Wafer dicing machine for chip production

Abstract

The utility model relates to wafer dicing machine technical field, concretely is a kind of wafer dicing machine for chip production, including fixed frame, the bottom of the fixed frame is rotatably connected with rotating stand, the top left side fixed connection of fixed frame bottom plate has transmission case, the front and rear sides of rotating stand bottom are slidably connected with a pair of mounting bracket, the inside of mounting bracket is equipped with driving motor, motor spindle and dicing cutter, the top left side fixed connection of rotating stand has adjusting box, the right side fixed connection of fixed frame has controller, the inside of transmission case is equipped with rotating mechanism, the inside of adjusting box is equipped with adjusting mechanism. The utility model has realized the rotation of rotating stand and the adjustment of mounting bracket, has promoted the convenience and adjustability of device.

Description

Technical Field

[0001] This utility model relates to the field of wafer dicing machine technology, specifically a wafer dicing machine for chip production. Background Technology

[0002] A wafer dicing machine is a device used to cut semiconductor wafers into smaller chips. It plays a crucial role in the semiconductor manufacturing process. Using a dicing disc and dicing blades, the machine rotates and cuts the chips on the wafer, dicing large wafers into smaller chips. These chips, after dicing, can be used to manufacture various electronic products, such as mobile phone and computer chips. Wafer dicing machines are widely used in the semiconductor industry and are an indispensable piece of equipment in semiconductor manufacturing. With the rapid development of semiconductor technology, the requirements for dicing precision and efficiency are becoming increasingly stringent, and wafer dicing machines are constantly undergoing technological innovation and improvement.

[0003] Existing devices primarily use dicing tools to cut wafers on a wafer carrier. Current technology is largely similar to a wafer dicing machine used in chip manufacturing. For example, CN219359078U describes a wafer carrier and a mounting frame positioned above it. An electric spindle is mounted on the mounting frame, and the output end of the electric spindle is equipped with a dicing tool. The device also includes a rotary drive mechanism, comprising a mounting plate, a rotating shaft, and a rotary drive component mounted on the mounting plate. The rotating shaft is rotatably connected to the mounting plate and fixedly connected to the mounting frame. This invention enables precise wafer dicing and saves dicing time; however, there are still areas for optimization.

[0004] Existing devices mainly limit the dicing tool to a fixed frame, making it difficult for some devices to adjust the orientation of the dicing blade according to the cutting path, thus making it inconvenient to dicing the wafer. At the same time, some devices have difficulty adjusting the spacing of the dicing blade according to the size of the wafer, making it difficult to cut the wafer to the appropriate size, thus reducing the working efficiency and practicality of the device. Therefore, in order to solve the above problems, a wafer dicing machine for chip production is proposed. Utility Model Content

[0005] The purpose of this invention is to provide a wafer dicing machine for chip manufacturing, in order to solve the problems mentioned in the background art. The existing devices mainly limit the dicing tool to a fixed frame, making it difficult for some devices to adjust the orientation of the dicing tool according to the cutting path, which makes it inconvenient to dicing the wafer. At the same time, some devices have difficulty adjusting the spacing of the dicing tools according to the size of the wafer, which makes it inconvenient to cut the wafer to a suitable size.

[0006] To achieve the above objectives, this utility model provides the following technical solution: a wafer dicing machine for chip production, comprising a fixed frame, a rotating frame rotatably connected to the bottom of the fixed frame, a transmission box fixedly connected to the top left side of the fixed frame base plate, a pair of mounting frames slidably connected to the front and rear sides of the bottom of the rotating frame, a drive motor fixedly connected to the inner wall of the mounting frame, a motor spindle fixedly connected to the inner middle of the drive motor, a dicing tool fixedly connected to the inner end of the motor spindle, an adjustment box fixedly connected to the top left side of the rotating frame, and a controller fixedly connected to the right side of the fixed frame; The transmission box is equipped with a rotating mechanism, which includes a first motor. The rear side of the first motor is fixedly connected to the front side of the transmission box. The adjustment box is equipped with an adjustment mechanism, which includes a second motor. The right side of the second motor is fixedly connected to the middle left side of the adjustment box.

