Anti-plate and coating equipment

Abstract

The embodiment of the utility model provides a kind of prevent and stick board and coating equipment, it is related to battery piece production field.The utility model provides prevent and stick board, including connecting portion, detachably set in coating equipment, and coating equipment has coating chamber, and connecting portion is set on the both sides of coating chamber;Shielding portion, set in the lower end of connecting portion, two shielding portions extend towards and all extend into coating chamber, to be used for when load plate is in coating in coating chamber, the both ends of load plate are shielded.The utility model provides coating equipment, including equipment ontology, load plate and preceding prevent and stick board.The utility model can improve the problem that the area of current load plate is not covered by silicon chip in coating process will be sputtered on film layer.

Description

Technical Field

[0001] This utility model relates to the field of battery cell manufacturing technology, and more specifically, to an anti-sticking plate and coating equipment. Background Technology

[0002] Currently, PVD coating is commonly used in the production of solar cells. The PVD equipment used for solar cells is generally horizontal. During operation, the silicon wafer to be processed is placed in a carrier plate, which carries the wafer into the coating chamber for coating. In actual production, several carrier plates sequentially enter the coating chamber. After coating is completed, the carrier plate is transferred out of the coating chamber and a new silicon wafer to be coated is inserted, and this cycle is repeated to achieve continuous production.

[0003] The inventors discovered that during continuous use, the areas of the carrier plate not covered by the silicon wafer on both sides are also sputtered with a film layer. This causes the film layer to absorb moisture from the air when the carrier plate flows outside the coating chamber, and release it in the high-temperature, low-vacuum environment when the carrier plate flows into the coating chamber. This results in a continuous increase in moisture inside the coating chamber, affecting the coating atmosphere and shortening the life of the coating chamber. Furthermore, the friction between the carrier plate and the sliding track of the transmission platform during the flow process causes the film layer on the carrier plate to be rubbed off, causing pollution of the coating environment and affecting the yield of solar cells. Utility Model Content

[0004] The purpose of this invention is to provide an anti-sputtering plate and a coating equipment, which can improve the problem that the area of ​​the carrier board not covered by the silicon wafer will be sputtered with a film layer during the current coating process.

[0005] The embodiments of this utility model can be implemented as follows:

[0006] In a first aspect, this utility model provides an anti-fall plate, comprising:

[0007] A connecting part is detachably disposed on the coating equipment, the coating equipment having a coating chamber, and the connecting part is disposed on both sides of the coating chamber;

[0008] A shielding portion is disposed at the lower end of the connecting portion. The two shielding portions extend towards each other and both extend into the coating chamber, so as to shield both ends of the carrier plate when the carrier plate is coated in the coating chamber.

[0009] In an optional embodiment, the width of the projection of the blocking part onto the plane of the carrier plate is 100mm-200mm.

[0010] In an optional embodiment, the height of the projection of the connecting part on the vertical plane is 100mm-150mm.

[0011] In an optional embodiment, the thickness of the connecting portion and the shielding portion is 2mm-3mm.

[0012] In an optional embodiment, the distance between the end of the shielding part and the carrier plate is 20mm-50mm.

[0013] In an optional embodiment, the connecting portion and the shielding portion are perpendicular to each other and together form an L-shaped structure, with the shielding portion extending horizontally toward the coating chamber.

[0014] In an optional embodiment, the end of the connecting portion near the coating equipment is provided with a protrusion for abutting against the coating equipment.

[0015] In an optional embodiment, an insulating layer is provided on the side of the protrusion closest to the coating device.

[0016] In an optional embodiment, the protrusion is provided with a screw hole.

[0017] Secondly, the present invention provides a coating device, including a device body, a carrier plate and an anti-sticking plate as described in any of the foregoing embodiments. The device body has a coating chamber, the carrier plate is movably disposed in the coating chamber, and the anti-sticking plate includes a connecting part and a shielding part. The connecting part is detachably connected to the device body, and the shielding part extends into the coating chamber.

[0018] The beneficial effects of the anti-sticking plate and coating equipment provided in this embodiment of the utility model include:

[0019] By setting an anti-splash plate on the coating equipment, when the carrier plate is in the coating chamber for coating processing, the shielding part is located between the coating equipment and the carrier plate. The shielding part is used to shield the areas at both ends of the carrier plate that are not shielded by the silicon wafer, so as to prevent the coating material from sputtering to both ends of the carrier plate. Attached Figure Description

[0020] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this utility model and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0021] Figure 1 This is a schematic diagram of the coating equipment provided in this embodiment;

[0022] Figure 2 This is a schematic diagram of the anti-collision plate provided in this embodiment.

