing and simplifying the structure, and allowing for a compact layout. Therefore, this control device can integrate, simplify, and optimize its structure, reduce redundant components, achieve a compact layout, and be highly integrated, compact, and concise, thus compressing its overall volume and improving space utilization. This is beneficial for the spatial layout, integration, and miniaturization of humanoid robots. Furthermore, due to the high integration of the control device, which incorporates the main computing power control of the humanoid robot, future upgrades and maintenance are relatively convenient. Attached Figure Description

[0029] To clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments of this application or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0030] Figure 1 A perspective view of a control device provided in some embodiments of this application;

[0031] Figure 2 for Figure 1 An exploded view of the provided control device;

[0032] Figure 3 for Figure 2 An exploded view of the provided heat dissipation components;

[0033] Figure 4 for Figure 2 A front view showing the mating of the first and second heat sink components;

[0034] Figure 5 A perspective view of an assembly of a first heat sink to a first housing provided in some embodiments of this application;

[0035] Figure 6 for Figure 5 The provided top view of the assembly;

[0036] Figure 7 for Figure 6 The provided sectional view along AA;

[0037] Figure 8 for Figure 6 Provided sectional view along BB;

[0038] Figure 9 A perspective view of an assembly of a second heat sink to a second housing provided in some embodiments of this application;

[0039] Figure 10 for Figure 9 The provided top view of the assembly;

[0040] Figure 11 for Figure 9 An exploded view of the provided assembly;

[0041] Figure 12 for Figure 9 The provided bottom view of the assembly;

[0042] Figure 13 for Figure 12 The provided sectional view along CC.

[0043] The following are the labeling elements in the figure:

[0044] 10-Heat dissipation assembly, 11-Fan, 11a-First fan, 11b-Second fan, 12-First heat sink, 121-First heat sink plate, 122-First side plate, 123-Second side plate, 124-Heat conduction platform, 13-Second heat sink, 131-Second heat sink plate, 132-Third side plate, 133-Fourth side plate, 134-Second connecting post, 14-Heat dissipation space, 141-Air duct, 15-Fin structure, 151-First fin, 152-Second fin, 20-First computing board, 21-First component, 22-First board body, 23 - Second plate, 30- Second computing board, 31- Second component, 40- Insulating isolation plate, 41- First hole, 42- First connecting post, 50- Insulating thermally conductive adhesive layer, 60- First shell, 61- First space, 70- First fastener, 80- Second fastener, 90- Insulating thermally conductive sheet, 100- Insulating fastener, 110- Second shell, 1101- Second space, 1102- First wall, 1103- Main body, 120- Third fastener, 130- Fourth fastener, 140- Fifth fastener, x- First direction, y- Second direction. Detailed Implementation

[0045] To make the technical problems, technical solutions, and beneficial effects to be solved by this application clear, the application will be described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of this application and are not intended to limit this application. Unless otherwise specified, all embodiments and optional embodiments of this application can be combined to form new technical solutions. Unless otherwise specified, all technical features and optional technical features of this application can be combined to form new technical solutions.

[0046] In the description of this application, it should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0047] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0048] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0049] In some cases, humanoid robots include multiple computing boards for functions such as visual control and motion control. To meet the demand for massive computing power, these computing boards need to perform a large number of high-speed calculations and rapid tasks such as instruction transmission and reception, which require high heat dissipation. This necessitates that each computing board be equipped with a heat sink, which is detrimental to the spatial layout, integration, and miniaturization of humanoid robots.

[0050] The embodiments provided in this application will solve the above problems.

[0051] To illustrate the technical solutions provided in this application, the following detailed description is provided in conjunction with specific drawings and embodiments.

[0052] Please see Figure 1 , Figure 2 , Figure 3 , Figure 4 Some embodiments of this application provide a control device, including a heat dissipation assembly 10, a first computing board 20, and a second computing board 30. The heat dissipation assembly 10 includes a fan 11, and a first heat sink 12 and a second heat sink 13 that overlap each other. The first heat sink 12 and the second heat sink 13 enclose a heat dissipation space 14 that extends along a first direction x. The fan 11 is disposed on the side of the heat dissipation space 14 along the first direction x. The first computing board 20 is disposed on the side of the first heat sink 12 facing away from the second heat sink 13 and is insulated and thermally connected to the first heat sink 12. The second computing board 30 is disposed on the side of the second heat sink 13 facing away from the first heat sink 12 and is insulated and thermally connected to the second heat sink 13.

[0053] It should be noted that the first computing board 20 and the second computing board 30 are computing boards that integrate circuits and numerous electronic components and perform different functions. For example, one can be a motion control computing board that performs the core function of motion control, mainly responsible for calculating the motion posture of various parts of the humanoid robot (such as head, arms, legs, etc.) and sending and receiving commands; another can be a vision control computing board that performs the core function of vision control, mainly responsible for linking and visually computing the vision-related devices of the humanoid robot (such as cameras, IMU (Inertial Measurement Unit), voice / sound modules, and other perception modules); yet another can be a computing board responsible for interactive functions; and so on.

[0054] The heat dissipation component 10 is located between the first computing board 20 and the second computing board 30, so that the first computing board 20 and the second computing board 30 share the heat dissipation component 10 for heat dissipation. That is, the first computing board 20 and the second computing board 30 share the heat dissipation component 10 to meet their own heat dissipation needs, without each needing to equip itself with a heat sink for heat dissipation.

[0055] The heat dissipation assembly 10 includes a first heat sink 12 and a second heat sink 13, with the first computing board 20, the first heat sink 12, the second heat sink 13, and the second computing board 30 arranged sequentially. The side of the first heat sink 12 facing away from the second heat sink 13 is insulated and thermally connected to the first computing board 20. This thermal connection facilitates quick and reliable heat exchange between the first heat sink 12 and the first computing board 20, allowing heat from the first computing board 20 to be transferred to the first heat sink 12 for efficient heat dissipation. Furthermore, the insulation between the first heat sink 12 and the first computing board 20 ensures grounding isolation, reducing the risk of short circuits, electric shocks, or arcing between them. This improves the safety, reliability, and lifespan of the first computing board 20, its circuitry, and electronic components. The side of the second heat sink 13 facing away from the first heat sink 12 is insulated and thermally connected to the second computing board 30. That is, the second heat sink 13 and the second computing board 30 are thermally connected to facilitate quick and reliable heat exchange between the second heat sink 13 and the second computing board 30, and facilitate the heat conduction of the second computing board 30 to the second heat sink 13, thereby facilitating heat dissipation of the second computing board 30. Moreover, the second heat sink 13 is insulated from the second computing board 30, so that the second computing board 30 and the second heat sink 13 are grounded and isolated, thereby reducing the risk of short circuits, electric shocks, arcing and other phenomena between the second computing board 30 and the second heat sink 13, thereby improving the safety, reliability, and service life of the second computing board 30 and its circuits and electronic components.

