A packaging structure for semiconductor products

Abstract

The utility model relates to packing technical field, concretely is a kind of packing structure for semiconductor product, including placing plate, the top of placing plate is provided with baffle, the side of placing plate is provided with fixed groove, the inside movable joint of fixed groove is connected with fixed plate, the side fixed connection of fixed plate has moving plate, moving plate is connected with baffle, the inner wall fixed connection of baffle has cross plate, the top rotary connection of cross plate has screw rod, the outside screw thread connection of screw rod has extrusion plate. Advantage lies in: the setting of fixed groove, fixed plate, moving plate, baffle, screw rod, extrusion plate, T type slot and T type column makes after moving plate and baffle are installed on placing plate three not easy to separate, and extrusion plate is completed to semiconductor product extrusion fixed under the restriction of screw rod also cannot move at will, so that the stability of packing structure when transporting semiconductor product can be guaranteed.

Description

Technical Field

[0001] This utility model relates to the field of packaging technology, and in particular to a packaging structure for semiconductor products. Background Technology

[0002] A power semiconductor module is a combination of components with specific functions and modes. A power semiconductor module is a combination of high-power electronic power devices with specific functions and then encapsulated into a single unit. After the semiconductor is manufactured, it needs to be packaged using a packaging structure to ensure that it is not damaged during storage and transportation.

[0003] A packaging structure for semiconductor products disclosed in Chinese patent CN218807558U not only allows for the reuse of the base plate, reducing the production cost of semiconductor products, but also enables packaging of semiconductor products of different heights. However, while solving the problem, this packaging structure for semiconductor products has the following drawbacks:

[0004] By attaching the magnetic rod to the magnet, the cover plate, the surrounding plate, and the bottom plate can be connected together. However, this arrangement makes it easy for the magnetic rod and the magnet to separate during transportation of the packaging structure if it is subjected to large bumps. This can cause the cover plate and the surrounding plate to detach from the bottom plate, resulting in low stability of the packaging structure when packaging semiconductor products. In severe cases, it can even lead to damage to the semiconductor products. Utility Model Content

[0005] The purpose of this utility model is to at least solve one of the technical defects described in the background art.

[0006] Therefore, one objective of this utility model is to propose a packaging structure for semiconductor products, which aims to solve the problem of low stability in existing packaging structures for semiconductor products when packaging semiconductor products.

[0007] To achieve the above objectives, one embodiment of the present invention provides a packaging structure for semiconductor products, including a placement plate, a baffle plate on the top of the placement plate, a fixing groove on one side of the placement plate, a fixing plate movably connected inside the fixing groove, a movable plate fixedly connected to one side of the fixing plate, the movable plate being movably connected to the baffle plate, a cross plate fixedly connected to the inner wall of the baffle plate, a screw rotatably connected to the top of the cross plate, a pressing plate threadedly connected to the outer side of the screw plate, a T-shaped groove on the top of the pressing plate, a T-shaped post movably connected inside the T-shaped groove, and the T-shaped post being fixedly connected to the movable plate.

[0008] Preferably, one side of the baffle has a storage groove, and a connecting column is movably connected inside the storage groove. The connecting column is fixedly connected to the movable plate. A limiting plate is movably connected inside the storage groove, and the limiting plate is fixedly connected to the connecting column. A spring is provided on the outside of the connecting column. The spring can pull the connecting column through the limiting plate, thereby allowing the connecting column to pull the movable plate. This arrangement ensures that the fixed plate will not arbitrarily detach from the sides of the fixed groove after it moves into the fixed groove, and that the movable plate will not detach from one side of the baffle when it is pulled.

[0009] Preferably, the top of the placement plate is provided with a positioning groove, and a positioning plate is movably connected inside the positioning groove. The positioning plate is fixedly connected to the baffle, and the positioning plate can move into the positioning groove. This arrangement ensures that the baffle will not move left or right under the pulling force when the two moving plates are pulled, thus making it more convenient to move the fixed plate into the fixed groove.

[0010] Preferably, in any of the above embodiments, a guide post is fixedly connected to the bottom of the cross plate, the guide post is movably connected to the extrusion plate, a support plate is fixedly connected to the bottom end of the guide post, and the bottom end of the screw is rotatably connected to the support plate. The support plate and the cross plate cooperate to support the screw, thereby ensuring the stability of the screw during rotation. At the same time, the guide post can guide the extrusion plate, thereby allowing the extrusion plate to move downwards more effectively.