[0023] Icons: 100-Equipment body; 110-Coating chamber; 200-Carrier plate; 300-Anti-stick plate; 310-Connecting part; 320-Shielding part; 330-Protrusion; 331-Screw hole. Detailed Implementation

[0024] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. The components of the embodiments of this utility model described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0025] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

[0026] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0027] In the description of this utility model, it should be noted that if terms such as "upper," "lower," "inner," or "outer" are used to indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship in which the utility model product is usually placed during use, they are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0028] Furthermore, the terms "first" and "second" are used only to distinguish descriptions and should not be interpreted as indicating or implying relative importance.

[0029] It should be noted that, where there is no conflict, the features in the embodiments of this utility model can be combined with each other.

[0030] The coating process of solar cells is a key step in improving their photoelectric conversion efficiency and durability. Common coating methods include physical vapor deposition (PVD), chemical vapor deposition (CVD), atomic layer deposition (ALD), and solution deposition. Currently, physical vapor deposition (PVD) is commonly used in solar cell production, and the PVD equipment used for cells is generally horizontal. During the coating process, the silicon wafer to be processed is placed in a carrier plate, which carries the wafer into the coating chamber for coating. In actual production, several carrier plates sequentially enter the coating chamber, complete the coating, and then exit the chamber. New silicon wafers are then loaded and re-enter the chamber for coating, repeating this cycle to achieve continuous coating production of solar cells.

[0031] The inventors discovered that when a silicon wafer is placed in the center of a carrier plate, the areas at both ends of the carrier plate not covered by the silicon wafer will also be sputtered with a film layer during continuous use. On one hand, the film layer at both ends of the carrier plate causes moisture to be absorbed from the air as the carrier plate flows outside the coating chamber. This moisture is then released in the high-temperature, low-vacuum environment inside the coating chamber, leading to a continuous increase in moisture within the chamber, affecting the coating atmosphere and shortening the chamber's lifespan. On the other hand, friction between the carrier plate and the sliding track of the transmission platform during transport causes the film layer on the carrier plate to be rubbed off, contaminating the coating environment and affecting the yield of solar cells.

[0032] To address the problem of sputtered coating layers at both ends of silicon wafers in current coating equipment, which reduces the lifespan of the coating chamber and affects the yield of solar cells, this invention provides an anti-sputtering plate and coating equipment. The overall structure, working principle, and technical effects of the anti-sputtering plate and coating equipment provided by this invention are described in detail below with reference to embodiments and accompanying drawings.

[0033] On the one hand, please refer to Figure 1 This invention provides a coating equipment for use in the production process of solar cell coating, used to deposit solid materials on the surface of the cell to improve the photoelectric conversion efficiency of the cell. Specifically, the coating equipment of this invention can be used in the production of solar cells such as crystalline silicon solar cells, thin-film solar cells, back-contact cells, and heterojunction cells.

[0034] The coating equipment provided by this utility model includes an equipment body 100, a carrier plate 200, and an anti-attachment plate 300. The equipment body 100 has a coating chamber 110 for coating solar cells. The carrier plate 200 is used to carry the silicon wafers to be processed, and the carrier plate 200 is movably disposed in the coating chamber 110 and driven below the cathode of the equipment body 100. The carrier plate 200 is located below the target material. The two ends of the carrier plate 200 correspond to the two ends of the cathode of the equipment body 100. The carrier plate 200 is used to carry and drive multiple silicon wafers to move sequentially into the coating chamber 110 for coating processing. The anti-attachment plate 300 includes a connecting part 310 and a shielding part 320. The connecting part 310 is detachably connected to the equipment body 100, and the shielding part 320 extends into the coating chamber 110.

[0035] By installing a shielding plate 300 on the equipment body 100, during the coating process, the shielding plate 300 blocks the areas at both ends of the carrier plate 200 not covered by the silicon wafer, thus preventing the film layer from sputtering onto the ends of the carrier plate 200. This prevents the film layer from absorbing moisture from the air when flowing outside the coating chamber 110 and carrying the moisture into the coating chamber 110 for release, thereby shortening the lifespan of the coating chamber 110. At the same time, the design of the shielding plate 300 can also prevent the film layer formed on the carrier plate 200 from rubbing against the track, causing the film layer to fall off and pollute the coating environment, thus affecting the yield of the solar cells.