[0056] The first heat sink 12 and the second heat sink 13 overlap each other, and the first heat sink 12 and the second heat sink 13 enclose each other to form a heat dissipation space 14. The heat dissipation space 14 is arranged to pass through the first heat sink 12 and the second heat sink 13 along the first direction x. Based on the overlap of the first heat sink 12 and the second heat sink 13, the first heat sink 12 and the second heat sink 13 can be connected and fixed to each other. The connection and fixing methods can be, but are not limited to, screw fastening, welding, snap-fitting, and bonding. The shape, size, and material of the first heat sink 12 can be set as needed. The material of the first heat sink 12 can be, but is not limited to, thermally conductive copper sheets, graphite, or other thermally conductive materials. The shape, size, and material of the second heat sink 13 can be set as needed. The material of the second heat sink 13 can be the same as or different from that of the first heat sink 12. The material of the second heat sink 13 can be, but is not limited to, thermally conductive copper sheets, graphite, or other thermally conductive materials.

[0057] At least one fan 11 is provided. Each fan 11 can be disposed as needed on the side of the first heat sink 12 and the second heat sink 13 along the first direction x, so that the fan 11 is located on the end side of the heat dissipation space 14 along the first direction x, so that the fan 11 can generate airflow along the heat dissipation space 14 when activated, thereby facilitating the airflow to carry away the heat of the first heat sink 12 and the second heat sink 13 and thus achieving heat dissipation. In the case of multiple fans 11, the multiple fans 11 can be uniformly disposed on one side of the heat dissipation space 14 along the first direction x, or they can be disposed on opposite sides of the heat dissipation space 14 along the first direction x. The fan 11 can be installed and fixed to at least one of the first heat sink 12 and the second heat sink 13, and the installation and fixing methods can be, but are not limited to, screw fastening, welding, snap-fitting, adhesive bonding, etc.

[0058] In summary, the control device provided in this application embodiment can integrate multiple core functions into a single controller module through the first computing board 20 and the second computing board 30. Based on this, redundant structures in traditional split modules can be reduced, the overall volume can be reduced, and space utilization can be improved. Furthermore, the first heat sink 12 can be insulated and thermally connected to the first computing board 20 on the side facing away from the second heat sink 13, allowing heat from the first computing board 20 to be conducted to the first heat sink 12; similarly, the second heat sink 13 can be insulated and thermally connected to the second computing board 30 on the side facing away from the first heat sink 12, allowing heat from the second computing board 30 to be conducted to the second heat sink 13; the first heat sink 12 and the second heat sink 13 can cover each other to form a heat dissipation space 14 extending along the first direction x, and a fan 11 generates heat at the end of the heat dissipation space 14. The airflow along the heat dissipation space 14 effectively carries away the heat from both the first heat sink 12 and the second heat sink 13, thus reliably removing the heat from both the first computing board 20 and the second computing board 30. Based on this, the first computing board 20 and the second computing board 30 can share the heat dissipation component 10, its heat dissipation space 14, and the fan 11 for effective heat dissipation to meet their own cooling needs. The first computing board 20 and the second computing board 30 do not need to be equipped with their own heat sinks, thereby reducing redundant configurations and space occupation of heat dissipation devices, compressing and simplifying the structure, and allowing for a compact layout. Therefore, this control device can integrate, simplify, and optimize its structure, reduce redundant components, achieve a compact layout, and be highly integrated, compact, and simple, compressing the overall volume and improving space utilization, thus facilitating the spatial layout, integration, and miniaturization of the humanoid robot. Furthermore, due to the high integration of the control device, which integrates the main computing power control of the humanoid robot, future upgrades and maintenance are relatively convenient.

[0059] Furthermore, since the first heat sink 12 is insulated and thermally conductively connected to the first computing board 20, the insulation between the first computing board 20 and the first heat sink 12 achieves grounding isolation, thereby reducing the risk of short circuits, electric shocks, and arcing between the first computing board 20 and the first heat sink 12. This improves the safety, reliability, and service life of the first computing board 20, its circuits, and electronic components. Similarly, since the second heat sink 13 is insulated and thermally conductively connected to the second computing board 30, the insulation between the second computing board 30 and the second heat sink 13 achieves grounding isolation, thereby reducing the risk of short circuits, electric shocks, and arcing between the second computing board 30 and the second heat sink 13. This improves the safety, reliability, and service life of the second computing board 30, its circuits, and electronic components. Therefore, the electrical safety, reliability, and stability of the control device are improved, and its service life is extended, which is beneficial for maintaining and improving the safety, reliability, and stability of the humanoid robot.

[0060] Please see Figure 2 , Figure 3 , Figure 4 In some embodiments of this application, the heat dissipation assembly 10 includes a fin structure 15, which is connected between the first heat dissipation component 12 and the second heat dissipation component 13 and extends along the first direction x. The heat dissipation space 14 is divided into at least two air ducts 141 by the fin structure 15.

[0061] It should be noted that the fin structure 15 is located within the heat dissipation space 14 and is connected between the first heat sink 12 and the second heat sink 13. In some embodiments, the fin structure 15 can be connected and fixed to the first heat sink plate 121 of the first heat sink 12, and when the first heat sink 12 and the second heat sink 13 are covered by each other, it can abut against the second heat sink plate 131 of the second heat sink 13, thereby achieving a connection between the first heat sink 12 and the second heat sink 13. In other embodiments, the fin structure 15 can be connected and fixed to the second heat sink plate 131 of the second heat sink 13, and when the first heat sink 12 and the second heat sink 13 are covered by each other, it can abut against the first heat sink plate 121 of the first heat sink 12, thereby achieving a connection between the first heat sink 12 and the second heat sink 13. In other embodiments, a portion of the fin structure 15 can be connected and fixed to the first heat sink plate 121 of the first heat sink 12, and another portion of the fin structure 15 can be connected and fixed to the second heat sink plate 131 of the second heat sink 13. When the first heat sink 12 and the second heat sink 13 overlap each other, the two portions of the fin structure 15 can abut against each other, thereby achieving a connection between the first heat sink 12 and the second heat sink 13. The first heat sink plate 121 is the portion where the first heat sink 12 is insulated and thermally connected to the first computing board 20. The second heat sink plate 131 is spaced apart from the first heat sink 121 and is the portion where the second heat sink 13 is insulated and thermally connected to the second computing board 30.

[0062] The fin structure 15 extends along the first direction x. The fin structure 15 may include one fin or at least two fins. The fin structure 15 can spatially divide the heat dissipation space 14 to form at least two parallel air ducts 141.

[0063] By adopting the above scheme, the heat dissipation space 14 can be spatially divided by the fin structure 15, which is connected between the first heat sink 12 and the second heat sink 13 and extends along the first direction x, to form at least two parallel air ducts 141. Based on this, the airflow can be evenly distributed through multiple parallel air ducts 141, thereby reducing the uneven heat dissipation problem caused by the edge effect of airflow in a single wide air duct, promoting balanced heat dissipation in each area of ​​the first heat sink 12 and the second heat sink 13, reducing local hot spots, and improving the overall heat dissipation uniformity and consistency. The airflow turbulence can be reduced through multiple independent air ducts 141, and compared with a single wide air duct, it is easier to maintain directional flow, high speed, and stable airflow, thereby reducing wind resistance, increasing wind speed, and maintaining efficient aerodynamic performance. The contact area with the airflow can be increased through the fin structure 15, thereby increasing the heat dissipation area and accelerating heat conduction. Thus, the heat dissipation effect and efficiency of the heat dissipation component 10 on the first computing board 20 and the second computing board 30 can be effectively optimized.