[0007] Preferably, a transmission worm is fixedly connected to the middle of the rear side of the first motor, the rear end of the transmission worm is movably connected to the rear side of the inner wall of the transmission box, and a transmission worm wheel is meshed with the left side of the outer wall of the transmission worm.

[0008] Preferably, a rotating shaft is fixedly connected to the inner wall of the transmission worm gear, the top end of the rotating shaft is movably connected to the top of the inner wall of the transmission box, and the bottom end of the rotating shaft passes through the bottom plate of the fixed frame and is fixedly connected to the main gear.

[0009] Preferably, an internal gear is meshed with the left side of the outer wall of the main gear, and the bottom of the internal gear is fixedly connected to the top right side of the rotating frame.

[0010] Preferably, a drive shaft is fixedly connected to the middle right side of the second motor, and the right end of the drive shaft passes through the left side wall of the regulating box and is fixedly connected to a first bevel gear.

[0011] Preferably, a second bevel gear is meshed with the right side of the first bevel gear, and a symmetrical screw is fixedly connected to the inner wall of the second bevel gear. The two ends of the symmetrical screw are movably connected to both sides of the inner wall of the regulating box.

[0012] Preferably, the outer walls of the symmetrical screw are threadedly connected to push sleeves on both sides, and the outer walls of the push sleeves pass through the rotating frame and are fixedly connected to the top center of the mounting frame.

[0013] Compared with the prior art, the beneficial effects of this utility model are: 1. This utility model utilizes a rotating mechanism comprising a first motor, a transmission worm, a transmission worm wheel, a rotating shaft, a main gear, and an internal gear. A controller activates the first motor to drive the transmission worm to rotate in a limited position. This causes the transmission worm to mesh and drive the transmission worm wheel, rotating shaft, and main gear to rotate in a limited position. The main gear then meshes and drives the internal gear and rotating frame to rotate in a limited position, thus achieving the rotation of the rotating frame. This allows some parts of the device to adjust the orientation of the dicing tool according to the cutting path, facilitating wafer dicing and improving the convenience and practicality of the device.

[0014] 2. This utility model, through the adjustment mechanism including a second motor, transmission shaft, first bevel gear, second bevel gear, symmetrical screw, and pusher sleeve, etc., uses a controller to start the second motor to drive the transmission shaft and first bevel gear to rotate in a limited position. The first bevel gear meshes and drives the second bevel gear and symmetrical screw to rotate in a limited position. The symmetrical screw drives the pusher sleeve and mounting bracket to slide symmetrically, thereby realizing the adjustment of the mounting bracket. This allows some parts of the device to adjust the spacing of the dicing blades according to the size of the wafer, making it easier to cut the wafer to a suitable size, thus improving the adjustability and practicality of the device. Attached Figure Description

[0015] Figure 1 This is a front side perspective view of the structure of this utility model; Figure 2 This is a left perspective view of the structure of the rotating frame and cutting assembly of this utility model; Figure 3 This is a frontal sectional perspective view of a partial structure of this utility model; Figure 4 This is a left-side sectional perspective view of a partial structure of the transmission box and rotating mechanism of this utility model; Figure 5 This is a left-side sectional perspective view of a partial structure of the regulating box and regulating mechanism of this utility model.

[0016] In the diagram: 11. Fixed frame; 12. Rotating frame; 13. Transmission box; 14. Mounting frame; 15. Drive motor; 16. Motor spindle; 17. Slicing tool; 18. Adjustment box; 19. Controller; 2. Rotating mechanism; 21. First motor; 22. Transmission worm gear; 23. Transmission worm wheel; 24. Rotating shaft; 25. Main gear; 26. Internal gear; 3. Adjustment mechanism; 31. Second motor; 32. Transmission shaft; 33. First bevel gear; 34. Second bevel gear; 35. Symmetrical screw; 36. Pushing sleeve. Detailed Implementation

