Electrolytic copper foil surface treatment device and electrolytic copper foil surface treatment system

Abstract

The application discloses an electrolytic copper foil surface treatment device and an electrolytic copper foil surface treatment system, and relates to the field of electrolytic copper foil preparation. The electrolytic copper foil surface treatment device comprises a first conductive roller, a second conductive roller, a first guide roller and a second guide roller. The first conductive roller and the second conductive roller are arranged at intervals. The first guide roller and the second guide roller are respectively arranged on the two sides of the second conductive roller and on the side of the second conductive roller far from the ground. The copper foil passes by the side of the first conductive roller far from the ground. After one end of the copper foil passes by the upper surface of the first guide roller far from the ground, the first part of the copper foil is located between the first guide roller and the second conductive roller, the second part of the copper foil is attached to the surface of the second guide roller close to the ground, the third part of the copper foil is located between the second conductive roller and the second guide roller, and the other end of the copper foil extends out by passing by the upper surface of the first guide roller far from the ground. Through the above design, the application avoids slipping and reduces the cost.

Description

Technical Field

[0001] This application relates to the field of electrolytic copper foil preparation, and more particularly to an electrolytic copper foil surface treatment apparatus and an electrolytic copper foil surface treatment system. Background Technology

[0002] High-performance electronic circuit copper foil is an indispensable material in high-speed digital circuits, millimeter-wave communications and 5G high-speed servers. Currently, low-thickness RTF copper foil and ultra-low profile HVLP copper foil are used. As signals become more high-frequency / high-speed, the surface treatment technology of high-performance copper foil is also constantly iterating and upgrading.

[0003] In the production of electrolytic copper foil, the process flow is generally as follows: electrolyte preparation, electrolytic foil production, surface treatment, and slitting and packaging. Surface treatment refers to electroplating the surface of the copper foil, using copper, zinc, and chromium plating to improve various performance indicators of the raw foil, such as peel resistance and oxidation resistance.

[0004] In existing electrolytic copper foil surface treatment equipment, when entering the roughening process, the current of the inlet conductive roller is usually 5 to 8 times greater than that of the outlet conductive roller in the previous process. This results in an excessively high current density on the inlet conductive roller, forming electrolytic erosion points at the micro-pits of the conductive roller. Since the copper foil surface treatment process requires passing through multiple tanks containing electrolytic copper solution, it is inevitable that the inlet conductive roller will be charged, resulting in localized copper plating on the conductive roller. Under continuous electroplating, burrs, bumps, and copper plating points are easily formed, and slippage is likely to occur. This increases the number of times the conductive roller needs to be polished and ground, leading to increased operating costs. Utility Model Content

[0005] The purpose of this application is to provide an electrolytic copper foil surface treatment apparatus and system that avoids slippage and reduces costs.

[0006] This application discloses an electrolytic copper foil surface treatment apparatus for use before a copper foil roughening process, comprising: a first conductive roller, a second conductive roller, a first guide roller, and a second guide roller. The first conductive roller and the second conductive roller are spaced apart and respectively disposed on both sides of the second conductive roller, with the first guide roller disposed on the side of the second conductive roller away from the ground. The copper foil travels along the first guide roller, the second conductive roller, and the second guide roller in a non-V-shaped path. The copper foil passes around the side of the first conductive roller away from the ground, with one end passing around the upper surface of the first guide roller away from the ground. A first portion of the copper foil is located between the first guide roller and the second conductive roller, a second portion of the copper foil adheres to the surface of the second guide roller near the ground, a third portion of the copper foil is located between the second conductive roller and the second guide roller, and the other end extends out from the upper surface of the first guide roller away from the ground.

[0007] Optionally, the included angle between the first guide roller and the second guide roller is 90° to 180°.

[0008] Optionally, the first guide roller is at the same height as the second guide roller, and the angle between the first guide roller and the second guide roller is 90°.

[0009] Optionally, the spacing between the first guide roller and the second conductive roller, and the spacing between the second guide roller and the second conductive roller are both the same and adjustable.

