Semiconductor cooling structure of an ultralow-temperature micro environmental protection cooling system

Abstract

The utility model relates to technical fields, concretely relates to a kind of semiconductor cooling structure of ultralow temperature trace environmental protection cooling system, including box, condenser component and nozzle component, condenser component includes at least one group of semiconductor sheet, condensing plate and condensing radiator group, nozzle component includes main nozzle component and vice nozzle component, temperature sensor is located in compressed air intake pipe, cooling outlet pipe and main nozzle seat, compressed air enters condenser component from main nozzle intake pipe and vice nozzle intake pipe, is cooled to 5 ℃ by two-stage semiconductor sheet, low-temperature air is divided into two ways, main road: access vortex tube secondary cooling to-25 ℃, and the lubricating oil conveyed in main nozzle atomization with capillary group;Secondary road: directly with the cooling water conveyed in vice nozzle mixing, spray to workpiece, temperature sensor monitors main nozzle seat temperature, >-20 ℃ when digital display control instrument starts third-stage semiconductor sheet, to solve the contradiction that high-temperature environment cold air flow and temperature cannot be obtained simultaneously.

Description

Technical Field

[0001] This utility model relates to the field of industrial cooling technology, and in particular to a semiconductor cooling structure for an ultra-low temperature micro-volume environmentally friendly cooling system. Background Technology

[0002] Existing low-temperature micro-cooling and lubrication systems mostly use eddy current tube single-stage cooling devices, which are mainly used for cooling cutting tools and workpieces.

[0003] However, single-stage cooling devices have significant drawbacks. Obtaining low temperatures requires increasing the exhaust volume at the hot end, resulting in insufficient effective cold air flow. In high-temperature environments, the cooling capacity drops sharply, and the gas consumption is too high, making it difficult for the workshop's gas supply system to handle.

[0004] This application aims to provide a staged cooling structure that can resolve the contradiction between the inability to simultaneously achieve cooling airflow and temperature in high-temperature environments. Utility Model Content

[0005] The purpose of this invention is to provide a semiconductor cooling structure for an ultra-low temperature micro-volume environmentally friendly cooling system, which can solve the contradiction between the inability to achieve both cold air flow and temperature in high-temperature environments.

[0006] To achieve the above objectives, this utility model provides a semiconductor cooling structure for an ultra-low temperature micro-volume environmentally friendly cooling system, including a housing, a condenser assembly, and a nozzle assembly. The condenser assembly includes at least one set of semiconductor wafers, a condenser plate, and a condenser heat sink assembly for multi-stage cooling of compressed air. The nozzle assembly includes a main nozzle assembly and a secondary nozzle assembly. The main nozzle assembly includes a vortex tube, a capillary tube assembly, and a main nozzle. The secondary nozzle assembly includes a mixing tube assembly and a secondary nozzle. Temperature sensors are located in the compressed air inlet pipe, the cooling outlet pipe, and the main nozzle seat, and are connected to a digital display controller to start and stop the condenser heat sink assembly in stages.

[0007] The capillary assembly consists of microtubes with an inner diameter of <1mm nested inside a large-diameter connecting pipe, with one end connected to the tank assembly and the other end extending to the outlet of the main nozzle.

[0008] The main nozzle assembly is installed via a strong magnetic base and a universal tube assembly, and the secondary nozzle assembly is installed via a strong magnetic base and a universal tube, enabling adjustment without dead angles.

[0009] The tank assembly integrates an oil-water dispensing mechanism, including an independent container, a filter, and a pressure liquid supply device, which delivers the medium via compressed air or a DC motor.

[0010] The semiconductor cooling structure of the ultra-low temperature micro-volume environmentally friendly cooling system also includes an oil and water low-level alarm device and an air pressure monitoring alarm device, which trigger the digital display controller to alarm through the liquid level sensor and pressure sensor, respectively.

[0011] This utility model discloses a semiconductor cooling structure for an ultra-low temperature micro-volume environmentally friendly cooling system, comprising a housing, a condenser assembly, and a nozzle assembly. The condenser assembly includes at least one set of semiconductor wafers, a condenser plate, and a condenser heat sink assembly for multi-stage cooling of compressed air. The nozzle assembly includes a main nozzle assembly and a secondary nozzle assembly. The main nozzle assembly includes a vortex tube, a capillary tube assembly, and a main nozzle. The secondary nozzle assembly includes a mixing tube assembly and a secondary nozzle. Temperature sensors are located at the compressed air inlet pipe, the cooling outlet pipe, and the main nozzle seat, connected to a digital display controller to segmentally start and stop the condenser heat sink assembly. During operation, compressed air enters the condenser assembly from the intake pipe and the secondary nozzle intake pipe. After being cooled to 5°C by the two-stage semiconductor wafers, the low-temperature air is divided into two paths: the main path connects to the vortex tube for secondary cooling to -25°C, and is atomized with the lubricating oil delivered by the capillary assembly at the main nozzle; the secondary path directly mixes with the cooling water delivered by the mixing pipe at the secondary nozzle and is sprayed onto the workpiece. The temperature sensor monitors the temperature of the main nozzle seat. When the temperature is >-20°C, the digital display controller activates the third-stage semiconductor wafer, thereby resolving the contradiction between the high-temperature environment and the inability to simultaneously achieve the required airflow and temperature. Attached Figure Description