[0017] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0018] Please see Figures 1-5 One embodiment provided by this utility model: A wafer dicing machine for chip manufacturing includes a fixed frame 11, a rotating frame 12 rotatably connected to the bottom of the fixed frame 11, a transmission box 13 fixedly connected to the top left side of the base plate of the fixed frame 11, a pair of mounting frames 14 slidably connected to the front and rear sides of the bottom of the rotating frame 12, a drive motor 15 fixedly connected to the inner wall of the mounting frame 14, a motor spindle 16 fixedly connected to the inner middle of the drive motor 15, a dicing tool 17 fixedly connected to the inner end of the motor spindle 16, an adjustment box 18 fixedly connected to the top left side of the rotating frame 12, and a controller 19 fixedly connected to the right side of the fixed frame 11. The transmission box 13 is equipped with a rotating mechanism 2, which includes a first motor 21. The rear side of the first motor 21 is fixedly connected to the front side of the transmission box 13. A transmission worm 22 is fixedly connected to the middle of the rear side of the first motor 21. The rear end of the transmission worm 22 is movably connected to the rear side of the inner wall of the transmission box 13. A transmission worm wheel 23 is meshed with the left side of the outer wall of the transmission worm 22. Through this design, the first motor 21 drives the transmission worm 22 to rotate in a limited position, so that the transmission worm 22 meshes with and drives the transmission worm wheel 23 to rotate. A rotating shaft 24 is fixedly connected to the inner wall of the transmission box 13. The top end of the rotating shaft 24 is movably connected to the top of the inner wall of the transmission box 13. The bottom end of the rotating shaft 24 passes through the bottom plate of the fixed frame 11 and is fixedly connected to the main gear 25. Through this design, the transmission worm gear 23 drives the rotating shaft 24 and the main gear 25 to rotate in a limited position. An internal gear 26 is meshed with the left side of the outer wall of the main gear 25. The bottom of the internal gear 26 is fixedly connected to the top right side of the rotating frame 12. Through this design, the main gear 25 meshes and drives the internal gear 26 and the rotating frame 12 to rotate in a limited position.

[0019] The regulating box 18 is equipped with an regulating mechanism 3, which includes a second motor 31. The right side of the second motor 31 is fixedly connected to the middle left side of the regulating box 18. A drive shaft 32 is fixedly connected to the middle right side of the second motor 31. The right end of the drive shaft 32 passes through the left side wall of the regulating box 18 and is fixedly connected to a first bevel gear 33. Through this design, the second motor 31 drives the drive shaft 32 and the first bevel gear 33 to rotate in a limited position. A second bevel gear 34 is meshed with the right side of the first bevel gear 33. A symmetrical screw 35 is fixedly connected to the inner wall of the gear 34. The two ends of the symmetrical screw 35 are movably connected to the two sides of the inner wall of the regulating box 18. Through this design, the first bevel gear 33 meshes and drives the second bevel gear 34 and the symmetrical screw 35 to rotate in a limited position. The outer walls of the symmetrical screw 35 are threaded with push sleeves 36. The lower part of the outer wall of the push sleeve 36 passes through the rotating frame 12 and is fixedly connected to the top middle of the mounting frame 14. Through this design, the symmetrical screw 35 drives the push sleeve 36 and the mounting frame 14 to slide symmetrically.

[0020] Working principle: When the rotating frame 12 needs to be rotated, the first motor 21 is started by the controller 19. The first motor 21 drives the transmission worm 22 to rotate in a limited position, so that the transmission worm 22 meshes and drives the transmission worm wheel 23 to rotate. The transmission worm wheel 23 drives the rotating shaft 24 to rotate in a limited position. The rotating shaft 24 drives the main gear 25 to rotate in a limited position. The main gear 25 meshes and drives the internal gear 26 to rotate. The internal gear 26 drives the rotating frame 12 to rotate in a limited position, thus realizing the rotation operation of the rotating frame 12.