[0010] Optionally, the cross-sectional area of ​​the first guide roller is equal to the cross-sectional area of ​​the second guide roller, and the ratio of the cross-sectional area of ​​the first guide roller to the cross-sectional area of ​​the second guide roller is 1:1.4 to 1.6.

[0011] Optionally, the electrolytic copper foil surface treatment device further includes a third guide roller, which is disposed between the first conductive roller and the second conductive roller.

[0012] Optionally, the cross-sectional area of ​​the third guide roller is larger than the cross-sectional areas of the first guide roller and the second guide roller.

[0013] Optionally, the distance between the third guide roller and the first guide roller is 200mm to 300mm, and the angle between the horizontal line where the center lines of the first guide roller and the third guide roller are located is 20° to 30°.

[0014] Optionally, the electrolytic copper foil surface treatment device further includes a first spray pipe and a second spray pipe, wherein the first spray pipe is disposed below the first conductive roller and the second spray pipe is disposed below the second conductive roller.

[0015] This application also discloses an electrolytic copper foil surface treatment system, including the electrolytic copper foil surface treatment apparatus and control component as described above, wherein the control component is electrically connected to the electrolytic copper foil surface treatment apparatus.

[0016] Compared to existing electrolytic copper foil surface treatment devices, which suffer from high current density on the inlet conductive roller during the roughening process, easily leading to electrolytic erosion points, and localized copper plating as the inlet conductive roller passes through the electrolyte tank, resulting in burrs, bumps, and copper plating spots during continuous electroplating and slippage, the electrolytic copper foil surface treatment device of this application includes a first conductive roller, a second conductive roller, a first guide roller, and a second guide roller. The first and second conductive rollers are spaced apart, with the first and second guide rollers respectively located on opposite sides of the second conductive roller, on the side of the second conductive roller furthest from the ground. The copper foil is then deposited on the first guide roller and the second conductive roller. The travel path at the roller and the second guide roller is non-V-shaped. The copper foil passes around the side of the first conductive roller away from the ground. After one end passes around the upper surface of the first guide roller away from the ground, part of the copper foil is located between the first guide roller and the second conductive roller. Part of the copper foil wraps the surface of the second guide roller near the ground. Part of the copper foil is located between the two second conductive rollers. The other end extends out from the upper surface of the first guide roller away from the ground. In this way, the contact area of ​​the copper foil on the lower surface of the second conductive roller is increased, reducing the copper plating phenomenon caused by the contact between the lower surface of the second conductive roller and the electrolyte. This makes it less likely to form burrs, bumps and copper plating points, avoids the current slippage phenomenon, and thus reduces operating costs. Attached Figure Description

[0017] The accompanying drawings, which form part of the specification, are used to provide a further understanding of the embodiments of this application and illustrate the implementation methods of this application, together with the textual description, to explain the principles of this application. Obviously, the drawings described below are merely some embodiments of this application, and those skilled in the art can obtain other drawings based on these drawings without any creative effort. In the drawings:

[0018] Figure 1 This is a schematic diagram of the structure of the electrolytic copper foil surface treatment apparatus provided in the embodiments of this application;

[0019] Figure 2 This is a block diagram of the electrolytic copper foil surface treatment system provided in the embodiments of this application.

[0020] Among them, 10 is an electrolytic copper foil surface treatment system; 100 is an electrolytic copper foil surface treatment device; 110 is a first conductive roller; 120 is a second conductive roller; 130 is a first guide roller; 140 is a second guide roller; 150 is a third guide roller; 160 is a first spray pipe; 170 is a second spray pipe; 200 is a control component; 300 is a copper foil; 310 is a first surface; and 320 is a second surface. Detailed Implementation

[0021] It should be understood that the terminology, specific structural and functional details used herein are merely for describing particular embodiments and are representative. However, this application may be implemented in many alternative forms and should not be construed as being limited to the embodiments set forth herein.

[0022] The present application will now be described in detail with reference to the accompanying drawings and optional embodiments.