[0064] Furthermore, the fin structure 15 provides physical and mechanical support between the first heat sink 12 and the second heat sink 13, enhancing the overall structural rigidity of the heat dissipation assembly 10 and reducing the risk of deformation caused by vibration or external forces. This improves the structural stability, reliability, usability, and service life of the heat dissipation assembly 10. Moreover, the fin structure 15 simultaneously achieves heat dissipation enhancement and structural reinforcement within a limited space without increasing the volume of the heat dissipation assembly 10, meeting the requirements of high integration.

[0065] Of course, in other embodiments, the fin structure 15 can be omitted, so that the heat dissipation space 14 forms a single wide air duct.

[0066] Please see Figure 2 , Figure 3 , Figure 4 In some embodiments of this application, the fin structure 15 includes a plurality of first fins 151 connected to the first heat sink 12 and arranged at intervals along the second direction y, and a plurality of second fins 152 connected to the second heat sink 13 and arranged at intervals along the second direction y, wherein the second direction y is perpendicular to the first direction x; the plurality of first fins 151 and the plurality of second fins 152 correspond one-to-one, and the corresponding first fins 151 and second fins 152 extend toward each other and abut against each other.

[0067] It should be noted that the fin structure 15 includes a plurality of first fins 151, which are arranged at intervals along the second direction y and all extend along the first direction x. The fin structure 15 also includes a plurality of second fins 152, which are arranged at intervals along the second direction y and all extend along the first direction x. The second fins 152 correspond one-to-one with the first fins 151. The first fins 151 are connected to the first heat sink plate 121 of the first heat sink 12 and extend toward the corresponding second fin 152. The second fins 152 are connected to the second heat sink plate 131 of the second heat sink 13 and extend toward the corresponding first fin 151. With the first heat sink 12 and the second heat sink 13 overlapping each other, the corresponding first fins 151 and second fins 152 abut against each other. The first fins 151 and the first heat sink plate 121 of the first heat sink 12 can be integrally connected or separately connected. The separate connection method can be, but is not limited to, welding or bonding. The second fin 152 and the second heat sink 131 of the second heat sink 13 can be connected as a whole or separately. The separate connection method can be, but is not limited to, welding or bonding.

[0068] By adopting the above scheme, multiple first fins 151 connected to the first heat sink 12 and multiple second fins 152 connected to the second heat sink 13 can be connected in a one-to-one contact to form a split fin structure 15. Based on this, an efficient heat conduction path can be formed, which can promote the rapid transfer of heat along the heat conduction path of "first computing board 20, first heat sink 12, each first fin 151" and "second computing board 30, second heat sink 13, each second fin 152", thereby reducing thermal resistance and optimizing the heat dissipation effect and efficiency of the heat dissipation component 10 on the first computing board 20 and the second computing board 30.

[0069] Furthermore, since the first fin 151 is connected and fixed to the first heat sink 12 and the second fin 152 is connected and fixed to the second heat sink 13, the first fin 151 and the second fin 152 can each share the structural load, which can reduce the risk of deformation or breakage of the fin structure 15 due to vibration or impact. Also, since the corresponding first fin 151 and second fin 152 abut against each other, the abutting design allows for small deformation buffering, which can reduce stress concentration caused by rigid connection. Thus, the mechanical stress of the fin structure 15 can be dispersed, which can improve the structural reliability, operational reliability and service life of the fin structure 15.

[0070] Of course, in other embodiments, the fin structure 15 may include only one or more first fins 151, without including second fins 152; or, the fin structure 15 may include only one or more second fins 152, without including first fins 151.

[0071] like Figure 2, Figure 3 , Figure 4 As shown, in some embodiments, the first heat sink 12 includes a first heat sink 121, a first side plate 122, and a second side plate 123. The first side plate 122 and the second side plate 123 are respectively disposed on opposite sides of the first heat sink 121 along the second direction y. The second heat sink 13 includes a second heat sink 131, a third side plate 132, and a fourth side plate 133. The third side plate 132 and the fourth side plate 133 are respectively disposed on opposite sides of the second heat sink 131 along the second direction y. The third side plate 132 abuts against and is fixed to the first side plate 122, and the fourth side plate 133 abuts against and is fixed to the second side plate 123. The connection and fixing method between the third side plate 132 and the first side plate 122 can be, but is not limited to, screw fastening, welding, snap-fitting, and bonding. The connection and fixing method between the fourth side plate 133 and the second side plate 123 can be, but is not limited to, screw fastening, welding, snap-fitting, and bonding. This arrangement allows the first heat sink 12 and the second heat sink 13 to cover and connect with each other to form a heat dissipation space 14.

[0072] Please see Figure 1 , Figure 2 , Figure 3 , Figure 4 In some embodiments of this application, multiple fans 11 are provided. Some fans 11 are first fans 11a, and other fans 11 are second fans 11b. The first fan 11a is located on one side of the heat dissipation space 14 along the first direction x, and the second fan 11b is located on the other side of the heat dissipation space 14 along the first direction x.

[0073] It should be noted that, since the first fan 11a and the second fan 11b are respectively located on opposite sides of the heat dissipation space 14 along the first direction x, and since each fan 11 can generate airflow along the heat dissipation space 14 when it is started, so that the airflow can carry away the heat of the first heat sink 12 and the second heat sink 13 to achieve heat dissipation, one of the first fan 11a and the second fan 11b can achieve the "air intake" effect (i.e., the airflow passes through the fan 11 before entering the heat dissipation space 14), and the other of the first fan 11a and the second fan 11b can achieve the "air exhaust" effect (i.e., the airflow comes out of the heat dissipation space 14 and passes through the fan 11), so that the first fan 11a and the second fan 11b work together to promote air circulation.

[0074] By adopting the above scheme, the "air intake" effect can be achieved by one of the first fan 11a and the second fan 11b, and the "air exhaust" effect can be achieved by the other of the first fan 11a and the second fan 11b, thus relaying the air circulation. Based on this, the problem of insufficient heat dissipation at the end of the heat dissipation space 14 caused by the excessive length of the heat dissipation space 14 on one side can be reduced, the uneven heat dissipation caused by the attenuation of airflow on one side can be reduced, the airflow coverage of the heat dissipation space 14 can be ensured throughout, the heat dissipation dead zones can be reduced, and the heat dissipation uniformity, heat dissipation effect and heat dissipation efficiency can be improved. Furthermore, if one of the first fan 11a and the second fan 11b fails, the other of the first fan 11a and the second fan 11b can still maintain at least part of the airflow, thereby reducing the risk of complete interruption of heat dissipation, improving the fault tolerance, heat dissipation redundancy and reliability of the heat dissipation component 10, and enhancing the reliability of the control device.

[0075] Of course, in other embodiments, only one fan 11 may be provided; or, multiple fans 11 may be provided, and multiple fans 11 may be uniformly provided on one side of the heat dissipation space 14 along the first direction x.

[0076] Please see Figure 1 , Figure 2 , Figure 3 , Figure 4 In some embodiments of this application, the first fan 11a and the second fan 11b are alternately arranged along the second direction y, which is perpendicular to the first direction x.

