Drying slot cover for semiconductor wafers, drying device

Abstract

The application provides a drying groove cover for a semiconductor wafer, a drying device, which comprises a groove cover body and a sealing piece. An inner cavity is formed in the groove cover body. The inner cavity is a semi-closed cavity with a closed top and an open bottom. The bottom of the groove cover body is provided with a mounting surface. The mounting surface is used to fit a matching surface of a drying groove body so that the groove cover body and the drying groove body form a closed space. The application further comprises a sealing piece used to seal the gap between the mounting surface and the matching surface. The application improves the sealing precision between the drying groove body and the groove cover body, significantly reduces the consumption of IPA, and improves the wafer yield.

Description

Technical Field

[0001] This application relates to the field of semiconductor equipment technology, and more specifically, to a drying tank cover and drying device for semiconductor wafers. Background Technology

[0002] Isopropyl alcohol (IPA) is commonly used in cleaning and drying processes in many industries, including semiconductor manufacturing. Taking semiconductor manufacturing as an example, after wet etching and cleaning processes, cleaning solution remains on the workpiece surface. If this residue is not removed promptly, impurities and liquid adhering to the workpiece surface will prevent it from meeting the requirements of subsequent processes, thus affecting the yield rate. Therefore, efficient drying equipment is a critical requirement.

[0003] Currently, the commonly used Marangoni Dryer technology relies on the mixing of IPA vapor and cleaning solution to penetrate the concave surface of the workpiece, utilizing the Marangoni effect to achieve drying. However, this technology has significant drawbacks. On the one hand, the process of vaporizing IPA and mixing it with the liquid solution can easily lead to poor film quality, resulting in low drying efficiency. Furthermore, water residue often remains on the workpiece surface after drying, severely affecting workpiece quality. On the other hand, some existing devices are equipped with mechanical lifting mechanisms that move the workpiece during the drying process. For precision and ultra-precision drying objects, this movement can easily cause vibration, which can damage the workpiece's internal stress.

[0004] Meanwhile, in the drying process, improper design of the drying tank lid leads to significant IPA volatilization. Taking traditional dryers as an example, their tank lids are mostly open or semi-open designs. During the drying process, IPA vapor continuously escapes from the tank lid, resulting not only in substantial IPA waste and increased production costs, but also in environmental pollution that affects the health of operators. Furthermore, IPA volatilization can cause instability in the drying process environment, thus impacting drying efficiency and product quality. For instance, in processes sensitive to humidity and gas composition, IPA volatilization can alter the composition of the working gas, thereby affecting the quality of semiconductor wafers. Utility Model Content

[0005] This application provides a drying tank cover for semiconductor wafers, which solves the problem of isopropanol volatility during the semiconductor wafer drying process.

[0006] In a first aspect, this application provides a drying tank cover for semiconductor wafers, including a tank cover body and a sealing element. The tank cover body has an inner cavity formed inside, which is a semi-closed inner cavity that is closed on all sides and top and open at the bottom. The bottom of the tank cover body is provided with a mounting surface, which is used to fit against the mating surface of the drying tank body so that the tank cover body and the drying tank body form a closed space. The sealing element is used to seal the gap between the mounting surface and the mating surface.

[0007] In this embodiment of the application, the groove cover body includes four side plates, a top cover and a bottom plate; the four side plates are circumferentially distributed and fixedly connected, the top cover covers the top of the four side plates, the bottom plate is fixedly connected to the bottom surface of the four side plates, and the bottom surface of the bottom plate forms the mounting surface.

[0008] In this embodiment of the application, the mounting surface is provided with a sealing groove, and at least a portion of the sealing element is embedded in the sealing groove.

[0009] In this embodiment, the mounting surface is fixed with a plurality of positioning pins, the drying tank is provided with positioning holes, and the positioning pins are used to be inserted into the positioning holes.