[0036] On the other hand, please refer to Figure 1 and Figure 2 This utility model provides an anti-splash plate 300, which is applied to the above-mentioned coating equipment. It is used to shield both ends of the carrier plate 200 during the coating process to prevent the areas at both ends of the carrier plate 200 that are not shielded by the silicon wafer from sputtering and forming a film layer.

[0037] The anti-stick plate 300 provided by this utility model includes a connecting part 310 and a blocking part 320. The connecting part 310 is detachably installed on the coating equipment, and the connecting part 310 is installed on both sides of the coating chamber 110. The line connecting the two connecting parts 310 is perpendicular to the moving direction of the carrier plate 200. The blocking part 320 is installed at the lower end of the connecting part 310. The two blocking parts 320 extend towards each other and both extend into the coating chamber 110.

[0038] By installing an anti-splash plate 300 on the coating equipment, when the carrier plate 200 is located in the coating chamber 110 for coating processing, the shielding part 320 is located between the coating equipment and the carrier plate 200. The shielding part 320 is used to shield the areas at both ends of the carrier plate 200 that are not shielded by the silicon wafer, so as to prevent the coating material from sputtering onto the two ends of the carrier plate 200. This also prevents the film layer from absorbing moisture from the air when flowing outside the coating chamber 110 and carrying the moisture into the coating chamber 110, where it is released in the high temperature and low vacuum environment of the coating chamber 110, thus shortening the life of the coating chamber 110. At the same time, the design of the anti-splash plate 300 can also prevent the film layer from forming on the carrier plate 200. When the carrier plate 200 moves, the film layer rubs against the sliding track, causing the film layer to fall off and pollute the coating environment, thus affecting the yield of the solar cells.

[0039] Please refer to Figure 1 and Figure 2 In some optional embodiments, the width of the projection of the shielding portion 320 onto the plane of the carrier plate 200 is 100mm-200mm. The specific width of the shielding portion 320 can be selected according to actual working conditions, such as the size of the silicon wafer to be processed. Specifically, the width of the projection of the shielding portion 320 onto the plane of the carrier plate 200 can be configured as 100mm, 120mm, 140mm, 160mm, 180mm, 200mm, etc. It is understood that the selection of the width of the projection of the shielding portion 320 onto the plane of the carrier plate 200 needs to meet the requirements of sufficient coating processing on the surface of the silicon wafer, and also needs to minimize the sputtering area on the carrier plate 200.

[0040] Please refer to Figure 1 and Figure 2 In some optional embodiments, the height of the projection of the connecting part 310 on the vertical plane is 100mm-150mm. The connecting part 310 provides a certain gap between the shielding part 320 and the coating equipment to facilitate the installation of the anti-stick plate 300 and to prevent interference between the anti-stick plate 300 and the coating equipment, thus affecting the normal operation of the coating equipment. Specifically, the height of the projection of the connecting part 310 on the vertical plane needs to be selected between 100mm and 150mm according to the specific size and structure of the coating equipment.

[0041] To ensure the structural strength of the anti-collision plate 300 while minimizing its weight to reduce interference with the coating equipment and lowering its manufacturing cost, the following alternative embodiments are described. Figure 1 and Figure 2 The thickness of the connecting part 310 and the shielding part 320 is set to 2mm-3mm, so as to minimize the weight of the anti-collision plate 300 while satisfying the structural strength of the anti-collision plate 300.

[0042] Please refer to Figure 1 and Figure 2 In this embodiment, the distance between the end of the shielding part 320 and the carrier plate 200 is 20mm-50mm. It is understood that during the coating process on the silicon wafer on the carrier plate 200, the coating material will enter the gap between the shielding part 320 and the carrier plate 200 and be sputtered onto the carrier plate 200. By keeping the distance between the end of the shielding part 320 and the carrier plate 200 at 20mm-50mm, the shielding effect on the carrier plate 200 can be maximized, reducing the amount of coating material entering the gap between the shielding part 320 and the carrier plate 200.

