A MEMS sensor and electronic device

Abstract

The application discloses a MEMS sensor and an electronic device, wherein the MEMS sensor comprises a base, the base comprises a bottom plate; a cover is fixedly connected with the base and cooperatively enclosed with the base to form a containing cavity. A first protruding block is protruded from one side of the cover towards the bottom plate, and a spacing is formed between the first protruding block and the bottom plate. A first air passage is further formed in the cover, and the first air passage is connected with the second cavity and the outside. A MEMS chip is located in the first cavity. The application prolongs the airflow path. The foreign matters (such as tobacco tar) mixed in the airflow can be deposited along the prolonged airflow path, so that the amount of the tobacco tar flowing to the surface of the MEMS chip is reduced, the foreign matters are prevented from being deposited on the surface of the MEMS chip, and the sensitivity and stability of the MEMS chip are improved.

Description

Technical Field

[0001] This application relates to the field of MEMS sensor technology, and more particularly to a MEMS sensor and electronic device. Background Technology

[0002] MEMS (Micro-Electro-Mechanical Systems) sensors detect pressure changes by sensing the pressure difference across a diaphragm and are widely used in gas detection, industrial process control, automotive electronics, environmental monitoring, and aerospace.

[0003] The front cavity of a MEMS sensor is directly connected to the medium being measured. Airflow can easily carry foreign matter (such as dust, oil mist, or condensate) into the front cavity through the air inlet and deposit it on the surface of the MEMS chip. For example, when a MEMS sensor is used in an e-cigarette, the e-liquid carried in the smoke can easily deposit on the MEMS chip, thus affecting the sensitivity and stability of the MEMS chip. Utility Model Content

[0004] This application provides a MEMS sensor and electronic device designed to prevent foreign matter from depositing on the surface of a MEMS chip, thereby improving the sensitivity and stability of the MEMS chip.

[0005] To achieve the above objectives, according to a first aspect of this application, a MEMS sensor is provided, comprising:

[0006] The base includes a base plate;

[0007] The cover is fixedly connected to the base and together with the base, they enclose a cavity. The cover is also provided with a first ventilation channel.

[0008] The MEMS chip is located in the first chamber and is fixedly connected to the base plate;

[0009] The cover has a first protrusion on the side facing the base plate, and there is a gap between the first protrusion and the base plate. The first protrusion is disposed on the airflow path from the first ventilation channel to the MEMS chip.

[0010] Optionally, the first protrusion and the cover are integrally formed.

[0011] Optionally, a first partition is provided on one side surface of the base plate facing the cover, the first partition dividing the accommodating cavity into a first chamber and a second chamber, the first partition having a through hole connecting the first chamber and the second chamber, and the MEMS chip being located in the first chamber.

[0012] Optionally, in the first direction, the projection of the first partition overlaps with the projection of the first protrusion, and the first direction is parallel to the surface of the base plate.

[0013] Optionally, the base plate has a first surface and a second surface disposed opposite to each other along a first direction. The first surface includes a first region and a second region. In the first region, the first surface and the second surface have a first dimension in the first direction. In the second region, the first surface and the second surface have a second dimension in the first direction. The first dimension is larger than the second dimension.

[0014] The MEMS chip is located in the first region.

[0015] Optionally, the base further includes: a base side plate, which is disposed around the side wall of the base plate and is fixedly connected to the side wall of the base plate;

[0016] The cover includes: a cover plate, which is disposed on the side plate of the base, the first protrusion is connected to the cover plate, and the first ventilation channel is opened on the cover plate;

[0017] The base plate, the base side plate, and the cover plate together form the accommodating cavity.

[0018] Optionally, the cover includes:

[0019] A cover plate, wherein the first protrusion is connected to the cover plate, and the first ventilation channel is formed on the cover plate;

[0020] A cover side plate, which is arranged around the side wall of the cover plate and is fixedly connected to the side wall of the cover plate;

[0021] The side of the cover plate opposite to the cover plate is fixedly connected to the bottom plate, and the cover plate, the side plate, and the bottom plate together form the accommodating cavity.

[0022] Optionally, the first ventilation channel includes a first settling trough and a ventilation hole, the first settling trough being located on the side of the cover plate away from the bottom plate, and the ventilation hole being opened at the bottom of the first settling trough.