[0010] In this embodiment of the application, it also includes an air inlet plate, an air inlet pipe, and a spray pipe assembly. The air inlet plate is fixed to the outer wall of the trough cover body and has an air inlet channel inside. The spray pipe assembly includes a plurality of spray pipes fixed to the cavity wall of the inner cavity and the air inlet channel is connected to the air inlet pipe and the spray pipes.

[0011] In this embodiment, the spray pipe includes an inner pipe, an outer pipe, a buckle, and two plugs. The outer pipe is sleeved on the outside of the inner pipe. Both the inner pipe and the outer pipe have multiple spray holes. The buckle is fixed to the inner wall of the outer pipe and sleeved on the outer wall of the inner pipe. The buckle is used to fix the inner pipe to the outer pipe. The two plugs are respectively sealed at the two ends of the inner pipe and the outer pipe. The plug at the air inlet end has an air inlet that communicates with the air inlet channel.

[0012] In this embodiment of the application, each spray hole on the inner tube is arranged along the axial direction of the inner tube, each spray hole on the outer tube is arranged along the axial direction of the outer tube, and the row of spray holes on the inner tube and the row of spray holes on the outer tube are staggered in the circumferential direction.

[0013] Secondly, this application also provides a drying device, including a drying tank cover, a drying tank body, a wafer lifting mechanism, an IPA bubbling mechanism, and a gas circulation assembly. The drying tank cover is disposed on the upper part of the drying tank body to form a closed space. The wafer lifting mechanism is connected to the drying tank body, and the IPA bubbling mechanism and the gas circulation assembly are connected to the drying tank body. The drying tank cover is the drying tank cover for semiconductor wafers described in the above embodiment.

[0014] In this embodiment, a flow meter and a concentration meter are also included. The flow meter is used to monitor the flow rate, and the concentration meter is used to monitor the IPA concentration parameter inside the drying tank in real time. The flow meter and the concentration meter are connected to a control unit.

[0015] In this embodiment, a wafer anti-tipping component is also included. The wafer anti-tipping component is disposed in the cavity of the drying tank and has an anti-tipping groove, in which the wafer is fixed. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of this application. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort.

[0017] Figure 1 This is a schematic diagram of the structure of a drying tank cover for semiconductor wafers provided in some embodiments of this application;

[0018] Figure 2 A schematic diagram of the structure of a drying tank cover for semiconductor wafers provided in some embodiments of this application from another perspective;

[0019] Figure 3 This is a schematic diagram illustrating the assembly of the spray pipes in the drying tank cover for semiconductor wafers, provided in some embodiments of this application.

[0020] Figure 4 A schematic diagram of the structure of the spray pipe in the drying tank cover for semiconductor wafers provided in some embodiments of this application;

[0021] Figure 5 This is a schematic diagram of the structure of a drying apparatus provided in some embodiments of this application;

[0022] Figure 6 This is a schematic diagram of the drying apparatus provided in some embodiments of this application from another perspective;

[0023] Figure 7A schematic diagram of the drying apparatus provided in some embodiments of this application from another perspective;

[0024] Figure 8 This is a schematic diagram of the structure of a wafer anti-tipping component in a drying tank cover for semiconductor wafers provided in some embodiments of this application.

[0025] The attached figures are labeled as follows:

[0026] 100-Drying device;

[0027] 1-Drying tank cover; 2-Drying tank body; 3-Wafer lifting mechanism; 4-IPA bubbling mechanism; 5-Gas circulation assembly; 6-Wafer anti-tipping component;

[0028] 11-Top cover; 12-Side panel; 13-Bottom plate; 51-Air inlet plate; 52-Air inlet pipe; 53-Spray pipe; 61-Anti-tipping groove;

[0029] 111-Slot cover body; 112-Seal; 111a-Mounting surface; 21a-Mating surface; 531-Inner tube; 532-Outer tube; 533-Snap-fit; 534-Plug; 535-Spray hole;

[0030] 5341 - Air Inlet. Detailed Implementation

[0031] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0032] In this application, "multiple" means two or more (including two).