[0011] Preferably, as described in any of the above embodiments, a rubber pad is provided at the bottom of the extrusion plate. The rubber pad prevents the extrusion plate from damaging the semiconductor body due to excessive pressure when extruding the semiconductor product.

[0012] Compared with the prior art, the advantages and beneficial effects of this utility model are as follows:

[0013] 1. The arrangement of the fixed groove, fixed plate, movable plate, baffle, screw, extrusion plate, T-slot and T-post makes it difficult for the movable plate and baffle to separate after they are installed on the placement plate. At the same time, after the extrusion plate completes the extrusion and fixation of the semiconductor product, it will not move arbitrarily under the restriction of the screw. Thus, the stability of the packaging structure can be guaranteed when transporting semiconductor products.

[0014] 2. The positioning plate and positioning groove are designed so that the baffle will not move arbitrarily when the two moving plates are pulled. At the same time, after the moving plate is released, the moving plate can automatically drive the fixed plate into the fixed groove under the pull of the spring, which makes the operation of installing the baffle and moving plate on the placement plate more convenient.

[0015] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0016] The above and / or additional aspects and advantages of this utility model will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0017] Figure 1 This is a structural schematic diagram according to the present invention;

[0018] Figure 2 This is a structural schematic diagram of the enclosure assembly according to the present invention;

[0019] Figure 3 This is a schematic diagram of the extrusion assembly according to the present invention;

[0020] Figure 4 This is a structural schematic diagram of the placement plate according to the present invention.

[0021] The components are: 1. Placement plate, 2. Baffle, 3. Fixing groove, 4. Fixing plate, 5. Moving plate, 6. Cross plate, 7. Screw, 8. Extrusion plate, 9. T-slot, 10. T-post, 11. Placement groove, 12. Semiconductor product, 13. Storage groove, 14. Connecting post, 15. Limiting plate, 16. Spring, 17. Positioning groove, 18. Positioning plate, 19. Guide post, 20. Support plate, 21. Pull groove, 22. Rotating ring, 23. Rubber pad. Detailed Implementation

[0022] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain this utility model, and should not be construed as limiting this utility model.

[0023] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0024] like Figure 1-4As shown, this embodiment of a semiconductor product packaging structure includes a placement plate 1, which is T-shaped. A baffle 2 is provided on the top of the placement plate 1, and two baffles 2 are symmetrically arranged on the placement plate 1. A fixing groove 3 is formed on one side of the placement plate 1, and a fixing plate 4 is movably connected inside the fixing groove 3. A movable plate 5 is fixedly connected to one side of the fixing plate 4, and the movable plate 5 is movably connected to the baffle 2. Two movable plates 5 are stacked on both sides of the baffle 2. By placing the baffle 2 and movable plates 5 on the placement plate 1 and then pulling the two movable plates 5 until the bottoms of the baffle 2 and movable plates 5 contact the placement plate 1, the solution is obtained. Together, the movable plate 5 is pushed and the fixed plate 4 is moved directly into the fixed groove 3. The inner wall of the baffle 2 is fixedly connected to the cross plate 6. The top of the cross plate 6 is rotatably connected to the screw 7. The screw 7 is rotatably connected to the cross plate 6 through the bearing. The outer side of the screw 7 is threadedly connected to the extrusion plate 8. The top of the extrusion plate 8 is provided with a T-shaped groove 9. The inside of the T-shaped groove 9 is movably connected to the T-shaped column 10. The T-shaped column 10 is fixedly connected to the movable plate 5. By rotating the screw 7, the screw 7 drives the extrusion plate 8 to move downward. At the same time, the T-shaped groove 9 on the extrusion plate 8 is directly fitted onto the outside of the T-shaped column 10.

[0025] Example 1: The top of the placement plate 1 is provided with a placement groove 11, and a semiconductor product 12 is disposed inside the placement groove 11. The placement groove 11 is opened to correspond to the shape of the semiconductor product 12, so that the semiconductor product 12 will not move randomly after being placed inside the placement groove 11.

