Lightweight liquid cooling pipe for computing power system
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- CHONGQING SULIAN PLASTIC CO LTD
- Filing Date
- 2025-09-16
- Publication Date
- 2026-08-07
AI Technical Summary
[0004]针对现有技术中存在的上述不足之处,本实用新型提供了一种算力系统用轻质液冷管,用以解决现有技术液冷管单位长度的重量较重和成本较高的问题
本实用新型的一种算力系统用轻质液冷管,有效降低成本,比现有PTFE或者FEP管路降本至少30%以上;相比EPDM管路,有效减重30%以上;
Smart Images

Figure CN224607195U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of liquid cooling pipeline technology, specifically relating to a lightweight liquid cooling pipe for computing power systems. Background Technology
[0002] Liquid cooling pipes are a core component of liquid cooling systems, primarily used for coolant transfer and heat exchange, and are widely used in new energy, data centers, high-performance computing, and other fields. With the development of AI, the demand for computing power is increasing, and the operation of computing units generates a large amount of heat. How to efficiently improve the heat exchange efficiency of computing systems has become a popular research area, and liquid cooling pipes constitute a significant portion of this, with their weight largely determining the quality of the computing system's heat dissipation device.
[0003] Existing liquid cooling pipes, using EPDM rubber tubing, PTFE, or FEP tubing, are either heavy or expensive, reducing their competitiveness in data center cooling products. Therefore, the heavy weight and high cost per unit length of liquid cooling tubing are pressing issues that need to be addressed. Utility Model Content
[0004] To address the aforementioned shortcomings in existing technologies, this invention provides a lightweight liquid cooling pipe for computing systems, thereby solving the problems of heavy weight and high cost per unit length of existing liquid cooling pipes.
[0005] To solve the above-mentioned technical problems, the present invention adopts the following technical solution: A lightweight liquid cooling pipe for a computing power system includes a cooling pipe body, wherein the cooling pipe body comprises an outer protective layer, an outer adhesive layer, a middle layer, an inner adhesive layer, and an inner protective layer arranged from the outside to the inside. The outer and inner adhesive layers are made of a copolymer of polyamide and olefins; The intermediate layer is made of polypropylene; The inner protective layer is made of ethylene-tetrafluoroethylene copolymer.
[0006] The cooling pipe body is fixedly connected to short sheathed pipes at both ends.
[0007] The outer protective layer 11 is made of polyamide 12 or polyamide 612.
[0008] The thickness ratio of the outer protective layer to the intermediate layer is 1:1, and the thickness of the outer protective layer is greater than that of the inner protective layer.
[0009] The thickness of the outer protective layer and the intermediate layer is D, where 0.1mm ≤ D ≤ 0.7mm.
[0010] The cooling pipe body is surrounded by shock-absorbing foam.
[0011] The shock-absorbing foam is made of ethylene-vinyl acetate copolymer, polyethylene, or silicone foam.
[0012] The outer protective layer is corrugated in shape.
[0013] Compared with the prior art, this utility model has the following advantages: This utility model discloses a lightweight liquid cooling pipe for a computing system, which effectively reduces costs by at least 30% compared to existing PTFE or FEP pipes; and effectively reduces weight by more than 30% compared to EPDM pipes. This utility model provides a lightweight liquid cooling pipe for a computing system, which solves the low evaporation requirement of plastic pipes; This invention relates to a lightweight liquid cooling pipe for a computing system, which is compatible with the tolerance of coolants of different properties and reduces the amount of precipitates inside the pipe. Attached Figure Description
[0014] Figure 1 This is a three-dimensional structural diagram of Embodiment 1 of the present utility model; Figure 2 This is a partial cross-sectional view of Embodiment 1 of the present invention; Figure 3 This is a three-dimensional structural diagram of Embodiment 2 of the present invention; Figure 4 This is a three-dimensional structural diagram of the outer protective layer in Embodiment 5 of this utility model; The reference numerals used in the attached figures are as follows: Cooling pipe body 1, outer protective layer 11, outer adhesive layer 12, intermediate layer 13, inner adhesive layer 14, inner protective layer 15, sheath short pipe 2. Detailed Implementation
[0015] To enable those skilled in the art to better understand this utility model, the technical solution of this utility model will be further described below in conjunction with the accompanying drawings and embodiments.
[0016] Example 1: like Figures 1 to 2 As shown, a lightweight liquid-cooled pipe is used in a computing system. A lightweight liquid cooling pipe for a computing power system includes a cooling pipe body 1, wherein the cooling pipe body 1 includes an outer protective layer 11, an outer adhesive layer 12, a middle layer 13, an inner adhesive layer 14, and an inner protective layer 15 arranged from the outside to the inside. The outer adhesive layer 12 and the inner adhesive layer 14 are made of a copolymer of polyamide and olefins; The intermediate layer 13 is made of polypropylene; The inner protective layer 15 is made of ethylene-tetrafluoroethylene copolymer.