[0023] Figure 1 This is a schematic diagram of the electrolytic copper foil surface treatment apparatus provided in the embodiments of this application, as shown below. Figure 1 As shown, this application discloses an electrolytic copper foil surface treatment apparatus 100, including: a first conductive roller 110, a second conductive roller 120, a first guide roller 130, and a second guide roller 140. The first conductive roller 110 and the second conductive roller 120 are spaced apart, and the first guide roller 130 and the second guide roller 140 are respectively disposed on both sides of the second conductive roller 120, and disposed on the side of the second conductive roller 120 away from the ground. The copper foil 300 is located at the first guide roller 130, the second conductive roller 120, and the second guide roller 140. The walking path is non-V-shaped; the copper foil 300 passes around the side of the first conductive roller 110 away from the ground, one end passes around the upper surface of the first guide roller 130 away from the ground, the first part of the copper foil 300 is located between the first guide roller 130 and the second conductive roller 120, the second part of the copper foil 300 is attached to the surface of the second guide roller 140 near the ground, the third part of the copper foil 300 is located between the second conductive roller 120 and the second guide roller 140, and the other end extends around the upper surface of the first guide roller 130 away from the ground.

[0024] The first conductive roller 110 is the exit-side conductive roller after the unwinding process in the surface treatment process of copper foil 300, while the second conductive roller 120 is the in-side conductive roller that will enter the first roughening process. The roughening process deposits a layer of dendritic cuprous oxide particles on the rough surface of copper foil 300, increasing the specific surface area of ​​the rough surface. After the first roughening process, a multi-stage surface treatment process of curing and re-roughening is required. The curing process deposits a dense layer of metallic copper in the gaps between the nodular particles of the roughened copper foil 300, reducing the surface roughness of the roughened layer and improving the adhesion of the roughened layer to the copper foil 300. After the curing process, a blackening process, an ashing process, and a passivation process are also performed. The blackening process mainly generates a layer of black copper oxide (CuO) or cuprous oxide (Cu2O) film on the surface of copper foil 300 through chemical oxidation. This film is used to isolate oxygen, moisture, and chemicals, slow down the oxidation rate of copper foil 300 in high temperature and high humidity environments, and extend its service life. In the blackening process, the thickness of the oxide layer must be strictly controlled, as excessive thickness can easily lead to increased brittleness. Therefore, it can be combined with subsequent passivation treatment to improve stability. The purpose of the ashing process is mainly to treat with zinc and nickel to form a zinc-nickel alloy layer on the surface of copper foil 300, improving the high-temperature oxidation resistance and heat resistance of copper foil 300. This also provides a better processing foundation for the subsequent passivation process. The passivation process forms a dense and stable passivation film on the surface of copper foil 300 through chemical or electrochemical methods. The main components are metal oxides or chromates, which improve the corrosion resistance and oxidation resistance of copper foil 300 without significantly affecting its conductivity and subsequent processing performance.

[0025] Therefore, when entering the roughening process, the current density of the inlet conductive roller is generally higher than that of the outlet conductive roller. This mainly serves as a foundation, as the higher current density of the inlet conductive roller creates a uniform micro-rough structure on the surface of the copper foil 300, enhancing the adhesion of subsequent fine roughening and curing processes. Another factor is matching the production speed; current copper foil 300 production speeds are all greater than 20m / min-50m / min, requiring electroplating to be completed on the copper foil 300 surface in a very short time to improve surface treatment efficiency. Each process is equipped with a corresponding electrolytic cell to store the solutions required for the surface treatment steps.

