An apparatus for manufacturing a gold card and a gold card

Abstract

The application provides a device for manufacturing a gold card and the gold card. The device for manufacturing the gold card comprises a host, an upper die assembly, a lower die assembly and a deformation assembly. The host is arranged on a support surface. The upper die assembly is connected with the host, and the upper die assembly is located at an end away from the support surface and slides along the height direction of the host. The lower die assembly is connected with the host, and the lower die assembly is arranged opposite to the upper die assembly, and the upper die assembly slides to be close to or away from the upper die assembly. The deformation assembly is connected with the lower die assembly, and when the upper die assembly slides to press the first flexible member in the deformation assembly, the deformation assembly generates a deformation force under pressure. The above structure improves the uniformity of forming.

Description

Technical Field

[0001] This application relates to the field of gold production, and more particularly to an apparatus for producing gold cards and a gold card. Background Technology

[0002] Gold cards, as high-value precious metal crafts or high-end gifts, are experiencing increasing market demand. These cards are typically made of pure gold or gold alloy foil, with intricate and clear patterns or text embossed on the surface. The core of their production process lies in using precision molds to stamp and shape soft gold blanks.

[0003] Currently, the production equipment for gold cards generally adopts the rigid molding technology of hydraulic presses. That is, through a rigid mold system consisting of an upper mold and a lower mold, the upper and lower molds are driven by external force to close at high speed, thereby applying huge instantaneous pressure to the gold blank placed between them, and completing the transfer and shaping of the pattern.

[0004] However, rigid pressing introduces inherent technical drawbacks. While gold is malleable, its ductility is extremely sensitive to the uniformity of pressure distribution. Ideally, the mold and the blank should achieve complete surface contact. In reality, microscopic unevenness of the mold, assembly errors, or slight thickness variations in the blank can all lead to uneven pressure distribution during mold closing, resulting in stress concentration in localized areas. This concentrated stress can easily exceed the material's yield strength, causing microcracks, internal damage, or even direct breakage of the card, severely reducing product yield and mechanical strength.

[0005] Uneven pressure distribution can directly affect the transfer quality of the pattern. Areas with excessive pressure may result in over-printing, blurred details, or thinning of the material. Areas with insufficient pressure, on the other hand, will cause the pattern to be blurry or incomplete. The final card is prone to uneven surface, uneven thickness, and poor pattern clarity.

[0006] Therefore, there is a need for a device and a gold card for making gold cards that improves the uniformity of force distribution. Utility Model Content

[0007] In view of this, it is necessary to provide an apparatus for producing gold cards and a gold card that improves the uniformity of force distribution, so as to solve the above problems.

[0008] Embodiments of this application provide an apparatus for producing gold cards, comprising: The main unit is mounted on the support surface; The upper mold assembly is connected to the main unit and is located at one end opposite to the support surface, and slides along the height direction of the main unit; The lower mold assembly is connected to the host and is positioned opposite the upper mold assembly, and the upper mold assembly slides to fit against or move away from the upper mold assembly; The deformation component is connected to the lower mold component, and when the upper mold component slides to press the first flexible member in the deformation component, the deformation component is compressed and generates a deformation force.

[0009] In at least one embodiment of this application, the deformation component includes: A first flexible component is connected to the lower mold assembly and is located between the upper mold assembly and the lower mold assembly; The second flexible component is connected to the lower mold assembly and is located at the end of the lower mold assembly opposite to the upper mold assembly.

[0010] In at least one embodiment of this application, the upper mold component includes: A sliding rod is provided along the height direction of the main unit; The drive table is slidably connected to the sliding rod.

[0011] In at least one embodiment of this application, the upper mold component further includes: A fixed plate is connected to the drive worktable, wherein the drive worktable drives the fixed plate to move relative to the lower mold assembly, and in the working state, it fits with the lower mold assembly to implement the hydraulic process.

[0012] In at least one embodiment of this application, the lower mold assembly includes: A support member is fixedly connected to the sliding rod and located at one end of the sliding rod near the support surface, and is used to support the lower mold assembly; A concave mold is disposed within the support member and is positioned opposite to the fixed plate so that it fits against the forming surface of the fixed plate to form a cavity when the upper mold assembly is pressed down.

[0013] In at least one embodiment of this application, the first flexible member is sleeved on the sliding rod, and the first flexible member is in close contact with the support member.

[0014] In at least one embodiment of this application, the second flexible member is connected to the die and is located at one end near the support surface.