[0023] Optionally, it further includes: an ASIC chip located in the second chamber, fixedly connected to the base plate, and electrically connected to the MEMS chip.

[0024] Optionally, the base plate has a second ventilation channel that extends through it, and the MEMS chip is located above the second ventilation channel.

[0025] Optionally, multiple pads are embedded on the base, each pad being partially exposed in the accommodating cavity and partially exposed on the side surface of the base plate opposite to the accommodating cavity. The MEMS chip is electrically connected to at least one portion of the pad exposed in the accommodating cavity via leads.

[0026] According to a second aspect of this application, an electronic device is provided, comprising the MEMS sensor described in any one of the foregoing claims.

[0027] In this embodiment, a first protrusion is provided on the side of the cover facing the accommodating cavity. The first protrusion is located on the airflow path from the first ventilation channel to the MEMS chip. The airflow can flow along the surface of the first protrusion to reach the surface of the MEMS chip, which extends the airflow path compared to the prior art. Foreign matter (such as e-liquid) doped in the airflow can be deposited along the extended airflow path, thereby reducing the amount of e-liquid flowing to the surface of the MEMS chip, avoiding the deposition of foreign matter on the surface of the MEMS chip, and improving the sensitivity and stability of the MEMS chip.

[0028] Other features and advantages of this application will be described in detail in the following detailed description section. Attached Figure Description

[0029] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0030] To gain a more complete understanding of this application and its beneficial effects, the following description will be provided in conjunction with the accompanying drawings, wherein the same reference numerals in the following description denote the same parts.

[0031] Figure 1 This is a schematic diagram of the structure of a base disclosed in an embodiment of this application;

[0032] Figure 2 yes Figure 1 Section at point AA Figure 1 ;

[0033] Figure 3 This is a bottom view of a base disclosed in an embodiment of this application;

[0034] Figure 4 yes Figure 1 Section at point AA Figure 2 ;

[0035] Figure 5 yes Figure 1 Section at point AA Figure 3;

[0036] Figure 6 yes Figure 1 Section at point AA Figure 4 ;

[0037] Figure 7 yes Figure 1 Section at point AA Figure 5 ;

[0038] Figure 8 This is a top view of the cover disclosed in the embodiments of this application.

[0039] Explanation of reference numerals in the attached figures:

[0040] 1. Base; 101. Base plate; 1011. First surface; 10111. First area; 10112. Second area; 1012. Second surface; X1. First dimension; X2. Second dimension; 102. Base side plate;

[0041] 2. MEMS chips;

[0042] 3. Cover; 301. Receiving cavity; 3011. First chamber; 3012. Second chamber; 302. Vent hole; 303. First protrusion; 304. Cover plate; 305. Cover side plate; 306. First settling groove; 30. First ventilation channel;

[0043] 4. First partition; 401. Through hole;

[0044] 5. ASIC chip;

[0045] 6. Second ventilation channel;

[0046] 7. Protective netting;

[0047] 8. Solder pads. Detailed Implementation

[0048] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the protection scope of this application.

[0049] Reference Figure 1 and Figure 2 Embodiment 1 of this application discloses a MEMS sensor, including a base 1, a cover 3, and a MEMS chip 2. It should be noted that, in order to facilitate observation of the internal structure of the base 1, this application... Figure 1 Only the base 1 structure is shown in the diagram; the cover 3 and the MEMS chip 2 are not shown. This application Figure 2 Depend on Figure 1 A cross-sectional view from a mid-AA perspective shows the cover 3 and the MEMS chip 2. Additionally, Figure 8 A top view of cover 3 is shown.

[0050] The base 1 includes a base plate 101. A cover 3 is fixedly connected to the base 1, and together with the base 1, forms a receiving cavity 301. A first ventilation channel 30 is provided on the cover 3. A first protrusion 303 protrudes from the side of the cover 3 facing the base plate 101, and there is a gap between the first protrusion 303 and the base plate 101. The MEMS chip 2 is located within the receiving cavity 301 and is fixedly connected to the base plate 101. The first protrusion 303 is positioned on the airflow path from the first ventilation channel 30 to the MEMS chip 2.