[0077] It should be noted that, based on the previous embodiment (i.e., based on "the first fan 11a is located on one side of the heat dissipation space 14 along the first direction x, and the second fan 11b is located on the other side of the heat dissipation space 14 along the first direction x"), the first fan 11a and the second fan 11b are alternately arranged along the second direction y. That is, the first fan 11a and the second fan 11b are alternately arranged along the second direction y in the order of "first fan 11a, second fan 11b, first fan 11a, second fan 11b..." or "second fan 11b, first fan 11a, second fan 11b, first fan 11a...". Based on the alternating arrangement of the first fan 11a and the second fan 11b along the second direction y, the projections of the first fan 11a and the second fan 11b arranged adjacent to each other along the second direction y can overlap or not overlap.

[0078] By adopting the above scheme, based on the previous embodiment, by alternately arranging the first fan 11a and the second fan 11b along the second direction y, the airflow action areas of the two fans can partially overlap and complement each other, forming a uniform and comprehensive heat dissipation distribution, thereby reducing the heat dissipation blind spots that may exist in traditional parallel fans 11. Based on this, the heat dissipation coverage area can be expanded and heat dissipation dead zones can be reduced by using a smaller number of fans 11 with an optimized layout; and the staggered arrangement of fans 11 can guide the airflow to form a non-linear flow (such as a wave or weak spiral shape) within the heat dissipation space 14, enhancing the contact time and disturbance intensity between the airflow and the first heat sink 12 and the second heat sink 13, improving heat exchange efficiency, and reducing local heat accumulation; thereby improving the heat dissipation effect and efficiency of the heat dissipation component 10. Furthermore, if one fan 11 fails, the staggered design of the other fan 11 can still drive the airflow through a part of the heat dissipation space 14 (rather than relying entirely on a single airflow direction), thereby reducing the risk of complete heat dissipation failure and improving the heat dissipation redundancy, fault tolerance, and system reliability of the heat dissipation component 10.

[0079] Of course, in other embodiments, the first fan 11a and the second fan 11b can be flexibly arranged, for example, one of the first fans 11a and one of the second fans 11b can be aligned along the first direction x.

[0080] Please see Figure 2 , Figure 5 , Figure 6 , Figure 7 In some embodiments of this application, the control device includes an insulating isolation plate 40 disposed between the first computing board 20 and the first heat sink 12. The insulating isolation plate 40 is provided with a first hole 41. The first heat sink 12 includes a heat conduction platform 124 protruding toward the first computing board 20. The heat conduction platform 124 passes through the first hole 41 and is insulated and thermally connected to the first computing board 20.

[0081] It should be noted that the insulating isolation plate 40 is made of insulating material and has insulating properties. The insulating isolation plate 40 may be made of, but is not limited to, nylon plastic, ABS (Acrylonitrile Butadiene Styrene), PP (Polypropylene), POM (Polyoxymethylene), PEEK (Polyether Ether Ketone), and other insulating and high-temperature resistant materials.

[0082] An insulating isolation plate 40 is disposed between the first computing board 20 and the first heat sink 12, thereby insulating and isolating the first computing board 20 and the first heat sink 12. The first computing board 20 and the first heat sink 12 can be connected and fixed together, or the first computing board 20, the insulating isolation plate 40, and the first heat sink 12 can be connected and fixed sequentially, thus ensuring relative fixation between them. The connection and fixing methods can include, but are not limited to, screw fastening, welding, snap-fitting, and bonding.

[0083] The insulating isolation plate 40 has a first hole 41 that penetrates the insulating isolation plate 40 along its thickness direction. The shape and size of the first hole 41 can be set as needed, and the first hole 41 can be, but is not limited to, a rectangular hole, a circular hole, etc. Correspondingly, the first heat sink 12 has a heat conduction platform 124 protruding from the side facing the first computing board 20, and the heat conduction platform 124 can pass through the first hole 41. In some embodiments, the shape and size of the heat conduction platform 124 can be set to correspond to the shape and size of the first hole 41, so that the heat conduction platform 124 can be adapted to fit the first hole 41; in other embodiments, the shape and size of the heat conduction platform 124 can be set as needed, so that the heat conduction platform 124 can be clearance-fitted with the first hole 41.

[0084] The heat-conducting platform 124, which passes through the first hole 41, can be thermally insulated from the first computing board 20. That is, the heat-conducting platform 124 is thermally connected to the first computing board 20 to facilitate quick and reliable heat exchange between the heat-conducting platform 124 and the first computing board 20, thereby facilitating the heat transfer of the first computing board 20 to the heat-conducting platform 124 and then to the first heat sink 12. Furthermore, the heat-conducting platform 124 is insulated from the first computing board 20, thereby achieving ground isolation between the first computing board 20 and the heat-conducting platform 124, reducing the risk of short circuits, electric shocks, arcing, and other phenomena between the first computing board 20 and the heat-conducting platform 124.

[0085] By adopting the above scheme, the first heat sink 12 can be thermally connected to the first computing board 20 through the heat conduction platform 124 passing through the first hole 41, so that the heat of the first computing board 20 can be thermally conducted to the first heat sink 12 via the heat conduction platform 124, thereby forming an efficient heat conduction channel. This can achieve directional heat conduction, reduce thermal resistance, improve the heat conduction efficiency between the first heat sink 12 and the first computing board 20, and optimize the heat dissipation effect and efficiency of the heat dissipation component 10 on the first computing board 20.

[0086] By adopting the above scheme, the insulating isolation plate 40 can be used as a basic isolation layer to insulate and isolate the first computing board 20 and the first heat sink 12, thereby blocking direct electrical contact between the first computing board 20 and the first heat sink 12 over a large area. Furthermore, by insulating the heat conduction platform 124 from the first computing board 20, grounding isolation is achieved between the first computing board 20 and the heat conduction platform 124. Based on this, through double insulation isolation measures, the insulation and grounding isolation between the first computing board 20 and the first heat sink 12 can be comprehensively and reliably achieved. This reduces the risk of short circuits, electric shocks, and arcing between the first computing board 20 and the first heat sink 12, improves the safety, reliability, and service life of the first computing board 20 and its circuits and electronic components, thereby improving the electrical safety, reliability, and stability of the control device, extending its service life, and facilitating the maintenance and improvement of the safety, reliability, and stability of the humanoid robot.

[0087] Of course, in other embodiments, the first computing board 20 and the first heat sink 12 can be connected in an insulated and thermally conductive manner in other ways, such as applying an insulating and thermally conductive adhesive between the first computing board 20 and the first heat sink 12 as needed.

[0088] Please see Figure 2 , Figure 6 , Figure 7 In some embodiments of this application, an insulating thermally conductive adhesive layer 50 is provided between the heat-conducting stage 124 and the first computing board 20. The insulating thermally conductive adhesive layer 50 may be, but is not limited to, thermally conductive silicone grease, thermally conductive epoxy adhesive, thermally conductive polyurethane adhesive, thermally conductive acrylic adhesive, etc.