[0015] In at least one embodiment of this application, the second flexible member is connected to the die and is located at one end near the support surface.

[0016] A gold card, wherein the gold card is manufactured by hydraulic pressing using any of the aforementioned gold card manufacturing apparatuses.

[0017] The gold card includes: The main body is located inside the die cavity; The patterned side faces the fixed plate and is made of the fixed plate.

[0018] The aforementioned apparatus and gold card manufacturing process utilize a deformation component. When the upper mold assembly slides to contact the deformation component, the deformation component generates deformation force to absorb or disperse the impact during the pressing process, ensuring that the pressure is evenly transmitted to the gold card material. This avoids localized stress concentration and reduces the risk of card deformation and cracking. Furthermore, as an active element, the deformation component adjusts the pressure distribution in real time during mold contact, compensating for unevenness in the mold or material and ensuring uniform card forming. Attached Figure Description

[0019] Figure 1 A perspective view of the apparatus for making gold cards as described in this application; Figure 2 This is a front view of the apparatus for making gold cards as described in this application; Figure 3 This is a schematic diagram of the back structure of the lower mold component described in this application; Figure 4 This is a schematic diagram of the structure of the gold card described in this application.

[0020] Explanation of main component symbols 100. Apparatus for making gold cards; 10. Main unit; 11. Support surface; 20. Upper mold assembly; 21. Sliding rod; 22. Drive worktable; 23. Fixing plate; 30. Lower mold assembly; 31. Support component; 32. Die; 40. Deformation component; 41. First flexible component; 42. Second flexible component; 200. Gold card; 210. Body; 220. Pattern surface; F1. Height direction of the main unit. Detailed Implementation

[0021] The embodiments of this application will now be described with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments.

[0022] It should be noted that when a component is considered to be "connected" to another component, it can be directly connected to the other component or may also have an intervening component. When a component is considered to be "placed" on another component, it can be directly placed on the other component or may also have an intervening component. The terms "top," "bottom," "upper," "lower," "left," "right," "front," "back," and similar expressions used in this article are for illustrative purposes only.

[0023] This application provides an apparatus for manufacturing gold cards and a gold card. The apparatus for manufacturing gold cards includes a main unit, an upper mold assembly, a lower mold assembly, and a deformation assembly. The main unit is disposed on a support surface. The upper mold assembly is connected to the main unit and is located at one end opposite to the support surface, and slides along the height direction of the main unit. The lower mold assembly is connected to the main unit and is disposed opposite to the upper mold assembly, and slides to conform to or move away from the upper mold assembly. The deformation assembly is connected to the lower mold assembly, and when the upper mold assembly slides to press against a first flexible member in the deformation assembly, the deformation assembly is compressed and generates a deformation force.

[0024] The aforementioned apparatus and gold card manufacturing process utilize a deformation component. When the upper mold assembly slides to contact the deformation component, the deformation component generates deformation force to absorb or disperse the impact during the pressing process, ensuring that the pressure is evenly transmitted to the gold card material. This avoids localized stress concentration and reduces the risk of card deformation and cracking. Furthermore, as an active element, the deformation component adjusts the pressure distribution in real time during mold contact, compensating for unevenness in the mold or material and ensuring uniform card forming.

[0025] The following detailed description of some embodiments of this application is provided in conjunction with the accompanying drawings. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0026] Please see Figures 1-4 This application provides an apparatus 100 for making gold cards. The apparatus 100 includes a main unit 10, an upper mold assembly 20, a lower mold assembly 30, and a deformation assembly 40. The main unit 10 is disposed on a support surface 11. The upper mold assembly 20 is connected to the main unit 10, located at one end away from the support surface 11, and slides along the height direction F1 of the main unit. The lower mold assembly 30 is connected to the main unit 10, and is disposed opposite to the upper mold assembly 20, with the upper mold assembly 20 sliding to conform to or move away from the upper mold assembly 20. The deformation assembly 40 is connected to the lower mold assembly 30, and when the upper mold assembly 20 slides to press against the first flexible member 41 in the deformation assembly 40, the deformation assembly 40 is compressed and generates a deformation force.

[0027] In this embodiment, it should be noted that a device 100 for making gold cards includes a host 10, an upper mold assembly 20, a lower mold assembly 30, and a deformation assembly 40. The overall structure is reasonably designed to solve the problem that the gold card 200 may crack, deform, or have unclear patterns due to uneven pressure distribution during the existing rigid molding process.