[0051] In this embodiment, a first protrusion 303 protrudes from the side of the cover 3 facing the accommodating cavity 301. The first protrusion 303 is located on the airflow path from the first ventilation channel 30 to the MEMS chip 2. The airflow can flow along the surface of the first protrusion 303 to reach the surface of the MEMS chip 2, which extends the airflow path compared to the prior art. Foreign matter (such as e-liquid) doped in the airflow can be deposited along the extended airflow path, thereby reducing the amount of e-liquid flowing to the surface of the MEMS chip 2, avoiding the deposition of foreign matter on the surface of the MEMS chip 2, and improving the sensitivity and stability of the MEMS chip 2.

[0052] In Embodiment 1 of this application, the base 1 further includes a base side plate 102. The base side plate 102 is disposed around the side wall of the base plate 101 and is fixedly connected to the side wall of the base plate 101. The cover 3 includes a cover plate 304. The cover plate 304 covers the base side plate 102, the first protrusion 303 is connected to the cover plate 304, and a vent 302 is formed on the cover plate 304; wherein, the base plate 101, the side plate, and the cover plate 304 together form an accommodating cavity 301. It should be noted that, in this embodiment of the application, the base plate 101 and the base side plate 102 are integrally formed. The cover plate 304 and the first protrusion 303 are integrally formed.

[0053] In some embodiments, a first partition 4 protrudes from the side surface of the base plate 101 facing the cover 3. The first partition 4 divides the accommodating cavity 301 into a first chamber 3011 and a second chamber 3012. A through hole 401 is formed on the first partition 4, which connects the first chamber 3011 and the second chamber 3012. The MEMS chip 2 is located in the first chamber 3011. The first partition 4 is also located on the airflow path from the first ventilation channel 30 to the MEMS chip 2. In a first direction, the projection of the first partition 4 overlaps with the projection of the first protrusion 303, and the first direction is parallel to the surface of the base plate 101.

[0054] The first chamber 3011 and the second chamber 3012 are physically separated by the first partition 4. After the airflow enters the first chamber 3011 through the gap of the first protrusion 303, it still needs to pass through the through hole 401 of the partition to further approach the MEMS chip 2. This process is equivalent to adding an airflow barrier inside the first chamber 3011. The through hole 401 restricts the speed and direction of the airflow directly hitting the chip, causing the airflow to flow around again at the opening. This allows foreign particles (such as smoke droplets) to be deposited on the surface of the first partition 4 due to inertia at the through hole 401, further reducing the probability of foreign objects reaching the surface of the MEMS chip 2.

[0055] Further, in some embodiments, the base plate 101 has a first surface 1011 and a second surface 1012 disposed opposite to each other along a first direction. The first surface 1011 includes a first region 10111 and a second region 10112. In the first region 10111, the first surface 1011 and the second surface 1012 have a first dimension X1 in the first direction, and in the second region 10112, the first surface 1011 and the second surface 1012 have a second dimension X2 in the first direction. The first dimension X1 is larger than the second dimension X2. The MEMS chip 2 is located in the first region 10111, the first partition 4 is located between the first region 10111 and the second region 10112, and the projection of the first ventilation channel 30 on the base plate 101 is located in the second region 10112.

[0056] When the first region 10111 is raised, the airflow flows from the second chamber 3012 through the gap between the first protrusion 303 and the base plate 101 into the first chamber 3011. It will flow around the first protrusion 303 and the first partition 4. During the airflow, some foreign matter mixed in the airflow is deposited on the first protrusion 303 and some is deposited on the first partition 4, which further reduces the deposition of foreign matter on the surface of the MEMS chip 2.

[0057] In some embodiments, the first ventilation channel 30 includes a ventilation hole 302 and a first sink 306. The first sink 306 is located on the side of the cover plate 304 away from the bottom plate 101, and the ventilation hole 302 is opened at the bottom of the first sink 306.

[0058] The first settling tank 306 in the figure forms a buffer chamber between the vent 302 and the outside air. After the outside airflow enters the first settling tank 306, it enters the vent 302, and the airflow speed will be slowed down, reducing the possibility of large particles directly entering the cavity with the high-speed airflow, and further reducing the possibility of foreign objects entering from the source.

[0059] In some embodiments, the MEMS sensor further includes a protective mesh 7. The protective mesh 7 is connected to the side of the cover plate 304 opposite to the receiving cavity 301, covering the vent 302. Specifically, the protective mesh 7 and the cover plate 304 can be fixed by means of snap-fit, welding, or bonding. The protective mesh 7 can prevent larger foreign objects such as dust, flux spatter, and soot droplets from entering the receiving cavity 301.