[0043] Please refer to Figure 1 and Figure 2 In this embodiment, the connecting portion 310 and the shielding portion 320 are perpendicular to each other and together form an L-shaped structure. The connecting portion 310 is vertically connected to the coating equipment, and the shielding portion 320 is perpendicular to the connecting portion 310 and extends into the coating chamber 110. By setting the anti-stick plate 300 to an L-shaped structure, the processing and transportation of the anti-stick plate 300 are facilitated, while minimizing the possibility of interference between the anti-stick plate 300 and the coating equipment. In other optional embodiments, the connecting portion 310 and the shielding portion 320 can also be at other angles, and the connecting portion 310 and the shielding portion 320 can also be non-plate-shaped structures. The anti-stick plate 300 only needs to satisfy the requirement that the shielding portion 320 extends into the coating chamber 110 and can effectively shield both ends of the carrier plate 200.

[0044] Please refer to Figure 1 and Figure 2 To increase the contact area between the connecting part 310 and the coating equipment, and to improve the connection stability between them, in some optional embodiments, a protrusion 330 is provided at the end of the connecting part 310 near the coating equipment. The protrusion 330 abuts against the coating equipment, and its function is to increase the contact area between the connecting part 310 and the coating equipment. Furthermore, to facilitate a detachable connection between the connecting part 310 and the coating equipment, multiple screw holes 331 are provided on the protrusion 330. Bolts are passed through the screw holes 331 to connect the connecting part 310 to the coating equipment, thus achieving a detachable connection. In other embodiments, the connecting part 310 and the coating equipment can also be detachably connected by magnetic attraction, snap-fit, or other means. Furthermore, in order to prevent the protective plate 300 from becoming conductive and affecting the coating process, in this embodiment, an insulating layer is provided on the side of the protrusion 330 near the coating equipment. In this embodiment, the insulating layer is made of ceramic sheet; in other embodiments, the insulating layer may also be made of other insulating materials.

[0045] In summary, the implementation principle of the anti-splash plate and coating equipment provided by this utility model is as follows: by setting an anti-splash plate 300 on the coating equipment, when the carrier plate 200 is located in the coating chamber 110 for coating processing, the shielding part 320 is located between the coating equipment and the carrier plate 200. The shielding part 320 is used to shield the areas at both ends of the carrier plate 200 that are not shielded by the silicon wafer, so as to prevent the coating material from being sputtered onto both ends of the carrier plate 200.

[0046] The above description is only a specific embodiment of this utility model, but the protection scope of this utility model is not limited thereto. Any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this utility model should be included within the protection scope of this utility model.

Claims

1. A type of anti-fall plate, characterized in that, include: A connecting part is detachably disposed on the coating equipment, the coating equipment having a coating chamber, and the connecting part is disposed on both sides of the coating chamber; A shielding portion is disposed at the lower end of the connecting portion. The two shielding portions extend towards each other and both extend into the coating chamber, so as to shield both ends of the carrier plate when the carrier plate is coated in the coating chamber.

2. The anti-collision plate according to claim 1, characterized in that, The width of the projection of the shielding part onto the plane of the carrier plate is 100mm-200mm.

3. The anti-collision plate according to claim 1, characterized in that, The height of the projection of the connecting part on the vertical plane is 100mm-150mm.

4. The anti-collision plate according to claim 1, characterized in that, The thickness of the connecting part and the shielding part is 2mm-3mm.

5. The anti-collision plate according to claim 1, characterized in that, The distance between the end of the shielding part and the carrier plate is 20mm-50mm.

6. The anti-collision plate according to claim 1, characterized in that, The connecting part and the shielding part are perpendicular to each other and together form an L-shaped structure, with the shielding part extending horizontally into the coating cavity.

7. The anti-fall plate according to any one of claims 1-6, characterized in that, The connecting part has a protrusion at one end near the coating equipment for abutting against the coating equipment.

8. The anti-collision plate according to claim 7, characterized in that, An insulating layer is provided on the side of the protrusion closest to the coating equipment.

9. The anti-collision plate according to claim 8, characterized in that, The protrusion is provided with a screw hole.

10. A coating apparatus, characterized in that, The device includes a device body, a carrier plate, and an anti-spotting plate as described in any one of claims 1-9. The device body has a coating chamber, the carrier plate is movably disposed in the coating chamber, and the anti-spotting plate includes a connecting portion and a shielding portion. The connecting portion is detachably connected to the device body, and the shielding portion extends into the coating chamber.

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