[0033] Please refer to Figure 1 and Figure 2 This application provides a drying tank cover for semiconductor wafers, including a tank cover body 111 and a sealing element 112. The tank cover body 111 is made of a high-strength, high-temperature resistant and chemically stable material, such as a special engineering plastic. The interior of the tank cover body 111 forms an inner cavity, which is a semi-closed structure with the sides and top closed and the bottom open. The bottom of the tank cover body 111 is provided with a mounting surface 111a for tightly fitting with the mating surface 21a of the drying tank body 2, so that when closed, it together with the drying tank body 2 forms a completely closed process chamber.

[0034] In this embodiment, the shape of the tank cover body 111 is precisely matched with the drying tank body 2 to ensure that it can completely cover the tank opening when closed, forming a sealed drying environment and fundamentally preventing the escape of IPA vapor.

[0035] A seal 112 is provided between the mounting surface 111a and the mating surface 21a of the tank body. The seal 112 is installed at the contact point between the tank cover body 111 and the tank body to seal the gap between them and prevent IPA vapor leakage. Optionally, the seal 112 can be a rubber sealing ring, etc., which has good high temperature resistance and chemical stability and is suitable for semiconductor manufacturing.

[0036] By using a fully covered drying tank cover 1 and a tight-fitting seal 112, a closed space is formed, significantly reducing IPA vapor volatilization at the source. Experimental data shows that compared to traditional open or semi-open tank cover designs, this solution can reduce IPA volatilization by more than 80%. This not only reduces IPA usage and raw material costs but also reduces waste caused by volatilization, improving resource utilization. Simultaneously, by reducing the frequency of IPA replenishment, it also lowers labor costs and equipment downtime, increasing production efficiency.

[0037] To improve the installation accuracy of the seal 112, a sealing groove can be formed on the mounting surface 111a. At least a portion of the seal 112 is embedded in the sealing groove. When installing seals such as fluororubber sealing rings 112, first place the seal 112 in the sealing groove at the contact point between the groove cover body 111 and the drying groove body 2, ensuring that the sealing ring is completely embedded in the sealing groove without twisting or deformation. During installation, an appropriate amount of sealant can be applied to the contact surface between the sealing ring and the sealing groove to enhance the sealing effect. In daily maintenance, regularly check the wear condition of the seal 112. If aging, cracking, or severe wear is found, replace it promptly. At the same time, keep the sealing groove clean to prevent debris and dust from entering the sealing groove and affecting the sealing performance.

[0038] To improve the fitting accuracy between the drying tank cover 1 and the drying tank body 2, multiple positioning pins can be fixedly installed on the mounting surface 111a of the drying tank cover 1. The drying tank body 2 is provided with positioning holes, and the positioning pins are used to be inserted into the positioning holes.

[0039] When installing the drying tank cover 1 for semiconductor wafers provided in this application, first ensure that the top edge of the drying tank 2 is flat, clean, and free of debris and oil. Then, align the tank cover 111 with the top of the drying tank 2 and slowly lower it to ensure precise alignment between the tank cover 111 and the edge of the drying tank 2. After installation, check whether the gap between the tank cover 111 and the drying tank 2 is uniform. If there is a deviation, it can be fine-tuned by adjusting the installation position or using shims to ensure the fitting accuracy between the tank cover 111 and the tank. During installation, positioning pins or guide structures can be used to assist in alignment to ensure the alignment accuracy between the drying tank cover 1 and the drying tank 2, avoiding poor sealing due to misalignment.

[0040] Continue to refer to Figure 2 The slot cover body 111 includes four side plates 12, a top cover 11, and a bottom plate 13. The four side plates 12 are circumferentially distributed and fixedly connected. The top cover 11 covers the top of the four side plates 12. The bottom plate 13 is fixedly connected to the bottom surface of the four side plates 12 respectively. The bottom surface of the bottom plate 13 forms a mounting surface 111a, and a positioning pin can be fixed on the mounting surface 111a.

