An automated vacuum film lamination machine

Abstract

The application relates to the technical field of wafer film pasting, and discloses an automatic vacuum film pasting machine. The vacuum film pasting machine comprises a feeding and discharging mechanism, a film cutting mechanism, a conveying mechanism, a film loading and releasing mechanism and a vacuum film pasting mechanism; the conveying mechanism comprises a plate feeding conveying assembly and a plate discharging conveying assembly; the feeding end of the feeding and discharging mechanism is arranged adjacent to the film cutting mechanism; and the discharging end of the feeding and discharging mechanism is arranged adjacent to the discharging end of the plate discharging conveying assembly; the film loading and releasing mechanism comprises an upper film loading and releasing assembly, an upper film, a lower film loading and releasing assembly and a lower film; the plate feeding conveying assembly is arranged between the unwinding end of the upper film loading and releasing assembly and the unwinding end of the lower film loading and releasing assembly; and the plate feeding conveying assembly is arranged adjacent to the feeding end of the feeding and discharging mechanism; the plate discharging conveying assembly is arranged between the winding end of the upper film loading and releasing assembly and the winding end of the lower film loading and releasing assembly; the plate discharging conveying assembly is arranged adjacent to the discharging end of the feeding and discharging mechanism; and the vacuum film pasting mechanism is arranged between the upper film loading and releasing assembly and the lower film loading and releasing assembly.

Description

Technical Field

[0001] This application relates to the technical field of wafer lamination, and in particular to an automated vacuum lamination machine. Background Technology

[0002] In the field of semiconductor wafer lamination technology, traditional lamination methods mainly rely on manual operation. This method has many drawbacks, including low efficiency and unstable quality, making it difficult to guarantee the consistency and accuracy of lamination. During manual operation, factors such as slight hand tremors and uneven force can easily damage or contaminate the wafer, thereby affecting subsequent wafer processing and final performance.

[0003] While mechanical lamination has found some application, it faces challenges in pressure control. Excessive pressure can compress the wafer, causing deformation and resulting in physical damage such as microcracks on the wafer surface. It can also easily trap air bubbles between the film and the wafer during lamination, leaving residual bubbles that affect the flatness of the lamination and potentially become a problem in subsequent processing. Conversely, insufficient pressure prevents the film from adhering tightly to the wafer surface, leading to poor adhesion and easy detachment during later processes.

[0004] Existing automated film lamination equipment suffers from low automation levels and low lamination accuracy. It cannot monitor lamination process parameters in real time, making it difficult to accurately control parameter changes during the lamination process. Furthermore, lamination in a high-vacuum environment makes it difficult to effectively avoid interference from gas particles, failing to meet the stringent requirements of the semiconductor industry for efficient, precise, and high-quality lamination processes. Therefore, developing a novel automated vacuum lamination machine to address these issues, improve lamination quality and efficiency, and adapt to the lamination needs of wafers of different sizes has become an urgent need in this field. Utility Model Content

[0005] The technical problem to be solved by this application is to provide an automated vacuum laminating machine, which improves the quality and efficiency of wafer lamination by increasing the degree of automation, and adapts to the lamination needs of wafers of different sizes.

[0006] To address the aforementioned problems, this application provides an automated vacuum laminating machine, comprising an loading / unloading mechanism, a film cutting mechanism, a conveying mechanism, a carrier film unwinding / rewinding mechanism, and a vacuum laminating mechanism. The conveying mechanism includes an infeed conveying assembly and an outfeed conveying assembly. The loading end of the loading / unloading mechanism is adjacent to one side of the film cutting mechanism, and the unloading end of the loading / unloading mechanism is adjacent to the outfeed end of the outfeed conveying assembly. The carrier film unwinding / rewinding mechanism includes an upper carrier film unwinding / rewinding assembly, an upper carrier film, a lower carrier film unwinding / rewinding assembly, and a lower carrier film. The infeed conveying assembly is located between the unwinding end of the upper carrier film unwinding / rewinding assembly and the unwinding end of the lower carrier film unwinding / rewinding assembly, and is adjacent to the upper carrier film unwinding / rewinding assembly. The feeding end of the unloading mechanism; the board delivery conveying assembly is located between the winding end of the upper film take-up and unwinding assembly and the winding end of the lower film take-up and unwinding assembly, and the board delivery conveying assembly is adjacent to the unloading end of the loading and unloading mechanism; the vacuum laminating mechanism is located between the upper film take-up and unwinding assembly and the lower film take-up and unwinding assembly; the upper film is rotatably connected to the upper film take-up and unwinding assembly, and the lower film is rotatably connected to the lower film take-up and unwinding assembly; the upper film and the lower film are respectively attached to the upper surface and the lower surface of the wafer conveyed by the board feeding conveying assembly; the upper film and the lower film cooperate to clamp the wafer to feed it into the vacuum laminating mechanism and convey the wafer to the board delivery conveying assembly.