[0089] By adopting the above solution, the tiny gap between the heat-conducting platform 124 and the first computing board 20 can be filled by the insulating thermally conductive adhesive layer 50 to reduce the influence of air (a low thermal conductivity medium), thereby reducing contact thermal resistance and improving heat transfer efficiency. This improves the heat conduction effect between the heat-conducting platform 124 and the first computing board 20 (i.e., between the first heat sink 12 and the first computing board 20), optimizing the heat dissipation effect and efficiency of the heat dissipation component 10 on the first computing board 20. Furthermore, the insulating thermally conductive adhesive layer 50 serves as an insulating layer, providing insulation in addition to heat conduction, thus blocking direct electrical contact between the heat-conducting platform 124 and the first computing board 20. This ensures that the heat-conducting platform 124 and the first computing board 20 are insulated and grounded, reducing the risk of short circuits, electric shocks, and arcing between the first computing board 20 and the heat-conducting platform 124. This improves the safety, reliability, and service life of the first computing board 20, its circuits, and electronic components. Furthermore, the insulating and thermally conductive adhesive layer 50 can be used as a structural adhesive to ensure a stable and reliable connection between the heat-conducting platform 124 and the first computing board 20. Since the insulating and thermally conductive adhesive layer 50 has a certain degree of elasticity, it can absorb mechanical vibration and buffer vibration stress, thereby reducing hard friction, loose connection, and poor contact between the heat-conducting platform 124 and the first computing board 20. This can enhance the connection stability, connection reliability, thermal stability, and thermal reliability between the heat-conducting platform 124 and the first computing board 20.

[0090] Please see Figure 2 , Figure 6 , Figure 7 In some embodiments of this application, the first computing board 20 has a first component 21 that abuts against the heat conduction platform 124, and the outer shell of the first component 21 is an insulating shell.

[0091] It should be noted that among the electronic components of the first computing board 20, the electronic component that contacts the heat-conducting platform 124 is the first component 21. If there is only one electronic component that contacts the heat-conducting platform 124, then there is only one first component 21; if there are multiple electronic components that contact the heat-conducting platform 124, then there are multiple first components 21. The types and functions of the multiple first components 21 are not necessarily the same. The outer shell of the first component 21 is an insulating shell with insulating properties.

[0092] By adopting the above scheme, by making the outer shell of the first component 21 that abuts against the heat conduction platform 124 an insulating shell, the first component 21 and the heat conduction platform 124 can be insulated and grounded, thereby reducing the risk of short circuits, electric shocks, arcing and other phenomena between the first computing board 20 and the heat conduction platform 124, and improving the safety, reliability and service life of the first computing board 20 and its circuits and electronic components.

[0093] It should be noted that this embodiment and the previous embodiment can be configured separately or in combination to achieve insulation and grounding isolation between the first computing board 20 and the heat conduction platform 124.

[0094] Of course, in other embodiments, insulation between the first computing board 20 and the heat conduction platform 124 can be achieved in other ways, such as by providing an insulating coating on the surface of the heat conduction platform 124 facing the first computing board 20.

[0095] Please see Figure 2 , Figure 5 , Figure 7 , Figure 8 In some embodiments of this application, the control device includes a first housing 60, which covers the side of the first heat sink 12 facing away from the second heat sink 13. The first housing 60 and the first heat sink 12 enclose a first space 61, and the first computing board 20 is disposed in the first space 61.

[0096] It should be noted that the first housing 60 is located on the side of the first heat sink 12 facing away from the second heat sink 13, and fits and covers the first heat sink 12, forming a first space 61. The first computing board 20 is located within the first space 61, so that the first housing 60 and the first heat sink 12 jointly protect the first computing board 20. The shape, size, and material of the first housing 60 can be set as needed. The first housing 60 is directly or indirectly connected and fixed to the first heat sink 12, and the connection and fixing methods can be, but are not limited to, screw fastening, welding, snap-fitting, and bonding. The first housing 60 can be provided with some openings as needed to expose the interface of the first computing board 20.

[0097] By adopting the above solution, the first housing 60 and the first heat sink 12 can be used to form a relatively closed first space 61 to enclose the first computing board 20 in the first space 61, thereby protecting the first computing board 20 and reducing damage to the first computing board 20 from external mechanical impacts, dust, liquid splashes, etc., and improving the reliability and service life of the first computing board 20.

[0098] Please see Figure 2 , Figure 5 , Figure 7 , Figure 8In some embodiments of this application, the control device includes a first housing 60, which covers the side of the first heat sink 12 facing away from the second heat sink 13. The first housing 60 and the first heat sink 12 enclose a first space 61. A first computing board 20 and an insulating isolation plate 40 are disposed in the first space 61. The insulating isolation plate 40 is connected and fixed to the first heat sink 12. The first housing 60, the first computing board 20 and the insulating isolation plate 40 are sequentially connected and fixed.

[0099] It should be noted that, based on the provision of an insulating isolation plate 40 between the first computing board 20 and the first heat sink 12, the first computing board 20 and the insulating isolation plate 40 can both be disposed within the first space 61 formed by the first housing 60 and the first heat sink 12, so that the first housing 60 and the first heat sink 12 jointly protect the first computing board 20 and the insulating isolation plate 40. In this case, the insulating isolation plate 40 can be connected and fixed to the first heat sink 12, and the first housing 60, the first computing board 20, and the insulating isolation plate 40 can be connected and fixed sequentially, so as to relatively fix the first housing 60, the first computing board 20, the insulating isolation plate 40, and the first heat sink 12. The connection and fixing methods can include, but are not limited to, screw fastening, welding, snap-fitting, and bonding.

[0100] By adopting the above scheme, based on the insulating isolation plate 40 between the first computing board 20 and the first heat sink 12, the insulating isolation plate 40 can be connected and fixed to the first heat sink 12, and the first housing 60, the first computing board 20, and the insulating isolation plate 40 can be sequentially connected and fixed, so that the first housing 60, the first computing board 20, the insulating isolation plate 40, and the first heat sink 12 can be relatively fixed to each other. Based on this, a rigid connection between the components from the first housing 60 to the first heat sink 12 can be conveniently, stably, and reliably achieved, which can improve the mechanical strength, stability, and reliability of the overall structure, and is especially suitable for high-dynamic motion scenarios of humanoid robots (such as running and jumping). Furthermore, this connection architecture can evenly distribute external impact forces, disperse stress, and reduce stress concentration that could lead to local cracking of the first housing 60 or the first heat sink 12, thereby extending the service life of the control device.

[0101] Please see Figure 2 , Figure 5 , Figure 8 In some embodiments of this application, an insulating isolation plate 40 is provided with a first connecting post 42 protruding on the side facing the first computing board 20. The control device includes a first fastener 70 corresponding to the first connecting post 42 and a second fastener 80 corresponding to the first fastener 70. The nail portion of the first fastener 70 passes through and connects the first computing board 20 and the first connecting post 42, and the second fastener 80 passes through and connects the first housing 60 and the head of the first fastener 70.

[0102] It should be noted that the first connecting post 42, the first fastener 70, and the second fastener 80 are configured in a one-to-one correspondence. For example, as shown... Figure 2 , Figure 5 , Figure 6 As shown, in some embodiments, there are four sets of combinations of the first connecting post 42, the first fastener 70, and the second fastener 80.

[0103] In the corresponding first connecting post 42, first fastener 70 and second fastener 80, the nail part of the first fastener 70 passes through the first computing board 20 and is connected and fixed to the first connecting post 42, and the head of the first fastener 70 presses and fixes the first computing board 20 to the first connecting post 42; the nail part of the second fastener 80 passes through the first housing 60 and is connected and fixed to the head of the first fastener 70, and the head of the second fastener 80 presses and fixes the first housing 60 to the head of the first fastener 70.