[0017] The outer protective layer 11 is preferably made of flame-retardant V0 grade polyamide 12 (or long-chain high-performance nylon materials such as polyamide 612), which has excellent chemical stability, wide temperature range adaptability, and is lightweight and highly tough, making it suitable as an outer protective material. It can meet the flame-retardant requirements of the product while reducing the weight of the protective layer.
[0018] The outer adhesive layer 12 and the inner adhesive layer 14 are made of a copolymer of polyamide and olefins. The intermediate layer 13 is made of PP (polypropylene), which can meet the requirements for water vapor barrier properties.
[0019] The inner protective layer 15 is made of ETFE (ethylene-tetrafluoroethylene copolymer), which meets the requirements for low exudation and resistance to special media such as bacteria. Example 2: The cooling pipe body 1 is fixedly connected to both ends with sheathed short pipes 2. The sheathed short pipes 2 serve to increase the circumferential clamping force and increase the pull-out force between the pipe and the component.
[0020] Example 3: The thickness ratio of the outer protective layer 11 to the intermediate layer 13 is 1:1, and the thickness of the outer protective layer 11 is greater than the thickness of the inner protective layer 15.
[0021] The thickness of the outer protective layer 11 and the intermediate layer 13 is D, where 0.1mm≤D≤0.7mm.
[0022] Example 4: The cooling pipe body 1 is covered with shock-absorbing foam.
[0023] The shock-absorbing foam is made of ethylene-vinyl acetate copolymer, polyethylene, or silicone foam.
[0024] Ethylene-vinyl acetate copolymer, as a shock-absorbing foam, has excellent elasticity and cushioning properties, high resilience, and strong energy absorption capacity.
[0025] Polyethylene, as a shock-absorbing foam, is lightweight and has high cushioning properties. It is also highly adaptable to the environment, maintaining its elasticity from -100℃ to 70℃, and is easy to process and mold.
[0026] Silicone foam, as a shock-absorbing foam, has excellent cushioning and resilience properties, adaptability to extreme environments, maintains stable performance at temperatures ranging from -60℃ to 250℃, and provides heat insulation and flame retardancy.
[0027] Example 5: The remaining features are the same as in Example 1, except that the outer protective layer 11 is corrugated.
[0028] The above descriptions are merely embodiments of this utility model. Commonly known structures and characteristics are not described in detail here. Those skilled in the art are aware of all common technical knowledge in the field prior to the application date or priority date, are knowledgeable of all existing technologies in that field, and possess the ability to apply conventional experimental methods prior to that date. Therefore, those skilled in the art can, based on the guidance provided in this application, improve and implement this solution in conjunction with their own capabilities. Typical known structures or methods should not be obstacles for those skilled in the art to implement this application. It should be noted that those skilled in the art can make several modifications and improvements without departing from the structure of this utility model. These modifications and improvements should also be considered within the scope of protection of this utility model, and will not affect the effectiveness of the implementation of this utility model or the practicality of the patent.
Claims
1. A lightweight liquid-cooled pipe for a computing system, characterized in that: The cooling pipe body (1) includes an outer protective layer (11), an outer adhesive layer (12), an intermediate layer (13), an inner adhesive layer (14), and an inner protective layer (15) arranged from the outside to the inside. The outer adhesive layer (12) and the inner adhesive layer (14) are made of a copolymer of polyamide and olefins; The intermediate layer (13) is made of polypropylene; The inner protective layer (15) is made of ethylene-tetrafluoroethylene copolymer.
2. The lightweight liquid cooling pipe for a computing system according to claim 1, characterized in that: The cooling pipe body (1) is fixedly connected to two end short sheaths (2).
3. A lightweight liquid-cooled pipe for a computing system according to claim 2, characterized in that: The outer protective layer (11) is made of polyamide 12 or polyamide 612.
4. A lightweight liquid-cooled pipe for a computing system according to claim 1, characterized in that: The thickness ratio of the outer protective layer (11) to the intermediate layer (13) is 1:1, and the thickness of the outer protective layer (11) is greater than the thickness of the inner protective layer (15).
5. A lightweight liquid-cooled pipe for a computing system according to claim 4, characterized in that: The thickness of the outer protective layer (11) and the intermediate layer (13) is D, where 0.1mm≤D≤0.7mm.
6. A lightweight liquid cooling pipe for a computing system according to claim 1, characterized in that: The cooling pipe body (1) is covered with shock-absorbing foam.
7. A lightweight liquid cooling pipe for a computing system according to claim 6, characterized in that: The shock-absorbing foam is made of ethylene-vinyl acetate copolymer, polyethylene, or silicone foam.
8. A lightweight liquid cooling pipe for a computing system according to claim 6, characterized in that: The outer protective layer (11) is corrugated.