[0007] Preferably, the loading film take-up and take-down assembly includes a drive wheel, a synchronous wheel, several driven wheels, and two sets of first driving members. The drive wheel, synchronous wheel, and each driven wheel are rotatably connected to the frame, and the drive wheel and synchronous wheel are located on both sides of the vacuum film application mechanism. The fixed end of the loading film is sleeved on the drive wheel, and the movable end of the loading film is sequentially wound around several driven wheels and synchronous wheels. The first driving members are disposed on the frame, with the driving end of one set of first driving members connected to the drive wheel and the driving end of the other set of first driving members connected to the synchronous wheel.

[0008] Preferably, the vacuum film-applying mechanism includes a vacuum valve, a first heating element, a base, an upper mold, a pressing mold, and a second driving element. The vacuum valve is connected to the upper mold, the upper mold is fixed to the top of the base, the pressing mold is slidably connected to the base, and a pressing cavity is formed between the upper mold and the pressing mold. The first heating element is respectively disposed on the upper mold and the pressing mold. The second driving element is disposed on the base, and the driving end of the second driving element is connected to the pressing mold.

[0009] Preferably, the loading and unloading mechanism includes a wafer storage rack, a first linear module, and a first robotic arm. The wafer storage rack is disposed adjacent to the first linear module. The loading end of the first linear module is disposed adjacent to the die cutting mechanism. The unloading end of the first linear module is disposed adjacent to the unloading end of the board conveying assembly. The first robotic arm is disposed at the drive end of the first linear module.

[0010] Preferably, the loading and unloading mechanism further includes an edge-finding platform, which is disposed between the loading end of the first linear module and the film-cutting mechanism.

[0011] Preferably, the loading and unloading mechanism further includes a transfer platform, a second linear module, and a second robotic arm. The transfer platform is arranged adjacent to the edge-finding platform, and the transfer platform and the edge-finding platform are respectively located on one side of the second linear module. The film-cutting mechanism is arranged on the other side of the second linear module, and the second robotic arm is arranged at the drive end of the second linear module.

[0012] Preferably, the film cutting mechanism includes a film cutting and receiving assembly, a film cutting platform, a film pulling assembly, and a film suction assembly. A protective film is rotatably connected to the film cutting and receiving assembly. The film cutting platform and the film pulling assembly are disposed in the middle of the film cutting and receiving assembly. The film pulling assembly holds the protective film and slides horizontally above the film cutting platform. The film suction assembly is slidably connected between the loading and unloading mechanism and the film cutting platform.

[0013] Preferably, the film suction assembly includes a third linear module, a third robotic arm, and a second heating element. The two ends of the third linear module are respectively located above the loading and unloading mechanism and the film cutting platform. The third robotic arm is disposed at the drive end of the third linear module, and the second heating element is disposed circumferentially on the third robotic arm.

[0014] Preferably, the feed conveying assembly includes a third driving member, a driving roller, a driven roller, and a conveyor belt. The driving roller and the driven roller are rotatably mounted on the frame. The driving end of the third driving member is connected to the driving roller. The conveyor belt is rotatably connected to the driving roller and the driven roller.

[0015] Preferably, the vacuum laminating machine further includes a cooling fan, which is respectively located between the upper film receiving and discharging assembly and the lower film receiving and discharging assembly at the discharge end of the vacuum laminating mechanism.

[0016] Compared with the prior art, this application includes at least one of the following beneficial technical effects:

[0017] In this application, the loading and unloading mechanism delivers the wafer to a position convenient for the cutting mechanism to pre-apply the protective film. After the cutting mechanism applies the protective film to the wafer surface, the loading and unloading mechanism places the wafer onto the infeed conveyor assembly. The infeed conveyor assembly is used to transport the pre-applied wafer to the infeed end of the vacuum film application mechanism. The upper and lower film carriers in the carrier film take-up and take-down mechanism are rotatably connected to their respective take-up and take-down assemblies. Simultaneously, the upper and lower film carriers are driven to move along the wafer transport direction, respectively, and adhere to the upper and lower surfaces of the wafer, forming a "sandwich" clamping structure. During transport and pressing, the upper and lower films provide uniform support for the wafer, offsetting mechanical stress and preventing wafer breakage and edge chipping due to uneven clamping force. The upper and lower film adopt a winding and unwinding design. The upper film winding and unwinding assembly and the lower film winding and unwinding assembly wind up the used film for subsequent processing or replacement with a new film, preparing for the next round of conveying.