[0041] The tank cover body 111 adopts a fully covered chamber structure, consisting of four side plates 12, a top cover 11, and a bottom plate 13. The four side plates 12 are evenly distributed circumferentially and are fixedly connected by welding or bolts to form a rectangular or square three-dimensional frame structure. The top cover 11 is hinged or bolted to the top of the four side plates 12, ensuring a sealed contact with the side plates 12 when closed. The bottom plate 13 is fixedly connected to the bottom surface of the four side plates 12, and each bottom plate 13 is rigidly connected to the corresponding side plate 12 by welding or high-strength bolts to ensure structural stability. The bottom surfaces of the bottom plates 13 together form a flat mounting surface 111a, which is used to mate with the top edge of the drying tank 2.

[0042] To further improve installation accuracy and repeatability, multiple locating pin holes can be provided on the mounting surface 111a, and the locating pins can be installed by pressing or threading. The number and position of the locating pins are designed according to the corresponding locating holes on the top of the groove to ensure that the groove cover is accurately aligned each time it is closed, avoiding poor sealing or IPA leakage due to misalignment.

[0043] refer to Figure 3The tank cover body 111 is also equipped with an air inlet plate 51, an air inlet pipe 52, and a spray pipe assembly. The air inlet plate 51 can be made of corrosion-resistant metal material (such as stainless steel or anodized aluminum) and is fixed to the outer wall of one side plate 12 of the tank cover body 111 by bolts or welding. The air inlet plate 51 has a sealed air intake channel formed inside by precision machining or casting. This air intake channel has one or more inlets and one or more outlets. One end of the air inlet pipe 52 is connected to an external air source, and the other end is connected to the inlet of the air intake channel on the air inlet plate 51 in a sealed manner through a standard compression fitting or flange connection to ensure that the process gas is introduced without leakage. The spray pipe assembly is located in the inner cavity of the tank cover body 111 and includes multiple parallel spray pipes 53. The spray pipes 53 are usually made of chemically inert materials (such as PTFE or stainless steel) and are fixed to the top wall or side wall of the inner cavity of the tank cover body 111 by brackets or clamps, and are located above the liquid surface of the tank. Each spray pipe 53 has several small holes along its length to spray gas evenly into the cavity of the entire drying tank 2.

[0044] The outlet of the air inlet channel on the air inlet plate 51 is connected to the main air inlet pipe of the spray pipe group or each spray pipe 53 through the connecting pipe that passes through the tank cover body 111. Thus, nitrogen supplied by the external air source is transported to the spray pipe group through the air inlet pipe 52 and the air inlet channel in the air inlet plate 51, and is evenly blown out from the spray hole 535 to form a stable IPA vapor layer on the process liquid surface.

[0045] Optionally, the spray pipes 53 can be distributed in the upper, middle and lower parts of the drying tank cover 1, and the number of spray pipes 53 corresponding to each area can be multiple and arranged at intervals, thereby forming a spray structure that is uniformly distributed in the horizontal and vertical directions to form a uniformly distributed IPA vapor layer.

[0046] refer to Figure 4 In one specific embodiment, the spray pipe 53 includes an inner pipe 531, an outer pipe 532, a buckle 533, and two plugs 534. The outer pipe 532 is sleeved on the outside of the inner pipe 531. Both the inner pipe 531 and the outer pipe 532 have multiple spray holes 535. The buckle 533 is fixed to the inner wall of the outer pipe 532 and sleeved on the outer wall of the inner pipe 531. The collar portion of the buckle 533 can fix the inner pipe 531 to the inner wall of the outer pipe 532. The two plugs 534 are respectively sealed at the two ends of the inner pipe 531 and the outer pipe 532. The plug 534 at the air inlet end has an air inlet 5341, which is connected to the air intake channel.

