A patch type impact plate detonator

Abstract

The utility model discloses a patch type impact plate detonator, including shell, secondary charge, primary charge ring, primary charge and integrated explosion foil chip. The utility model increases the pad at the bottom of integrated explosion foil chip, and explosion foil chip has the function of firing device and connecting piece simultaneously, and patch welding of detonator itself and next stage overall is realized directly with the help of reflow soldering technology, and the connecting mode of welding through the electrode foot line of firing electrode plug of traditional detonator is replaced, can reduce firing loop inductance and detonator resistance, improves energy utilization, provides technical support for miniaturization and low energy of impact plate detonator. The whole structure of impact plate detonator is simple, integrates explosion foil chip and firing loop, and the firing device such as traditional high -cost electrode plug is saved in the structure, realizes low -cost manufacturing of impact plate detonator, and can realize mass production and use of product quickly.

Description

Technical Field

[0001] This utility model belongs to the field of pyrotechnics technology, specifically relating to a patch-type impact detonator. Background Technology

[0002] Impact detonators are a crucial component of inline detonation systems, widely used in weapon systems due to their high reliability, high instantaneous firing rate, and high safety. The ignition element of an impact detonator is typically assembled manually from independent components such as the ignition electrode plug, chip substrate, explosive bridge foil, flyer, and acceleration chamber. Insufficient assembly precision negatively impacts mass production, resulting in low production efficiency and poor consistency. Furthermore, the inherent electrode wires of the ignition electrode plug increase the detonator's own resistance and the inductance of the ignition circuit, leading to low energy utilization of the explosive bridge foil chip. This presents challenges in reducing the ignition energy and miniaturizing the system, making it difficult to meet the demands of modern weapon systems towards high integration, miniaturization, and intelligence.

[0003] The reported improvements include the integration of the chip substrate, the explosive bridge foil, the flyer, and the acceleration chamber. However, traditional explosive foil chips still need to be connected to the ignition electrode plug during assembly. The electrode plug is usually manufactured using processes such as glass sintering or high-temperature injection molding. The high cost of the ignition electrode plug results in a high product price for the impact detonator, which is not conducive to the large-scale mass production of the impact detonator. Utility Model Content

[0004] The technical problem solved by this utility model is to provide a patch-type impact detonator that is simple in structure, low in manufacturing cost, miniaturized and low in energy.

[0005] To achieve the above-mentioned objectives, this utility model adopts the following technical solution:

[0006] A patch-type impact detonator includes a shell, a secondary charge, a primary charge ring, a primary charge, and an integrated explosive foil chip.

[0007] The integrated explosive foil chip is formed by bonding together the following components from top to bottom: accelerator chamber, flyer, copper foil, and substrate. The substrate is stepped and has a solder pad at the bottom. The explosive foil chip serves as both an ignition element and a connector.

[0008] The integrated explosive foil chip serves as the carrier for all components of the impact detonator, with the primary charge and primary charge ring placed on the upper end of the integrated explosive foil chip.

[0009] The primary charge is pressed into the primary charge ring, and the upper and lower surfaces of the primary charge are flush with the upper and lower end surfaces of the primary charge ring.

[0010] The secondary charge is placed on top of the primary charge and is directly pressed into the shell, keeping the charge surface flat.

[0011] The shell, secondary charge, primary charge ring, primary charge and integrated explosive foil chip are arranged coaxially from top to bottom.

[0012] The bottom of the housing is rolled and tapered so that the bottom of the housing is within the step of the integrated explosive foil chip substrate, and the bottom of the integrated explosive foil chip protrudes from the bottom of the housing after tapering.

[0013] The gap between the bottom of the integrated explosion foil chip and the bottom of the housing is sealed by filling with adhesive.

[0014] Impact detonators utilize reflow soldering technology to directly solder the detonator itself to the next stage of the overall system via the pads at the bottom of the integrated explosive foil chip.