[0060] In some embodiments, the MEMS sensor further includes an ASIC chip 5. The ASIC chip 5 is located in the second chamber 3012, fixedly connected to the base plate 101, and electrically connected to the MEMS chip 2.

[0061] In some embodiments, the MEMS sensor further includes a second ventilation channel 6 extending through the base plate 101, with the MEMS chip 2 located above the second ventilation channel 6. In one embodiment, a first through hole is formed on the base plate 101, and the first through hole extends through the base plate 101 to form the second ventilation channel 6.

[0062] Reference Figure 1 and Figure 3 In some embodiments, the MEMS sensor further includes multiple pads 8. The pads 8 are embedded in the base 1, and each pad 8 is partially exposed in the receiving cavity 301 and partially exposed on the side surface of the base plate 101 opposite to the receiving cavity 301. The MEMS chip 2 is electrically connected to at least one portion of the pad 8 exposed in the receiving cavity 301 via leads.

[0063] It should be noted that the pad 8 can be a U-shaped or C-shaped structure. One end of the pad 8 is exposed in the receiving cavity 301, and the other end is exposed on the surface of the base plate 101 away from the receiving cavity 301. The pad 8 can also be a bent structure. The bent structure is embedded in the base plate 101, with one side exposed in the receiving cavity 301 and the other side exposed on the surface of the base plate 101 away from the receiving cavity 301.

[0064] The pads 8 can be made of copper, aluminum, or a copper-aluminum alloy. The base 1 is formed by injection molding, which encloses a metal frame formed by multiple pads 8, so that the pads 8 are partially exposed in the cavity 301 and partially exposed on the side surface of the base plate 101 away from the cavity 301, so as to allow the MEMS chip 2 and the ASIC chip 5 to transmit electrical signals.

[0065] Reference Figure 4Embodiment 2 of this application also discloses a MEMS sensor. Unlike Embodiment 1, in Embodiment 2, the cover 3 includes a cover plate 304 and a cover side plate 305. A first protrusion 303 is connected to the cover plate 304, and a vent 302 is formed on the cover plate 304. The cover side plate 305 is disposed around the side wall of the cover plate 304 and is fixedly connected to the side wall of the cover plate 304. The side of the cover side plate 305 facing away from the cover plate 304 is fixedly connected to the bottom plate 101. The cover plate 304, the cover side plate 305, and the bottom plate 101 together form an accommodating cavity 301.

[0066] Reference Figure 5 In some embodiments, the second ventilation channel 6 is formed by a second through hole, the axis of which forms an angle with the thickness direction of the base plate 101, i.e., the first through hole is opened at an angle. (Refer to...) Figure 6 In some embodiments, the second ventilation channel 6 includes a first groove and a second groove that are connected. The first groove is formed on the first surface 1011, and the second groove is formed on the second surface 1012. The projection portions of the first groove and the second groove on the base plate 101 overlap, that is, the first groove and the second groove are staggered. (Refer to...) Figure 7 In some embodiments, the second ventilation channel 6 includes a third groove, a fourth groove and a fifth groove. The third groove is opened on the surface of the first surface 1011, the fourth groove is opened on the second surface 1012, and the fifth groove is opened on the side wall of the base plate 101. The third groove and the fourth groove are connected to the fifth groove, and the projections of the third groove and the fourth groove on the base plate 101 do not overlap.

[0067] Through the above embodiments, the openings on both sides of the second ventilation channel 6 do not overlap or partially overlap, breaking the "straight channel" between the airflow and foreign objects, forcing the airflow to flow in a tortuous or oblique direction between the two openings, thus lengthening the airflow path. Foreign objects entering the back cavity of the MEMS chip 2 through the second ventilation channel 6 will settle or collide with the inner wall of the second ventilation channel 6 due to inertia or gravity, making it difficult for them to reach the back cavity of the MEMS chip 2. Simultaneously, the airflow must change direction and travel a relatively long distance within the second ventilation channel 6, significantly reducing transient impact pressure.

[0068] This application also discloses an electronic device including any of the MEMS sensors disclosed above.

[0069] In the description of this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more features. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0070] In the above embodiments, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.

[0071] The embodiments, implementation methods, and related technical features of this application can be combined and substituted for each other without conflict.