[0018] The loading and unloading films feed the wafers into the vacuum laminating mechanism. By evacuating air to create a negative pressure environment, tiny air bubbles between the wafer and the protective film are completely eliminated. This avoids defects such as wrinkles and air pockets caused by residual gas in traditional atmospheric pressure lamination, thus improving the bonding accuracy between the protective film and the wafer. After vacuum lamination, the wafers are transported away by the board ejection conveyor assembly. The loading and unloading mechanism removes the wafers from the ejection end of the board ejection conveyor assembly, completing the fully automated wafer loading, pre-lamination, vacuum lamination, and unloading process. The automated operation of this vacuum laminating machine reduces manual intervention, minimizes errors and quality instability caused by human factors, and improves the automation level of wafer lamination, thereby improving lamination quality and efficiency. In addition, by adjusting the parameters of components such as the conveying mechanism and the film loading and unloading mechanism, lamination requirements for wafers of different sizes can be met, enhancing the versatility and flexibility of this vacuum laminating machine. Attached Figure Description

[0019] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1 This is a schematic diagram of the overall structure of the vacuum laminating machine in the embodiments of this application.

[0021] Figure 2 This is a schematic diagram of the conveying mechanism, the carrier film feeding and receiving mechanism, and the vacuum film application mechanism in the embodiments of this application.

[0022] Figure 3This is a schematic diagram of the conveying mechanism and the carrier film take-up and take-up mechanism in the embodiments of this application.

[0023] Figure 4 This is a schematic diagram of the vacuum film application mechanism in an embodiment of this application.

[0024] Figure 5 This is a schematic diagram of the loading / unloading mechanism and the film cutting mechanism in the embodiments of this application.

[0025] Figure 6 This is a schematic diagram of the structure of the film cutting and feeding assembly, film cutting platform, film pulling assembly and film suction assembly in the embodiments of this application.

[0026] Figure 7 This is a schematic diagram of the structure of the film cutting and receiving assembly, the film cutting platform, and the film suction assembly in the embodiments of this application.

[0027] Figure 8 This is a schematic diagram of the structure of the feed plate conveying assembly in an embodiment of this application.

[0028] Explanation of reference numerals in the attached drawings: 1. Loading and unloading mechanism; 2. Film cutting mechanism; 3. Conveying mechanism; 4. Carrier film loading and unloading mechanism; 5. Vacuum film laminating mechanism; 6. Protective film; 7. Cooling fan; 8. Wafer; 9. Wafer storage rack; 10. First linear module; 11. First robotic arm; 12. Edge finding platform; 13. Transfer platform; 14. Second linear module; 15. Second robotic arm; 16. Film cutting and unloading assembly; 17. Film cutting platform; 18. Film stretching assembly; 19. Film suction assembly; 20. Third linear module; 21. Third robotic arm; 22. Second heating element. 23. Infeed conveyor assembly; 24. Third drive component; 25. Drive roller; 26. Driven roller; 27. Conveyor belt; 28. Outfeed conveyor assembly; 29. ​​Loading film take-up and unload assembly; 30. Drive wheel; 31. Synchronous wheel; 32. Driven wheel; 33. First drive component; 34. Air knife; 35. Loading film; 36. Unloading film take-up and unload assembly; 37. Unloading film; 38. Vacuum valve; 39. First heating component; 40. Base; 41. Upper mold; 42. Pressing mold; 43. Second drive component; 44. Pressing cavity; 45. Limiting block; 46. Support column. Detailed Implementation

[0029] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0030] It should be understood that, when used in this specification and the appended claims, the terms "comprising" and "including" indicate the presence of the described features, integrals, steps, operations, elements and / or components, but do not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components and / or collections thereof.

[0031] It should also be understood that the terminology used in this application specification is for the purpose of describing particular embodiments only and is not intended to limit the application. As used in this application specification and the appended claims, the singular forms “a,” “an,” and “the” are intended to include the plural forms unless the context clearly indicates otherwise.

[0032] It should also be further understood that the term “and / or” as used in this application specification and the appended claims means any combination of one or more of the associated listed items and all possible combinations, and includes such combinations.

[0033] Please refer to Figures 1 to 8 This application provides an automated vacuum laminating machine, which first pre-laminates the wafers with film and then performs vacuum lamination. The vacuum laminating machine includes a loading / unloading mechanism 1, a cutting mechanism 2, a conveying mechanism 3, a carrier film handling mechanism 4, and a vacuum laminating mechanism 5. The conveying mechanism 3 includes an infeed conveying assembly 23 and an outfeed conveying assembly 28. The loading end of the loading / unloading mechanism 1 is adjacent to one side of the cutting mechanism 2, and the unloading end of the loading / unloading mechanism 1 is adjacent to the outfeed end of the outfeed conveying assembly 28.