[0028] The main unit 10 is fixedly mounted on a sturdy support surface 11 to bear the weight of the entire device and the impact forces during processing. The upper mold assembly 20 is mounted above the main unit 10, located at the end opposite to the support surface 11, and is slidably positioned along the height direction F1 of the main unit to allow for vertical movement during the process. The upper mold assembly 20 is connected to the main unit 10 via a guide structure to ensure the stability and accuracy of its movement. The lower mold assembly 30 is mounted at the end of the main unit 10 closest to the support surface 11, directly opposite the upper mold assembly 20, together forming the working cavity for processing the gold card 200. Through the sliding of the upper mold assembly 20, the lower mold assembly 30 can be tightly fitted or separated from the upper mold assembly 20, meeting the process requirements at different stages.

[0029] The deformation component 40 is connected to the lower mold assembly 30 and arranged between the upper mold assembly 20 and the lower mold assembly 30. When the upper mold assembly 20 slides downward to contact and press the first flexible member 41 in the deformation component 40, the first flexible member 41 generates a deformation force after being pressed. This deformation force can absorb part of the impact and achieve pressure buffering and dispersion through flexible deformation, thereby evenly distributing the pressure transmitted from the upper mold onto the gold blank. Through the action of the deformation component 40, the local stress concentration phenomenon caused by uneven mold appearance or blank thickness difference in traditional rigid molding is effectively avoided.

[0030] Furthermore, in this embodiment, the position of the deformation component 40 allows it to automatically adjust its stress state during the mold closing process between the upper and lower molds, achieving real-time dynamic compensation. This flexible compensation mechanism ensures that the mold can always achieve full and uniform contact with the gold blank during the pressing process, thereby improving the uniformity of the molding and the clarity of the pattern.

[0031] The technical solution of this embodiment achieves pressure buffering and dispersion during the stamping process by setting a deformation component 40 on the lower die assembly 30 and causing the first flexible component 41 to deform under force during the pressing process of the upper die assembly 20. Compared with traditional rigid molds, this device can significantly reduce local stress concentration when forming the gold card 200, avoiding micro-cracks or breakage of the gold card 200 during processing. At the same time, because the pressure can be transmitted more evenly to the entire surface of the blank, the transfer of the pattern is clearer and more complete, and the surface flatness and thickness uniformity are also effectively guaranteed.

[0032] Therefore, this embodiment not only improves the yield rate of the gold card 200, but also enhances the product's appearance quality and mechanical properties, meeting the stringent quality and precision requirements of the high-end precious metal crafts market. Through this solution, companies can reduce production costs, increase production efficiency, and gain a competitive edge in the market.

[0033] In one specific embodiment, the deformation component 40 includes a first flexible member 41 and a second flexible member 42. The first flexible member 41 is connected to the lower mold component 30 and is located between the upper mold component 20 and the lower mold component 30. The second flexible member 42 is connected to the lower mold component 30 and is located at the end of the lower mold component 30 opposite to the upper mold component 20.

[0034] Specifically, in this embodiment, it should be noted that the deformation component 40 includes two parts: a first flexible component 41 and a second flexible component 42. Through reasonable connection and arrangement with the lower mold component 30, the two components work together to buffer, disperse and adjust the pressure during the molding process, thereby providing more precise and gentle pressure control during the stamping process of the gold card 200.

[0035] The first flexible component 41 is positioned between the upper die assembly 20 and the lower die assembly 30, above the entire stamping working area, and directly facing the forming surface of the upper die assembly 20. This first flexible component 41 is fixedly connected to the lower die assembly 30 via a fastening structure. Its main function is to contact the upper die assembly 20 immediately when it presses downwards, and absorb part of the impact force through its own elastic deformation, effectively mitigating the initial high impact pressure. Simultaneously, the first flexible component 41 can undergo localized deformation according to different stress states, resulting in a more uniform pressure distribution and preventing stress concentration caused by minor unevenness on the die surface or the thickness of the gold blank. In other words, the first flexible component 41 acts as both a buffer and a pressure equalizer throughout the stamping process.