[0021] When the mounting bracket 14 needs to be adjusted, the second motor 31 is first started by the controller 19. The second motor 31 drives the transmission shaft 32 to rotate in a limited position. The transmission shaft 32 drives the first bevel gear 33 to rotate synchronously. The first bevel gear 33 meshes and drives the second bevel gear 34 to rotate. The second bevel gear 34 drives the symmetrical screw 35 to rotate in a limited position. The symmetrical screw 35 drives the push screw sleeve 36 to slide symmetrically. The push screw sleeve 36 drives the mounting bracket 14 to slide synchronously, so that the spacing of the dicing blades 17 is half the radius of the wafer, thus realizing the adjustment operation of the mounting bracket 14. The operation ends here.

[0022] The above are merely preferred embodiments of this utility model and are not intended to limit the utility model in any way. Those skilled in the art can readily implement this utility model based on the accompanying drawings and the description above. However, any modifications, alterations, or variations made by those skilled in the art without departing from the scope of the utility model's technical solution, utilizing the disclosed technical content, are equivalent embodiments of this utility model. Furthermore, any equivalent changes, alterations, or variations made to the above embodiments based on the essential technology of this utility model are still within the protection scope of this utility model's technical solution.

Claims

1. A wafer dicing machine for chip manufacturing, comprising a fixture (11), characterized in that: The bottom of the fixed frame (11) is rotatably connected to a rotating frame (12). The top left side of the bottom plate of the fixed frame (11) is fixedly connected to a transmission box (13). The front and rear sides of the bottom of the rotating frame (12) are slidably connected to a pair of mounting frames (14). The inner wall of the mounting frame (14) is fixedly connected to a drive motor (15). The middle inner side of the drive motor (15) is fixedly connected to a motor spindle (16). The inner end of the motor spindle (16) is fixedly connected to a slicing tool (17). The top left side of the rotating frame (12) is fixedly connected to an adjustment box (18). The right side of the fixed frame (11) is fixedly connected to a controller (19). The transmission box (13) is provided with a rotating mechanism (2) inside. The rotating mechanism (2) includes a first motor (21). The rear side of the first motor (21) is fixedly connected to the front side of the transmission box (13). The regulating box (18) is provided with an regulating mechanism (3) inside. The regulating mechanism (3) includes a second motor (31). The right side of the second motor (31) is fixedly connected to the middle left side of the regulating box (18).

2. The wafer dicing machine for chip manufacturing according to claim 1, characterized in that: A transmission worm (22) is fixedly connected to the middle of the rear side of the first motor (21). The rear end of the transmission worm (22) is movably connected to the rear side of the inner wall of the transmission box (13). A transmission worm wheel (23) is meshed with the left side of the outer wall of the transmission worm (22).

3. The wafer dicing machine for chip manufacturing according to claim 2, characterized in that: The inner wall of the transmission worm gear (23) is fixedly connected to a rotating shaft (24), the top end of the rotating shaft (24) is movably connected to the top of the inner wall of the transmission box (13), and the bottom end of the rotating shaft (24) passes through the bottom plate of the fixed frame (11) and is fixedly connected to a main gear (25).

4. A wafer dicing machine for chip manufacturing according to claim 3, characterized in that: The outer left side of the main gear (25) is meshed with an inner gear (26), and the bottom of the inner gear (26) is fixedly connected to the top right side of the rotating frame (12).

5. A wafer dicing machine for chip manufacturing according to claim 1, characterized in that: The right side of the second motor (31) is fixedly connected to a drive shaft (32), and the right end of the drive shaft (32) passes through the left side wall of the regulating box (18) and is fixedly connected to a first bevel gear (33).

6. A wafer dicing machine for chip manufacturing according to claim 5, characterized in that: The right side of the first bevel gear (33) is meshed with a second bevel gear (34), and the inner wall of the second bevel gear (34) is fixedly connected with a symmetrical screw (35). The two ends of the symmetrical screw (35) are movably connected to the two sides of the inner wall of the regulating box (18).

7. A wafer dicing machine for chip manufacturing according to claim 6, characterized in that: The outer walls of the symmetrical screw (35) are threaded with push sleeves (36) on both sides. The outer walls of the push sleeves (36) pass through the rotating frame (12) and are fixedly connected to the top middle of the mounting frame (14).

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