[0104] like Figure 8 As shown, in some embodiments, the first fastener 70 is a screw, and the first connecting post 42 has a threaded hole for connection and mating with the first fastener 70. In other embodiments, the first fastener 70 is a pin or other fastener, and the first connecting post 42 may have a hole or bayonet for connection and mating with the first fastener 70. The first fastener 70 can be a metal part or a non-metal part.

[0105] like Figure 8 As shown, in some embodiments, the second fastener 80 is a screw, and the head of the first fastener 70 has a threaded hole for connection and mating with the second fastener 80. In other embodiments, the second fastener 80 is a pin or other fastener, and the head of the first fastener 70 may have a hole or bayonet for connection and mating with the second fastener 80. The second fastener 80 can be a metal part or a non-metal part.

[0106] like Figure 8 As shown, in some embodiments, the first computing board 20 includes a first plate 22 arranged adjacent to the first connecting post 42, and a second plate 23 arranged at intervals on the side of the first plate 22 facing away from the first connecting post 42. In this case, the head of the first fastener 70 can press and fix the first plate 22 to the first connecting post 42 and support it between the first plate 22 and the second plate 23. In other embodiments, the first computing board 20 may be a single-plate structure, and the head of the first fastener 70 can press and fix the first computing board 20 to the first connecting post 42 and support it between the first computing board 20 and the first housing 60; or, the first computing board 20 may include at least three plates, and the head of the first fastener 70 can press and fix the plate of the first computing board 20 closest to the first connecting post 42 to the first connecting post 42.

[0107] By adopting the above scheme, the first connecting post 42 can be used as a positioning reference, and the first fastener 70 and the second fastener 80 can be used for layered locking. This allows for convenient, quick, and reliable precise positioning, connection, and anti-loosening design among the first housing 60, the first computing board 20, and the insulating isolation plate 40. Based on this, the connection convenience, reliability, and stability among the first housing 60, the first computing board 20, and the insulating isolation plate 40 can be improved. This reduces the risk of displacement or loosening of the components in high-dynamic scenarios and the risk of fastener loosening due to vibration during long-term use. Therefore, the structural and operational reliability of the control device can be improved, making it suitable for high-dynamic motion scenarios of humanoid robots. Furthermore, the configuration of this embodiment facilitates layered disassembly, improving the ease of assembly and disassembly and maintainability of the control device, and facilitating future upgrades, maintenance, and replacements.

[0108] Furthermore, in order to maintain the function and effectiveness of the first computing board 20, the insertion positions of the first fastener 70 and the second fastener 80 will avoid the circuit and electronic component layout of the first computing board 20. Since the insulating isolation plate 40 has insulating properties, regardless of whether the first fastener 70 or the second fastener 80 is a metal or non-metal part, it will not affect the grounding isolation of the first computing board 20. This can reduce the risk of short circuits, electric shocks, arcing, etc. of the first computing board 20, and improve the safety, reliability, and service life of the first computing board 20 and its circuits and electronic components.

[0109] Of course, in other embodiments, the first housing 60, the first computing board 20, and the insulating isolation plate 40 can be connected and fixed in sequence by other methods (such as welding, snap-fitting, bonding, etc.).

[0110] Please see Figure 2 , Figure 9 , Figure 10 , Figure 11 In some embodiments of this application, the second computing board 30 has a second component 31 that abuts against the second heat sink 13, and the control device includes an insulating heat-conducting sheet 90 disposed between the second component 31 and the second heat sink 13.

[0111] It should be noted that among the electronic components of the second computing board 30, the electronic component that abuts (not limited to direct or indirect contact) with the second heat sink 13 is designated as the second component 31. If there is only one electronic component abutting between the second computing board 30 and the second heat sink 13, then there is one second component 31; if there are multiple electronic components abutting between the second computing board 30 and the second heat sink 13, then there are multiple second components 31. The types and functions of the multiple second components 31 are not necessarily the same. The casing of the second component 31 may be a metal casing or a non-metal casing.

[0112] The insulating heat-conducting sheet 90 is a sheet-like structure made of insulating and thermally conductive material, possessing both insulating and thermally conductive properties. The insulating heat-conducting sheet 90 is disposed between the second component 31 and the second heat sink 13, allowing indirect contact and heat conduction between them. This achieves insulation and grounding isolation between the second component 31 and the second heat sink 13, thus providing an insulated and thermally conductive connection. The insulating heat-conducting sheet 90 can be, but is not limited to, a thermally conductive silicone pad, a ceramic heat-conducting sheet, etc. It can be used to connect and fix the second computing board 30 and the second heat sink 13, or the second component 31, the insulating heat-conducting sheet 90, and the second heat sink 13 can be sequentially connected and fixed, thus relatively fixing the second computing board 30, the insulating heat-conducting sheet 90, and the second heat sink 13. The connection and fixing methods can include, but are not limited to, screw fastening, welding, snap-fitting, and bonding.

[0113] By adopting the above scheme, the second component 31 of the second computing board 30 and the second heat sink 13 can be indirectly contacted and conduct heat through the insulating heat-conducting sheet 90. Based on this, the insulating heat-conducting sheet 90 can fill the micro gap between the second component 31 and the second heat sink 13, reduce the contact thermal resistance, and improve the heat conduction efficiency from the second computing board 30 to the second heat sink 13. This can improve the heat conduction effect between the second computing board 30 and the second heat sink 13, and optimize the heat dissipation effect and efficiency of the heat dissipation component 10 on the second computing board 30. Furthermore, the insulating heat-conducting sheet 90 can serve as an insulating layer, providing both heat conduction and insulation to block direct electrical contact between the second component 31 of the second computing board 30 and the second heat sink 13. This ensures that the second computing board 30 and the second heat sink 13 are insulated and grounded, thereby reducing the risk of short circuits, electric shocks, and arcing between the second computing board 30 and the second heat sink 13. This improves the safety, reliability, and service life of the second computing board 30, its circuits, and electronic components.

[0114] Of course, in other embodiments, the second computing board 30 and the second heat sink 13 can be connected in an insulated and thermally conductive manner in other ways, such as applying an insulating and thermally conductive adhesive between the second computing board 30 and the second heat sink 13 as needed.

[0115] Please see Figure 2 , Figure 10 , Figure 11 In some embodiments of this application, the control device further includes an insulating fastener 100, which passes through and connects the second heat sink 13, the insulating heat-conducting sheet 90, and the second component 31. The insulating fastener 100 may be, but is not limited to, an insulating screw, an insulating pin, etc., and the insulating screw may be, but is not limited to, a plastic screw (e.g., a PEEK screw), etc. The number of insulating fasteners 100 may be one or more, for example, such as... Figure 11 As shown, in some embodiments, four insulating fasteners 100 are provided, and the four insulating fasteners 100 are distributed at the four corners of the insulating heat-conducting sheet 90.