[0036] The second flexible component 42 is located at the end of the lower mold assembly 30 furthest from the upper mold assembly 20, i.e., at the bottom of the lower mold assembly 30. It is also tightly connected to the lower mold assembly 30 via a fixed or embedded method. Its main function is to further absorb the remaining impact force transmitted from the upper mold assembly 20 and the first flexible component 41, and to gradually release the downward-transmitted force to the support surface 11 through its flexible structure, preventing the impact force from directly acting on the host machine 10 or the support surface 11, thus avoiding equipment wear or structural fatigue. Furthermore, the presence of the second flexible component 42 can also form a secondary buffer to a certain extent, working in conjunction with the first flexible component 41 throughout the molding process to ensure that the up-and-down movement of the mold remains stable and gentle.

[0037] Through this combination of upper and lower flexible components, the entire deformation assembly 40 forms a double-layer flexible buffer system. The upper first flexible component 41 is responsible for directly acting between the gold blank and the mold, ensuring the uniformity and precision of the pattern formation. The lower second flexible component 42 is responsible for isolating the equipment from impact, extending the service life of the main unit 10 and the mold, and maintaining the stability of the equipment operation.

[0038] Implementing the technical solution of this embodiment, since the deformation component 40 includes both a first flexible member 41 and a second flexible member 42, their coordinated operation makes the force distribution during the entire stamping process more reasonable. Firstly, the first flexible member 41 acts as a buffer when the die initially contacts the gold blank, actively adjusting the pressure distribution to ensure that the pressure is evenly transmitted to the blank surface, preventing localized overpressure that could cause cracks or surface depressions in the gold card 200, thus ensuring the integrity and precision of the formed pattern. Secondly, the second flexible member 42 acts as a shock absorber throughout the process, effectively dispersing and releasing impact loads, protecting the lower die assembly 30 and the main unit 10 from damage caused by excessive impact.

[0039] Through the technical solution of this embodiment, the equipment operates more smoothly, the mold life is extended, and the gold card 200 can maintain excellent surface quality and structural integrity during stamping. Compared with traditional single rigid molding, this dual flexible component structure not only improves the yield of gold card 200 but also reduces equipment maintenance costs, making the production process more efficient, safe, and reliable. This structure is particularly suitable for the mass production and precision manufacturing of high-end gold card 200, meeting the market demand for high-quality products.

[0040] In one specific embodiment, the upper mold assembly 20 includes a sliding rod 21, a drive worktable 22, and a fixing plate 23. The sliding rod 21 is arranged along the height direction of the main unit 10. The drive worktable 22 is slidably connected to the sliding rod 21. The fixing plate 23 is connected to the drive worktable 22. The drive worktable 22 drives the fixing plate 23 to move relative to the lower mold assembly 30, and in the working state, it fits against the lower mold assembly 30 to implement the hydraulic process.

[0041] First, the sliding rod 21 is positioned along the height F1 of the main unit. Its upper end is securely connected to the frame of the main unit 10, and its lower end extends through the entire upper die assembly 20, working in conjunction with the drive worktable 22. The sliding rod 21 serves as a guide, ensuring that the upper die assembly 20 remains vertical and precise during its up-and-down movement, preventing any skewing or wobbling. The sliding rod 21 is made of high-strength, wear-resistant material, and its surface undergoes precision machining and anti-corrosion treatment to ensure good sliding performance and stability even during prolonged operation. Furthermore, a lubrication system is provided between the sliding rod 21 and the main unit 10 to reduce friction and improve the smoothness of the stamping process.

[0042] Secondly, the drive table 22 is mounted on the sliding rod 21 via a sliding connection, enabling smooth up-and-down movement along the axial direction of the sliding rod 21. The bottom of the drive table 22 is directly connected to the fixed plate 23, serving as the core transmission component of the entire upper die assembly 20. In actual operation, the drive table 22 is driven by a hydraulic system or an electric servo mechanism, and under the command of the control program, it drives the fixed plate 23 to move downwards or return upwards. A precision sliding sleeve or guide structure is provided between the drive table 22 and the sliding rod 21 to reduce gaps and vibrations caused by high-frequency movement during the stamping process, ensuring motion accuracy.

[0043] Finally, the fixing plate 23 is installed at the lower end of the drive worktable 22. Its lower surface is a specially designed forming surface, used to form a stamping cavity together with the die 32 in the lower die assembly 30. The fixing plate 23 and the drive worktable 22 are firmly connected by fasteners or an integrated structure, which can withstand the huge instantaneous pressure during the stamping process without deformation. In the working state, the drive worktable 22 drives the fixing plate 23 to move downward and fit tightly against the lower die assembly 30. The gold billet is clamped between the fixing plate 23 and the die 32, thereby implementing the hydraulic process to complete the stamping of the gold card 200. The forming surface of the fixing plate 23 is machined with high precision to ensure the clarity of the pattern details, and different forming dies can be replaced according to design needs to adapt to the production of gold cards 200 with different patterns or specifications.