[0012] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the accompanying drawings used in the description of the embodiments or the prior art will be briefly introduced below.

[0013] Figure 1 This is a schematic diagram of the overall structure of the semiconductor cooling structure of the ultra-low temperature micro-volume environmentally friendly cooling system according to the first embodiment of this utility model.

[0014] Figure 2 This is an exploded view of the condenser assembly according to the first embodiment of this utility model.

[0015] Figure 3 This is a schematic diagram of the main nozzle assembly according to the first embodiment of the present invention.

[0016] Figure 4 This is a schematic diagram of the structure of the auxiliary nozzle assembly according to the first embodiment of the present invention.

[0017] In the diagram: 1-Box body, 2-Condenser assembly, 3-Digital display controller, 4-Solenoid valve assembly, 5-Electrical control box, 6-Tank assembly, 7-Exhaust fan assembly, 8-Condenser radiator assembly, 12-Condenser plate, 16-Semiconductor chip, 17-Cooling exhaust pipe, 18-Condenser plate connecting pipe, 19-Main nozzle inlet pipe, 20-Capillary tube assembly, 21-Strong magnetic base assembly, 22-Temperature sensor, 23-Main nozzle seat, 24-Universal tube assembly, 25-Main nozzle, 26-Vortex tube, 27-Secondary nozzle inlet pipe, 28-Mixing tube assembly, 29-Secondary nozzle seat, 30-Universal tube, 31-Secondary nozzle. Detailed Implementation

[0018] The embodiments of the present invention are described in detail below. Examples of the embodiments are shown in the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present invention, but should not be construed as limiting the present invention.

[0019] The first embodiment of this application is as follows:

[0020] Please see Figures 1 to 4 ,in Figure 1 This is a schematic diagram of the overall structure of the semiconductor cooling structure in an ultra-low temperature micro-volume environmentally friendly cooling system. Figure 2 This is an exploded diagram of the condenser assembly. Figure 3 This is a structural schematic diagram of the main nozzle assembly. Figure 4 This is a schematic diagram of the auxiliary nozzle assembly. This utility model provides a semiconductor cooling structure for an ultra-low temperature micro-volume environmentally friendly cooling system: it includes a housing 1, a condenser assembly 2, and a nozzle assembly. The condenser assembly 2 includes at least one set of semiconductor wafers 16, a condenser plate 12, and a condenser heat sink assembly 8, which performs multi-stage cooling of compressed air. The nozzle assembly includes a main nozzle assembly and an auxiliary nozzle assembly. The main nozzle assembly includes a vortex tube 26, a capillary tube assembly 20, and a main nozzle. The auxiliary nozzle assembly includes a mixing tube assembly 28 and an auxiliary nozzle 31. A temperature sensor 22 is located at the compressed air inlet pipe, the cooling outlet pipe 17, and the main nozzle seat 23, and is connected to a digital display controller 3 to start and stop the condenser heat sink assembly 8 in stages. The aforementioned solution solves the significant defects of single-stage cooling devices. Obtaining low temperatures requires increasing the hot-end exhaust volume, resulting in insufficient effective cold air flow. The cooling capacity drops sharply in high-temperature environments, and the air consumption is too high, making it difficult for the workshop air supply system to handle. It is understood that the aforementioned solution can be used to achieve both cold air flow and temperature in high-temperature environments.