[0116] By adopting the above solution, the second component 31, the insulating heat-conducting sheet 90, and the second heat sink 13 can be directly connected by the insulating fastener 100, so as to fix the second component 31, the insulating heat-conducting sheet 90, and the second heat sink 13 relatively. Based on this, the connection convenience, connection reliability, connection stability, connection tightness, thermal conductivity stability, and thermal conductivity reliability among the second component 31, the insulating heat-conducting sheet 90, and the second heat sink 13 can be improved. The risk of displacement or loosening of the component in high dynamic scenarios can be reduced, the risk of fastener loosening due to vibration during long-term use can be reduced, and the structural reliability and operational reliability of the component can be improved. It is suitable for high dynamic motion scenarios of humanoid robots. Furthermore, since the insulating fastener 100 has insulating properties, even if the insulating fastener 100 passes through the second component 31 of the second computing board 30, it will not affect the grounding isolation of the second computing board 30. This can reduce the risk of short circuits, electric shocks, arcing, etc. in the second computing board 30, and improve the safety, reliability, and service life of the second computing board 30 and its circuits and electronic components.

[0117] Of course, in other embodiments, the second component 31, the insulating heat-conducting sheet 90, and the second heat sink 13 can be connected and fixed in sequence by other means (such as welding, snap-fitting, bonding, etc.); or, only the second computing board 30 and the second heat sink 13 are connected and fixed, while the insulating heat-conducting sheet 90 is clamped and fixed between the second computing board 30 and the second heat sink 13.

[0118] Please see Figure 2 , Figure 9 , Figure 11In some embodiments of this application, the control device includes a second housing 110, which covers the side of the second heat sink 13 facing away from the first heat sink 12. The second housing 110 and the second heat sink 13 enclose a second space 1101, and the second computing board 30 and the insulating heat-conducting sheet 90 are disposed in the second space 1101.

[0119] It should be noted that the second housing 110 is located on the side of the second heat sink 13 facing away from the first heat sink 12, and fits and covers the second heat sink 13, forming a relatively enclosed second space 1101. The second computing board 30 and the insulating heat-conducting sheet 90 are located within the second space 1101, so that the second housing 110 and the second heat sink 13 jointly protect the second computing board 30 and the insulating heat-conducting sheet 90. The shape, size, and material of the second housing 110 can be set as needed. The second housing 110 is directly or indirectly connected and fixed to the second heat sink 13, and the connection and fixing methods can be, but are not limited to, screw fastening, welding, snap-fitting, and bonding. The second housing 110 can be provided with some openings as needed to expose the interface of the second computing board 30.

[0120] By adopting the above solution, the second housing 110 and the second heat sink 13 can be used to form a relatively closed second space 1101, so as to encapsulate the second computing board 30 and the insulating heat-conducting sheet 90 in the second space 1101, thereby protecting the second computing board 30 and reducing damage to the second computing board 30 from external mechanical impacts, dust, liquid splashes, etc., and improving the reliability and service life of the second computing board 30 and the control device.

[0121] Please see Figure 2 , Figure 9 , Figure 11 In some embodiments of this application, the second computing board 30 has a second component 31 that abuts against the second heat sink 13, and the peripheral wall of the second housing 110 has a first wall portion 1102 adjacent to the second component 31, the first wall portion 1102 being an insulating wall portion.

[0122] It should be noted that among the electronic components of the second computing board 30, the electronic component that abuts (not limited to direct or indirect contact) with the second heat sink 13 is designated as the second component 31. If there is only one electronic component abutting between the second computing board 30 and the second heat sink 13, then there is one second component 31; if there are multiple electronic components abutting between the second computing board 30 and the second heat sink 13, then there are multiple second components 31. The types and functions of the multiple second components 31 are not necessarily the same. The casing of the second component 31 may be a metal casing or a non-metal casing.

[0123] The second housing 110 includes a main body 1103 and a first wall 1102. The first wall 1102 is the wall closest to the second component 31 in the peripheral wall of the second housing 110. The main body 1103 includes the bottom wall of the second housing 110 and the other walls in the peripheral wall of the second housing 110 besides the first wall 1102. The first wall 1102 is an insulating wall and has insulating properties. The material of the first wall 1102 can be, but is not limited to, insulating materials such as ABS plastic. The material of the main body 1103 can be set as needed. The first wall 1102 and the main body 1103 are separately connected and fixed. The separate connection and fixing method can be, but is not limited to, screw fastening, welding, snap-fitting, adhesive bonding, etc.

[0124] By adopting the above solution, the first wall portion 1102 closest to the second component 31 on the periphery of the second housing 110 can be made into an insulating wall portion to achieve insulation and isolation, thereby blocking the conductive path of the high-risk contact point. This localized and precise insulation eliminates the electrical contact risk of the second component 31 on the second computing board 30, thus maintaining the grounding isolation of the second computing board 30. This reduces the risk of short circuits, electric shocks, and arcing on the second computing board 30, and improves the safety, reliability, and service life of the second computing board 30, its circuits, and electronic components. Furthermore, by using insulating material in the critical area of ​​the second housing 110 (i.e., the first wall portion 1102), it is beneficial to balance protection, cost, and weight, thus achieving a balance of safety, lightweight design, and cost-effectiveness.

[0125] Of course, in other embodiments, the material of the second housing 110 can be set as needed.

[0126] Please see Figure 2 , Figure 9 , Figure 12 , Figure 13 In some embodiments of this application, the second heat sink 13 further includes a second connecting post 134 protruding toward the second computing board 30. The control device includes a third fastener 120 corresponding to the second connecting post 134, a fourth fastener 130 corresponding to the third fastener 120, and a fifth fastener 140 corresponding to the fourth fastener 130. The nail portion of the third fastener 120 is connected to the second connecting post 134, and the head of the third fastener 120 abuts against the second computing board 30. The nail portion of the fourth fastener 130 passes through and connects the second computing board 30 and the head of the third fastener 120. The head of the fourth fastener 130 abuts against the second housing 110, and the fifth fastener 140 passes through and connects the second housing 110 and the head of the fourth fastener 130.

[0127] It should be noted that the second connecting post 134, the third fastener 120, the fourth fastener 130, and the fifth fastener 140 are configured in a one-to-one correspondence. For example, as shown... Figure 2 , Figure 12 As shown, in some embodiments, the combination of the second connecting post 134, the third fastener 120, the fourth fastener 130 and the fifth fastener 140 is provided in three sets.

[0128] In the corresponding second connecting post 134, third fastener 120, fourth fastener 130 and fifth fastener 140, the nail portion of the third fastener 120 is connected to the second connecting post 134, and the head of the third fastener 120 abuts against and supports the second computing board 30; the nail portion of the fourth fastener 130 passes through the second computing board 30 and is connected and fixed to the head of the third fastener 120, and the head of the fourth fastener 130 presses and fixes the second computing board 30 to the head of the third fastener 120, and the head of the fourth fastener 130 also abuts against and supports the second housing 110; the nail portion of the fifth fastener 140 passes through the second housing 110 and is connected and fixed to the head of the fourth fastener 130, and the head of the fifth fastener 140 presses and fixes the second housing 110 to the head of the fourth fastener 130.

[0129] like Figure 13 As shown, in some embodiments, the third fastener 120 is a screw, and the second connecting post 134 is provided with a threaded hole for connection and engagement with the third fastener 120. In other embodiments, the third fastener 120 is a pin or other fastener, and the second connecting post 134 may be provided with a hole or bayonet for connection and engagement with the third fastener 120. The third fastener 120 can be a metal part or a non-metal part.