[0044] In addition, to further improve the operational stability of the entire upper mold assembly 20, this embodiment can also add a buffer structure, such as an elastic washer or a hydraulic damper, between the drive worktable 22 and the sliding rod 21 to reduce the impact force on the drive worktable 22 during high-speed movement and improve the service life and operational reliability of the device.

[0045] By configuring a three-part cooperative structure consisting of a sliding rod 21, a drive worktable 22, and a fixed plate 23, high-precision guidance and stable driving of the upper die assembly 20 are achieved during the stamping process. The sliding rod 21 provides a stable linear motion trajectory, preventing the upper die from shifting or tilting during high-speed movement, thereby ensuring that all contact surfaces can accurately fit together and that pressure is evenly distributed when the die is closed. The drive worktable 22, as the core of power transmission, can smoothly and controllably drive the fixed plate 23 to perform lifting and lowering movements, ensuring the smoothness and repeatability of the stamping action.

[0046] In one specific embodiment, the lower mold assembly 30 includes a support member 31 and a die 32. The support member 31 is fixedly connected to the sliding rod 21, and is located at one end of the sliding rod 21 near the support surface 11, and is used to support the lower mold assembly 30. The die 32 is disposed within the support member 31, and is disposed opposite to the fixing plate 23, so that the die 32 fits against the molding surface of the fixing plate 23 to form a cavity when the upper mold assembly 20 is pressed down.

[0047] In this embodiment, it should be noted that, firstly, the support member 31 is located at the bottom of the lower die assembly 30 and is fixedly connected to the sliding rod 21 in the upper die assembly 20. Its main function is to bear the weight and working pressure of the entire lower die assembly 30, and at the same time, through the fixed connection with the sliding rod 21, to achieve a stable connection between the lower die assembly 30 and the overall structure of the main machine 10, preventing positional displacement or structural loosening caused by impact or vibration during the stamping process. The support member 31 is usually made of high-strength metal materials, such as alloy steel or ductile iron, to ensure that it has sufficient load-bearing capacity and impact resistance.

[0048] The surface of the support member 31 may be provided with positioning grooves, threaded holes or limiting bosses for precise installation of the die 32 and other auxiliary components, and these structures ensure that the die 32 remains in a fixed position during use.

[0049] Secondly, the die 32, embedded inside the support member 31, is an important forming element positioned opposite the fixing plate 23 in the upper die assembly 20. The upper surface of the die 32 is precision machined, and its cavity structure is customized according to the shape and pattern design of the gold card 200. During the stamping process, the die 32 and the fixing plate 23 of the upper die assembly 20 together form a closed cavity. The gold blank is placed on the die 32. When the upper die assembly 20 is pressed down, the fixing plate 23 and the forming surface of the die 32 fit tightly together, clamping the gold blank within. Under hydraulic pressure, the pattern is imprinted and the blank is shaped.

[0050] The bottom of the die 32 can be equipped with a buffer structure or through holes as needed to facilitate heat dissipation or cleaning after prolonged high-pressure operation. For ease of maintenance, the die 32 is usually connected to the support 31 via fasteners or a modular structure, allowing for quick replacement of different dies 32 when producing gold cards 200 of different specifications, thus improving equipment flexibility and production efficiency.

[0051] Through the combined design of the support member 31 and the die 32, the lower die assembly 30 not only provides a stable load-bearing foundation but also ensures the precise positioning of the gold blank. Before the stamping operation, the worker can accurately place the gold blank in the preset position area within the die 32 to ensure that there is no offset or misalignment during the stamping process, which has a crucial impact on the clarity of the pattern and the quality of the finished card.

[0052] By incorporating a support member 31 and a die 32 within the lower die assembly 30, and fixing the support member 31 to the sliding rod 21, a stable and reliable lower die support system is constructed. The support member 31 serves as the overall load-bearing component, ensuring that the high-intensity pressure from the upper die assembly 20 during stamping is evenly transmitted to the support surface 11, preventing damage to the equipment due to localized stress concentration. Simultaneously, the support member 31 provides a robust mounting base for the die 32, ensuring that the die 32 remains stable under high-pressure impact.