[0047] Furthermore, the spray holes 535 on the inner tube 531 are arranged along the axial direction of the inner tube 531, and the spray holes 535 on the outer tube 532 are arranged along the axial direction of the outer tube 532. The row of spray holes 535 on the inner tube 531 and the row of spray holes 535 on the outer tube 532 are staggered in the circumferential direction. Thus, the inner and outer tubes 532, the plug 534, and the clip 533 form a paint spray pipe. The row of spray holes 535 on the inner tube 531 and the row of spray holes 535 on the outer tube 532 are distributed at a 180-degree angle, thereby creating jet airflows in opposite directions and forming an airflow buffer zone, thus improving the stability of the airflow.

[0048] The drying tank cover 1 for semiconductor wafers provided in this application achieves effective sealing and protection of the semiconductor wafer tank through the combination of the tank cover body 111 and the sealing element 112. It has the advantages of anti-pollution, anti-leakage, high adaptability and reliable structure, and is suitable for semiconductor manufacturing with high cleanliness requirements.

[0049] refer to Figure 5 , Figure 6 and Figure 7 Furthermore, this application also provides a drying apparatus 100, including a drying tank cover 1, a drying tank body 2, a wafer lifting mechanism 3, an IPA bubbling mechanism 4, and a gas circulation assembly 5. The drying tank cover 1 is disposed on the upper part of the drying tank body 2 to form a closed space. The wafer lifting mechanism 3 is connected to the drying tank body 2. The IPA bubbling mechanism 4 and the gas circulation assembly 5 are connected to the drying tank body 2. The drying tank cover 1 is the drying tank cover 1 for semiconductor wafers in the above embodiment.

[0050] The drying device 100 is mainly used for drying wafers in semiconductor manufacturing processes. For example... Figures 1 to 6 As shown, the drying device 100 mainly includes a drying tank cover 1, a drying tank body 2, a wafer lifting mechanism 3, an IPA bubbling mechanism 4, and a gas circulation assembly 5.

[0051] The drying tank 2 is used to hold the wafers. The drying tank cover 1 is closable and positioned over the upper opening of the drying tank 2. When the cover is closed, it engages with the drying tank 2 via a sealing element 112, forming a closed drying process chamber, preventing the exchange of internal substances with the external environment, thereby reducing IPA volatilization. The wafer lifting mechanism 3 is located at the bottom or side of the drying tank 2, driving the wafer carrier to smoothly lift and lower the wafers within the drying tank 2. The IPA bubbling mechanism 4 and the gas circulation assembly 5 are connected to the internal space of the drying tank 2 via a piping system. The IPA bubbling mechanism 4 creates bubbles, and the gas circulation assembly 5 supplies nitrogen gas to the drying tank 2. The tank cover is opened, and the wafers to be dried are immersed below the liquid surface of the tank 200 via the lifting mechanism 300. Bubbling and film formation: Closing the tank cover forms a sealed chamber. The IPA bubbling mechanism 4 is activated, and the introduced N2 bubbles in the IPA storage tank, forming a mixed gas rich in IPA vapor. The gas is delivered to the inlet pipe 52104 of the tank cover via pipeline, and after being distributed by the inlet plate 51103, it is evenly blown onto the liquid surface of the tank by the spray pipe assembly 105, forming a layer of IPA vapor film on the liquid surface. During the drying process, the wafer lifting mechanism 3 slowly and constantly pulls the wafer out of the liquid surface. Under the action of the Maragoni effect, the liquid on the wafer surface is completely stripped off, achieving traceless drying. Throughout the drying process and after its completion, the gas circulation assembly 5 continues to work. Its circulating fan draws the gas rich in IPA vapor from the bottom of the tank through the tank outlet and transports it to the waste gas treatment end for treatment, while maintaining negative pressure inside the chamber to prevent IPA from escaping.