[0026] Compared to existing electrolytic copper foil 300 solutions, where the high current density of the inlet conductive roller during the roughening process easily forms electrolytic erosion points, and the inlet conductive roller forms localized copper plating as it passes through the electrolyte tank, easily forming burrs, bumps, and copper plating points during continuous electroplating, and slippage is likely to occur, the electrolytic copper foil surface treatment apparatus 100 of this application includes a first conductive roller 110, a second conductive roller 120, a first guide roller 130, and a second guide roller 140. The first conductive roller 110 and the second conductive roller 120 are spaced apart, and the first guide roller 130 and the second guide roller 140 are respectively located on both sides of the second conductive roller 120, and on the side of the second conductive roller 120 furthest from the ground. The copper foil 300 enters from the first conductive roller 110... The copper foil 300 is routed around the side away from the ground. One end of the copper foil 300 is routed around the upper surface of the first guide roller 130 away from the ground. Part of the copper foil 300 is located between the first guide roller 130 and the second conductive roller 120. Part of the copper foil 300 wraps the surface of the second guide roller 140 near the ground. Part of the copper foil 300 is located between the second conductive roller 120 and the second guide roller 140. The other end extends out from the upper surface of the first guide roller 130 away from the ground. In this way, the contact area of ​​the copper foil 300 on the lower surface of the second conductive roller 120 is increased, reducing the copper plating phenomenon caused by the contact between the lower surface of the second conductive roller 120 and the electrolyte. This makes it less likely to form burrs, bumps and copper plating points, avoids slippage, and reduces the number of polishing and repair times of the second conductive roller 120, thereby reducing the operating cost of the surface treatment machine.

[0027] Specifically, such as Figure 1As shown, the copper foil 300's path around the first guide roller 130, the second conductive roller 120, and the second guide roller 140 forms a "Mickey Mouse" shape. The copper foil 300 includes a first surface 310 and a second surface 320, wherein the first surface 310 is the processed surface and the second surface 320 is the unprocessed surface. The electrolytic copper foil surface treatment device 100 also includes a first spray pipe 160 and a second spray pipe 170. The first spray pipe 160 is disposed below the first conductive roller 110 and is used to spray the electrolyte in the electrolytic cell corresponding to the first conductive roller 110 onto the first conductive roller 110. The second spray pipe 170 is disposed below the second conductive roller 120, and the copper foil 300 bypasses the first conductive roller 120. After the first guide roller 130, the processed surface of the copper foil 300 faces the second spray pipe 170, while the unprocessed surface of the copper foil 300 faces the second conductive roller 120 and is attached to the second conductive roller 120. Therefore, the second spray pipe 170 sprays electrolyte onto the copper foil 300 wrapped on the second conductive roller 120 to reduce copper plating on the second conductive roller 120. At the same time, more electrolyte is sprayed onto the copper foil 300 passing through the second conductive roller 120, which allows the charged copper foil 300 to adsorb an appropriate amount of copper and form a more rapid and uniform micro-rough structure on the surface of the copper foil 300. Therefore, the current density of the second conductive roller 120 can be appropriately reduced to perform surface treatment on the copper foil 300.

[0028] The included angle between the first guide roller 130 and the second guide roller 140 is 90° to 180°. This ensures that after the copper foil 300 enters from the first guide roller 130, it passes around the lower surface of the second conductive roller 120 and then extends to the second guide roller 140, so as to ensure that the electrolyte in the electrolytic cell and the electrolyte sprayed from the second spray pipe 170 do not adhere to the second conductive roller 120. Preferably, the horizontal plane at which the first guide roller 130 is located is at the same height as the horizontal plane at which the second guide roller 140 is located, and the angle between the first guide roller 130 and the second guide roller 140 is 90°, that is, the horizontal line at which the center point of the first guide roller 130 and the second conductive roller 120 are located forms an angle of 45°; the horizontal line at which the center point of the second guide roller 140 and the second conductive roller 120 are located forms an angle of 135°. In this way, the angle at which the copper foil 300 wraps around the second conductive roller 120 during the copper foil 300 processing is increased from the original 90° to 270°. On the one hand, this ensures that the length of the copper foil 300 wrapped around the second conductive roller 120 after passing around the first guide roller 130 is the longest and the processing surface area is the largest. On the other hand, it ensures the spacing between the first guide roller 130 and the second guide roller 140 and other structural components, so that they will not interfere with each other during operation and ensure the normal progress of the copper foil 300 surface treatment process. Furthermore, this design can reduce the current density to two-thirds of the original, thereby reducing energy consumption in this process. In addition, the area of ​​the non-processed surface of the copper foil 300 in contact with the second conductive roller 120 is also the largest at this time, resulting in better adhesion of the copper foil 300.