[0021] In this specific embodiment, the condenser assembly 2 includes at least one set of semiconductor wafers 16, a condenser plate 12, and a condenser heat sink assembly 8 to perform multi-stage cooling of compressed air. The nozzle assembly includes a main nozzle assembly and a secondary nozzle assembly. The main nozzle assembly includes a vortex tube 26, a capillary tube assembly 20, and a main nozzle 25. The secondary nozzle assembly includes a mixing tube assembly 28 and a secondary nozzle. A temperature sensor 22 is located in the compressed air inlet pipe, the cooling outlet pipe 17, and the main nozzle seat 23, and is connected to a digital display controller 3 to start and stop the condenser heat sink in stages. The device assembly 8, with multiple sets of semiconductor wafers 16 attached to the condenser plate 12, is forcibly cooled by the exhaust fan assembly 7, providing one or more stages of pre-cooling (temperature reduction of 10-35℃) to the compressed air in the main nozzle intake pipe 19. The pre-cooled air in the main nozzle assembly is further cooled to below -30℃ by the vortex tube 26, and then atomized and sprayed at the main nozzle 25 with the trace amount of lubricant delivered by the capillary tube assembly 20 into the cutting area of ​​the tool. The pre-cooled air in the secondary nozzle assembly is directly mixed with the lubricant delivered by the mixing tube assembly 28 at the secondary nozzle 31. The mixture is sprayed onto the workpiece surface. The temperature sensor 22 monitors the temperature of each node in real time. The digital display controller 3 starts and stops the semiconductor chip 16 according to the set value to achieve dynamic energy saving, so that it can still output -30℃ cold air in high temperature environment, and the cold air flow rate is increased by 100%. The staged cooling reduces the load of the vortex tube 26, and the overall energy saving is >100%. The strong magnetic universal nozzle bracket achieves precise coverage of the processing area. In use, compressed air enters the condenser assembly 2 from the main nozzle inlet pipe 19 and the auxiliary nozzle inlet pipe 27, and is cooled by two stages of cooling. Semiconductor chip 16 is cooled to 5°C. The low-temperature air is split into two paths: the main path is connected to the vortex tube 26 for secondary cooling to -25°C, and atomized with the lubricating oil delivered by the capillary group 20 at the main nozzle 25; the secondary path is directly mixed with the cooling water delivered by the mixing tube at the secondary nozzle 31 and sprayed onto the workpiece. The temperature sensor 22 monitors the temperature of the main nozzle 25 seat 23. When the temperature is >-20°C, the digital display controller 3 starts the third stage of the semiconductor chip 16, thereby resolving the contradiction between the high-temperature environment and the inability to achieve both the cold air flow and temperature.

[0022] The capillary assembly 20 consists of microtubes with an inner diameter of <1mm nested within a large-aperture cooling plate connecting pipe 17. One end is connected to the tank assembly 6, and the other end extends to the outlet of the main nozzle 25. The capillary assembly 20 plays a crucial role in the cooling system by coordinating the delivery and atomization of the core medium. Through the capillary microtubes (e.g., 0.3-0.8mm) with an inner diameter of <1mm, it delivers the lubricating oil / cooling water from the tank assembly 6 at a flow rate in the milliliter / minute range (typically 5-50mL / min) to the main nozzle 25 and the secondary nozzle 31, achieving the quasi-dry cutting required. With ultra-low liquid consumption, the capillary assembly 20 adopts a nested structure: the microtubes are placed inside the large-diameter cooling plate connecting pipe 17, forming a "pipe-in-pipe" design. The inner microtubes transport the liquid medium, and the outer cooling plate connecting pipe 17 introduces high-pressure cold air (the main nozzle 25) or mixed gas (the secondary nozzle 31). This structure uses gas pressure to wrap the liquid flow, preventing high-pressure gas from flowing back into the tank and ensuring unidirectional flow of the medium. The large-diameter cooling plate connecting pipe 17 introduces low-temperature gas from the cooling outlet pipe 17, which wraps the inner microtubes to form a heat insulation layer, reducing the temperature rise during the medium transportation process.

[0023] Secondly, the main nozzle assembly is installed via a strong magnetic base 21 and a universal tube assembly 24, while the secondary nozzle assembly is installed via a strong magnetic base 21 and a universal tube 30, achieving adjustment without dead angles. The main nozzle assembly uses the vortex tube 26 to further deep cool the pre-cooled air (0-5℃) to below -30℃, forming high-speed ice mist (>200m / s), which is then directly sprayed onto the cutting edge of the tool through the main nozzle 25. The capillary assembly 20 delivers lubricating oil (5-20mL / min) to the main nozzle 25, where it is atomized into 5-10μm oil droplets under the shearing of the ultra-low temperature airflow, penetrating the high-temperature cutting zone to form lubrication, increasing tool life from 45 minutes to 135 minutes. The secondary nozzle assembly directly utilizes... The condenser pre-cools the air (0-10℃), which is then sprayed at medium pressure (0.5-0.8MPa) through the secondary nozzle 31 to cover the workpiece machining surface, reducing the hot spot temperature by more than 100℃ within 5 seconds. The mixing tube assembly 28 premixes the cooling water / emulsion (10-30mL / min) with the cold air in the secondary nozzle 31, spraying it to form a 10-30μm water-based mist film, blocking the conduction of cutting heat to the workpiece body, reducing the local temperature from 620℃ to 120℃, and avoiding strength degradation caused by material phase transformation. The main nozzle 25 solves the problem of extreme heat load on the tool, and the secondary nozzle 31 solves the problem of thermal deformation of the workpiece. The two achieve thermal balance of the cutting system through temperature gradient and media ratio difference.