[0130] like Figure 13 As shown, in some embodiments, the fourth fastener 130 is a screw, and the head of the third fastener 120 is provided with a threaded hole for connection and mating with the fourth fastener 130. In other embodiments, the fourth fastener 130 is a pin or other fastener, and the head of the third fastener 120 may be provided with a hole or bayonet for connection and mating with the fourth fastener 130. The fourth fastener 130 can be a metal part or a non-metal part.

[0131] like Figure 13 As shown, in some embodiments, the fifth fastener 140 is a screw, and the head of the fourth fastener 130 is provided with a threaded hole for connection and mating with the fifth fastener 140. In other embodiments, the fifth fastener 140 is a pin or other fastener, and the head of the fourth fastener 130 may be provided with a hole or bayonet for connection and mating with the fifth fastener 140. The fifth fastener 140 can be a metal part or a non-metal part.

[0132] By adopting the above scheme, the second connecting post 134 can be used as a positioning reference, and the third fastener 120, fourth fastener 130, and fifth fastener 140 can be used for layered locking. This allows for convenient, quick, and reliable precise positioning, connection, and anti-loosening design between the second housing 110, the second computing board 30, and the second heat sink 13. Based on this, the convenience, reliability, and stability of the connection between the second housing 110, the second computing board 30, and the second heat sink 13 can be improved. This reduces the risk of displacement or loosening of the component in high-dynamic scenarios and the risk of fastener loosening due to vibration during long-term use. Consequently, the structural and operational reliability of the control device can be improved, making it suitable for high-dynamic motion scenarios of humanoid robots. Furthermore, the configuration of this embodiment facilitates layered disassembly, improving the ease of assembly and disassembly and maintainability of the control device, and facilitating future upgrades, maintenance, and replacements.

[0133] Furthermore, in order to maintain the function and effectiveness of the second computing board 30, the fourth fastener 130 is installed in a position that avoids the circuit and electronic component layout of the second computing board 30. Therefore, regardless of whether the fourth fastener 130 is a metal or non-metal part, it will not affect the grounding isolation of the second computing board 30, thereby reducing the risk of short circuits, electric shocks, arcing and other phenomena in the second computing board 30, and improving the safety, reliability, and service life of the second computing board 30 and its circuits and electronic components.

[0134] Of course, in other embodiments, the second housing 110, the second computing board 30, and the second heat sink 13 can be connected and fixed in sequence by other means (such as welding, snap-fitting, bonding, etc.).

[0135] Please see Figure 1 Some embodiments of this application provide a humanoid robot, including the control device provided in the embodiments of this application. The control device can be disposed inside the humanoid robot as needed, for example, it can be disposed inside the chest cavity of the humanoid robot.

[0136] By adopting the above-mentioned solution, the humanoid robot can realize the core functions of motion control and vision control by applying the control device provided in the embodiments of this application, which is convenient for later upgrades and maintenance; the space occupied by the control device is reduced, thereby improving the space utilization rate, which is beneficial to the spatial layout, integration and miniaturization of the humanoid robot; and the safety, reliability and stability of the humanoid robot are improved based on the better electrical safety, reliability and stability of the control device.

[0137] The above are merely optional embodiments of this application and are not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the scope of the claims of this application.

Claims

1. A control device, characterized in that, include: A heat dissipation assembly includes a fan, and a first heat dissipation component and a second heat dissipation component that overlap each other, wherein the first heat dissipation component and the second heat dissipation component enclose a heat dissipation space that extends along a first direction, and the fan is disposed on the side of the heat dissipation space along the first direction. The first computing board is located on the side of the first heat sink that faces away from the second heat sink, and is insulated and thermally connected to the first heat sink. The second computing board is located on the side of the second heat sink that faces away from the first heat sink, and is insulated and thermally connected to the second heat sink.

2. The control device as described in claim 1, characterized in that, The heat dissipation assembly includes a finned structure, which is connected between the first heat dissipation component and the second heat dissipation component and extends along the first direction. The heat dissipation space is divided into at least two air ducts by the finned structure.

3. The control device as described in claim 2, characterized in that, The fin structure includes a plurality of first fins connected to the first heat sink and spaced apart along the second direction, and a plurality of second fins connected to the second heat sink and spaced apart along the second direction, wherein the second direction is perpendicular to the first direction. Each of the first fins corresponds to one of the second fins, with the corresponding first fins and second fins extending toward each other and abutting against each other.

4. The control device as described in any one of claims 1-3, characterized in that, The fan is provided in multiple parts, some of which are first fans and others are second fans. The first fans are located on one side of the heat dissipation space along the first direction, and the second fans are located on the other side of the heat dissipation space along the first direction. The first fan and the second fan are alternately arranged along a second direction, which is perpendicular to the first direction.

5. The control device as described in claim 4, characterized in that, The control device includes an insulating isolation plate disposed between the first computing board and the first heat sink, and the insulating isolation plate has a through hole; The first heat sink includes a heat-conducting platform protruding toward the first computing board, the heat-conducting platform passing through the first hole and being insulated and thermally connected to the first computing board.

6. The control device as described in claim 5, characterized in that, An insulating and thermally conductive adhesive layer is provided between the heat-conducting platform and the first computing board; And / or, the first computing board has a first component that abuts against the heat-conducting platform, and the outer shell of the first component is an insulating shell.

7. The control device as described in claim 5, characterized in that, The control device includes a first housing, which covers the side of the first heat sink facing away from the second heat sink. The first housing and the first heat sink together form a first space, and the first computing board and the insulating isolation plate are located within the first space. The insulating isolation plate has a first connecting post protruding on the side facing the first computing board. The control device includes a first fastener corresponding to the first connecting post and a second fastener corresponding to the first fastener. The nail portion of the first fastener passes through and connects the first computing board and the first connecting post, and the second fastener passes through and connects the first housing and the head of the first fastener.

8. The control device as described in claim 4, characterized in that, The second computing board has a second component that abuts against the second heat sink, and the control device includes an insulating heat-conducting sheet disposed between the second component and the second heat sink.

9. The control device as described in claim 8, characterized in that, The control device further includes insulating fasteners, which are inserted through and connected to the second heat sink, the insulating heat-conducting sheet, and the second component.

10. The control device as claimed in claim 8, characterized in that, The control device includes a second housing, which covers the side of the second heat sink facing away from the first heat sink. The second housing and the second heat sink together form a second space, and the second computing board and the insulating heat-conducting sheet are located in the second space. The second heat sink further includes a second connecting post protruding toward the second computing board, and the control device includes a third fastener corresponding to the second connecting post, a fourth fastener corresponding to the third fastener, and a fifth fastener corresponding to the fourth fastener. The nail portion of the third fastener is connected to the second connecting post, the head of the third fastener abuts against the second computing board, the nail portion of the fourth fastener passes through and connects the second computing board and the head of the third fastener, the head of the fourth fastener abuts against the second housing, and the fifth fastener passes through and connects the second housing and the head of the fourth fastener.

11. A humanoid robot, characterized in that, Includes the control device as described in any one of claims 1-10.

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