[0029] Meanwhile, this application only provides one guide roller on each of the two sides above the second conductive roller 120, which makes the structure simple to operate, avoids affecting the original electroplating performance of the second conductive roller 120, and does not damage the surface quality of the second conductive roller 120, further reducing the appearance quality defects of the copper foil 300, and has high reliability.

[0030] Of course, the heights of the first guide roller 130 and the second guide roller 140 can be set differently, as long as the first guide roller 130 and the second guide roller 140 are both located on the side of the second conductive roller 120 away from the ground. This can also ensure that the copper foil 300 wrapped around the second conductive roller 120 has a sufficiently large area to cover the second conductive roller 120.

[0031] The cross-sectional area of ​​the first guide roller 130 is equal to that of the second guide roller 140, and the ratio of the cross-sectional area of ​​the first guide roller 130 to that of the second conductive roller 120 is 1:1.4 to 1.6. This makes the first guide roller 130 and the second guide roller 140 relatively small and lightweight, which allows the copper foil 300 to move around the first guide roller 130 and the second guide roller 140 with a uniform speed and easier movement. This also allows the copper foil 300 to better fit the second conductive roller 120 and provides uniform pressure above the second conductive roller 120, preventing the copper foil 300 from being indented or deformed due to the excessive weight of the first guide roller 130 and the second guide roller 140.

[0032] The spacing between the first guide roller 130 and the second conductive roller 120, and the spacing between the second guide roller 140 and the second conductive roller 120 are the same. The spacing can be adjusted according to the thickness of the copper foil 300 being processed. It is generally suitable for copper foil 300 with a thickness of 9μm to 105μm. The spacing can be 1μm to 2μm greater than the thickness of the copper foil 300 being surface treated. This ensures that the copper foil 300 has low friction and smooth traction at this point, and also ensures sufficient flatness and prevents wrinkles from easily forming.

[0033] In addition, the electrolytic copper foil surface treatment device 100 also includes a third guide roller 150, which is disposed between the first conductive roller 110 and the second conductive roller 120. The cross-sectional area of ​​the third guide roller 150 is smaller than that of the first conductive roller 110 and the second conductive roller 120. It can pull the copper foil 300 coming out of the first conductive roller 110, so that the copper foil 300 can be more easily guided from the first conductive roller 110 to the first guide roller 130, thereby reducing the pulling force on the copper foil 300 when transitioning from the first conductive roller 110 to the first guide roller 130 and improving the efficiency of surface treatment.

[0034] Furthermore, the cross-sectional area of ​​the third guide roller is larger than that of the first guide roller 130 and the second guide roller 140, which can appropriately increase the tension assistance to the traction copper foil 300, resulting in a faster traction speed. The distance between the third guide roller 150 and the first guide roller 130 is 200mm to 300mm, and the angle between the horizontal lines where the center lines of the first guide roller 130 and the third guide roller 150 are located is 20° to 30°. Under these conditions, the tension-assisted traction effect of the third guide roller 150 is relatively the best, and the operation is stable.

[0035] Before winding up the copper foil 300 after the surface treatment is completed, the copper foil 300 can be dried. The main purpose of drying is to remove moisture and dry and wet gases from the surface and pores of the copper foil 300, remove hydrogen to eliminate stress, increase the flexibility and ductility of the copper foil 300, and eliminate brittleness.