[0053] The die 32 and the fixed plate 23 are arranged opposite to each other, forming a complete closed cavity during stamping. This allows the gold blank to be evenly stressed under hydraulic pressure, thus achieving complete embossing of the surface pattern. Because the inner cavity of the die 32 is machined with high precision, it ensures clear details and sharp edges of the embossed pattern, significantly improving the appearance quality of the gold card 200. Furthermore, the replaceable structure of the die 32 allows the equipment to quickly switch between producing different types or specifications of cards, meeting diverse market demands and enhancing the equipment's versatility.

[0054] In one specific embodiment, the first flexible member 41 is sleeved on the sliding rod 21, and the first flexible member 41 is in close contact with the support member 31.

[0055] In this embodiment, it should be noted that the sliding rod 21 passes through the entire space between the upper mold assembly 20 and the lower mold assembly 30, and is arranged along the height direction F1 of the main unit, mainly serving a guiding and positioning function. In this embodiment, the first flexible member 41 is directly sleeved on the outer surface of the sliding rod 21 through a hollow cylindrical or annular structure. Due to the sleeve-type installation, the first flexible member 41 can generate controlled elastic deformation along the axial direction of the sliding rod 21 when pressed down by the upper mold assembly 20. Its movement is guided and constrained by the sliding rod 21, thereby ensuring that the first flexible member 41 remains stable during operation and will not shift or fall off. The sleeve structure is not only easy to install, but also facilitates later maintenance and replacement, greatly improving the ease of use of the equipment.

[0056] Furthermore, the lower end of the first flexible member 41 is tightly fitted and connected to the support member 31 of the lower mold assembly 30. Through this fitted connection, the first flexible member 41 can effectively transfer some of the impact force absorbed during the pressing process to the support member 31, while simultaneously utilizing the structural strength of the support member 31 to disperse and release the force, thereby preventing concentrated loads from acting directly on the gold blank or being transferred to the base of the main unit 10. To ensure the stability of the connection, the first flexible member 41 and the support member 31 can be fixed using bolts, slot positioning, or high-strength adhesive bonding, ensuring a reliable bond even under high-pressure working conditions.

[0057] In terms of material selection, the first flexible component 41 is preferably made of a flexible material with high elasticity, high fatigue resistance, and high temperature resistance, such as polyimide or other engineering elastomers. This material can maintain good deformation performance and recovery ability during repeated pressing, ensuring that no permanent deformation or failure occurs during long-term use. The thickness and hardness of the first flexible component 41 can be adjusted according to the actual stamping process requirements to achieve a balance between cushioning performance and support performance.

[0058] By sleeved the first flexible component 41 onto the sliding rod 21 and closely connected to the support component 31, an integrated design of the flexible buffer component, guide, and load-bearing component is achieved. Firstly, the sleeved structure ensures that the first flexible component 41 remains on the central axis of the sliding rod 21 during the pressing process of the upper die assembly 20, guaranteeing not only the accuracy of the force direction but also avoiding the lateral displacement problem that may occur with traditional independent buffer components. Thus, during the stamping process, the first flexible component 41 can uniformly and stably absorb the instantaneous impact force transmitted from the upper die.

[0059] Secondly, because the first flexible component 41 is tightly connected to the support component 31, the entire buffer force can be reasonably dispersed and released through the support component 31, avoiding stress concentration in local areas and effectively reducing the risk of cracks or breakage of the gold billet due to local overpressure. This structural design ensures the smooth transmission of pressure during the stamping process, making the stress on each part of the gold card 200 more uniform during forming, thereby significantly improving the quality and precision of forming.

[0060] In one specific embodiment, the second flexible member 42 is connected to the die 32 and is located at one end near the support surface 11.

[0061] In this embodiment, it should be noted that the lower die assembly 30 includes an upper die cavity 32 and a bottom support member 31. The die cavity 32, as the core component that directly contacts and shapes the gold blank, must withstand the enormous instantaneous pressure transmitted from the fixing plate 23 of the upper die assembly 20 during the stamping operation. To prevent the high impact force during the stamping process from directly acting on the support surface 11, leading to structural fatigue of the main unit 10 or wear of the lower die component, this embodiment places a second flexible member 42 below the die cavity 32 and firmly connects it to the die cavity 32 through a fixing structure, making it the bottom buffer layer of the lower die assembly 30.