[0026] Example 2: A storage groove 13 is provided on one side of the baffle 2. A connecting post 14 is movably connected inside the storage groove 13. The connecting post 14 is fixedly connected to the movable plate 5. When the movable plate 5 is pulled, the connecting post 14 can move inside the storage groove 13. This setting allows the fixed plate 4 on the movable plate 5 to be directly aligned with the fixed groove 3.

[0027] Example 3: The storage slot 13 is internally connected to a limiting plate 15, which is fixedly connected to a connecting column 14. A spring 16 is provided on the outside of the connecting column 14. One end of the spring 16 is fixedly connected to the limiting plate 15, and the other end of the spring 16 is fixedly connected to the inner wall of the storage slot 13. This allows the spring 16 to directly push the connecting column 14 through the limiting plate 15, and the connecting column 14 to move the fixed plate 4 directly into the fixed slot 3 via the moving plate 5.

[0028] Example 4: A positioning groove 17 is provided on the top of the placement plate 1. A positioning plate 18 is movably connected inside the positioning groove 17. The positioning plate 18 is fixedly connected to the baffle 2. After the baffle 2 is placed on the top of the placement plate 1, the positioning plate 18 can be moved directly into the positioning groove 17. At this time, the two moving plates 5 are pulled directly so that the positioning plate 18 can be completely moved into the positioning groove 17. Then the two moving plates 5 are released, so that the moving plates 5 drive the fixed plate 4 to move into the fixed groove 3 under the pull of the spring 16.

[0029] Example 5: A guide post 19 is fixedly connected to the bottom of the cross plate 6. The guide post 19 is movably connected to the extrusion plate 8. A support plate 20 is fixedly connected to the bottom end of the guide post 19. The bottom end of the screw 7 is rotatably connected to the support plate 20. The bottom end of the screw 7 is rotatably connected to the support plate 20 through a bearing. When the baffle 2 and the moving plate 5 are both installed on the top of the placement plate 1, the support plate 20 is also in direct contact with the placement plate 1. At the same time, when the screw 7 drives the extrusion plate 8, the extrusion plate 8 can move up and down under the guidance of the guide post 19.

[0030] Example 6: A groove 21 is provided on one side of the movable plate 5. The two movable plates 5 can be pulled easily through the groove 21. At the same time, the packaging structure as a whole can be lifted through the groove 21. A rotating ring 22 is fixedly connected to the top of the screw 7. The screw 7 can be rotated easily through the rotating ring 22.

[0031] Example 7: A rubber pad 23 is provided at the bottom of the extrusion plate 8. The extrusion plate 8 can move together with the rubber pad 23, so that the extrusion plate 8 can complete the extrusion and fixation of the semiconductor product 12 through the rubber pad 23.

[0032] The working principle of this utility model is as follows: In use, after semiconductor products 12 are placed in the placement slots 11 on the placement plate 1, the baffle 2 and the moving plate 5 are directly placed on the outside of the placement plate 1. When the baffle 2 and the moving plate 5 cannot move, the two moving plates 5 are pulled by the pull groove 21 so that the positioning plate 18 can be completely moved into the positioning slot 17. Then the two moving plates 5 are released. At this time, the spring 16 pushes the limiting plate 15 and moves the limiting plate 15 inside the receiving slot 13. At the same time, the limiting plate 15 drives the moving plate 5 to move through the connecting column 14 and moves the moving plate 5 to move the fixing plate 4 into the fixing slot 3. Finally, the screw 7 is rotated by the rotating ring 22 and the screw 7 drives the extrusion plate 8 to move downward. At the same time, the T-shaped groove 9 on the extrusion plate 8 is directly placed on the outside of the T-shaped column 10. When the rubber pad 23 at the bottom of the extrusion plate 8 contacts the top of the semiconductor product 12, the rotation of the screw 7 is stopped. Thus, the packaging of the semiconductor product 12 is completed.