[0034] Specifically, the film take-up and unwrap mechanism 4 includes an upper film take-up and unwrap assembly 29, an upper film 35, a lower film take-up and unwrap assembly 36, and a lower film 37. The board feeding conveyor assembly 23 is located between the unwinding end of the upper film take-up and unwrap assembly 29 and the unwinding end of the lower film take-up and unwrap assembly 36, and the board feeding conveyor assembly 23 is adjacent to the loading end of the loading and unloading mechanism 1. The board discharging conveyor assembly 28 is located between the winding end of the upper film take-up and unwrap assembly 29 and the winding end of the lower film take-up and unwrap assembly 36, and the board discharging conveyor assembly 28 is adjacent to the unloading end of the loading and unloading mechanism 1. The vacuum film laminating mechanism 5 is located between the upper film take-up and unwrap assembly 29 and the lower film take-up and unwrap assembly 36. The upper film 35 is rotatably connected to the upper film receiving and dispensing assembly 29, and the lower film 37 is rotatably connected to the lower film receiving and dispensing assembly 36. The upper film 35 and the lower film 37 are respectively attached to the upper and lower surfaces of the wafer 8 conveyed by the board feeding assembly 23. The upper film 35 and the lower film 37 cooperate to clamp the wafer 8 to send it into the vacuum film attaching mechanism 5, and then convey the wafer 8 to the board output conveying assembly 28.

[0035] In this embodiment, the upper film take-up and lower film take-up and ...

[0036] In response, the loading and unloading mechanism 1 delivers the wafer 8 to a position where the cutting mechanism 2 can pre-apply the protective film. After the cutting mechanism 2 applies the protective film 6 to the surface of the wafer 8, the loading and unloading mechanism 1 places the wafer 8 onto the board feeding conveyor assembly 23. The board feeding conveyor assembly 23 is used to transport the pre-applied wafer 8 to the feeding end of the vacuum film application mechanism 5.

[0037] In the carrier film take-up and drop mechanism 4, the upper carrier film 35 and the lower carrier film 37 are rotatably connected to their respective take-up and drop components. Simultaneously, the upper carrier film take-up and drop component 29 and the lower carrier film take-up and drop component 36 are driven to move the upper carrier film 35 and the lower carrier film 37 along the transport direction of the wafer 8, causing them to adhere to the upper and lower surfaces of the wafer 8 respectively, forming a "sandwich" clamping structure. During transport and pressing, the upper carrier film 35 and the lower carrier film 37 provide uniform support for the wafer 8, offsetting mechanical stress and preventing wafer 8 from breaking or edge chipping due to uneven clamping force. The upper carrier film 35 and the lower carrier film 37 employ a take-up and drop design. The upper carrier film take-up and drop component 29 and the lower carrier film take-up and drop component 36 rewind the used carrier film for subsequent processing or replacement with a new carrier film, preparing for the next round of transport.

[0038] The loading film 35 and the unloading film 37 feed the wafer 8 into the vacuum laminating mechanism 5. By evacuating the air to create a negative pressure environment, the tiny air bubbles between the wafer 8 and the protective film 6 can be completely eliminated, avoiding defects such as wrinkles and air bubbles caused by residual gas in traditional atmospheric pressure lamination, thereby improving the bonding accuracy between the protective film 6 and the wafer 8. After vacuum lamination, the wafer 8 is conveyed away by the board delivery conveyor assembly 28. The loading and unloading mechanism 1 removes the wafer 8 from the output end of the board delivery conveyor assembly 28, thus completing the fully automatic loading, pre-lamination, vacuum lamination, and unloading of the wafer 8.

[0039] The automated operation of this vacuum laminator reduces manual intervention, minimizing errors and quality instability caused by human factors, and improving the automation level of wafer 8 lamination to enhance lamination quality and efficiency. Furthermore, by adjusting the parameters of components such as the conveyor mechanism 3 and the wafer loading / unloading mechanism 4, lamination requirements for wafer 8 of different sizes can be met, improving the versatility and flexibility of the vacuum laminator.

[0040] Please refer to Figure 2 and Figure 3In one specific embodiment, the loading film take-up and take-down assembly 29 includes a drive wheel 30, a synchronous wheel 31, a plurality of driven wheels 32, and two sets of first driving members 33. The drive wheel 30, synchronous wheel 31, and each driven wheel 32 are rotatably connected to the frame, with the drive wheel 30 and synchronous wheel 31 located on opposite sides of the vacuum film application mechanism 5. The fixed end of the loading film 35 is sleeved on the drive wheel 30, and the movable end of the loading film 35 is sequentially wound around the plurality of driven wheels 32 and synchronous wheel 31. The first driving members 33 are mounted on the frame; the driving end of one set of first driving members 33 is connected to the drive wheel 30, and the driving end of the other set of first driving members 33 is connected to the synchronous wheel 31.

[0041] The drive wheel 30 and the synchronous wheel 31 are located on both sides of the vacuum laminating mechanism 5 and are rotatably connected to the frame. The fixed end of the upper film 35 is fitted onto the drive wheel 30, while the movable end of the upper film 35 is rotatably connected to several driven wheels 32 and synchronous wheels 31 in sequence. Two sets of first drive members 33 are mounted on the frame; one set of drive ends is connected to the drive wheel 30, and the other set is connected to the synchronous wheels 31. When the first drive members 33 operate, they simultaneously drive the drive wheel 30 and the synchronous wheels 31 to rotate. Under the synergistic action of the drive wheel 30 and the synchronous wheels 31, the upper film 35 begins to unwind. As the drive wheel 30 rotates, the upper film 35 is released from the drive wheel 30 and passes sequentially through the driven wheels 32 and the synchronous wheels 31. The driven wheels 32 change the direction of movement of the upper film 35 and tension the upper film 35, allowing the upper film 35 to be smoothly and stably attached to the upper surface of the wafer 8.