[0062] The second flexible component 42 is preferably made of a material with high elasticity, good deformation recovery ability, and pressure resistance, such as polyimide or other engineering elastomers. Its structure is usually a monolithic block or multi-layered stacked structure, and it is precision machined to ensure uniform deformation under pressure. Since it is located at the bottom of the entire lower die assembly 30, close to the support surface 11, during the stamping process, when the upper die assembly 20 applies pressure, the impact force is first transmitted to the second flexible component 42 through the die 32. After being squeezed, the second flexible component 42 will undergo elastic deformation, converting the impact force into stored deformation energy, and gradually return to its original shape when the stamping ends or the pressure is released, slowly releasing the energy to the support surface 11, thereby achieving effective isolation and buffering of the impact force.

[0063] In terms of connection method, the second flexible component 42 can be firmly connected to the lower end of the die 32 by screws, slots, or interference fit to ensure that it does not loosen or shift under high-frequency stamping conditions. At the same time, in order to facilitate subsequent maintenance and replacement, the second flexible component 42 can also be designed as a modular structure, which can facilitate quick replacement after wear or aging, reduce equipment downtime, and improve production efficiency.

[0064] With this structural design, the second flexible component 42 is always located at the bottom layer throughout the stamping process, forming a buffer isolation barrier. This not only protects the support surface 11 and the main frame 10 from direct impact, but also disperses the pressure applied by the upper die assembly 20, making the stamping process more stable and gentle.

[0065] By placing the second flexible element 42 at the bottom of the die 32 and close to the support surface 11, it plays a crucial role in damping, buffering, and dispersing impact forces during the stamping process of the gold card 200. First, when the upper die assembly 20 presses down, the first flexible element 41 initially absorbs and homogenizes the pressure. The pressure is then transmitted to the die 32, which directly applies the forming force to the gold blank, pressing it into shape. At this time, the reaction force from below the die 32 is absorbed and buffered by the second flexible element 42, preventing the impact force from being directly transmitted to the support surface 11 or the main unit 10, thereby significantly reducing equipment wear and vibration.

[0066] Secondly, the elastic deformation capability of the second flexible component 42 allows it to dynamically adjust the pressure release process in each stamping cycle, enabling a gradual transition of impact force and reducing instantaneous impact and noise generated during the stamping process. This not only improves the stability of equipment operation but also provides operators with a safer and more comfortable working environment.

[0067] A gold card 200 is manufactured by hydraulic pressing using any of the aforementioned gold card manufacturing apparatus 100. The gold card 200 includes a body 210 located within a die 32 and a patterned surface 220 facing a fixing plate 23 and formed by the fixing plate 23.

[0068] The gold card 200 is made of high-purity gold or gold alloy and is suitable for high-end precious metal crafts, collectibles, or high-end customized gifts. During its manufacturing process, the gold blank is placed inside the concave mold 32 of the lower mold assembly 30. The fixing plate 23 of the upper mold assembly 20 moves downward under hydraulic pressure, forming a closed cavity with the concave mold 32, thereby uniformly pressing the gold blank and shaping it into a card with a predetermined shape and pattern.

[0069] Specifically, the gold card 200 comprises two main parts: the body 210 and the patterned surface 220. The body 210 of the gold card 200 is made of pure gold or a high-quality gold alloy, typically rectangular or other regular shapes, thin but with a certain degree of strength and ductility. The body 210 is located within the die 32 of the lower die assembly 30. During the stamping process, the die 32 provides support and positioning, preventing the gold blank from shifting or warping during forming. After the edges and surfaces of the body 210 are precisely formed using a hydraulic pressing process, smooth edges and uniform thickness are achieved, ensuring that the gold card 200 meets high-end product standards in appearance.

[0070] The patterned surface 220 is the core decorative part of the gold card 200. It is located on one side of the card body 210 and always faces the fixing plate 23 of the upper mold assembly 20 during the molding process. The lower surface of the fixing plate 23 is designed with a precision-engraved pattern, such as text, relief, logo, or decorative texture. When the hydraulic process is performed, the upper mold assembly 20 presses down, the molding surface of the fixing plate 23 contacts the gold blank, and the surface pattern is completely transferred to the blank through uniform pressure, thus forming a beautiful and clear patterned surface 220.

[0071] In actual production, the pattern on the fixing plate 23 can be changed according to customer needs to achieve diversified product designs, such as commemorative coin patterns, zodiac-themed patterns, and customized corporate logos. Because the fixing plate 23 is processed with high precision, the pressed patterns have clear edges and rich details, which can reflect the high-end craftsmanship of the gold card 200.