[0033] Compared with the prior art, the present invention has the following advantages:

[0034] 1. When packaging and limiting the semiconductor product 12, the baffle 2 and the movable plate 5 are installed on the top of the placement plate 1. Then, the movable plate 5 is pulled and pushed, so that the fixed plate 4 moves into the interior of the fixed groove 3. Then, the screw 7 is rotated directly. With the rotation of the screw 7, the extrusion plate 8 can move downward. At the same time, the T-slot 9 on the extrusion plate 8 can be directly fitted onto the outside of the T-post 10, so that the connection between the baffle 2 and the movable plate 5 is more secure. When the bottom of the extrusion plate 8 contacts the semiconductor product 12, the rotation of the screw 7 is stopped. In summary, the arrangement of the fixed groove 3, fixed plate 4, movable plate 5, baffle 2, screw 7, extrusion plate 8, T-slot 9 and T-post 10 makes it difficult for the baffle 2 and the movable plate 5 to detach from the placement plate 1 after they are installed on the placement plate 1. At the same time, the extrusion plate 8 will not move arbitrarily under the restriction of the screw 7, so that the overall stability of the packaging structure can be guaranteed when transporting the semiconductor product 12.

[0035] 2. When installing baffle 2 and movable plate 5 on placement plate 1, the positioning plate 18 can be moved into the positioning groove 17 first, and then the movable plate 5 can be pulled, so that the movable plate 5 squeezes the spring 16 through the connecting column 14 and the limiting plate 15 and completely separates from the baffle 2. At this time, continue to move the baffle 2 downward and make the positioning plate 18 completely move into the positioning groove 17. Then release the movable plate 5. At this time, the spring 16 can pull the movable plate 5 through the connecting column 14 and make the fixed plate 4 move directly into the fixed groove 3. In summary, the setting of positioning plate 18 and positioning groove 17 makes it so that the baffle 2 will not move arbitrarily when the two movable plates 5 are pulled. At the same time, after the movable plate 5 is released, the movable plate 5 can automatically drive the fixed plate 4 to move into the fixed groove 3 under the pull of the spring 16, so that the operation of installing baffle 2 and movable plate 5 on placement plate 1 is relatively convenient.

Claims

1. A packaging structure for semiconductor products, characterized in that, The device includes a placement plate (1), a baffle (2) on the top of the placement plate (1), a fixing groove (3) on one side of the placement plate (1), a fixing plate (4) movably connected inside the fixing groove (3), a movable plate (5) fixedly connected to one side of the fixing plate (4), the movable plate (5) movably connected to the baffle (2), a cross plate (6) fixedly connected to the inner wall of the baffle (2), a screw (7) rotatably connected to the top of the cross plate (6), a pressing plate (8) threadedly connected to the outer side of the screw (7), a T-shaped groove (9) on the top of the pressing plate (8), a T-shaped column (10) movably connected inside the T-shaped groove (9), and the T-shaped column (10) fixedly connected to the movable plate (5).

2. The packaging structure for semiconductor products as described in claim 1, characterized in that, The top of the placement plate (1) is provided with a placement slot (11), and a semiconductor product (12) is disposed inside the placement slot (11).

3. The packaging structure for semiconductor products as described in claim 1, characterized in that, A storage slot (13) is provided on one side of the baffle (2), and a connecting column (14) is movably connected inside the storage slot (13). The connecting column (14) is fixedly connected to the movable plate (5).

4. The packaging structure for semiconductor products as described in claim 3, characterized in that, The storage slot (13) is internally connected to a limiting plate (15), which is fixedly connected to a connecting column (14). A spring (16) is provided on the outside of the connecting column (14).

5. The packaging structure for semiconductor products as described in claim 4, characterized in that, The top of the placement plate (1) is provided with a positioning groove (17), and a positioning plate (18) is movably connected inside the positioning groove (17). The positioning plate (18) is fixedly connected to the baffle (2).

6. The packaging structure for semiconductor products as described in claim 1, characterized in that, The bottom of the cross plate (6) is fixedly connected to a guide post (19), the guide post (19) is movably connected to the extrusion plate (8), the bottom end of the guide post (19) is fixedly connected to a support plate (20), and the bottom end of the screw (7) is rotatably connected to the support plate (20).

7. The packaging structure for semiconductor products as described in claim 1, characterized in that, A groove (21) is provided on one side of the movable plate (5), and a rotating ring (22) is fixedly connected to the top of the screw (7).

8. The packaging structure for semiconductor products as described in claim 1, characterized in that, A rubber pad (23) is provided at the bottom of the extrusion plate (8).

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