[0042] When the infeed conveyor assembly 23 delivers the pre-coated wafer 8, the upper film 35, driven by the drive wheel 30, synchronous wheel 31, and driven wheel 32, accurately adheres to the upper surface of the wafer 8. Simultaneously, the lower film receiving assembly 36 (since the upper film receiving assembly 29 and the lower film receiving assembly 36 have the same structure and are symmetrically arranged along the conveying direction) performs a similar operation, attaching the lower film 37 to the lower surface of the wafer 8, forming a sandwich-like clamping structure. This provides uniform support for the conveying of the wafer 8, thereby sending the wafer 8 into the vacuum coating mechanism 5.

[0043] Furthermore, the loading film take-up and take-up assembly 29 also includes an air knife 34. The air knife 34 is located between two adjacent driven rollers 32 on the feeding side of the vacuum film attaching mechanism 5, and the loading film 35 first passes through the air knife 34 and then is attached to the upper surface of the wafer 8.

[0044] When the carrier film 35 is released from the driving wheel 30, after passing through several driven wheels 32, it first passes through the air knife 34 and then adheres to the upper surface of the wafer 8. The air knife 34 can guide and initially flatten the carrier film 35. During the process of the carrier film 35 adhering to the upper surface of the wafer 8, the air knife 34 can blow out gas, which can form a tiny air cushion between the carrier film 35 and the wafer 8. This air cushion can make the carrier film 35 adhere more smoothly to the surface of the wafer 8, reduce the direct friction between the carrier film 35 and the wafer 8, and at the same time help to eliminate any air bubbles that may exist between the carrier film 35 and the wafer 8, so that the carrier film 35 adheres smoothly to the upper surface of the wafer 8.

[0045] Please refer to Figure 3 and Figure 4 In one specific embodiment, the vacuum film-applying mechanism 5 includes a vacuum valve 38, a first heating element 39, a base 40, an upper mold 41, a pressing mold 42, and a second driving element 43. The vacuum valve 38 is connected to the upper mold 41, which is fixedly connected to the top of the base 40. The pressing mold 42 is slidably connected to the base 40, forming a pressing cavity 44 between the upper mold 41 and the pressing mold 42. The first heating element 39 is disposed on both the upper mold 41 and the pressing mold 42. The second driving element 43 is disposed on the base 40, and its driving end is fixedly connected to the pressing mold 42.

[0046] Vacuum valve 38 is connected to upper mold 41. When vacuum laminating mechanism 5 is working, vacuum valve 38 opens, creating a negative pressure environment inside upper mold 41, which can effectively eliminate tiny air bubbles between wafer 8 and protective film 6. Upper mold 41 is fixedly connected to the top of base 40, and pressing mold 42 is slidably connected to base 40, forming a pressing cavity 44 between upper mold 41 and pressing mold 42. When second drive component 43 is working, it drives pressing mold 42 to move closer to upper mold 41, thereby causing wafer 8 and protective film 6 to be tightly bonded in pressing cavity 44 under the combined action of negative pressure and pressure. First heating component 39 is respectively provided on upper mold 41 and pressing mold 42, which can heat upper mold 41 and pressing mold 42. During the lamination process, heat can be transferred to wafer 8 and protective film 6 through upper mold 41 and pressing mold 42, which enhances the adhesion of protective film 6 material and makes it easier to bond with wafer 8.

[0047] Furthermore, the vacuum film-applying mechanism 5 also includes a limiting block 45. The base 40 has support columns 46 arranged around its perimeter, the pressing mold 42 is slidably connected to the support columns 46, and the limiting block 45 is detachably connected to the support columns 46 between the upper mold 41 and the pressing mold 42 via bolts or slots.

[0048] When the vacuum laminating mechanism 5 is in a resting state or under maintenance, the limit block 45 can be installed on the support column 46 to prevent accidental contact by the operator or abnormal control system from causing a hard collision between the pressing mold 42 and the upper mold 41, which could lead to equipment damage or personal injury. When the vacuum laminating mechanism 5 is in working state, the limit block 45 can be removed for normal operation.

[0049] In one specific embodiment, the vacuum laminating machine further includes a cooling fan 7, which is respectively disposed between the upper film take-up assembly 29 and the lower film take-up assembly 36 at the discharge end of the vacuum laminating mechanism 5. At the discharge end of the vacuum laminating mechanism 5, after the upper film 35 and the lower film 37 are separated by pressing, they are wound and recycled by the synchronous wheel 31. During the process, heat generated by friction or residual heat from vacuum pressing can easily cause the film material to soften and deform. The cooling fan 7 is disposed between the two sets of take-up assemblies, driving airflow to blow towards the film material and the surface of the wafer 8 to quickly dissipate heat. On the other hand, it can reduce the failure rate of film material sticking due to overheating, especially for PET material carrier film, the peel strength stability is improved after cooling, so as to prevent film material from remaining on the upper surface of the protective film 6 or the lower surface of the wafer 8.