[0036] Figure 2 This is a block diagram of the electrolytic copper foil surface treatment system provided in the embodiments of this application, as shown below. Figure 2 As shown, this application also discloses an electrolytic copper foil surface treatment system 10, including the electrolytic copper foil surface treatment device 100 and a control component 200 as described above. The control component 200 is electrically connected to the electrolytic copper foil 300 surface treatment device and is used to intelligently control the electrolytic copper foil 300 surface treatment. The control component 200 can be equipped with a visual display, which can intuitively display various data of the electrolytic copper foil 300 surface treatment process and make appropriate adjustments as needed.

[0037] It should be noted that the utility model concept of this application can form many embodiments, but due to the limited space of the application documents, they cannot all be listed. Therefore, without conflict, the embodiments described above or the technical features can be arbitrarily combined to form new embodiments. After the embodiments or technical features are combined, the original technical effect will be enhanced.

[0038] The above description, in conjunction with specific optional embodiments, provides a further detailed explanation of this application and should not be construed as limiting the specific implementation of this application to these descriptions. For those skilled in the art, various simple deductions or substitutions can be made without departing from the concept of this application, and all such modifications or substitutions should be considered within the scope of protection of this application.

Claims

1. An electrolytic copper foil surface treatment apparatus, used before the copper foil roughening process, characterized in that, include: First conductive roller; The second conductive roller is provided at an interval from the first conductive roller; First guide roller; as well as The second guide roller, the first guide roller and the second guide roller are respectively disposed on both sides of the second conductive roller, and disposed on the side of the second conductive roller away from the ground; Wherein, the copper foil travels along the first guide roller, the second conductive roller, and the third guide roller in a non-V-shaped path; the copper foil passes around the side of the first conductive roller away from the ground, with one end passing around the upper surface of the first guide roller away from the ground, the first part of the copper foil being located between the first guide roller and the second conductive roller, the second part of the copper foil wrapping around the surface of the second guide roller near the ground, the third part of the copper foil being located between the second conductive roller and the third guide roller, and the other end extending out from the upper surface of the first guide roller away from the ground.

2. The electrolytic copper foil surface treatment apparatus as described in claim 1, characterized in that, The included angle between the first guide roller and the second guide roller is 90° to 180°.

3. The electrolytic copper foil surface treatment apparatus as described in claim 2, characterized in that, The first guide roller is at the same height as the second guide roller, and the angle between the first guide roller and the second guide roller is 90°.

4. The electrolytic copper foil surface treatment apparatus as described in claim 2, characterized in that, The distance between the first guide roller and the second conductive roller, and the distance between the second guide roller and the second conductive roller are both the same and adjustable.

5. The electrolytic copper foil surface treatment apparatus as described in claim 4, characterized in that, The cross-sectional area of ​​the first guide roller is equal to that of the second guide roller, and the ratio of the cross-sectional area of ​​the first guide roller to that of the second guide roller is 1:1.4 to 1.

6.

6. The electrolytic copper foil surface treatment apparatus as described in claim 5, characterized in that, The electrolytic copper foil surface treatment device further includes a third guide roller, which is disposed between the first conductive roller and the second conductive roller, and the cross-sectional area of ​​the third guide roller is smaller than the cross-sectional areas of the first conductive roller and the second conductive roller.

7. The electrolytic copper foil surface treatment apparatus as described in claim 6, characterized in that, The cross-sectional area of ​​the third guide roller is greater than that of the first guide roller and the second guide roller.

8. The electrolytic copper foil surface treatment apparatus as described in claim 7, characterized in that, The distance between the third guide roller and the first guide roller is 200mm to 300mm, and the angle between the horizontal line where the center line of the first guide roller and the center line of the third guide roller are located is 20° to 30°.

9. The electrolytic copper foil surface treatment apparatus as described in claim 1, characterized in that, The electrolytic copper foil surface treatment device further includes a first spray pipe and a second spray pipe, wherein the first spray pipe is disposed below the first conductive roller and the second spray pipe is disposed below the second conductive roller.

10. A surface treatment system for electrolytic copper foil, characterized in that, The device includes an electrolytic copper foil surface treatment apparatus as described in any one of claims 1-9 and a control component, wherein the control component is electrically connected to the electrolytic copper foil surface treatment apparatus.

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