[0052] The working process of the drying device 100 is as follows: Before the drying process begins, the wafers to be dried are first placed in the drying tank 2. Then, the fully covered tank cover 111 is closed, and the sealing element 112 automatically functions to tightly seal the drying tank cover 1 and the drying tank 2, forming a closed drying environment. During the drying process, N2 enters the IPA storage tank through the flow meter, generating bubbles. The N2 carrying IPA components is blown from the spray pipe 53 to the liquid surface of the tank through the pipeline, forming an IPA film on the liquid surface. The wafers are pulled out of the liquid surface from bottom to top by the lifting mechanism 3 for drying. After drying is completed, the circulating fan is started to extract the gas containing IPA vapor from the bottom of the drying tank 2 and send it to the exhaust gas treatment end. Finally, the drying tank cover 1 is opened, and the wafers are removed.

[0053] Furthermore, a flow meter and a concentration meter can be installed inside the drying tank 2. The flow meter is used to monitor the flow rate, and the concentration meter is used to monitor the IPA concentration parameter inside the drying tank 2 in real time. The flow meter and the concentration meter are connected to an external control unit.

[0054] Throughout the drying process, the IPA concentration inside the drying tank 2 can be continuously monitored in real time using a concentration meter. The control unit monitors the concentration inside the chamber in real time via the IPA concentration meter and controls the N2 flow rate into the bubbling mechanism through feedback from the flow meter, achieving closed-loop control of the IPA concentration and ensuring process stability. When the concentration is too high or too low, the flow meter adjusts the N2 inlet flow rate, thereby adjusting the IPA concentration to ensure that the drying process always operates under optimal environmental conditions.

[0055] This device integrates a high-performance drying tank cover 1, combining sealing, gas distribution, circulation and recycling with intelligent control to form a highly efficient, environmentally friendly and stable semiconductor wafer drying system. This significantly reduces IPA consumption, improves the working environment, and increases product yield.

[0056] refer to Figure 8 The drying tank 2 is equipped with a wafer anti-tipping component 6, which is located in the cavity of the drying tank 2. The wafer anti-tipping component 6 is provided with an anti-tipping groove 61, and the wafer is fixed in the anti-tipping groove 61. The wafer is installed inside the anti-tipping groove 61, which effectively fixes the wafer.

[0057] The gas circulation assembly 5 includes an inlet air duct, an outlet air pipe, and a circulating fan. The inlet air duct is located on the tank cover and connects to the top spray pipe 53 of the chamber. The outlet air pipe is located on the side of the tank. The circulating fan extracts residual IPA gas from the tank after processing, forming an internal gas circulation loop. The spray pipe 53 is entirely internal and does not spray externally; its double-pipe structure allows control of the IPA spray direction.

[0058] The control unit's user interface should be simple and easy for operators to understand. Before powering on, check that the power connection of the intelligent control unit is normal and that communication between the sensors and the controller is unobstructed. After powering on, operators can set target values ​​for parameters such as the drying IPA gas concentration on the control interface according to the requirements of the drying process. The intelligent control unit will automatically adjust the operating status of equipment such as the gas flow meter based on real-time feedback data from the sensors to maintain a stable drying environment. During routine maintenance, regularly upgrade the software of the intelligent control unit to improve its control accuracy and stability. Simultaneously, check the measurement accuracy of the sensors; if there are deviations, calibrate them promptly. Additionally, back up the data in the intelligent control unit to prevent data loss from affecting the normal operation of the drying process.

[0059] The drying tank cover for semiconductor wafers provided in this application has been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of this application. The descriptions of the embodiments above are only for the purpose of helping to understand the method and core ideas of this application. It should be noted that those skilled in the art can make several improvements and modifications to this application without departing from the principles of this application, and these improvements and modifications also fall within the protection scope of this application.

Claims

1. A drying tank cover for semiconductor wafers, characterized in that, The device includes a trough cover body (111) and a sealing element (112). The trough cover body (111) has an inner cavity formed inside. The inner cavity is a semi-closed inner cavity that is closed on all sides and top and open at the bottom. The bottom of the trough cover body (111) is provided with a mounting surface (111a). The mounting surface (111a) is used to fit the mating surface (21a) of the drying trough body (2) so that the trough cover body (111) and the drying trough body (2) form a closed space. The sealing element (112) is used to seal the gap between the mounting surface (111a) and the mating surface (21a).