[0072] The above are merely preferred embodiments of this application and are not intended to limit this application in any way. Any simple modifications, equivalent changes, and alterations made to the above embodiments based on the technical essence of this application without departing from the scope of the technical solution of this application shall still fall within the scope of the technical solution of this application.

Claims

1. A MEMS sensor, characterized in that, include: A base (1), the base (1) including a base plate (101); The cover (3) is fixedly connected to the base (1) and together with the base (1) forms a cavity (301). The cover (3) has a first ventilation channel (30). The MEMS chip (2) is located in the cavity (301) and is fixedly connected to the base plate (101); The cover (3) has a first protrusion (303) protruding on the side facing the base plate (101). The first protrusion (303) is spaced from the base plate (101) on the side facing the base plate (101). The first protrusion (303) is disposed on the airflow path from the first ventilation channel (30) to the MEMS chip (2).

2. The MEMS sensor according to claim 1, characterized in that, The first protrusion (303) is integrally formed with the cover (3).

3. The MEMS sensor according to claim 1, characterized in that, The bottom plate (101) has a first partition (4) protruding on one side surface facing the cover (3). The first partition (4) divides the accommodating cavity (301) into a first chamber (3011) and a second chamber (3012). A through hole (401) is provided on the first partition (4), which connects the first chamber (3011) and the second chamber (3012). The MEMS chip (2) is located in the first chamber (3011).

4. The MEMS sensor according to claim 3, characterized in that, In a first direction, the projection of the first partition (4) overlaps with the projection of the first protrusion (303), and the first direction is parallel to the surface of the base plate (101).

5. The MEMS sensor according to claim 1, characterized in that, The base plate (101) has a first surface (1011) and a second surface (1012) disposed opposite to each other along a first direction. The first surface (1011) includes a first region (10111) and a second region (10112). In the first region (10111), the first surface (1011) and the second surface (1012) have a first dimension X1 in the first direction. In the second region (10112), the first surface (1011) and the second surface (1012) have a second dimension X2 in the first direction. The first dimension X1 is greater than the second dimension X2. The MEMS chip (2) is located in the first region (10111).

6. The MEMS sensor according to claim 1, characterized in that, The base (1) also includes: A base side plate (102) is provided around the side wall of the base plate (101) and is fixedly connected to the side wall of the base plate (101). The cover (3) includes: A cover plate (304) is provided on the side plate (102) of the base. The first protrusion (303) is connected to the cover plate (304). The first ventilation channel (30) is opened on the cover plate (304). The base plate (101), the base side plate (102), and the cover plate (304) together enclose the accommodating cavity (301).

7. The MEMS sensor according to claim 1, characterized in that, The cover (3) includes: Cover plate (304), the first protrusion (303) is connected to the cover plate (304), and the first ventilation channel (30) is opened on the cover plate (304); Cover side plate (305), the cover side plate (305) is arranged around the side wall of the cover plate (304) and is fixedly connected to the side wall of the cover plate (304); The side plate (305) of the cover body is fixedly connected to the bottom plate (101) on the side opposite to the cover plate (304), and the cover plate (304), the side plate (305) of the cover body and the bottom plate (101) together enclose the accommodating cavity (301).

8. The MEMS sensor according to claim 6 or 7, characterized in that, The first ventilation channel (30) includes a first sink (306) and a ventilation hole (302). The first sink (306) is located on the side of the cover plate (304) away from the bottom plate (101), and the ventilation hole (302) is opened at the bottom of the first sink (306).

9. The MEMS sensor according to claim 3, characterized in that, Also includes: An ASIC chip (5) is located in the second chamber (3012), fixedly connected to the base plate (101), and electrically connected to the MEMS chip (2).

10. The MEMS sensor according to claim 1, characterized in that, The base plate (101) has a second ventilation channel (6) that runs through it, and the MEMS chip (2) is located above the second ventilation channel (6).

11. The MEMS sensor according to claim 1, characterized in that, Multiple pads (8) are embedded on the base (1). Each pad (8) is partially exposed in the accommodating cavity (301) and partially exposed on the side surface of the base plate (101) opposite to the accommodating cavity (301). The MEMS chip (2) is electrically connected to at least one of the pads (8) exposed in the accommodating cavity (301) via leads.

12. An electronic device, characterized in that, Including the MEMS sensor as described in any one of claims 1-11.

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