[0015] Compared with the prior art, the advantages of this utility model are:

[0016] 1. By adding pads to the bottom of the integrated explosive foil chip, the explosive foil chip serves as both an ignition element and a connector. The impact detonator directly achieves surface mounting welding between the detonator itself and the next stage of the overall system using reflow soldering technology, replacing the traditional connection method of welding through the electrode leads of the ignition electrode plug. This can reduce the inductance of the ignition circuit and the resistance of the detonator, improve energy utilization, and provide technical support for the miniaturization and low-energy use of impact detonators.

[0017] 2. The impact detonator has a simple overall structure, integrating the explosive foil chip and ignition circuit into a single design. This eliminates the need for traditional high-cost ignition components such as electrode plugs, enabling low-cost manufacturing of the impact detonator and facilitating rapid mass production and use. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the various structures of the impact detonator of this utility model before assembly.

[0019] Figure 2 This is a schematic cross-sectional view of the assembled structure of the impact detonator of this utility model.

[0020] Figure 3 This is a schematic diagram of the integrated explosive foil chip structure of this utility model.

[0021] 1. Shell; 2. Secondary charge; 3. Primary charge ring; 4. Primary charge; 5. Integrated explosive foil chip;

[0022] 51. Acceleration chamber; 52. Flying blade; 53. Copper foil; 54. Substrate; 55. Solder pad. Detailed Implementation

[0023] The embodiments of this utility model will now be described in detail with reference to the accompanying drawings.

[0024] like Figures 1-3 As shown, a patch-type impact detonator includes a housing 1, a secondary charge 2, a primary charge ring 3, a primary charge 4, and an integrated explosive foil chip 5;

[0025] The integrated explosive foil chip 5 serves as the carrier for the various components of the impact detonator. The integrated explosive foil chip 5 is an integrated structure, with the following components arranged from top to bottom: acceleration chamber 51, flying plate 52, copper foil 53, and substrate 54. The bottom of the substrate 54 has a solder pad 55. The integrated explosive foil chip 5 also functions as an ignition component and a connector.

[0026] The present invention provides a specific implementation scheme as follows: A primary charge 4 and a primary charge ring 3 are placed on the upper end of the integrated explosive foil chip 5. The primary charge 4 is pressed into the primary charge ring 3, and the upper and lower charge surfaces of the primary charge 4 are flush with the upper and lower end surfaces of the primary charge ring 3.

[0027] Primary charge 4 is HNS-IV, with a charge density of 1.60 ± 0.1 mg / mm³. 3 .

[0028] The present invention provides a specific implementation scheme as follows: the secondary charge 2 is placed at the upper end of the primary charge 4 and the primary charge ring 3, and the secondary charge 2 is directly pressed into the shell 1, and the charge surface is kept flat;

[0029] Secondary charge 2 is JH-14, with a charge density of 1.65 ± 0.2 mg / mm³. 3 .

[0030] The present invention provides a specific implementation scheme as follows: the acceleration chamber 51 is made of ceramic material with a thickness of 0.2-0.4 mm, and the bore diameter of the acceleration chamber 51 is 0.3-0.6 mm;

[0031] The present invention provides a specific implementation scheme as follows: the flyer 52 is a polyimide flyer with a thickness of 15-50 μm;

[0032] The present invention provides a specific implementation scheme as follows: Copper foil 53 is formed on the upper end of substrate 54 by magnetron sputtering process, and the thickness of the square bridge area of ​​copper foil 53 is 15-35μm and the side length is 0.2-0.4mm;

[0033] The present invention provides a specific implementation scheme as follows: the substrate 54 is made of ceramic material with a thickness of 2-4 mm, and the step height at the lower end of the substrate 54 is 0.3-0.5 mm;

[0034] The present invention provides a specific implementation scheme as follows: the pads 55 are formed on the lower end of the substrate 54 by magnetron sputtering process, and are symmetrically distributed. The distance between the two pads 55 is 1-2mm. The length of a single pad 55 area is 1.5-2.5mm, the width is 0.5-1.5mm, and the thickness is 3-5μm.