2. The drying tank cover for semiconductor wafers according to claim 1, characterized in that, The groove cover body (111) includes four side plates (12), a top cover (11) and a bottom plate (13); the four side plates (12) are circumferentially distributed and fixedly connected, the top cover (11) covers the top of the four side plates (12), the bottom plate (13) is fixedly connected to the bottom surface of the four side plates (12), and the bottom surface of the bottom plate (13) forms the mounting surface (111a).

3. The drying tank cover for semiconductor wafers according to claim 2, characterized in that, The mounting surface (111a) has a sealing groove, and at least a portion of the sealing element (112) is embedded in the sealing groove.

4. The drying tank cover for semiconductor wafers according to any one of claims 1 to 3, characterized in that, The mounting surface (111a) is fixed with a plurality of positioning pins, and the drying tank (2) is provided with positioning holes, the positioning pins being inserted into the positioning holes.

5. The drying tank cover for semiconductor wafers according to claim 4, characterized in that, It also includes an air inlet plate (51), an air inlet pipe (52), and a spray pipe assembly. The air inlet plate (51) is fixed to the outer wall of the trough cover body (111). The air inlet plate (51) has an air inlet channel inside. The spray pipe assembly includes multiple spray pipes (53) fixed to the cavity wall of the inner cavity. The air inlet channel is connected to the air inlet pipe (52) and the spray pipes (53).

6. The drying tank cover for semiconductor wafers according to claim 5, characterized in that, The spray pipe (53) includes an inner pipe (531), an outer pipe (532), a buckle (533), and two plugs (534). The outer pipe (532) is sleeved on the outside of the inner pipe (531). Both the inner pipe (531) and the outer pipe (532) have multiple spray holes (535). The buckle (533) is fixed to the inner wall of the outer pipe (532) and sleeved on the outer wall of the inner pipe (531). The buckle (533) is used to fix the inner pipe (531) to the outer pipe (532). The two plugs (534) are respectively sealed at the two ends of the inner pipe (531) and the outer pipe (532). The plug (534) located at the air inlet end has an air inlet (5341) connected to the air inlet channel.

7. The drying tank cover for semiconductor wafers according to claim 6, characterized in that, Each spray hole (535) on the inner tube (531) is arranged along the axial direction of the inner tube (531), and each spray hole (535) on the outer tube (532) is arranged along the axial direction of the outer tube (532). Furthermore, a row of spray holes (535) on the inner tube (531) and a row of spray holes (535) on the outer tube (532) are arranged in a staggered manner along the circumferential direction.

8. A drying apparatus, characterized in that, The device includes a drying tank cover (1), a drying tank body (2), a wafer lifting mechanism (3), an IPA bubbling mechanism (4), and a gas circulation assembly (5). The drying tank cover (1) is placed on the upper part of the drying tank body (2) to form a closed space. The wafer lifting mechanism (3) is connected to the drying tank body (2). The IPA bubbling mechanism (4) and the gas circulation assembly (5) are connected to the drying tank body (2). The drying tank cover (1) is the drying tank cover for semiconductor wafers as described in any one of claims 1 to 7.

9. The drying apparatus according to claim 8, characterized in that, It also includes a flow meter and a concentration meter. The flow meter is used to monitor the flow rate, and the concentration meter is used to monitor the IPA concentration parameters inside the drying tank (2) in real time. The flow meter and the concentration meter are connected to the control unit.

10. The drying apparatus according to claim 9, characterized in that, It also includes a wafer anti-tipping component (6), which is disposed in the cavity of the drying tank (2). The wafer anti-tipping component (6) is provided with an anti-tipping groove (61), and the wafer is fixed in the anti-tipping groove (61).

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