[0050] Furthermore, cooling fans 7 are also provided in the upper mold 41 and the pressing mold 42. The heating elements 39 (such as resistance wires or semiconductor heaters) inside the upper mold 41 and the pressing mold 42 heat up to a set temperature during the film application process. When the temperature sensor detects that the real-time temperature exceeds the process threshold or when pressing is completed and the cooling phase begins, the cooling fans 7 are activated, rapidly dissipating heat through forced convection. The cooling fans 7 can reduce the ambient temperature of the heating elements 39, slowing down the aging rate of the heating elements 39 and reducing circuit aging failures caused by overheating.

[0051] Please refer to Figure 1 In one specific embodiment, the loading and unloading mechanism 1 includes a wafer storage rack 9, a first linear module 10, and a first robotic arm 11. The wafer storage rack 9 is disposed adjacent to the first linear module 10, the loading end of the first linear module 10 is disposed adjacent to the die cutting mechanism 2, the unloading end of the first linear module 10 is disposed adjacent to the unloading end of the board conveying assembly 28, and the first robotic arm 11 is disposed at the drive end of the first linear module 10.

[0052] The wafer storage rack 9 stores wafers 8 to be coated and wafers 8 that have already been coated. It is located adjacent to the first linear module 10, facilitating the rapid transfer of wafers 8. The loading end of the first linear module 10 is close to the cutting mechanism 2, while the unloading end is located at the discharge end of the board conveying assembly 28, forming a continuous production line layout. The first linear module 10 starts upon receiving a control signal, driving the first robotic arm 11, which is located at its drive end, to move along a straight line. According to a preset program, the first robotic arm 11 precisely picks up a wafer 8 to be coated from the wafer storage rack 9, and then, driven by the first linear module 10, moves the wafer 8 to the vicinity of the cutting mechanism 2, preparing it for subsequent pre-coating operations.

[0053] After the wafer 8 completes the entire vacuum lamination process and is transported to its discharge end by the board delivery conveyor 28, the first linear module 10 operates again, driving the first robotic arm 11 to move to the discharge end of the board delivery conveyor 28, grab the laminated wafer 8, and place it back on the wafer storage rack 9, realizing the unloading and recycling of the wafer 8 for subsequent packaging or transfer operations.

[0054] Please refer to Figure 5 In one specific embodiment, the loading and unloading mechanism 1 further includes an edge-finding platform 12, which is disposed between the loading end of the first linear module 10 and the film cutting mechanism 2.

[0055] After the first linear module 10 delivers the wafer 8 to the loading end, the wafer 8 is placed on the edge-finding platform 12. The edge-finding platform 12 uses its built-in detection devices (such as optical sensors, mechanical probes, etc.) to quickly scan and position the edges of the wafer 8. It can accurately determine the position and orientation of the wafer 8, including the center position, diameter, and whether there are any notches on the wafer 8. Based on the position information of the wafer 8 detected by the edge-finding platform 12, if the position or orientation of the wafer 8 does not meet the requirements of the subsequent pre-applying film operation of the cutting mechanism 2, the edge-finding platform 12 will make minor displacement adjustments to the wafer 8, such as translation or rotation, to place the wafer 8 in the correct processing position so that the subsequent cutting mechanism 2 can pre-apply the cut protective film 6 to the surface of the wafer 8.

[0056] In one specific embodiment, the loading and unloading mechanism 1 further includes a transfer platform 13, a second linear module 14, and a second robotic arm 15. The transfer platform 13 is disposed adjacent to the edge-finding platform 12, and the transfer platform 13 and the edge-finding platform 12 are respectively located on one side of the second linear module 14. The film cutting mechanism 2 is disposed on the other side of the second linear module 14, and the second robotic arm 15 is disposed at the drive end of the second linear module 14.

[0057] After the first linear module 10 and the first robotic arm 11 place the wafer 8 on the edge-finding platform 12 for positioning and calibration, the second linear module 14 starts under the command of the control system, driving the second robotic arm 15, which is located at its drive end, to move along a straight line. The second robotic arm 15 moves to the vicinity of the edge-finding platform 12, picks up the wafer 8 that has been positioned and calibrated from the edge-finding platform 12, and transfers it to the transfer platform 13. The transfer platform 13 serves as an intermediate transition, allowing for brief reception and position adjustment of the wafer 8 to ensure its stability during the pre-filming process of the subsequent cutting mechanism 2. After the cutting mechanism 2 completes the pre-filming of the wafer 8, the second linear module 14 operates again, driving the second robotic arm 15 to pick up the wafer 8 from the transfer platform 13 and transfer the wafer 8 to the feed end of the infeed assembly 23 for subsequent transport of the wafer 8.