[0024] Meanwhile, the tank assembly 6 integrates an oil-water dispensing mechanism, including an independent container, a filter, and a pressure supply device. The medium is transported by compressed air or a DC motor. The tank assembly 6 adopts an independent dual-chamber design, which completely isolates oil and water through a physical partition (marked 13) to avoid emulsification and deterioration (lubricating oil water content < 0.1%) and prevents cooling water from freezing and clogging the pipeline in low-temperature environments. The tank assembly 6 solves the three major pain points of medium contamination, unstable flow, and risk of liquid interruption in micro-volume cooling systems through a three-in-one design of compartmentalized storage, intelligent liquid supply, and real-time monitoring. It is a key guarantee for continuous operation at ultra-low temperatures.

[0025] In addition, the semiconductor cooling structure of the ultra-low temperature micro-volume environmentally friendly cooling system also includes an oil and water low level alarm device and an air pressure monitoring alarm device, which trigger the digital display controller 3 to alarm through the liquid level sensor and the pressure sensor, respectively.

[0026] When using the semiconductor cooling structure of the ultra-low temperature micro-volume environmentally friendly cooling system of this embodiment, compressed air enters the condenser assembly 2 from the main nozzle inlet pipe 19 and the auxiliary nozzle inlet pipe 27. After being cooled to 5°C by the two-stage semiconductor wafers 16, the low-temperature air is divided into two paths: the main path: it is connected to the vortex tube 26 for secondary cooling to -25°C, and atomized with the lubricating oil delivered by the capillary group 20 at the main nozzle 25; the auxiliary path: it is directly mixed with the cooling water delivered by the mixing pipe at the auxiliary nozzle 31 and sprayed onto the workpiece. The temperature sensor 22 monitors the temperature of the main nozzle 25 seat 23. When the temperature is >-20°C, the digital display controller 3 activates the third stage of the semiconductor wafers 16, thereby solving the contradiction between the cold air flow and temperature in a high-temperature environment.

[0027] The above-disclosed embodiments are merely one or more preferred embodiments of this application and should not be construed as limiting the scope of this application. Those skilled in the art can understand that all or part of the processes for implementing the above embodiments and equivalent changes made in accordance with the claims of this application still fall within the scope of this application.

Claims

1. A semiconductor cooling structure for an ultra-low temperature micro-volume environmentally friendly cooling system, characterized in that, The device includes a housing, a condenser assembly, and a nozzle assembly. The condenser assembly includes at least one set of semiconductor wafers, a condenser plate, and a condenser heat sink assembly for multi-stage cooling of compressed air. The nozzle assembly includes a main nozzle assembly and a secondary nozzle assembly. The main nozzle assembly includes a vortex tube, a capillary tube assembly, and a main nozzle. The secondary nozzle assembly includes a mixing tube assembly and a secondary nozzle. Temperature sensors are located at the compressed air inlet pipe, the cooling outlet pipe, and the main nozzle seat, and are connected to a digital display controller to start and stop the condenser heat sink assembly in stages. A tank assembly is also provided on the housing.

2. The semiconductor cooling structure of the ultra-low temperature micro-volume environmentally friendly cooling system as described in claim 1, characterized in that: The capillary assembly consists of microtubes with an inner diameter of <1mm nested inside a large-diameter connecting pipe, with one end connected to the tank assembly and the other end extending to the outlet of the main nozzle.

3. The semiconductor cooling structure of the ultra-low temperature micro-volume environmentally friendly cooling system as described in claim 1, characterized in that: The main nozzle assembly is installed via a strong magnetic base and a universal tube assembly, and the secondary nozzle assembly is installed via a strong magnetic base and a universal tube, enabling adjustment without dead angles.

4. The semiconductor cooling structure of the ultra-low temperature micro-volume environmentally friendly cooling system as described in claim 1, characterized in that: The tank assembly integrates an oil-water dispensing mechanism, including an independent container, a filter, and a pressure liquid supply device, which delivers the medium via compressed air or a DC motor.

5. The semiconductor cooling structure of the ultra-low temperature micro-volume environmentally friendly cooling system as described in claim 1, characterized in that: The semiconductor cooling structure of the ultra-low temperature micro-volume environmentally friendly cooling system also includes an oil and water low-level alarm device and an air pressure monitoring alarm device, which trigger the digital display controller to alarm through the liquid level sensor and pressure sensor, respectively.

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