[0072] By using the aforementioned gold card 200 manufacturing device equipped with deformation component 40, the gold blank is subjected to uniform and gentle pressure in the hydraulic process, thereby overcoming the problem of local overpressure or underpressure caused by uneven pressure distribution in the traditional rigid molding process.

[0073] The first flexible component 41 and the second flexible component 42 provide dual buffering and pressure dispersion during the stamping process, ensuring that the pressure applied by the upper die assembly 20 to the gold blank is evenly distributed. In this way, the card body 210 can maintain a consistent overall thickness during forming, without any localized excessive thinning of material or localized uncompacted residue, ensuring that the card is flat and smooth overall.

[0074] Because the pressure of the fixing plate 23 can be evenly transmitted to the gold blank, the pattern surface 220 is completely and evenly imprinted during the forming process. Even if the pattern contains complex details or tiny textures, it can be accurately presented without problems such as local blurring, missing parts or excessive indentation, giving the finished product extremely high aesthetic and craftsmanship value.

[0075] In traditional rigid molding, stress concentration often leads to microcracks or internal damage to the gold card 200. However, the device in this embodiment effectively reduces impact stress through the buffering effect of the flexible component, protects the internal structural integrity of the gold card 200, and significantly improves the mechanical properties and service life of the finished product.

[0076] Therefore, the aforementioned apparatus 100 for manufacturing gold cards and the gold card 200, by incorporating a deformation component 40, allow the upper mold assembly 20 to slide into contact with the deformation component 40. The deformation component 40 generates deformation force to absorb or disperse the impact during the pressing process, ensuring that pressure is evenly transmitted to the gold card 200 material. This avoids localized stress concentration and reduces the risk of card deformation and cracking. Furthermore, the deformation component 40, as an active element, adjusts the pressure distribution in real time during mold contact, compensating for unevenness in the mold or material and ensuring uniform card forming.

[0077] The above description is merely an embodiment of this application. It should be noted that those skilled in the art can make improvements without departing from the inventive concept of this application, but these improvements all fall within the protection scope of this application.

Claims

1. An apparatus for producing gold cards, characterized in that, include: The main unit is mounted on the support surface; The upper mold assembly is connected to the main unit and is located at one end opposite to the support surface, and slides along the height direction of the main unit; The lower mold assembly is connected to the host and is positioned opposite the upper mold assembly, and the upper mold assembly slides to fit against or move away from the upper mold assembly; The deformation component is connected to the lower mold component, and when the upper mold component slides to press the first flexible member in the deformation component, the deformation component is compressed and generates a deformation force.

2. The apparatus for making gold cards according to claim 1, characterized in that, The deformation component includes: A first flexible component is connected to the lower mold assembly and is located between the upper mold assembly and the lower mold assembly; The second flexible component is connected to the lower mold assembly and is located at the end of the lower mold assembly opposite to the upper mold assembly.

3. The apparatus for making gold cards according to claim 2, characterized in that, The upper mold component includes: A sliding rod is provided along the height direction of the main unit; The drive table is slidably connected to the sliding rod.

4. The apparatus for making gold cards according to claim 3, characterized in that, The upper mold assembly also includes: A fixed plate is connected to the drive worktable, wherein the drive worktable drives the fixed plate to move relative to the lower mold assembly, and in the working state, it fits with the lower mold assembly to implement the hydraulic process.

5. The apparatus for making gold cards according to claim 4, characterized in that, The lower mold assembly includes: A support member is fixedly connected to the sliding rod and located at one end of the sliding rod near the support surface, and is used to support the lower mold assembly; A concave mold is disposed within the support member and is positioned opposite to the fixed plate so that it fits against the forming surface of the fixed plate to form a cavity when the upper mold assembly is pressed down.

6. The apparatus for making gold cards according to claim 5, characterized in that, The first flexible element is sleeved on the sliding rod, and the first flexible element is in close contact with the support element.

7. The apparatus for making gold cards according to claim 5, characterized in that, The second flexible element is connected to the die and is located at one end near the support surface.

8. The apparatus for making gold cards according to claim 2, characterized in that, Both the first flexible component and the second flexible component are polyimide.

9. A gold card, characterized in that, The gold card is manufactured using a hydraulic process by the apparatus for making gold cards as described in any one of claims 1-8.

10. A gold card according to claim 9, characterized in that, The gold card includes: The main body is located inside the die cavity; The patterned side faces the fixed plate and is made of the fixed plate.

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