[0058] Please refer to Figure 6 and Figure 7 In one specific embodiment, the film cutting mechanism 2 includes a film cutting and receiving assembly 16, a film cutting platform 17, a film pulling assembly 18, and a film suction assembly 19. The protective film 6 is rollably connected to the film cutting and receiving assembly 16. The film cutting platform 17 and the film pulling assembly 18 are disposed in the middle of the film cutting and receiving assembly 16, with the film pulling assembly 18 clamping the protective film 6 and sliding horizontally above the film cutting platform 17. The film suction assembly 19 is slidably connected between the loading / unloading mechanism 1 and the film cutting platform 17.

[0059] The protective film 6 is tumbledly connected to the cutting and winding assembly 16, which serves to supply and wind up the protective film 6. When a cutting operation is required, the cutting and winding assembly 16 releases the protective film 6 while maintaining appropriate tension. During the cutting process, the film pulling assembly 18 first clamps a certain length of the protective film 6, and then slides horizontally above the cutting platform 17, flattening and taut the protective film 6 above the cutting platform 17 so that the cutting platform 17 can perform the cutting. After the rotating cutting blade at the bottom of the cutting platform 17 cuts the protective film 6 to a size that conforms to the wafer size, the film suction assembly 19 slides above the cutting platform 17 and fixes the flat protective film 6 by suction. Then, the film suction assembly 19 carries the protective film 6 to the top of the transfer platform 13 and pre-attaches the protective film 6 to the upper surface of the wafer 8. In this embodiment, since the structures of the cutting and winding assembly 16, the cutting platform 17, and the film pulling assembly 18 are all prior art, the specific structures will not be described in detail.

[0060] Furthermore, the film suction assembly 19 includes a third linear module 20, a third robotic arm 21, and a second heating element 22. The two ends of the third linear module 20 are respectively located above the loading / unloading mechanism 1 and the film cutting platform 17. The third robotic arm 21 is positioned at the drive end of the third linear module 20, and the second heating element 22 is circumferentially disposed on the third robotic arm 21. In this embodiment, two sets of second heating elements 22 are provided. The first set of second heating elements 22 is positioned directly opposite the third robotic arm 21 to heat the protective film 6 with a diameter of 8 inches. The second set of second heating elements 22 is positioned directly opposite the third robotic arm 21 in a direction perpendicular to the first set of second heating elements 22 to heat the protective film 6 with a diameter of 12 inches.

[0061] After the cutting platform 17 cuts the protective film 6 to a size that conforms to the wafer 8, the third linear module 20 drives the third robot arm 21 to move above the cutting platform 17, where the robot arm 21 picks up the flat protective film 6. The second heating element 22 is circumferentially positioned on the third robot arm 21, and the two sets of second heating elements 22 respectively heat the protective films 6 of different diameters. The heated protective film 6 becomes more viscous. Subsequently, the third linear module 20 drives the third robot arm 21 to carry the protective film 6 to the wafer 8 near the loading / unloading mechanism 1, precisely attaching the protective film 6 to the surface of the wafer 8 to complete the pre-attachment of the protective film onto the wafer 8.

[0062] Please refer to Figure 8 In one specific embodiment, the feed conveyor assembly 23 includes a third drive member 24, a drive roller 25, a driven roller 26, and a conveyor belt 27. The drive roller 25 and driven roller 26 are rotatably mounted on the frame. The drive end of the third drive member 24 is connected to the drive roller 25, and the conveyor belt 27 is tactilely connected to both the drive roller 25 and the driven roller 26. In this embodiment, the third drive member 24 drives the drive roller 25 by tactilely connecting it to a motor and one end of the drive roller 25 via a synchronous belt.

[0063] The wafer feeding assembly 23 achieves high-precision and stable transport of the wafer 8 via a motor-driven synchronous belt transmission system. The third drive unit 24 transmits power to the drive roller 25 via the synchronous belt. The drive roller 25 drives the annular conveyor belt 27 by friction, while the driven roller 26 assists in tensioning the conveyor belt 27 and maintaining smooth operation. Furthermore, when the wafer 8 is placed on the conveyor belt 27, the antistatic coating on the surface of the conveyor belt 27 prevents the wafer 8 from slipping or shifting during acceleration or deceleration.