[0035] The present invention provides a specific implementation scheme as follows: the shell 1, the secondary charge 2, the primary charge ring 3, the primary charge 4, and the integrated explosive foil chip 5 are arranged coaxially from top to bottom.

[0036] The bottom of the housing 1 is rolled and finished so that the bottom of the housing 1 is closed within the step of the integrated explosive foil chip 5 substrate 54. The bottom of the integrated explosive foil chip 5 protrudes from the bottom of the housing 1 after the rolling is finished, with a protrusion height of 0.3 to 0.5 mm.

[0037] The gap between the bottom of the integrated explosion foil chip 5 and the bottom of the housing 1 is sealed by filling with epoxy resin.

[0038] The impact detonator can be directly surface-mounted to the next stage of the overall system by means of reflow soldering technology through the pad 55 at the bottom of the integrated explosion foil chip 5.

[0039] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A patch-type impact detonator, characterized in that: It includes a shell (1), a secondary charge (2), a primary charge ring (3), a primary charge (4), and an integrated explosive foil chip (5); The first-stage explosive charge (4) and the first-stage explosive charge ring (3) are placed on the upper end of the integrated explosive foil chip (5); The primary charge (4) is pressed into the primary charge ring (3), and the upper and lower surfaces of the primary charge (4) are flush with the upper and lower end surfaces of the primary charge ring (3). The secondary charge (2) is placed on top of the primary charge (4), and the secondary charge (2) is directly pressed into the shell (1), with the charge surface kept flat; The integrated explosive foil chip (5) serves as the carrier for various components of the impact detonator, and also functions as an ignition component and a connecting component; The components inside the integrated explosion foil chip (5) are integrated into one structure, and from top to bottom they are: acceleration chamber (51), flying plate (52), copper foil (53), and substrate (54). The bottom of the substrate (54) has a solder pad (55).

2. The patch-type impact detonator according to claim 1, characterized in that: In the integrated explosive foil chip (5), the acceleration chamber (51) is a ceramic material acceleration chamber with a thickness of 0.2 to 0.4 mm and a bore diameter of 0.3 to 0.6 mm.

3. The patch-type impact detonator according to claim 1, characterized in that: The flyer (52) is a polyimide flyer with a thickness of 15-50 μm.

4. The patch-type impact detonator according to claim 1, characterized in that: Copper foil (53) is formed on the upper end of substrate (54) by magnetron sputtering. The thickness of the square bridge area of ​​copper foil (53) is 15-35 μm and the side length is 0.2-0.4 mm.

5. The patch-type impact detonator according to claim 1, characterized in that: The substrate (54) is a ceramic material substrate with a thickness of 2-4 mm and the step height at the lower end of the substrate (54) is 0.3-0.5 mm.

6. The patch-type impact detonator according to claim 1, characterized in that: The pads (55) are formed on the lower end of the substrate (54) by magnetron sputtering and are symmetrically distributed. The spacing between the two pads (55) is 1-2 mm. The length of a single pad (55) area is 1.5-2.5 mm, the width is 0.5-1.5 mm, and the thickness is 3-5 μm.

7. The patch-type impact detonator according to claim 1, characterized in that: The shell (1), secondary charge (2), primary charge ring (3), primary charge (4) and integrated explosive foil chip (5) are arranged coaxially from top to bottom.

8. The patch-type impact detonator according to claim 1, characterized in that: The bottom of the housing (1) is the bottom after the edge is rolled and closed. The bottom of the housing (1) is closed within the step of the integrated explosive foil chip (5) base (54). The bottom of the integrated explosive foil chip (5) protrudes from the bottom of the housing (1) after the edge is rolled and the protrusion height is 0.3 to 0.5 mm.

9. The patch-type impact detonator according to claim 1, characterized in that: The gap between the bottom of the integrated explosion foil chip (5) and the bottom of the housing (1) is filled with epoxy resin for sealing.

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