[0064] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in this application, and these modifications or substitutions should all be covered within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. An automated vacuum laminating machine, characterized in that: It includes a loading and unloading mechanism, a film cutting mechanism, a conveying mechanism, a carrier film taking and releasing mechanism, and a vacuum film laminating mechanism; The conveying mechanism includes an infeed conveying assembly and an outfeed conveying assembly. The loading end of the loading and unloading mechanism is adjacent to one side of the film cutting mechanism, and the unloading end of the loading and unloading mechanism is adjacent to the outfeed end of the outfeed conveying assembly. The carrier film take-up and unwrap mechanism includes an upper carrier film take-up and unwrap assembly, an upper carrier film, a lower carrier film take-up and unwrap assembly, and a lower carrier film. The board feeding conveyor assembly is located between the unwinding end of the upper carrier film take-up and unwrap assembly and the unwinding end of the lower carrier film take-up and unwrap assembly, and is adjacent to the loading end of the loading and unloading mechanism. The board discharging conveyor assembly is located between the winding end of the upper carrier film take-up and unwrap assembly and the winding end of the lower carrier film take-up and unwrap assembly, and is adjacent to the unloading end of the loading and unloading mechanism. The vacuum film laminating mechanism is located between the upper carrier film take-up and unwrap assembly and the lower carrier film take-up and unwrap assembly. The upper loading film is rotatably connected to the upper loading film receiving and dispensing assembly, and the lower loading film is rotatably connected to the lower loading film receiving and dispensing assembly. The upper loading film and the lower loading film are respectively attached to the upper and lower surfaces of the wafer conveyed by the board feeding assembly. The upper loading film and the lower loading film cooperate to clamp the wafer to feed it into the vacuum film attaching mechanism and convey the wafer to the board exiting assembly.

2. The automated vacuum laminating machine according to claim 1, characterized in that, The loading film take-up and take-down assembly includes a drive wheel, a synchronous wheel, several driven wheels, and two sets of first driving members. The drive wheel, synchronous wheel, and each driven wheel are rotatably connected to the frame, and the drive wheel and synchronous wheel are located on both sides of the vacuum film application mechanism. The fixed end of the loading film is sleeved on the drive wheel, and the movable end of the loading film is sequentially wound around several driven wheels and synchronous wheels. The first driving members are disposed on the frame, with the driving end of one set of first driving members connected to the drive wheel and the driving end of the other set of first driving members connected to the synchronous wheel.

3. An automated vacuum laminating machine according to claim 1, characterized in that, The vacuum film application mechanism includes a vacuum valve, a first heating element, a base, an upper mold, a pressing mold, and a second driving element. The vacuum valve is connected to the upper mold, the upper mold is fixed to the top of the base, the pressing mold is slidably connected to the base, and a pressing cavity is formed between the upper mold and the pressing mold. The first heating element is respectively disposed on the upper mold and the pressing mold. The second driving member is disposed on the base, and the driving end of the second driving member is connected to the pressing mold.

4. An automated vacuum laminating machine according to claim 1, characterized in that, The loading and unloading mechanism includes a wafer storage rack, a first linear module, and a first robotic arm. The wafer storage rack is disposed adjacent to the first linear module. The loading end of the first linear module is disposed adjacent to the film cutting mechanism. The unloading end of the first linear module is disposed adjacent to the unloading end of the board conveying assembly. The first robotic arm is disposed at the drive end of the first linear module.

5. An automated vacuum laminating machine according to claim 4, characterized in that, The loading and unloading mechanism also includes an edge-finding platform, which is located between the loading end of the first linear module and the film-cutting mechanism.

6. An automated vacuum laminating machine according to claim 5, characterized in that, The loading and unloading mechanism further includes a transfer platform, a second linear module, and a second robotic arm. The transfer platform is arranged adjacent to the edge-finding platform, and the transfer platform and the edge-finding platform are respectively located on one side of the second linear module. The film cutting mechanism is arranged on the other side of the second linear module, and the second robotic arm is arranged at the drive end of the second linear module.

7. An automated vacuum laminating machine according to claim 1, characterized in that, The film cutting mechanism includes a film cutting and receiving assembly, a film cutting platform, a film pulling assembly, and a film suction assembly. A protective film is tumbledly connected to the film cutting and receiving assembly. The film cutting platform and the film pulling assembly are located in the middle of the film cutting and receiving assembly. The film pulling assembly holds the protective film and slides horizontally above the film cutting platform. The film suction assembly is slidably connected between the loading and unloading mechanism and the film cutting platform.

8. An automated vacuum laminating machine according to claim 7, characterized in that, The film suction assembly includes a third linear module, a third robotic arm, and a second heating element. The two ends of the third linear module are located above the loading and unloading mechanism and the film cutting platform, respectively. The third robotic arm is disposed at the drive end of the third linear module, and the second heating element is disposed circumferentially on the third robotic arm.

9. An automated vacuum laminating machine according to claim 1, characterized in that, The feeding conveyor assembly includes a third driving member, a driving roller, a driven roller, and a conveyor belt. The driving roller and the driven roller are rotatably mounted on the frame. The driving end of the third driving member is connected to the driving roller. The conveyor belt is rotatably connected to the driving roller and the driven roller.

10. An automated vacuum laminating machine according to claim 1, characterized in that, The vacuum laminating machine also includes a cooling fan, which is respectively located between the upper film receiving and discharging assembly and the lower film receiving and discharging assembly at the discharge end of the vacuum laminating mechanism.

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